Home

MSP430 Hardware Tools User's Guide (Rev. Q)

1. 4 2 3 4 5 6 4 5 JP6 JP7 JP8 JP10 J5 R7 1 ijs ijs SBW 1 330R RSTDVCC SHWIDIO m gt gt 8 D 02 31 lt GND 314 RST NMI gt tcea Tus moes z HEAD 1X3 PINHEAD 1X3 PINHEAD 1X3 1X3 1X3 1X3 PINHEAD 1X3 TEST SBWTCK ae GND DVCC RS lt HORTCUT2 R10 5 R pice tbd C4 vecja HH aH BSL lo lt 0 2 2nF 47K 51 0 JP1 120 RSTDVCC_SBWTDIO P1 Har 1 1 0 0 gt LR 3 5 BOOTST PINHEAD 1X2 OR c _105 ERRE EEH 354556 1
2. 99 8 24 MSPHESASOPRZ 100 103 8 25 15430 2100 106 B26 5430 00 109 27 IMSP TS430PZ100GC 112 28 lt 18430 75 100 ee 118 29 75430 210005 cc be eet es ir 118 B 30 8430 128 ees 122 1 430 5137 900 m 125 32 EM430F6137RF900 2 129 33 430 6147 900 wea 133 834 eec 187 35 er 139 B 35 1 MSP FET430UIF Revision History 144 Hardware Installation Guide 2240 000 145 C 1 Hardware Installati n 146 Document Revision HIStOry ettet ten nnne ene ane Exon RE a Exe ERE ate In Exe EM ERE 151 SLAU278Q May 2009 Revised February 2014 Contents 3 Submit Documentation Feedback Copyr
3. DUCC XIN P2 6 XOUT P2 7 P1 0 P1 1 P1 2 P1 3 P1 4 P1 5 P1 6 P1 7 P2 0 P2 1 P2 2 P2 3 P2 4 P2 5 P3 0 P3 1 P3 2 01 RUCC 0 8055 RST NMI TCK TMS TDI TDO P4 7 P4 6 P4 5 4 4 P4 3 P4 2 P4 1 P4 0 P3 7 P3 6 P3 5 P3 4 P3 3 Socket Enplas QFN 4 B 0 5 01 GND If external supply voltage remove R11 and add R10 0 Ohm MSP TS430F 23x0 Target Socket Board for MSP43 F23x IRHA TITLE MSP TS430F23x0 Document Number Date 3 05 2007 09 31 46 Sheet 1 1 Ic Schemati TS430QFN23x0 Target Socket Module B 19 MSP Figure SLAU278Q May 2009 Revised February 2014 Hardware 58 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumper JP2 Open to measure current Jumper JP3 Open to disconnect LED LED connected to P1 0 0000000 14 00000002 10 gt Jet JTAG int HO m 1 1 c5 H R4 J4 BOOTST
4. INSTRUMENTS www ti com 11 710 0000000 00000002 000002 JTAG R8 R5 BOOTST LED connected R3 ri ids to pin 12 3 my ro CB usw J7 Open 76 if XTCLK R14 GND 6 Jumper 47 LCD connected 82 00000000000090000 54 44 Jumper 96 cf e Open to disconnect LED 1C51 0644 807 o o 000000 Orient Pin 1 of 95 49 MSP430 device 896 988 o o 998 988 o o 090 olo T 00000 Clamshell 12 22 ue So Figure B 32 MSP TS430PM64 Target Socket Module PCB 32 DO OO OO OO OO OO OOO O0 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PM64 Connector J5 External power connection Remove R8 and jumper R9 Hardware 77 5 INSTRUMENTS MSP TS430PM64 www ti com Table B 18 MSP TS430PM64 Bill of Materials Pos Ref Des Description Part 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation i 0 4 pF SMD0805 Check your crystal spec 2 C6 C7 1 1
5. 9 5 5 6 gt lt 5 amp o 5 19 o 10 2 u o o D D 5 e e 9 N N N L uL a n rc rc x gt S 8 1 8 3 o o o 5 o o 9 5 Supports all programmable MSP430 CC430 devices F1xx F2xx F4xx F5xx x F6xx G2xx L092 FR57xx FR59xx MSP430TCH5E Supports only F20xx G2x01 G2x11 G2x21 G2x31 Supports MSP430F20xx F21x2 F22xx G2x01 G2x11 G2x21 G2x31 G2x53 Supports MSP430F20xx F21x2 F22xx x G2x01 G2x11 G2x21 G2x31 Supports F5438 F5438A x Supports BT5190 F5438A x Supports only F552x x Supports FR57xx F5638 F6638 X Supports only CC430F613x x Allows fuse blow x Adjustable target supply voltage X Fixed 2 8 V target supply voltage x Fixed 3 6 V target supply voltage x X X X X X X x x 4 wire JTAG x x 2 wire JTAG x x x x x x x x Application UART x x x x x x x x Supported by CCS for Windows x x x x x x x x Supported by CCS for Linux Supported by IAR x x x X X x x x The MSP FET430PIF is for legacy device support only This emulation tool will not support any new devices released after 2011 The 2 wire JTAG debug interface is also referred to as Spy Bi Wire SBW interface SL
6. 74 17 MSP TS430RGZ48C of Materials 75 18 MSP TS430PM64 Bill of Materials 2 45 4 4 78 B 19 MSP TS430PM64A Bill of Materials 81 20 MSP TS430RGC64B Bill of Materials 84 B 21 MSP TS430RGC64C Bill of Materials 88 B 22 MSP TS430RGC64USB Bill of 91 B 23 MSP TS430PN80 Bill of Materials 95 24 MSP TS430PN80A Bill of Materials 98 25 MSP TS430PN80USB Bill of Materials 0 101 B 26 MSP TS430PZ100 Bill of Materials 22 2 ccccee cece cece 105 B 27 MSP TS430PZ100A Bill of Materials 2 0 cece eee cece eee 108 28 MSP TS430PZ100B Bill of 111 29 MSP TS430PZ100C Bill of 5 0 114 30 MSP TS430PZ5x100 Bill of eee eens eee enna eens enna enna 117 31 MSP TS430PZ100USB Bill of Materials
7. 43 43 LDOI LDOO p41 pn Uce1sIYo Pn 42 42 P4 2 PM_UCBLSTE PM_UCALCLK p2 41 41 C11 18007 D je Note If the system should be supplied via LDOI J6 close JP4 and set JP3 to external pa t ucsesonivucsasc 35 35 CCLK OMAE f 22 6 RT 34 34 LDOI Interface MSP430 Target Socket MSP TS430RGC64B for F53xx TITLE MSP TS430RGC64B Document Number Date 10 13 2010 5 25 05 PM Sheet 1 1 Ic Schemati TS430RGC64B Target Socket Module 35 MSP igure F Submit Documentation Feedback SLAU278Q May 2009 Revised February 2014 Hardware 82 Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGC64B Connector J5 External power connector 18 ext 1 2 Jumper to ext Jumpers JP5 to JP10 e 20 55 5 Close 1 2 to debug in Spy Bi Wire mode Sos BOOTS 000 Close 2 3 to debug 4 wire JTAG mode 521 PU Eau 57 0 dm TEAS ene If the system should be supplied LDOI 46 32156 72 2 Orient Pin 1 MSP430 device
8. 44 11 MSP TS430DW28 Target Socket Module Schematic enne 46 12 MSP TS430DW28 Target Socket Module 0 0 0 nenne 47 B 13 MSP TS430PW28 Target Socket Module Schematic 49 B 14 MSP TS430PW28 Target Socket Module PCB 0 50 15 MSP TS430PW28A Target Socket Module 52 B 16 MSP TS430PW28A Target Socket Module PCB Red 53 17 MSP TS430DA38 Target Socket Module 0 55 18 MSP TS430DA38 Target Socket Module 0 2 56 B 19 MSP TS430QFN23x0 Target Socket Module Schematic 58 B 20 MSP TS430QFN23x0 Target Socket Module 59 B 21 MSP TS430RSB40 Target Socket Module Schematic nenne 61 B 22 MSP TS430RSB40 Target Socket Module 0 62 23 MSP TS430RHA40A Target Socket Module Schematic 64 24 MSP TS430RHA40A Target Socket Module 2 6 00 1 65 B 25 MSP TS430DL48 Target Socket Module Schematic 67 B 26 MSP TS430DL48 Target Socket Module 00 2 68 27 MSP TS430RGZ48B Tar
9. 99 24 6 16 430 2100 mere edam A 103 B 25 MSP TS430PZ100A 106 26 MSP TS430PZ100B IEEE SOT UID 109 27 6 5430 7100 2222 2 22 112 282 5 2 RUE 115 B 29 MSP TS430PZ100USB 118 B 30 54 28 122 B31 0 900 2222222 20 125 8 32 129 EM430F 614 7 133 222702202 137 B 35 2 MSP EETA430UIE 139 30 Hardwae 2780 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430D8 www ti com MSP TS430D8 B 1 SBWICK RST SBWTDIO TST SBWTCK 2 to measure supply current J6 0 R2 330R TST SBWTCK R5 47K RST SBWTDIO i 100nF 10uF 10V DVCC Dvss 1 2 1 2 TSTISBWTCK BEEN P1 5 TAQ AS SCLK RST SBWTDIO PIG TAT AGISDOISCL P1 7 A7ISDI SDA MSP TS430D8 Socket YAMAICHI IC369 0082 MSP TS430D8 Target Socket Board TITLE MSP TS430D8 Document Number Date 28 07 20111 03 35 Sheet 1 Figure B 1 MSP TS430D8 Target Socket Module Schematic 31 Hardwa
10. P8 7 S17 00 4 7uF 100nF P amp 6 S18 to Too Titel MSP430 Target Socket Bearb Petersen MSP TS430PEU128 for F6779 Dok 1080 1 001 01 1 MSP TS430PEU128 Datum 22 05 2012 09 37 33 Seite 1 1 Figure B 59 MSP TS430PEU128 Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 122 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com JP11 JP12 JP13 Connect 1 2 to connect AUXVCCx with DVCC or drive AUXVCCx externally e nR D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED y R3 015 1 430 40 R1 2 JP12 RST NMI TCK TMS TDI GND TDO TEST SBWTCK AUXVCC3 ISAUXVCC 1234 18 C19 macs mci mci 4 5 INSTRUMENTS MSP TS430PEU128 Rev 1 1 RoHS 45 50 55 60 64 J 2 9 0 2 0 0 0 0 0 0 000 0 0 00 0 0 00 0 0 0 0 0 MSP TS430PEU128 Jumper JP1 Open to measure current Connector J5 External power connector Jumper JP1 to ext Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode
11. 1 22 2 118 B 58 MSP TS430PZ100USB Target Socket Module 119 59 MSP TS430PEU128 Target Socket Module Schematic 122 B 60 MSP TS430PEU128 Target Socket Module PCB 123 61 EM430F5137RF900 Target board 2 44 44 4 nnne 125 B 62 EM430F5137RF900 Target board 126 63 EM430F6137RF900 Target board 2 4 nnn 129 B 64 EM430F6137RF900 Target board 8 8 86 8 6 68 8 130 B 65 EM430F6147RF900 Target Board Schematic 1 nennen 133 66 EM430F6147RF900 Target Board 134 67 MSP FET430PIF FET Interface Module 137 B 68 MSP FET430PIF FET Interface Module 138 B 69 MSP FET430UIF USB Interface Schematic 1 of 4 139 70 MSP FET430UIF USB Interface Schematic 2 14 2 2 140 71 MSP FET430UIF USB Interface Schematic 3 of 4 6 6 141 B 72 MSP FET430UIF USB Interface Sche
12. VCC430 1OuF 6 3V as S psa m coo e 330R JP1 Open JP1 if LCD is connected CC430 R4 47k C3 58 58 P7 3 TCK S35 P7 2 TMS S34 00 01 532 54 54 2 lt 8 8 5 B RST NMI SBHITDIO tio Erg 5838 3 da 9 E ORE P6 1 UCBOSONL UCBOSCL P 2 UCBOSIMO UCBOSDR P 3 UCBBSTE UCRBCLK 3 CR5 UeREF UREF P 4 UCBRCLK UCADSTE A4 CA6 UeREF UREF P 5 UCABRXD UCABSOMI AS P6 6 UCABTXD UCARSINO AS Duce XIN 1 Duss P6 7 A7 CA7 SUSIN P4 7 ADCAGCLK SO 4 6 51 P4 5 52 4 4 83 4 3 54 Socket Yamaichi 51 0644 807 3 T81 4 912 P2 2 T61 3 913 2 1 784 2 814 1 53 53 P4 4 TAQ Q MCLK S30 P2 0 TAL 1 S15 2nF IM DNP GND 3 3 3 1 C D JP6 JP8 1 2 80 1 529 P1 3 TAL B SUSOUT S28 P3 4 CA0UT 519 1 4 81 0 527 1 5 TABCLK CADUT S26 MSP430F 41 2 P3 3 TAQ B TALCLK S28 P5 2 R13 LCDREF P1 6 ACLK CAQ P7 6 T60 2 525 5 0 1 1 524 R33 LCDCAP P5 1 R23 P5 3 R03 5 4 0 P5 5 C0M2 P5 6 C0M1 2 P3 0 TAL 2 823 P3 1 T61 3 522 P3 2 TA1 4 521
13. INSTRUMENTS MSP TS430PN80A www ti com Table B 24 MSP TS430PN80A Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP C6 C7 3 C10 C12 3 10uF 6 3 SMD0805 DNP C10 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND Ji J2 J8 SAM1029 20 ND DNP Headers and receptacles 10 J4 0 20 pin header TH Header SAM1213 20 enclosed with kit Keep vias free of ND Receptacle solder 11 J5 J6 2 3 pin header male TH ge 2 place jumpers on pins 2 3 on JP5 12 JP9 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers pins 1 2 JP10 JP1 JP2 13 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and Pos 13 15 JTAG 1 ce connector male HRP14H ND 16 BOOTST 0 ene DNP Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 18 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder http Awww ettinger de Ar 19 dd 0 Insulating disk to 02 t Detail cfm ART ART NUM 70 08 121 20 D3 D4 2 LL103A Buerklin 24S3406 21 R3 R7 2 330 5 00805 541 330ATR ND R1 R2 R4 R6 22 R8 3 0 Ohm
14. MSP TS430PW28A Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Figure B 16 MSP TS430PW28A Target Socket Module PCB Red SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Hardware 53 Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PW28A www ti com Table B 9 MSP TS430PW28A Bill of Materials Position Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 1 10uF 10V SMD0805 4 C4 C6 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles 6 J1 J2 0 14 pin header TH enclosed with kit Keep vias free of solder Header amp Receptacle J5 JP1 JP4 JP5 Place jumper 1 2 of JP4 JP9 7 JP6 JP7 8 3 pin header male SAM1035 03 ND Place on 1 2 on JP1 JP8 JP9 8 JP2 JP3 2 pin header male SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see 7 8 10 JTAG 1 connector male eps wp 11 BOOTST 0 DNP Keep vias free of solder Micro Crystal MS3V 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13 R1 R7 2 330 O SMD0805 541 330ATR ND ip 0 0 Ohm 5 00805 541 000ATR ND DNP R2 R3
15. 36 B 3 MSP TS430L092 Bill of Materials 39 B 4 MSP TS430L092 JP1 Selttings ii rre ntt eara atu rh erar seid Y ERR SD 41 B 5 MSP TS430L092 Active Cable Bill of Materials 42 B 6 MSP TS430PW 24 Bill of 45 B 7 MSP TS430DW28 Bill of Materials oim ena rn nin ro nnnm urne nitent ac 48 8 MSP TS430PW28 Bill of Materials nnne ne nennen 51 9 MSP TS430PW28A Bill of Materials nnne 54 10 MSP TS430DA38 Bill of Materials 57 B 11 MSP TS430QFN23x0 Bill of 60 B 12 MSP TS430RSB40 of Materials 63 B 13 MSP TS430RHA4O0A of 66 14 MSP TS430DL48 Bill of 1 11 4 1 4 hme nnn nennen 69 B 15 MSP TS430RGZ48B Bill of 72 16 MSP TS430RGZ48C Revision History
16. 2 3 Jumper JP2 Open to measure current 0 Orient Pin 1 of Device e x OTS 28 0 65 01 00 Jumper JP3 z Open to disconnect LED MSP TS430PW28 pf BR Rev 3 1 LED 01 connected to 5 1 Figure B 14 MSP TS430PW28 Target Socket Module PCB 50 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW28 Table 8 MSP TS430PW28 Bill of Materials Pos Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 holes 2 C3 1 10uF 10V Tantal Elko B 3 C4 1 100nF SMD0805 4 C5 0 2 2nF SMD0805 DNP 5 D1 1 LED green SMD0603 Micro Crystal MS1V T1K DNP Cover holes and 6 Q1 0 QUARZ Crystal 32 768kHz C Load neighboring holes while 12 5pF soldering DNP Headers and receptacles enclosed with 7 J1 J2 2 14 pin header TH male kit Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with 71 2 14 pin header TH female kit Keep vias free of solder Header Receptacle 8 J5 IP1 1 3 Pin Connector male JP1 JP4 8a T tee 7 3 Pin Connector male Jumper on Pos 1 2 JP9 9 JP2 JP3 2 2 Pin Connector male with Jumper 10 BOOTST 0 ML10 10 Pin Conn m RS 48
17. 120 32 MSP TS430PEU128 Bill of Materials 0 124 33 EM430F5137RF900 Bill of 127 34 EM430F6137RF900 Bill of 131 35 EM430F6147RF900 Bill of 135 C 1 USB VIDs and PIDs Used 430 eee eee 146 List of Tables SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated TEXAS SLAU278Q May 2009 February 2014 INSTRUMENTS Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP FET430 Flash Emulation Tool FET The FET is the program development tool for the MSP430 ultra low power microcontroller Both available interface types the parallel port interface and the USB interface are described How to Use This Manual Read and follow the instructions in Chapter 1 This chapter lists the contents of the FET provides instructions on installing the hardware and according software drivers After you see how quick and easy it is to use the development tools recommends that you read all of this manual This manual describes the setup and operation of the FET but does not fully describe the MSP430 microcontrollers or
18. 470R R13 52 101 Figure 39 MSP TS430RGC64USB Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 89 MSP TS430RGC64USB 90 Hardware Hs Xp Texas god INSTRUMENTS cno 0 9000000000000000 05 1 1333 Bo 11 N C10 2 5 oo a 22 C409 Ye e e C35 e 02 5833 g e E e 25 e cH pas e 2 o e c38 See 2 g e s Yon D 4 OM 7 e s ote d e gt lt 2 52 aN ee J ee m 19 79 2 01 Lm 11 12 51 13 JP2 LED1 0000 88 5555 c7t 16 JTAG LEQ3 1 Ji 9999999999999999 e 5 Figure 40 MSP TS430RGC64USB Target Socket Module TEXAS INSTRUMENTS www ti com SLAU278Q 20
19. 5 INSTRUMENTS www ti com MSP TS430PZ100USB Table B 31 MSP TS430PZ100USB Bill of Materials continued Pos Ref Des aaa Description DigiKey Part No Comment 30 C38 1 220 SMD0603 Buerklin 53D2074 31 C39 1 4u7 SMD0603 Buerklin 5302086 32 C40 1 0 1 SMD0603 Buerklin 5302068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 IC7 1 TPD4E004 Manu 35 LED 0 JP3QE SAM1032 03 ND DNP 36 E 0 LEDCHIPLED 0603 FARNELL 852 9833 DNP 0 4708 SMD0603 Buerklin 07 564 DNP 38 R33 1 1k4 1 5 SMD0603 Buerklin 07 612 39 R34 1 278 SMD0603 Buerklin 07E444 40 R35 1 278 SMD0603 Buerklin 07E444 41 R36 1 33k SMD0603 Buerklin 07E740 42 1 52 3 1 P12225STB ND DNP S1 and S2 Only S3 43 USB1 1 USB_RECEPTACLE FARNELL 117 7885 44 JP11 1 4 pin header male TH SAM1035 04 ND place jumper only on Pin 1 SLAU278Q May 2009 Revised February 2014 Hardware 121 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430PEU128 B 30 MSP TS430PEU128 10UF 6 3V JP5 2 3 4JP7 26 2 2 2 RST NMLS Ick 3 IMS JP10 4JP9 E 1 lt SBW ToL 4 lt 2 GND 10uF 6 3V GND eiT ASS XIN
20. 20 2 2 External POWOF 24 2 3 Bootstrap BSU 24 Frequently Asked Questions and Known Issues 25 A 1 Hardware FAQS m 26 A 2 KNOWN 155005 dao orina CO 28 B Hardware sas A XOO 29 B 1 1543008 E 31 B 2 ETZMESZRDOIJUAD 34 B 3 MSP TS4930L092 37 4 MSP TS430L092 Active Cable rna p YER S SER DFRN 40 B 5 MSP TS430PW24 2 43 6 5430 28 46 7 MSP TS430PW B 7 49 8 5430 28 52 9 ciation 58 B 10 IMSP TS430QFN2Z3XO E a 58
21. SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 63 www ti com xi TEXAS INSTRUMENTS 12 MSP TS430RHA40A MSP TS430RHA40A JTRG Mode selection vire JTAG Set jumpers JP4 to 0 9 to position 2 3 2 uire SpyBilire Set jumpers JP4 to to position 1 2 ext ps 2 int 1 1 2 3 3 a TEST SBLTCI IDO 4 2 PJ 1 TDI 2 DJ 3 ICK JP2 1 JP 197 140 10077 GND c2 c6 180uF 1Q0U100nF BOOTST connection via 139 85 2 P2 0 J3 70 3_TCK 8 as 1 2 2 1 2 3 8 gt oo Jos Jos JNJ ox co Io gt gt e iv gt I N N ls 1 TDI 11 GND If external supply voltage 1 RA 330R remove and add RZ 8 Ohm meen MSP TS43 RHA4 A Target Socket Board for MSP430FR572x FR573x IRHA GND TITLE MSP TS43 RHA4 A Document Number Date 4 21 2010 1 23 27 Sheet 1 1
22. 1 3 E gt PR 8 BEER 8 b BR 1 101 6 2 2 102 104 5 3 2 3 GND 103 4 25 76 26 75 TPD4E004 2 74 5 28 23 5 5 29 xcu 72 71 21 9 5434 U 2 Sax 2 28 l 32 183 OD 5 S9XI2IN t5 g 33 gz 68 a 8 5 67 8 35 66 U 5 38 39 62 5 ky 2 Li T gen as il UuSB ___ 454 5 ueus 9 28 PULT OM 58 85 _ 5 2 5 c 5 2 25 S t 8 aoe 38 23 Eag 8 11838 9 o LEDI P 5 2 5 alza 215 8 g a N A 811319 oa o LED2 470R 210139 E M m m R16 Sg 3 a LED3 470R ty 8 5 z 9 R13 N 5 x 4 g o S 1 mi th 9 8 5 51 2 E m 2 12 2 v 2 t 14 5 e 3 a 9 2 5 e w D ej em NS NOTE R11 should be populated Figure B 45 MSP TS430PN80USB Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 99 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PN80US
23. 193 470nF Jalal 2 S 2 5 Ss j TEXAS GND 005 5 INSTRUMENTS comment TI Friesing Date Name Design 12 1410 5 6 MSP TS430RGC64C Title of Schematic Drawing Revision 1 1 MSP TSA30RGCBAC sch 1 of 1 Mentor Pads Logic V9 size 1 2 3 4 5 6 Figure B 37 MSP TS430RGC64C Target Socket Module Schematic Submit Documentation Feedback SLAU278Q May 2009 Revised February 2014 Hardware 86 Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumpers JP5 to 10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device gt a gt gt gt 4 a gt x gt D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED Tz fi s s MSP TS430RGC64C Connector J6 External power connector to supply DVIO Jumper JP4 O For F524x devices close O For F522x F523x and F525x devices close only if one power supply is used for VCC and DVIO and if VCC is not higher then 1 98 V Otherwise supply DVIO over J6 Do not close if VCC gt 1 98 V as it ma
24. Figure B 42 MSP TS430PN80 Target Socket Module PCB 94 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PN80 Table B 23 MSP TS430PN80 Bill of Materials Pos Ref Des Description Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 DNP Only recommendation 0 4 pF SMD0805 Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with 6 J1 J2 J3 0 25 pin header TH kit Keep vias free of solder SAM1029 20 ND Header SAM1213 20 ND Receptacle 7 95 JP1 2 3 pin header male SAM1035 03 ND 8 J6 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 0 E on J6 JP2 JP1 Pos1 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH MAE O solder Q1 Micro Crystal MS1V T1K 12 01 02 0 Crystal 32 768 C Load solder 12 5pF 13 R3 1 560 SMD0805 541 560 R1 R2 R4 14 R6 R7 R10 2 0 Q SMD0805 541 000ATR ND DAP RA RG R7 R10 RIT R12 R11 R12 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket
25. 440 35 c JF J2 11 15 Texas 20 INSTRUMENTS 5 5430 23 0 2 2 MSP TS430QFN23x0 Connector J5 External power connector Jumper JP1 to ext Figure B 20 MSP TS430QFN23x0 Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 59 5 INSTRUMENTS MSP TS430QFN23x0 www ti com Table B 11 MSP TS430QFN23x0 Bill of Materials Pos Ref Des Description DigiKey Part Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C3 1 10uF 10V Tantal Size 511 1463 2 ND 3 C4 1 100nF SMD0805 478 3351 2 ND 4 C5 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP headers and receptacles enclosed with 6 J1 0 10 header TH kit Keep vias free of solder SAM1034 10 ND Header SAM1212 10 ND Receptacle T Place jumper on header 7 J5 JP1 2 3 pin header male TH SAM1035 03 ND JP1 Pos 1 2 8 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH solder Micro Crystal MS1V
26. 5 INSTRUMENTS MSP TS430PZ100 www ti com Jumper J6 Jumper J7 Open to disconnect LED Open to measure current 14 118 6000000 1 00000 000002 LED connected to 12 JTAG nag B OTST 15 83 Open 26 if LCD connected Connector J5 5 0000000000000000000000000 75 78 65 6a 55 1 External power connection 9 x Remove 8 and jumper 9 a lol 25 It gi oles 000000000 92 0 S C 99 998 o9 o9 o o o9 o 960 12 o9 o9 o IS 800 Al Orient Pin 1 of MSP430 device i 8 R12 Ri JF p cms S E am 5 jg 15 22 25 o000000000000000000000000 Figure B 48 MSP TS430PZ100 Target Socket Module PCB 104 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100 Table B 26 MSP TS430PZ100 Bill of Materials Pos Ref Des Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size 511 1463 2 ND DNP C6 3 C5 1 1
27. sacs 13 1 10 Kit Contents uud ais aca aan uma rana T3 1 1 Kit Contents 430 6137 900 etre r tet IR X GER RI S 14 1 12 Kit Contents 5430 0 6 6 14 113 5 16 1 14 Hardware Installation MSP FET430PIF 1 6 16 1 15 Hardware Installation 4 17 1 16 Hardware Installation 2430 MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 17 1 17 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 17 1 18 Important MSP430 Documents on the Web 18 2 Design Considerations for In Circuit Programming 1 19 2 1 Signal Connections for In System Programming and Debugging
28. JP10 11 JP1 JP2 2 header male TH SAM1035 02 ND Place jumper on header 12 Jumper 15 38 1024 ND See Pos 10and Pos 11 13 JTAG 1 nm connector male HRP14H ND 14 BOOTST 0 connector male DNP Keep vias free of solder Micro Crystal MS3V T1R 15 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 16 02 0 Crystal 78134 Q2 Keep vias free of solder http www ettinger de Ar 17 0 Insulating disk to Q2 t Detail cfm ART ART NUM 70 08 121 18 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 R4 R6 19 R8 3 0 Ohm 0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 20 R5 1 47k O SMD0805 541 47000ATR ND Socket QFN11T048 21 U1 1 008 A101121 RGZ48 Manuf Yamaichi 22 PCB 1 81 x 76 mm 2 layers for example Adhesive Approximately 6mm 23 plastic feet 4 width 2mm height S Part No SJ Apply to corners at bottom side 24 MSP430 2 MSP430F5342IRGZ DNP enclosed with kit supplied by TI 72 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback MSP TS430RGZ48C JTAG JTAG Mode selection 2 wire 4 wire JTAG Set jumpers JP3 to JP8 to position 2 3 SpyBiWire Set jumpers JP3 to JP8 to position 1 2 GND VCC J2 Ext_PWR 4 5 INSTRUMENTS B 15 MSP
29. 73 Hardware Copyright 2009 2014 Texas Instruments Incorporated Figure 29 MSP TS430RGZ48C Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback 5 INSTRUMENTS MSP TS430RGZ48C www ti com 10 Connector JTAG 000001 Connector BOOTST For JTAG Tool 000002 For BSL Tool Jumper J1 J1 TCK TMS IDI C5 Ext Power select exti JTAG II ONT owe 2552 we Connector J2 ext for external supply Vec ae ORE TEXAS GN External Power int for tool supply INSTRUMENTS 550 J1 connect to ext JP7 JP6 4 12 Jumper JP1 bidon RST SBWTDIO TEST SBWTCK Power measurement zg MSP TS430RGZ48C 2 Jumper JP2 20 15 S A Analog Digital Power TEM 20 Clamshell 0000 Jumper JP3 8 Connect 1 2 for SpyBiWire Connect 2 3 for JTAG Debugging LEDs connected to P1 0 P1 1 P1 2 via JP9 JP10 JP11 only D1 assembled R1 D1 ampio R10 D2 D R11 03 88 8BP 2 QFN11T048 008 A101121 me Device Pin 1 Switch SW2 connected to
30. 1 a gt 5 i lt 55 05 of 2 5 1 o a o 2 gt RV 65 858 B 9 yo 52 5 2 2 5 35 85 2 gt O lt PS gt 2 9 amp 2040 5 z Figure B 63 EM430F6137RF900 Target board Schematic SLAU278Q May 2009 Revised February 2014 Hardware 129 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 LED D1 green connected to P1 0 via JP5 connected to P1 7 INSTRUMENTS EM430F6137RF900 www ti com JTAG connector Jumper JP2 7 current Close EXT for external supply Jump Close INT for J AG supply External power connector bee 2 12 JTAG GND Jumper JP1 2 Close osition to Open to disconnect LEDs ebo in Tm jumper JP5 JP10 aes JTAG mode 2 position B a ee to Oo Spy Bi Wire mode Push button 52 INSTRUMENTS EM430F6137RF980 Rev 3 2 cio C522 Footprint for 32kHz crystal Use 00 resistor for R541 R551 to makeP5 0 P5 1 available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA R441 L451 L401 L411 A 8 422 2 421 C381 A C402 L41
31. 201 0804 014 Manuf Yamaichi 17 PCB 1 77 77 2 layers Adhesive for example Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height Part No SJ 5302 side 19 MSP430 2 MSP430FG439IPN DNP Enclosed with kit supplied by TI SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 95 X TEXAS INSTRUMENTS www ti com MSP TS430PN80A B 22 MSP TS430PN80A UCC 9 R2330R JP5 lt SBH LL103ph XTLGND2 1 ieur ieenr SB C12 T l GND lt R3 KI 3 pi 330R lt JTAG GND BSL Interface BOOTST C11 100nF DUCC1 I QF P8 PN Socket Yamaichi C201 0804 014 2 a n 0 0 0 0 0 E for F532x GND gt Note If the system should supplied via LDOI 762 close and set JP3 to external LDOI b sel a MSP430 Target Socket MSP TS430PN80B TITLE MSP TS43 PN8 A Document Number Date 8 25 2010 12 43 41 PM Sheet 1 1 Schemati TS430PN80A Target Socket Module 43 MSP igure F Submit Documentation F
32. 2 6 15 7 B 31892 301129 16 uu 9 8 04 3 150091 Z Cd IQL 41224 S THOUd33 0 b 150091 oj aq Edf 15004 ATddns si2euuo2 95 2 70 68 21 edh 208 8 8NId 6 __ 6 5500 27 cTNId ETNId bt Y 2200 euo JONG 40 neauseieg 2172691 154 529 001 101 V2d SWL 9 Zzd 21 2691 20 ZNId 2 90 9NId 9 GNId Zhetoa Q Zd 21 TNId 150080 5540 2200 1x3 2200 5500 OT 1823315 08214 SNId Figure B 5 MSP TS430L092 Target Socket Module Schematic 37 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430L092 www ti com Settings of the MSP TS430L092 Target Socket Figure B 6 shows the PCB layout of the MSP TS430L092 target socket The following pinning is recommended e JP1 is write enable for the EPROM If this is not set the EPROM can only be read e JP2 conn
33. 9 J1 10 Jumper 15 38 1024 ND Place on JP1 JP2 JP9 91 JP4 JP5 JP6 JP3 JP5 JP7 JP8 JP6 JP7 JP8 7 R2 R3 R5 R6 9 DNP 0805 DNP R8 R9 R10 R11 R14 8 R12 R13 R7 3 OR 0805 541 000ATR ND 9 C5 1 1 1nF CSMD0805 490 1623 2 ND 10 C3 C7 2 1uF 10V CSMD0805 490 1702 2 ND 11 R4 1 47k 0805 541 47000ATR ND 12 C4 C6 2 100nF CSMD0805 311 1245 2 ND 13 R1 1 330R 0805 541 330ATR ND 14 C1 C2 C8 C9 4 DNP 5 00805 DNP 15 SW1 SW2 2 EVQ 11L05R P8079STB ND DNP Lacon 1251459 16 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 17 JTAG 1 14 pin connector male TH HRP14H ND 18 Q1 1 DNP MS3V TR1 32768kHz depends on application Micro Crystal DNP enclosed in kit keep vias 20ppm 12 5pF free of solder 19 Q2 1 DNP Christal depends on application DNP keep vias free of solder 20 1 Socket QFN11T048 008 Manuf Yamaichi A101121 001 20 1 U1 1 MSP430 DNP enclosed with kit Is supplied by 21 D1 1 green LED DIODE0805 P516TR ND 22 D3 1 red DNP DIODE0805 DNP 23 D2 1 yellow DNP DIODE0805 DNP 24 TP1 TP2 2 Testpoint DNP keep pads free of solder 25 Rubber stand off 4 Buerklin 20H1724 apply to corners at bottom side 26 PCB 1 79 6 x 91 0 mm MSP TS430RGZ48C 2 layers black solder mask Rev 1 2 SLAU278Q May 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 75 MSP
34. Date 3 20 2008 08 03 58a Sheet 1 1 115 Hardware Schematic TS430PZ5x100 Target Socket Module Copyright 2009 2014 Texas Instruments Incorporated B 55 MSP Figure SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback MSP TS430PZ5x 100 Connector J5 External power connector Jumper J3 to ext Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP3 TEXAS INSTRUMENTS www ti com 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply 7114 0000000 00000002 JTAG GND GND 75 78 65 68 55 51 ucc ele TEXAS INSTRUMENTS e e R4 e e Bcia 5 5 ez 53 cs de e ra i Jom 5 Si e 2 4 JTRG 8 052 J2 je e 6 qe le e 00000000 le e e 00000000 e Loewe n ie e 24 5 r CS 01 oe BEB ERs 5 2 8 R2 e e es E LED connected to P1 0 1 5 19 7115 28 Jumper JP2 Open to disconnect LED Figure B 56 MSP TS430PZ5x100 Tar
35. Ic Submit Documentation Feedback Schemat SLAU278Q May 2009 Revised February 2014 TS430RHA40A Target Socket Module Copyright 2009 2014 Texas Instruments Incorporated igure B 23 MSP F Hardware 64 13 TEXAS 1 000090 000092 INSTRUMENTS www ti com 2 0000000 JTAG oie MALE Jumper JP2 int SBI pg Open to measure current BOOTST INSTRUMENTS a ER 5 R2 GND 87 a 728 JP7 JP6 5 JP4 0000000000 20 15 11 4 000000000 31 35 40 MSP TS43 RHA4 A Rev 1 8 RoHS MSP TS430RHA40A Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode D1 LED connected to P1 0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure 24 MSP TS430RHA40A Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 65 5 INSTRUMENTS MSP TS430RHA40A www ti com Table B 13 MSP TS430RHA40A Bill of Materi
36. MSPSISA30RSBAO IN ERR REN IHRE MEAE NN METER UNE ERA UK ERU CN E 61 8412 5 4 eh x oma va caius 64 13 54 cR 67 814 5430 6748 00400 0 a E Eaa ers rock ETE 70 8 15 430 748 e 73 816 5 15 76 2 Contents SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com 817 MSP2TS430PM64A tel deed OR PR PUR tdvedtend 79 818 5 15430850648 82 19 165430 064 RD C PONE RAM EE 85 B 20 MSP TS430RGGOA4USB neat cide 89 B21 18430 80 a P ND 93 22 54 96 23 5430 5
37. an e e nx e e 5 1 1 e 01 a 1812 7 13 DB se 5 5 eec n R8 C1 C2R6 82 C6 9 1 5 10 15 28 25 0000000000000000000000000 Figure B 58 MSP TS430PZ100USB Target Socket Module SLAU278Q May 2009 Revised February 2014 Hardware 119 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PZ100USB www ti com Table B 31 MSP TS430PZ100USB Bill of Materials Pos Ref Des Boer er Description Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND C5 C11 3 C13 C14 5 100nF SMD0805 311 1245 2 ND C19 C10 C12 3 1 C18 C17 0 100nF SMD0805 311 1245 2 ND DNP C10 C12 C18 C17 4 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 43 44 4 25 SAM1029 25 ND Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with kit 7 1 4 25 SAM1213 25 ND Keep vias free of solder Heade
38. 22 P1 6 TDI P3 7 TRACLK CROUT P4 3 UREF X P4 4 UREF 4X ojoje SLAU278Q May 2009 Revised February 2014 MSP TS430PW28A 8 MSP TS430PW28A 9 9 ewe 14 1 1 17111 ewm 12 1 1 112 13 14 14 01 8 eme 10 10 11 11 12 12 13 13 14 14 NIN IAIN P3 6 TAQ 2 49 5 P2 5 TAL2 P2 4 TAL 2 P2 3 TR1 0 15 lo elele gt G2XXX PW28 ENPLASSOCKET Socket ENPLAS OTS 28 0 65 01 1 DNP RST SBHTDIO MSP TS43 PW28A Socket Board for TITLE 62XXX and F20XX MSP TS43 PW28A Document Number Date 10 14 2010 9 34 34 AM Sheet 1 1 TS430PW28A Target Socket Module 15 MSP igure F Hardware 52 Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1 0 0000000 00000002 0090900 009002 10 BOOTST 5 R28 RS ucc 2 0 5 28 0 65 01 00 TEXAS INSTRUMENTS MSP TS43 PW28A Rev 1 8 RoHS e eere amp lt
39. 222222222 12 17 SEL 12 4 8 Contents eZ430 Chronos2 00 2222 2222 13 1 9 KitGontents MSP EET430UIE 22222222 222222222222 13 110 Kit Contents 5 TE 13 15 FET430F6137RF900 em 14 1 42 15 amp 65430 cere EE 14 113 Kit Gontents 1 7 90 0 16 1 14 Hardware Installation MSP FET430PIF 16 115 Hardware Installation MSP FET430UIF 17 1 16 Hardware Installation 2430 MSP EXP430G2 MSP EXP430FR5739 MSP EXPA430E5529 17 1 17 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 7 9 17 1 18 Important MSP430 Documents the Web 18 10 Get Started Now SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Flash Emulation Tool FET Overview 1 1 Flash Emulation Tool FET Overview offers several flash emulation tools according to different requirements Table 1 1 Flash Emulation Tool FET Features and Device Compatibility
40. SAM1035 03 ND 9 JP10 place jumpers JP8 JP9 pins 1 2 on JP3 JP10 JP1 JP2 13 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and Pos 13 15 JTAG 1 connector male 4RP14H ND 16 BOOTST 0 Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5 Q2 4MHz Buerklin 18 Q2 0 Crystal 780134 Q2 Keep vias free of solder insulatin http Awww ettinger de Art iih ieoa 0 Insulating disk to 02 _Detail cfm ART_ARTNU M 70 08 121 20 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 R4 3 0 Ohm 5 00805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R11 R12 22 R5 1 47k Q SMD0805 541 47000ATR ND Socket QFN11T064 006 inhi 23 U1 1 N HSP Manuf Yamaichi 24 PCB 1 85 x 76 mm 2 layers for example Adhesive Approximately 6mm E 5 25 plastic feet 4 width 2mm height Part SJ Apply to corners at bottom side 26 D3 D4 27 MSP430 2 MSP430F5310 RGC DNP enclosed with kit supplied by TI 84 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430RGC64C 19 MSP TS430RGC64C The MSP TS430RGC64C target board has been designed with the option to operate with the ta
41. UCORE 32 7337 P4 8 TARCLK ACLK 36 36 1 2 34 34 33 33 2 D4 4 PM UCALTXD PH UCR1SIMO C11 100nF 8 ND 38 7 37 XTLGND2 d 5 430 Target Socket MSP TS430RG248B for F534x TITLE MSP TS430RG248B Document Number Date 10 15 2010 11 44 25 Sheet 1 1 Schemati TS430RGZ48B Target Socket Module 27 MSP igure F SLAU278Q May 2009 Revised February 2014 Hardware 70 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGZ48B Connector J5 Ucc 14 5110 eoooe 000000 02 009002 Jumpers 5 to JP10 BHDTST 9 9 95 Close 1 2 to debug in Spy Bi Wire mode 54555 55 zz Close 2 3 to debug in 4 wire JTAG mode Curr JPA 210811 48 42 37 Meas C84 C8 R5 21225 5 543086248 Rev 1 0 RoHS e s Orient Pin 1 of MSP430 device Ut 5 e QFN111048 008 8101121 C6C14 e
42. 17 R6 2 0 SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 18 R10 1 100 SMD0805 Buerklin 07E500 18 R11 1 1M SMD0805 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 Socket QFN11T064 006 Manuf Yamaichi 20 PCB 1 79 x 77 mm 2 layers 2 RE UE 4 Buerklin 20H1724 to corners at bottom 22 MSP430 2 MSP430F5509 RGC 422 WIRES Insulating http www ettinger de Art De 3 disk to Q2 1 Insulating disk to Q2 2 27 C33 1 220 SMD0603 Buerklin 53D2074 28 C35 1 10 SMD0603 Buerklin 56D102 29 C36 1 10 SMD0603 Buerklin 56D102 30 C38 1 220 SMD0603 Buerklin 5302074 31 C39 1 4u7 SMD0603 Buerklin 53D2086 32 C40 1 0 1u 6 00603 Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 24S3406 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 91 5 INSTRUMENTS MSP TS430RGC64USB www ti com Table B 22 MSP TS430RGC64USB Bill of Materials continued Pos Ref Des No Per Description DigiKey Part No Comment Board 34 1 TPD4E004 Manu Tl 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 852 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 SEM 0 470R Buerklin 07E564 DNP 41 R33 1 1k4 1k5 Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27
43. 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F6147RF900 Table B 35 EM430F6147RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 26MHz ASX 531 CS ELECTRONIC 1 5 C112 C252 C381 2 C391 C421 14 CD CH SMT 0402 CER 16V 10 0402YC104KAT2A AVX C431 C451 C522 C562 CAPACITOR SMT 0603 CERAMIC 0 47 3 C101 0603YD474KAT2A AVX 4 R511 1 50402 47 0K CRCW04024702F100 DALE HEADER THU MALE 14P 2x7 5 CON11 22 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V 1608 KINGBRIGHT HEADER THU MALE 3P 1x3 10 CON12 22 03 5035 MOLEX 11 C361 C371 2 5 27pF GRM36COG270J50 MURATA 12 L451 1 Inductor SMD 0402 12nH 5 370mA LQW15AN12NJ00 MURATA CAPACITOR SMT 0402 CERAMIC 100pF 13 C403 GRM1555C1H101JZ01 MURATA INDUCTOR SMT 0402 2 2nH 0 2nH 14 L414 te LQW15AN2N2C10 MURATA 15 L413 1 Inductor SMD 0402 15nH 5 370 LQW15AN15NJ00 MURATA 250MHz 15 L415 1 LQW15AN15NJOO MURATA 16 L402 L412 2 Inductor SMD 0402 18nH 5 460mA LQW15AN18NJOO MURATA 250MHz CAPACITOR SMT 040
44. R1 0 DN JP9 2 7 3 TC HF ADD LCD CAP GND If supplied by interface populate R11 OR remove 10 supplied locally populate R10 OR remove R11 MSP TS430PM64A Target Socket for F4152 TITLE MSP TS430PM64A Document Number Date 3 29 2011 3 07 02 PM Sheet 1 1 Figure B 33 MSP TS430PM64A Target Socket Module Schematic 79 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PM64A Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP2 Open to measure current Orient Pin 1 of Device Jumper JP3 TEXAS INSTRUMENTS www ti com 1 2 int Power supply via JTAG interface 4 22 ofzie fede tele grag lt SBW 94005 R6 Lele JP5 18 JP7 JP6 J4 0 50 R2 00 64 60 55 49 e aa 1 51 0644 807 Wag aslo Sau 3 gt 5 446 P 4 a j R e a Clamshell 356 a Ui e 17 20 J2 25 32 le 20006060060060060000 0 2 3 ext External Power Supply Jumper
45. Yamaichi 25 PCB 1 90 x 82 mm 2 layers for example Adhesive Approximately 6mm 26 plastic feet 4 width 2mm height Eu uh Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F6733IPZ enclosed with kit supplied by TI SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 111 5 INSTRUMENTS MSP TS430PZ100C www ti com B 27 MSP TS430PZ100C w 2 n 5 w zh D 3 8 5 gre 5 s o vcc b 5826 B seg LES i SS M sgg k 5 3 3 i 2 B 5 5 5g 2 5 Uc TUS oum Pu o zg S gh 8 2 5 1 U N ziy ITOcIX UH Won 1 J2 F fro 9 2 92 x 3 FT 4 25 5 J5 2 56 of of a PWR3 7 o 2 7 a m NM BI S s z 5 e D 4 2 o mA 3 8
46. 0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 1 201 0804 014 Yamaichi 25 1 77 x 91 mm 2 layers for example Adhesive Approximately 6mm 26 plastic feet 4 width 2mm height EINE Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F5329IPN DNP enclosed with kit supplied by 98 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PN80USB 23 MSP TS430PN80USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V 9 5 1228 2 2 gh BB 0 as exco 5 LTD s e eS a 3 8 47 R11 D B 9 5 5 03 id 5 3 5 5 n 5 B lk 2 9 ala oR ER NEN 413
47. 2 15 1303 1305 Eres 0 015uH LOW15AN15NGO0 MURATA INDUCTOR SMT 0402 18nH 2 16 1292 1302 a 0 018uH 1 15 18 000 MURATA 8 0402 GRM1555C1H1ROW _ 17 C291 1 1pF 50V 0 05pF COG NPO 701 MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H8R2W E 18 C303 1 8 2pF 50V 0 05pF COG NPO 82pF 701 MURATA C292 C301 CAPACITOR SMT 0402 CERAMIC GRM1555C1H1R5W 19 C302 C304 4 5pF 0 05pF COG NPO 152 701 MURATA INDUCTOR SMT 0402 12nH 2 20 1291 1301 2 0 012uH 1 15 12 000 MURATA C282 C312 0312 CAPACITOR SMT 0402 CERAMIC GRM1555C1H2R0B 21 0351 0361 BS E 2 0pF Soy Murata INDUCTOR SMT 0402 6 2nH 0 1nH 22 L1 1 bros 6 2nH LQP15MN6N2BO2 Murata ULTRA SMALL TACTILE SWITCH SMT m MESE 2 SPST NO 1 2x3x2 5mm 0 05A 12V OMRON R4 R5 8051 M UNINSTALLED RESISTOR JUMPER 24 RO6T R431 0402 00 5 ew 00 20 DNP 24a R7 1 JUMPER 00 ERJ 2GEOROOX RESISTOR SMT 0402 THICK FILM 25 R2 R3 R6 ee ew ace 3300 ERJ 2GEJ331 PANASONIC CAPACITOR SMT 0402 CER 12pF 26 C431 C441 8 NED 12 ECJ OEC1H120J PANASONIC CAPACITOR SMT 0402 CER 2200pF 27 C401 1 Bay 0 0022uF ECJ 0EB1H222K PANASONIC 28 R331 1 RESISTOR SMT THICK FILM 56K 56kQ ERJ 2GEJ563 PANASONIC 1 16W 5 C081 C221 CAPACITOR SMT
48. CSMD0805 490 1628 2 ND 11 13 14 16 7 4 7uF 6 3V CSMD0805 587 1302 2 ND C17 C18 C19 C29 12 C11 1 10uF 6 3V CSMD0805 445 1372 2 ND 13 C12 1 10uF 6 3V CSMD0805 445 1372 2 ND DNP 14 C1 C2 2 12pF CSMD0805 490 5531 2 ND DNP 15 R5 1 47K 0805 311 47KARTR ND C4 C5 C6 C7 C8 100nF CSMD0805 311 1245 2 ND 16 6 C15 17 C9 1 100nF CSMD0805 311 1245 2 ND DNP 18 R3 R7 2 330R 0805 541 330ATR ND 19 C10 C26 2 470nF CSMD0805 587 1282 2 ND 20 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 21 JTAG 1 14 pin connector male TH HRP14H ND 22 IC1 Socket 1 Socket 500 1284 009 Manuf Yamaichi 23 2 MSP430F67791IPEU DNP enclosed with kit Is supplied by TI 24 J5 1 3 pin header male TH SAM1035 03 ND 25 Q1 1 Crystal MS3V T1R 32 768kHz DNP Crystal enclosed with kit Keep vias 12 5pF 20ppm free of solder 26 TP2 2 Test point DNP keep vias free of solder 27 2 2 26 SAM1029 26 ND DNP Headers enclosed with kit Keep vias free of solder 28 2 2 26 receptable SAM1213 26 ND DNP Receptacles enclosed with kit Keep vias free of solder 38 pin header TH SAM1029 38 ND DNP Headers enclosed with kit Keep vias 29 J1 J3 2 free of solder 38 pin receptable TH SAM1213 38 ND DNP Receptacles enclosed with kit Keep 30 J1 J3 2 vias free of solder 31 Rubber feet 4 Rubber feet Buerklin 20H1724 apply to bottom side corners Hardware SLAU2
49. Individual Kit Contents MSP TS430xx Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP TS430D8 8 pin D MSP430G2210 1 x MSP430G2210 and Two PCB 1x4 pin headers two male and green PCB TSSOP ZIF MSP430G2230 1 x MSP430G2230 two female MSP430F20xx MSP430G2x01 MSP TS430PW14 14 pin PW Four PCB 1x7 pin headers two male and green PCB TSSOP ZIF 2 two female MSP430G2x31 Four PCB 1 7 headers two male and two female Micro MaTch 10 pin T female connector is also present on the 72 TSSOP MSP TS430L092 2 x MSP430L092IPW PCB which connects the kit with an 9 Active Cable PCB this Active Cable PCB is connected by 14 pin JTAG cable with the FET430UIF MSP TS430PW24 24 pin PW Four PCB 1x12 pin headers two male green PCB TSSOP ZIF MSP430AFE2xx 2 x MSP430AFE253IPW and two MSP430F11x1 MSP430F11x2 MSP TS430DW28 28 pin DW O 2 x MSP430F123IDW Four PCB 1x12 pin headers two male green PCB SSOP ZIF MSP430F21xx and two female Supports devices in 20 and 28 pin DA packages MSP430F11x1 MSP430F11x2 MSP TS430PW28 28 pin PW A Four PCB 1x12 pin headers two male green PCB TSSOP ZIF Meus DEC D ARN and two female 5 430 21 MSP430F20xx MSP430G2xxx 14 20 on MSP TS430PW28A 28 pin PW and 28 pin PW packages 2 x MSP430G2452IPW20 Four PCB 1x12 pin headers two male red PCB TSSOP ZIF MSP430TCHSE in PW and t
50. R12 19 R5 1 47k Ohm SMD0805 541 47000ATR ND 20 U1 1 Socket 357 1004 53 Manuf Yamaichi MSP TS430PZ100C 21 PCB 1 79 5 x 99 5 mm Rev 1 0 2 layers 22 Rubber 4 Buerklin 20H1724 apply to corners at bottom side stand off 24 16 1 4 7 nF SMD0603 Buerklin 53 D 2042 26 D3 D4 2 LL103A Buerklin 24S3406 27 JP11 1 4 pin header male TH SAM1035 04 ND Place jumper on Pin 1 and Pin 2 28 C15 1 4 7 uF SMD0805 Buerklin 53 D 2430 29 C21 1 220nF 5 00805 Buerklin 53 D 2381 114 Hardware Copyright 2009 2014 Texas Instruments Incorporated SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback MSP TS430PZ5x100 X5 TEXAS INSTRUMENTS B 28 MSP TS430PZ5x100 www ti com UCC R7 3308 1295 ns DI 00 XTLGND2 2 2nF C8 RST NMI DNP If BSL is used If external supply voltage remove R11 and add R10 QFP100PZ XTLGND1 Socket Yamaichi 1C201 1004 008 NN G OO 10 0 IN O0 D NL OO x 10 OO D 9 00 00 00 00 00 CO s TT TTT TTT TH 5 430 Target Socket 5 5430 25 100 for F543x TITLE 5 5430 25 100 Document Number
51. R17 C 22 178 17 8 GND GND R18 UCCT 3 1 1 24 100u 16U R48 39k2 8 17 apc2 R19 22 170 17 GND BUCHSE2 J4 BUCHSE2 IN1 OUTI UCCT 1 8U 5U IN2 0072 EN FB PG 185 e 4 17 242 160 DI 2k2 872 RIS 201 0 1 Ct R47 c37 22k1 0 17 T GND GND R14 C17 22k1 0 17 Tu GND GND 39 2 0 14 CI CI ES 1 8 17 GND m 100 6 681 0 17 TPS77301DGK USBFET TITLE Document Number Date 7 25 2006 03 38 10 MSP FETU43 I1F Sheet 3 4 141 4 Ic Schemati FET430UIF USB Interface igure B 71 MSP F SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated www ti com Xi TEXAS INSTRUMENTS RST 3410 R13 33k cg 1u 6 39 GND TXD 144148 UREGEN RESET SUSPEND CLKOUT SIN SOUT SDA SCL P3 0 P3 1 P3 3 P3 4 X1 2 05 3410 R33 1 5 UCC R45 100k 1 R32 100k 717 100nF T GND UBUS R46 33R R24 338 C35 22 GND SHIELD SHIELDI USB_RECEPTACLE Type B 33k 012 SN75240PH 4 of
52. Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ100 24 MSP TS430PZ100 reserved for further enhancement 1 1 1 R12 1 55 you 6 pue gu 991 ST 091 1 8nF 10uF 6 3U 180uF 6 3U ot assembled IJT 6234 159 1194205 800 007 170221 FE25 1A4 JALIL UT S23j iueunoog TY 6002 82 8 EI eisfuo J 1284405 104 pe quesse 00724 06 51 5 pue 1 40 2 5 1 1 205 1 ou WY E pesn st 158 ebei o Atddns euaaixe 6440 8 BTY PPE pue TTY NOTE Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made Figure B 47 MSP TS430PZ100 Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 103 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated
53. 0603 CERAMIC si ciel 10uF ECJ 1VBoJ106M PANASONIC SLAU278Q 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 127 5 INSTRUMENTS EM430F5137RF900 www ti com Table B 33 EM430F5137RF900 Bill of Materials continued No per e Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment 30 R1 1 RESISTOR JUMPER SMT 0402 0 00 ERJ 2GEORO0X PANASONIC 5 1 16W UNINSTALLED CAP CERAMIC 4 7UF 31 041 0 6 3V X5R 0603 4 7uF ECJ 1VB0J475K Panasonic DNP 32 x1 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER 33 Q2 0 Crystal SMT 32 768 kHz 32 768k MS3V T1R Micro Crystal DUT SMT RGZ 48 0 5mmLS m 7 15x7 15x1mm THRM PAD 430 52 1 n 35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 36 1 9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP 37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 38 gio ie 3 Pin Connector 1x2pin 61300211121 WUERTH 38a JP7 CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP 39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP 40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 128 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti c
54. 11 9 n 2 n 611 m m5 Clamshell Je Jumper JP2 PE _ 4 Open to disconnect LED R2 TEXAS P PU INSTRUMENTS R3 H 13 18 24 01 LED connected 1 0 T jeeeeeeeeeeee External power connector Jumper JP1 to ext Jumper JP1 Open to measure current Figure B 28 MSP TS430RGZ48B Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 71 5 INSTRUMENTS MSP TS430RGZ48B www ti com Table B 15 MSP TS430RGZ48B Bill of Materials Position Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 B C7 3 10 6 3V SMD0805 C12 C5 C11 4 C13 C14 4 100nF SMD0805 311 1245 2 ND 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 12 ND DNP Headers and receptacles 8 J4 0 12 Header SAM1213 12 enclosed with kit Keep vias free of ND Receptacle solder 9 J5 1 3 pin header male TH d place jumpers on pins 2 3 on JP5 10 JP8 9 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers pins 1 2 on
55. 2 TA ang Ele gt MES gt 15 LED1 470R p n 5 R15 2 1 02 5 Be e m R16 t J S 3 AS a cu outs m gt 9 e B m R13 v m 9S 3 M n Ss 842 3 5 s 2181 5 3 S R 28 9 Figure B 57 MSP TS430PZ100USB Target Socket Module Schematic 118 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100USB ucc J3 GND 00 00000000000000000000000070 8 en J 5 70 65 60 55 51 nie 35 2210 INSTRUMENTS ee i7 n ee 22 n e 2 _ 2 42 235 C19 e S 10 c36 c39 38 02 000000000 e GND e e 28 o v Jmm UBAT 10 14 e 1 oucc ED 55 de JP3 R12 eee 02 LED gt e e lea jess e c9 R15
56. 2014 Copyright 2009 2014 Texas Instruments Incorporated Figure B 3 MSP TS430PW14 Target Socket Module Schematic Hardware 34 5 INSTRUMENTS www ti com LED connected to P1 0 Jumper J4 Open to disconnect LED Orient Pin 1 of MSP430 device 5 54300414 Rev 2 0 Figure 4 MSP TS430PW14 Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PW14 Connector J3 External power connector Jumper 45 to ext Jumpers J7 to J12 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG mode Jumper J6 Open to measure current Hardware 35 MSP TS430PW14 36 TEXAS INSTRUMENTS www ti com Table B 2 MSP TS430PW14 Bill of Materials m No per mer Position Ref Des Board Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C7 1 ps 10V Tantal Size 511 1463 2 ND 3 C3 C5 1 100nF SMD0805 478 3351 2 ND DNP C3 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with kit Keep vias free of i solder 6 J1 J2 0 7 pin header TH SAM1029 07 ND Header SAM1213 07 ND Receptacle 93 45 J7 3 Place jumpers on headers 45 J7 J8 7 48 99 J10
57. 54 mm place jumpers on pins 2 3 SAM1035 03 ND 12 JP3 3 pin header male TH 1 3 Grid 100mil place jumper on pins 1 2 SAM1035 03 ND 13 JP1 JP2 JP4 2 pin header male TH 168097 102 Grid 100mil jumper on header SAM1035 02 ND Place on JP1 JP2 JP3 14 10 Jumper JP5 JP6 7 15 38 1024 ND JP9 JP10 Header THD 2x7 Pin 15 1 JTAG 2x7Pin Wanne Wanne 100mil spacing HRP14H ND 2 5 16 0 BOOTST 2x5Pin Wanne Wanne 100mil spacing DNP CRYSTAL SMD 5x3MM 17 1 Q1 26 2 5 53 26MHz Only Kit 02 26MHz ASX53 Gay ST at 300 8219 1 ND 26MHz DIODE SMD SOD123 m 19 1 03 LL103A Schottky Buerklin 24S3406 20 2 R3 R7 330 Ohm SMD0805 541 330ATR ND 21 1 R5 47k Ohm SMD0805 RES SMD 0805 1 8W x 541 47000ATR ND R1 82 R4 22 R6 R8 R9 0 Ohm 5 00805 RES SMD 0805 1 8W x DNP R6 8 R9 R10 popa TR ND R11 R12 R10 R11 R12 23 1 Ut Socket QFN11T064 006 N Yamaichi HSP IC MCU SMD 9 15x9 15mm 24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket 25 4 Rubber stand Rubber stand off apply to corners at bottom Buerklin 2081724 26 1 PCB 84 x 76 mm 84 x 76 mm 88 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com 20 MSP TS430RGC64USB
58. BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1 Figure B 41 MSP TS430PN80 Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 93 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PN80 TEXAS INSTRUMENTS www ti com LED connected to 12 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device 2218 090902 Ucci 21 00 5 018 v Rm JTAG ETP d 3 7 00000000000000000000 5 55 50 13 45 41 J5 o E 6150 79 9 e 2 je 5 Ze e 4 0000000 05 2v 2 le Se F2x1x Y S ees ee 9 3 Ole 6 22 O See ese ess C3 le sie e a e Be a 1 gt ww ce 52 7 E c2E JF 1 2 mcs LEXTE e n ale Z R2 5 12 15 20 Connector J5 External power connection Remove R8 and jumper R9
59. EN o N 6 5 S 92 4 T N S M Figure 53 MSP TS430PZ100C Target Socket Module Schematic 112 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED MSP TS430PZ100C PTS el o a xl 5058 2 9 384 9 09 60H 5 5430 2100 Rev 1 1 1 R3 JPZ Connector J5 External power connector Jumper JP3 to ext If the system should be supplied via LDOI J6 close JP4 and set JP3 to external O Figure B 54 MSP TS430PZ100C Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 113 5 INSTRUMENTS MSP TS430PZ100C www ti com Table B 29 MSP TS430PZ100C Bill of Materials Number Pos Ref Des Per Description Digi Key Part No Comment B
60. Figure B 60 MSP TS430PEU128 Target Socket Module PCB NOTE The MSP TS430PEU128 Rev 1 1 ships with the following modifications R7 value is changed to 0 instead of 330 e JTAG pin 8 is connected only to JP5 pin and not to pin 2 e JP5pin2 is connected to pin 97 BOOTST pin 7 is connected to pin 97 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 123 5 INSTRUMENTS MSP TS430PEU128 www ti com Table B 32 MSP TS430PEU1 28 Bill of Materials No Per Ref Des Description DigiKey Part No Comment Board 94x119 4mm 4 layers MSP TS430PEU128 4 layers green solder mask 1 PCB 1 Rev 1 1 D1 1 green LED DIODE0805 516 1434 1 ND JP1 JP2 3 2 pin header male TH SAM1035 02 ND Place jumper on header JP5 JP6 JP7 JP8 3 pin header male TH SAM1035 03 ND Place jumpers on pins 1 2 SBW 4 6 JP9 JP10 JP11 JP12 JP13 3 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 JP3 1 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 JP1 JP2 Jumper WM4592 ND 7 JP5 JP6 JP7 JP8 13 9 JP10 JP11 JP12 JP13 R1 R2 R4 R6 R8 5 OR 0805 541 0 0ATR ND R10 R11 2 OR 0805 541 0 0ATR ND DNP 10 1 2 2nF
61. TITLE MSP FETU43OIF Document Number Date 7 25 2006 03 38 10 Sheet 1 4 139 Hardware Figure B 69 MSP FET430UIF USB Interface Schematic 1 of 4 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP FET430UIF UCCT US 4 D5 TEST ICK SN74LUC16G125 4 LL1 3A SELT IMS 2 SN74LUC16125 915 4 SN74LUC16125 U34 4 SN74LUC1G125 U35 4 SN74LUC16G125DBU R91 1008 04 AQY 211 EHA 029 SN75240 E 270R AQY211EHA TARGET CON SN74LUC1G07DBU Cii zi e 100 C12 TGTRST R42 5 R21 1008 ITCK C R22 1808 SELT LI 1098 5 7419 161250 assembled SN74LUC1G 7DBU 3 n G USBFET MSP FETU43 I1F Document Number Date 7 25 2006 03 38 10 Sheet 2 4 2 of 4 Ic Schemati FET430UIF USB Interface 70 MSP igure F SLAU278Q May 2009 Revised February 2014 Hardware 140 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 4 TEXAS INSTRUMENTS MSP FET430UIF www ti com 3 6U 6 6U UF R16 38678 17 1
62. XOUT AUXVCC3 RTCCAP1 RTCCAPO P1 5 SMCLK CBO AS P1 4 MCLK SDCLK CB1 A4 P1 3 ADC10CLK TACLKIRTCCLI AS P1 ACLKITA3 1 A2 P1 1 TA2 1 VEREF A1 P1 0 TA1 1 TA0 0 VEREF A0 P2 4 PM_TA2 0 P2 5 PM_UCBOSOMI PM_UCBOSCL P2 6 PM_USBOSIMO PM_UCBOSDA PZ TIPM UCBOCLK UCAORXD PM UCAOSOMI UCAOTXD PM P3 2 PM_UCAOCLK P3 3IPM UCATCLK UCATRXD PM UCAISOMI 3 UCATTXD PM UCA1SIMO COMO P1 6 COM2 5 P5 2 COM6 LCDCAP R33 PS ASDCLK RZ3 P5 5 SDODIO LCDREFIR13 P5 6 SD1DIO RO3 P5 7 SD2DIO CB2 PG 0 SD3DIO UCAZRXD PM UCAZS UCAZTXD PM UCAZSII 2 4 UCBTSIMO PM UCB1SDA P4 2 PM_UCA3TXD PM_UCA3SIMO GRXDIPM UCASSOMI P4 1 PM_UCR P4 3 PM UCA3CLK UCBISOMIPM UCBISCL UCB1CLK PA TIPM TA3 0 P6 1 SD4DIO S39 6 2 505010 538 P6 3 SDEDIO S37 MSP430F677XIPEU 10 3 55 RST NMISBWTDIO PJ 3ITCK PJ 2TMS PLOTDO BOOTST OR TEST SBWTCK P23 PM TA1 0 22 0 2 P2 1 PM TAQ 1 2 TAO 0 P11 5 TACLK RTCCLK P11 4 CBOUT 11 3 2 1 11 2 1 1 P11 1 TA3 1 CB3 P11 0 80 P10 7 51 P10 6 52 P10 5 53 10 4 54 P10 2 56 P10 1 57 10 0 58 9 7 59 P9 6 S10 9 5 511 9 4 512 P9 3 S13 9 2 514 9 1 515 9 0 516 Dvss2
63. de sorte que la puissance isotrope rayonn e quivalente ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l imp dance requise pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur Important Notice for Users EVMs for RF Products Japan This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan you are required by Radio Law of Japan to follow the instructions below with respect to this product 1 Use this product in a shielded room or any other test facility as defined in the notification 173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product or 3 Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do n
64. nnne 96 List of Figures SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS www ti com 44 MSP TS430PN80A Target Socket Module 0 0 5 97 B 45 MSP TS430PN80USB Target Socket Module Schematic 99 B 46 MSP TS430PN80USB Target Socket Module 100 47 MSP TS430PZ100 Target Socket Module Schematic 222 103 48 MSP TS430PZ100 Target Socket Module PCB 104 B 49 MSP TS430PZ100A Target Socket Module 22 2 106 B 50 MSP TS430PZ100A Target Socket Module 000 22222 107 B 51 MSP TS430PZ100B Target Socket Module 22 22 109 B 52 MSP TS430PZ100B Target Socket Module 110 B 53 MSP TS430PZ100C Target Socket Module Schematic 1222 112 B 54 MSP TS430PZ100C Target Socket Module PCB 113 B 55 MSP TS430PZ5x100 Target Socket Module Schematic 22222 115 56 MSP TS430PZ5x100 Target Socket Module 0 2222 116 B 57 MSP TS430PZ100USB Target Socket Module
65. pin PZ Eight PCB 1 25 headers four male MSP430F44x 2 x MSP430FG4619IPZ green PCB QFP ZIF MSP430FG461x MSP430 and four female F47xx MSP TS430PZ100A 100 pin PZ Eight PCB 1x25 pin headers four male red PCB MSP430F471xx 2 x MSP430F47197IPZ ara four fonna MSP TS430PZ100B 100 pin PZ Eight PCB 1x25 pin headers four male blue PCB MSP430F67xx 2 x MSP430F6733IPZ and four Temale MSP430F645x MSP TS430PZ100C 100 pin PZ MSP430F643x Eight PCB 1x25 pin headers four male black PCB QFP ZIF MSP430F535x 2 x MSP430F64381PZ and four female MSP430F533x MSP430F543x MSP TS430PZ5x100 100 pin PZ Eight PCB 1x25 pin headers four male MSP430BT5190 2 x MSP430F5438IPZ green PCB QFP ZIF MSP430SL5438A and four female SLAU278Q May 2009 Revised February 2014 Get Started Now 15 Submit Documentation Feedback Copyright O 2009 2014 Texas Instruments Incorporated 16 5 INSTRUMENTS Kit Contents EM430Fx1x7RF900 www ti com Table 1 2 Individual Kit Contents MSP TS430xx continued Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP430F665x MSP TS430PZ100USB 100 pin PZ Eight 1x25 pin headers four male MSP430F663x 2 x MSP430F6638IPZ green PCB QFP ZIF MSP430F563x and four female MSP430F677x MSP430F676x Four 1x26 pin headers two male MSP TS430PEU128 128 pin PEU MSP430F674x green PCB QFP ZIF MSP430F677x1 2
66. to ensure that your use of the EVM will not result in any property damage injury or death even if the EVM should fail to perform as described or expected 4 You will take care of proper disposal and recycling of the EVM s electronic components and packing materials Certain Instructions It is important to operate this EVM within recommended specifications and environmental considerations per the user guidelines Exceeding the specified EVM ratings including but not limited to input and output voltage current power and environmental ranges may cause property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM User s Guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation some circuit components may have case temperatures greater than 60 as long as the input and output are maintained at a normal ambient operating temperature These components include but are not limited to linear regulators switching transistors pass transistors and current sense resistors which can be i
67. user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES 003 Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment Concerning EVMs including radio transmitters This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concerning EVMs including detachable antennas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio trans
68. voltage that is supplied by the TEST VPP pin during the fuse blow process If fuse blow functionality is not needed R2 is not required populate 0 and do not connect TEST VPP to TEST SBWTCK Figure 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx Devices Design Considerations for In Circuit Programming SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Signal Connections for In System Programming and Debugging Importanttoconnect MSP430Fxxx 1 O see Note Vel AV oI DV 42 see Note C2 L 63 R1 10 uF 0 1 HF 47 See Note JTAG TOOL TDO TDI RST NMI SBWTDIO VCC TARGET TCK GND TEST SBWTCK ci 2 2nF 1 See Note Make connection J1 if a local target power supply is used or make connection J2 if the target is powered from the debug or programming adapter device RST NMI SBWTDIO is used 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper lim
69. 0 Ohm MSP TS430DA38 Target Socket Board for MSP430F2247IDA TITLE MSP TS430DA38 Document Number Sheet 1 1 Date 6 18 2008 11 04 56 AM Figure B 17 MSP TS430DA38 Target Socket Module Schematic 55 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430DA38 www ti com Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG Mode LED connected to P1 0 Jumper JP3 Open to disconnect LED 6600000006 Orient pin 1 of 999999299 MSP430 device Jumper JP2 Open to measure current 0000000000 93 External power connector Jumper JP1 to ext 20 25 30 35 38 Figure B 18 MSP TS430DA38 Target Socket Module PCB 56 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DA38 Table B 10 MSP TS430DA38 Bill of Materials Pos Ref Des Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C7 1 10uF 10V Tantal Size 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 N
70. 00000000000000000000060 2 io 2 0 Rev MSP TS430PZ100A Jumper JP2 Open to disconnect LED LED D1 connected to P5 1 Figure B 50 MSP TS430PZ100A Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 107 5 INSTRUMENTS MSP TS430PZ100A www ti com Table B 27 MSP TS430PZ100A Bill of Materials Pos Ref Des Description DigiKey Part Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal spec 2 C7 C9 2 10uF 10V Tantal Size B 511 1463 2 ND 3 3 100nF SMD0805 311 1245 2 ND 4 C8 1 10nF SMD0805 478 1358 1 ND 5 C6 0 470nF SMD0805 478 1403 2 ND DNP 6 D1 1 green LED SMD0805 67 1553 1 ND DNP Headers and receptacles enclosed with 7 J1 d 93 0 25 header kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND pPlace jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 12 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH PINE MOOD VIdS solder Q1 Micro Crystal MS1V
71. 0080 10000000 Orient Pin 1 of MSP430 device Figure 12 MSP TS430DW28 Target Socket Module SLAU278Q May 2009 Revised February 2014 Hardware 47 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430DW28 www ti com Table 7 MSP TS430DW28 Bill of Materials Position Ref Des Description DigiKey Part No Comment DNP C1 C2 Cover holes while 1 C1 C2 0 12pF SMD0805 soldering 2 C5 1 100nF SMD0805 3 C7 1 10uF 10V Tantal Elko B 4 C8 1 10nF SMD0805 5 D1 1 LED3 T1 3mm yellow RS 228 4991 Micro Crystal MS1V T1K 6 Q1 0 QUARZ Crystal 32 768kHz C Load DNP Cover holes while soldering 12 5pF DNP Headers and receptacles enclosed with kit Keep vias free of 7 J1 J2 2 14 pin header TH male DNP Headers and receptacles enclosed with kit Keep vias free of 14 pin header TH solder 1 2 female Header Receptacle 8 J3 1 3 Pin Connector male 9 44 45 2 2 With jumper 10 BOOTST 0 ML10 10 Pin RS 482 115 DNP Cover holes while soldering 11 JTAG 1 ML14 14 Pin Conn RS 482 121 R1 R2 R6 R7 12 9 4 SMD0805 DNP 1 R2 R9 R10 R10 R11 13 R3 1 560R SMD0805 14 R5 1 47K SMD0805 15 Ut 1 SOP28DW socket 16 02 0 TSSOP DNP Hardware S
72. 0082 14 pin device PW package Enplas OTS 14 065 01 14 pin package for 1092 PW package Yamaichi IC 189 0142 146 24 pin package PW package Enplas OTS 24 28 0 65 02 28 pin device DW package Wells CTI 652 0028 28 pin device PW package Enplas OTS 28 0 65 01 38 pin device DA package Yamaichi IC189 0382 037 40 pin device RHA package Enplas QFN 40B 0 5 01 40 pin device RSB package Enplas QFN 40B 0 4 48 pin device RGZ package Yamaichi QFN11T048 008 A101121 001 48 pin device DL package Yamaichi IC51 0482 1163 64 pin device PM package Yamaichi IC51 0644 807 64 device RGC package Yamaichi QFN11T064 006 80 pin device PN package Yamaichi 201 0804 014 100 pin device PZ package Yamaichi 201 1004 008 128 pin device PEU package Yamaichi 500 1284 009 Enplas www enplas com Wells CTI www wellscti com Yamaichi www yamaichi us SLAU278Q May 2009 February 2014 Frequently Asked Questions and Known Issues 27 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Known Issues 2 Known Issues MSP FET430UIF Problem Description Solution MSP FET430PIF Problem Description Solution TEXAS INSTRUMENTS www ti com Current detection algorithm of the UIF firmware If high current is detected the lc monitor algorithm stays a loop of frequently switching on and off the target power supply This power swit
73. 00nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 yellow LED TH 3mm T1 511 1251 ND DNP Headers and receptacles enclosed with 7 J1 ky J3 0 25 pin header TH kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 2 Jumper 15 38 1024 ND Place on J6 J7 11 JTAG 1 14 pin connector male TH HRP14H ND 12 BOOTST 0 10 pin connector male TH Gop Mids Iree oi solder Q1 Micro Crystal MS1V 13 Q1 02 0 Crystal 32 768kHz niri aor Migs NSO 12 5pF 14 R3 1 330 SMD0805 541 0 R1 R2 15 R8 R9 R10 3 0 SMD0805 541 000ATR ND DNP R4 R9 R10 R12 R11 R12 16 R5 1 47k SMD0805 541 47000ATR ND Socket 201 1004 008 or 17 U1 1 357 1004 53 Yamaichi 18 1 82 90 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom 19 Plastic feet 6mm width 2mm height Part No 54 5302 side DNP enclosed with kit 20 MSP430 2 MSP430FG4619IPZ supplied by TI SLAU278Q May 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 105 Xi TEXAS INSTRUMENTS www ti com MSP TS430PZ100A TS430PZ100A B 25 MSP BST NMI C
74. 00nF 10uF BCUCETESE J1 3 be aH 1 48 16 Ri C30 2 2 47 15 DVIO Power Circle OR 62 2 P4 5 PM_UCAIRXD 4 PAAIPM 45 13 a 5 44 121 SHC1 100nF 6 65 42 _ 43 1X3 2 14 mL 7 P4 APM UcBisiMO 42 101 3 ng m 8 pezicBzIAT Ut 41 9 2s 1 Gt T2pF a 9 9 MSP430F5229 40 lg Tom 1 21 10 10 5 pvss 39 1 1 PINHEAD_1X2 1 11 avec AJUCADRXD UCADSOMI 6 le t 12 5 R6 PSAIXIN P3 3 UCAOTXDIUCADSIMO Q1 R R8 213 13 pssxour Pa2IucBocLKucAosrE 36 41 100nF 4 7uF OR AVS amp gt 14 avss 35 aig DVCC 15 w 5 P3 ciucagimoruceospa 34 21 to 16 16 pvss d 8 8 33 is 12 g 8 5 8 18 GND gt 3 J3 555 34222224 822343445224 244 10uF HoonF E E ps ES Ez E pat o ye RR Di i 4 R3 GND 27 330R
75. 09 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGC64USB Table B 22 MSP TS430RGC64USB Bill of Materials Pos Ref Des a Description Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND 3 SERA 4 100nF SMD0805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 DNP C10 C12 4 C8 1 2 2nF SMD0805 C9 1 470nF 5 00805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 4 16 pin header TH Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 10 T 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Q1 Micro Crystal MS1V T1K DNP Q1 14 Q1 0 Crystal C Load Keep vias free of solder 5 pF 15 Q2 1 Crystal Q2 4MHz Buerklin 780134 16 R3 R7 2 330 5 00805 541 0 R1 R2 R4
76. 0uF 10V Tantal Size B 511 1463 2 ND DNP C6 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with 7 J1 J2 J3 0 16 pin header TH kit Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 2 Jumper 15 38 1024 ND Place on J6 J7 12 JTAG 1 14 pin connector male TH HRP14H ND 13 BOOTST 0 10 pin connector male TH DNP Keep vias tree of solder Q1 Micro Crystal MS1V T1K 14 Q1 Q2 0 Crystal 32 768kHz C Load lt 1 solder 12 5pF 15 R3 1 330 5 00805 541 0 R1 R2 R4 R6 R7 R8 16 R9 R10 3 0 Q SMD0805 541 000ATR ND DAP RA RG E R11 R12 R13 R14 R11 R12 R13 R14 17 R5 1 47k Q SMD0805 541 47000ATR ND 18 U1 1 Socket 51 0644 807 Manuf Yamaichi 19 PCB 1 78 x 75 mm 2 layers Rubber Apply to corners at bottom 20 standoff 4 select appropriate side 21 MSP430 22 MSP430F2619IPM DNP Enclosed with kit MSP430F4171PM supplied by TI 78 Hardware SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 4 TEXAS INSTRUMENTS MSP TS430PM64A www ti com 17 MSP TS430PM64A
77. 15 01 02 0 Crystal 32 768kHz C Load PNP Keep vias free of solder 12 5pF 16 R3 1 330 5 00805 541 330ATR ND R1 R2 R4 R6 R7 R8 DNP 4 R6 R7 R8 R9 17 R9 R10 2 0 Q SMD0805 541 000ATR ND R10 R11 R12 R11 R12 18 R5 1 47k SMD0805 541 47000ATR ND 19 U1 1 Socket 357 1004 53 Manuf Yamaichi 20 PCB 1 90 x 82 mm 4 layers Rubber 3 Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI Hardware SLAU278Q May 2009 Revised February 2014 108 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430PZ100B www ti com 26 MSP TS430PZ100B ucc R2330R 4 JPS JP10 1 lt SBH 2 3 lt JTAG eva Tes AUXUCC1 4 Socket Yamaichi 1 201 1004 008 C6 near Pin 75 C14 9 near Pin 20 5 430 Target Socket MSP TS430PZ100B for F67xx TITLE 5 5430 2100 Document Number Sheet 1 1 Date 8 3 2010 1 05 54 PM 109 Hardware Ic Schemati TS430PZ100B Target Socket Module igure B 51 MSP F SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback C
78. 2 L414 C413 C414 1 415 L413 C412 Figure B 64 EM430F6137RF900 Target board PCB The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 130 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F6137RF900 Table B 34 EM430F6137RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 26MHz ASX 531 CS ELECTRONIC C1 C5 C112 C252 C381 2 C391 C421 14 CD CH SMT 0402 CER 16V 10 402 1 4 AVX C431 C451 C522 C562 3 C101 1 AN 0603 CERAMIC 0 470 0603YD474KAT2A 4 R511 1 RES0402 47 0K CRCW04024702F100 DALE 5 1 5 iE 2 7 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V APT1608EC KINGBRIGHT 10 CON12 1 MALE 3P 1x3 22 03 5035 MOLEX 11 C361 C371 2 5 27pF GRM36COG270J50 MURATA 12 L451 1 FERRITE SMT 0402 1 0kO 250mA BLM15HG102SN1D MURATA 13 C403 SO AMI 1006 GRMISSSCIHI01JZ01 MURATA 14 L
79. 2 CER 1pF 50V 17 C401 M GJM1555C1H1ROCBO1D MURATA CAPACITOR SMT 0402 CERAMIC 8 2pF 18 C413 2 1555 1 8 2 701 MURATA C402 411 CAPACITOR SMT 0402 CERAMIC 1 5pF 1555 1 1 5 701 MURATA 20 L1 L401 L411 3 INDUCTOR SMT 0402 12nH 5 500mA QW15AN12NJ00 MURATA 250MHz C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pF 21 udo 1555 1 280 701 MURATA E Inductor SMD 0805 2 2uH 20 600 OM21PN2R2MCO MUERE 50MHz ULTRA SMALL TACTILE SWITCH SMT 2P 23 51 52 2 SPST NO 1 2x3x2 5mm 0 05A 12V B3U 1000P OMRON R1 R7 R551 RESISTOR JUMPER SMT 0402 0 Q 5 24 27722 ERJ 2GEOROOX UN PANASONIC 25 R2 R3 R6 RESISTOR SMT 0402 THICK FILM 5 ERJ 2GEJ331 PANASONIC 1 16W 330 CAPACITOR SMT 0402 CER 2200pF 27 C511 ECJ 0EB1H222K PANASONIC C111 C251 CAPACITOR SMT 0603 CERAMIC 1 1 CZ ECJ 1VB0J105K PANASONIC 28a C041 1 CERAMIC 4 7UF 6 3V X5R 0603 ECJ 1VB0J475M PANASONIC 29 R441 TOK ELM 766 WIEN 30 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278Q May 2009 February 2014 Submit Documentation Feedback Hardware 135 Copyright 2009 2014 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS EM430F6147RF900 www ti com Table B 35 EM430F6147RF900 Bill o
80. 2 115 4 holes while 11 JTAG 1 ML14 14 Pin Conn RS 482 121 12 R1 R7 2 330R SMD0805 12 R2 R5 0 OR SMD0805 DNP 14 R4 1 47K SMD0805 15 U1 1 SOP28PW socket Enplas OTS 28 0 65 01 PCB 66 x 79 mm two layers Rubber stand off four pieces SLAU278Q May 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 51 X TEXAS INSTRUMENTS www ti com RST NMI SBWTCK Ext_PWR OO 5 5 TDO SBHTDIO TEST SBHTCK R7 330R ic Schemat Submit Documentation Feedback RST SBWTDIO 1 7 00 JTAG gt ape 3 3 TEST SBWTCK 2 2 P1 6 TDI 1 5 5 1 4 n a a 1 a SBW gt Jpg R4 1 6 1 5 224 47 JTAG Mode selection 4 wire JTAG Set jumpers J4 to J9 to position 2 3 2 wire SpyBiWire Set jumpers J4 to J9 to position 2 1 2 to measure supply current bs C4 ki 01 100n 10uF 10U LED Green MSP430G2XXX GND 27 MSP4 4 R5 buss 3 PL1 T80 8 4 1 2 80 4 xs 5 3 5 6 1 47 2 1 5 9 BSL Interface BOOTST 82 0 R3 XIN P2 6 T80 1 XoUT P2 7 TEST SBHTCK 24 RS T SBHTDIO 2 23 P1 7 TDO 9 Pueri
81. 2 MSP430F4270IDL supplied by TI SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 69 X TEXAS INSTRUMENTS www ti com MSP TS430RGZ48B 14 MSP TS430RGZ48B UCC TES R 723392 4 5 JP10 1228 1228 1d ig lt SBW 2 2 2 o 2 lt JTAG BSL Interface one BOOTST Rio 00 2 2nF C8 m E 10uF 6 3U FE12 1 1 i R44 OR 1 2 1 1 1 40 0 Thermal Pad P 3 CB3 63 P6 2 CB2 A2 P6 4 CB4 A4 P6 1 CB1 A1 P6 5 CB5 A5 RST NHL SBHTOIO P5 0 UREF UeREF AB PJ 3 TCK P5 UREF eREF h9 PJ 2 THS PJ A TDI TCLK P5 4 XIN 8 700 P5 5 XDUT 20551 P5 3 XT20UT P5 2 XT2IN 0551 0553 P4 6 PM_NONE 4 DUCC2 1 5 82 4 00582 P1 6 TA1CLK CBOUT P4 3 PH UCB1CLK P1 2 T01 8 4 2 P2 7 UCB STE UCAOCLK 4 0 UCB1STE P3 1 UCBOSOML UCBESCL P3 4 UCA RXD UCAQSONI P3 2 UCBOCLK UCA STE P3 3 UCA TXD UCAQSIMO MSP430F 534X Socket Yamaichi 0 117048 008 8101121
82. 3 7 R11 R15 2 1K SMD0603 8 R12 0 5 00603 9 R13 0 5 00603 10 14 1 0 5 006033 11 1 SN74AUC1G04DBVR Manu Tl 12 IC2 103 104 3 SN74AUC2G125DCTR Manu Tl Reichelt MicroMaTch 13 J2 1 MICRO_STECKV_10 Connector MM FL 10G Put jumper on Position 1 and 14 JP1 1 2x2 Header JP2Q 5 Do not mixdirection 15 JP2 1 2 pin header male TH SAM1035 02 ND place jumper on header 16 JTAG 1 14 pin connector male TH HRP14H ND 17 Qt 1 BC817 25LT1SMD SOT23 Digi Key 817 BEC 25LT1GOSCT ND 18 01 02 2 TLVH431IDBVR SOT23 5 Manu Hardware SLAU278Q May 2009 Revised February 2014 42 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS MSP TS430PW24 www ti com 5 MSP TS430PW24 JTRG Mode selection 4 uire JTAG Set jumpers JP4 to to position 2 3 2 vire SpyBilire Set jumpers JP4 to to position 1 2 330R TEST SBLTCI JTAG gt 1 SBW gt 3 P2 0 IDI I 1 1 JP JP8 P2 0 STEQ TRO TOI TCLK P1 7 UCLKO TR1 TOO TDI P4 6 SOMIB TA2 TCK P4 5 SIMOB SUSOUT THS 24 4 08 08 50200 1 3 080 50100 P1 2 TAB SD DO R1 3308 P1 1 T81 S0CLK DUcC P2 2 XT20UT P2 6 XT2IN 0085 Socket EnplasOTS 28 65 B1 MSP430RFE2XX P1 0 DNP XT20UT P2 7 12p
83. 4 Ic Schemati FET430UIF USB Interface 72 MSP igure SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated USBFET 24LC1281 SN TITLE MSP FETU4301F Document Number F MSP FET430UIF Date 7 25 2006 03 38 10p Sheet 4 4 Hardware 142 5 INSTRUMENTS www ti com MSP FET430UIF En Ex ang N D 2 N e 5 e giz b M e 9 5 Me ES 2 5 se N LE a m 280 200 wW ol e e e 2 e 3 40 D 2 aA Og E 9 8 Ve oO Lo D o m T ol N ua 2 amp me Ov S SEE SES NON ON us TRRGET CON Figure B 73 MSP FET430UIF USB Interface PCB SLAU278Q May 2009 Revised February 2014 Hardware 143 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 144 5 INSTRUMENTS MSP FET430UIF www ti com 35 1 MSP FET430UIF Revision History Revision 1 3 Initial released hardware version Assembly change on 1 3 May 2005 R29 R51 R42 R21 R22 R74 value changed from 330R to 100R Changes 1 3 to 1 4 Aug 2005 J5 VBUS and RESET additionally connected R29 R51 R42 R21 R22 R74 val
84. 4 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Important to connect gt c Signal Connections for In System Programming and Debugging MSP430Fxxx VCC TOOL TDO TDI 47 see Note B ANN I Note A i VeclAV 92 1 R1 C2 MGE CDU LA CES EE 10 RST NMI VCC TARGET TDI VPP TDO TDI TDI VPP TMS TEST VPP TCK RST see Note D gt C1 10 nF 2 2 nF see Notes B and E TEST VPP see Note C If a local target power supply is used make connection J1 If power from the debug or programming adapter is used make connection J2 The configuration of R1 and C1 for the RST NMI pin depends on the device family See the respective MSP430 family user s guide for the recommended configuration The TEST pin is available only on MSP430 family members with multiplexed JTAG pins See the device specific data sheet to determine if this pin is available The connection to the JTAG connector RST pin is optional when using a device that supports only 4 wire JTAG communication mode and it is not required for device programming or debugging However this connection is required when using a device that supports 2 wire JTAG communication mode in 4 wire JTAG mode When using a devic
85. 414 1 0402 2 2nH 0 2nH LQW15AN2N2C10 MURATA 15 L413 L415 2 ce SMT 0402 15nH 5 460MA QW15AN15NJ00 MURATA 16 1402 L412 2 4 SMT 0402 18nH 5 370MA QW15AN18NJ00 MURATA 17 C401 MPG 0402 TPF SOV GJMISGSCIHIROCBOID MURATA 18 C413 COGINED 82 GRMISSSCTHBR2CZO MURATA C402 C411 CAPACITOR 5 0402 CERAMIC 1 5pF ig ed 2 1555 1 1 5 701 MURATA 20 L401 L411 2 4 SMT 0402 12nH 5 500MA QW15AN12NJ00 MURATA C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pF 21 52222 GRM1555C1H2ROCZO1 Murata 22 L1 1 2 0402 6 2nH 0 1nH LQW15AN6N2D00 Murata ULTRA SMALL TACTILE SWITCH SMT 2P 23 51 52 2 SPST NO 1 2x3x2 5mm 0 05A 12V B3U 1000P OMRON 24 R7 1 0 SMT 0402 0 9 5 2GEOROOX UN PANASONIC 25 R2 R3 R6 oe 27 511 1 ae Pr 0402 GER 2200pF ECJ 0EB1H222K PANASONIC aM PANASONIC 28a C041 1 CERAMIC 4 7UF 6 3V X5R 0603 ECJ 1VB0J475M PANASONIC 29 R441 30 R1 1 A JUMPER SMT 0402 0 5 ERJ 2GE0R00X 31 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 131 5 INSTRUMENTS EM430F6137RF900 www ti com Table B 34 EM430F613
86. 78Q 2009 February 2014 124 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS EM430F5137RF900 www ti com 31 EM430F5137RF900 REVISIONS ECR 20 20 09 9 Vect 33t0hms IURE PRS RS AGAVREF NE ut 20 09 09 DATE 28 09 09 SCHEMATIC EM430F5137RF 322 Rev 8 2 868 915MHz DATE 20 09 08 XXXXXXX Power Management 1 external VCC Vdd DVCC A DD RF A CC RF Vdda2 A CC Port connectors CON3 Port Port3 o
87. 7RF900 Bill of Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 33 i 1 9 15x9 15ximm THRM PAD CC430F6137 4 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH JP5 JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 132 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated X TEXAS INSTRUMENTS EM430F6147RF900 www ti com 33 EM430F6147RF900 zer reat 2pr 7 2pF I Cas RFSINGLE SAL 1 5 fl 5 F AVCC RVCC_1 uninstalled 1210 L T oT Correspondig Layout Revisions 4 0 U1 direct soldered external VCC DVCC Digital VCC AVCC Analog VCC RVCC RF VCC Port connectors 5 Port5 of cc430 CONG DVCC GND Vcore COMO LCDCAP CON7 RFVCC_1 AVCC GND AGND 8 JTAG_BASE JTAG Port CONO DVCC GND AGND Figure B 65 EM430F6147RF900 Target Board Schematic 133 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated EM430F6147RF900 Jumper JP9 TPS status Open to measure current jumper JP3 External po
88. 8 3 pin header male SAM1035 03 ND J9 J10 J11 J12 Pos 1 2 J11 J12 8 J4 J6 2 2 pin header male SAM1035 02 ND Place jumper on header 9 9 Jumper 15 38 1024 ND Place on J5 J7 J12 Pos 1 2 10 1 1 connector male HRP14H ND Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13 R2 R3 2 330 SMD0805 541 330ATR ND 15 R5 1 47k SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 14 0 65 01 Manuf Enplas 17 PCB 1 56 x 53 mm 2 layers Adhesive Approximately 6mm 18 plastic feet 4 width 2mm height 22 59 Apply to corners at bottom side 19 MSP430 2 MSP430F2013IPW DNP enclosed with kit supplied by Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS MSP TS430L092 www ti com MSP TS430L092 T T nasus 0147 6002 27 8 19120 2 JUSWNRAEH se you seop gylf 39803 Atddns 2601 0 51 5 131111 p4eog 193505 196 1 ZE 1 EFS1 dSW 510 ssna Ing 901 pattddns paeog seu e qe2 eui jo paeoq 99 5 404 NId 00170 Iain n SWLATNA 21n 1n 5
89. AU278Q May 2009 Revised February 2014 Get Started Now 11 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Contents MSP FET430PIF www ti com 1 2 Kit Contents MSP FET430PIF One READ ME FIRST document One MSP FET430PIF interface module One 25 conductor cable One 14 conductor cable NOTE This part is obsolete and is not recommended to use in new design 1 3 Kit Contents eZ430 F2013 One QUICK START GUIDE document One eZ430 F2013 development tool including one MSP430F2013 target board 1 4 Kit Contents eZ430 T2012 Three MSP430F2012 based target boards 1 5 Kit Contents eZ430 RF2500 One QUICK START GUIDE document One eZ430 RF2500 CD ROM One eZ430 RF2500 development tool including one MSP430F2274 and CC2500 target board One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 1 6 Kit Contents eZ430 RF2500T One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 1 7 Kit Contents eZ430 RF2500 SEH One MSP430 development tool CD containing documentation and development software One eZ430 RF USB debugging interface Two eZ430 RF2500T wireless target boards One SEH 01 solar energy harvester board OneAAA battery pack with expansion board batteries included 12 Get Started Now 51 02780 May 2009 Revised February 2014 Submit Documentation Feedback C
90. B USB Connector Jumper JP3 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply Jumper JP1 Open to measure current Jumper JP5 to JP10 Close 1 2 to debug in Spy Bi TEXAS INSTRUMENTS www ti com Connector J5 External power connector Jumper JP3 to ext Jumper JP4 Close for USB bus powered device Wire mode T 0 Close 2 3 to debug 4 e se 7S 14 5 ei 06 JTAG mode e e ge e ege e 333 e LED connected to P1 0 ges e 2 e 224 e or 0000000 ole e eo ee Jumper JP2 Open to disconnect LED 5 29 321 21 25 J2 35 42 ooo 0990000e9009000000090 a 015 LEO Zn 00 OD UNP MSP TS430PNS8OUSB o o PCO 1 2 RoHS SLNAWNUISN 04 BSL invoke button 53 Figure B 46 MSP TS430PN80USB Target Socket Module PCB 100 Hardware SLA Copyright 2009 2014 Texas Instruments Incorporated 92780 2009 Revised February 2014 Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PN80USB Table B 25 MSP TS430PN80USB Bill of M
91. B40 MSP TS430RGC64USB MSP TS430PZ100USB MSP FET430F5137RF900 SLAU278E Added jumper information o MSP TS430L092 PCBs to Appendix B Added new supported devices in Chapter 1 Added information about MSP TS430PW24 MSP TS430PW28A MSP TS430RHA40A MSP TS430RGZ48B MSP SLAU278F TS430RGC64B MSP TS430PN80A and MSP TS430PZ100B Updated MSP TS430RSB40 schematics SLAU278G Added information for MSP TS430PZ100C SLAU278H Added information for MSP TS430D8 and MSP TS430RGC64C Updated Table 1 1 Replaced Figure 2 2 SLAU278l Added Figure 2 3 Replaced Figure B 37 and Figure B 67 Added Table C 1 Editorial changes throughout SLAU278J Added EM430F6147RF900 Section B 33 Added battery pack connection information to all EM430Fx1x7RF900 kits SLAU278K Added information MSP TS430RGZ48C and MSP TS430PEU128 Updated Figure B 38 SLAU278L Changed descriptions in Section B 19 and Section B 30 Changed Figure B 60 SLAU278M Added information for MSP430G2x44 MSP430G2x55 in Table 1 2 SLAU278N Updated Table 1 1 Updated Section 2 3 Changed Table 1 1 and Table 1 2 for Changed Figure 2 1 through Figure 2 3 LAU27 SLAU2780 Changed FAQ 12 in Section A 1 Changed Figure B 47 Figure B 49 and Figure B 69 through Figure B 73 Added information about F523x F524x and F525x to Table 1 2 and Section B 19 SLAU278P Changed Figure B 38 Added BSL information to note on Figure B 41 Figure B 15 Corrected JTAG mode selection ju
92. D DNP headers and receptacles enclosed with 6 J1 J2 0 19 pin header TH kit Keep vias free of solder SAM1029 19 ND Header SAM1213 19 ND Receptacle Es pe Place jumpers on headers 7 8 3 pin header male TH SAM1035 03 ND JP1 JP4 JP5 JP6 JP7 piget JP8 JP9 Pos 1 2 JP9 8 JP2 JP3 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 9 Jumper 15 38 1024 ND 10 1 14 connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load solder 12 5 13 1 2 330 SMD0805 541 330ATR ND 14 R10 R11 0 0 SMD0805 541 000ATR ND DNP 15 R5 1 47k SMD0805 541 47000ATR ND 16 U1 1 Socket 189 0382 037 Manuf Yamaichi 17 PCB 1 67 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height Part No 5 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F22741DA supplied by TI SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 57 X TEXAS INSTRUMENTS www ti com MSP TS430QFN23x0 10 MSP TS430QFN23x0 18uF 18U J5 Ext PAR R1 330R P1 0 R mr JP3 ico i on
93. DEEE BOE e n 15 e e GFN11T064 006 B n e c2 4 e c ne Bo ce e jv e 06255 t e 01 LED connected to 1 0 222 5 3 C13 Pe EZ Clamshell 1 UT 46 SB Bey me Jumper JP2 5 Open to disconnect LED MSP TS430RGC64B RoHs Figure B 36 MSP TS430RGC64B Target Socket Module SLAU278Q May 2009 February 2014 Hardware 83 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430RGC64B www ti com Table B 20 MSP TS430RGC64B Bill of Materials Pos Ref Des Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 C6 C7 C10 3 10uF 6 3V SMD0805 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND J1 J2 J3 SAM1029 16 ND DNP Headers and receptacles 10 UA a 0 16 Header SAM1213 16 enclosed with kit Keep vias free of J4 6 ND Receptacle solder 11 45 96 2 3 pin header male es e place jumpers on pins 2 3 on JP5 JP6 12 7 3
94. Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V MSP TS430RGC64USB ong 5 D E QN9 OND OJUITES7IS3I R11 alle 512 5 9 8 18 oR NEN 218 n 8 3920 9 c D o af ae M 2 N 5 3 007 S a 1 S 5 a 5 EN c gt 9 A 3 9 7 i 2 EN Es e ejem aS 295205 1 101 6 T wane 28 2 102 6066 4J0E dSW JSN 991 gt mas gt j Teusaixe Oi 125 pue var gsn el pinoys WaISAS aui 31 1910N 8 Phi gt LEDI 470R 4 2 5 p LED2 03 p LED3 p 1 031 R15 a3 4788 gt R16
95. F f 1 XTLGND ono o 12 1 lt 2 DNP GUARZ5 C2 11 e XT2IN P2 6 12pF DNP MSP TS430PW24 Target Socket Board for MSP430 s AFE2xx ICs PW24 package TITLE MSP TS430PW24 Document Number Date 04 08 2010 13 36 04 Sheet 1 1 Schemati TS430PW24 Target Socket Module MSP 9 igure F 43 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PW24 www ti com Connector J5 External power connector Jumper JP1 to ext Jumper JP2 Open to measure current 1 9 JP JP5 1 4 J J2 Jumpers JP4 to JP9 e a e Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug 4 mode 0 H Orient Pin 1 MSP430 device 24 28 0 65 02 00 e e 1 01 LED connected to 1 0 e 49 5 Su Jumper JP3 INSTRUMENTS MSP TS43 PW24 Open to disconnect LED 2 Bev 40 Figure 10 MSP TS430PW24 Target Socket Module 44 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas In
96. JP1 Open to disconnect LED LED D1 connected to P5 1 Figure B 34 MSP TS430PM64A Target Socket Module PCB 80 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com Table B 19 MSP TS430PM64A Bill of Materials MSP TS430PM64A No per Pos Ref Des Board Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 0 2 2nF SMD0805 DNP 3 C6 1 10uF 10V Tantal Size 511 1463 2 ND 4 C4 C5 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with kit 6 J1 J2 J3 J4 0 16 pin header TH Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle J5 JP3 JP4 7 8 3 pin header male SAM1035 03 ND 9 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 2 Jumper 15 38 1024 ND Place on J6 J7 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH 2 vias of 12 Q1 0 Crystal eek Coad H 5 vias free of 5pF 13 R3 R6 2 330 SMD0805 541 330ATR ND R1 R2 R5 RI 155 2 00 SMD0805 541 000ATR ND Bud 14 15 4 1 47k SMD0805 541 47000ATR ND 16 U1 1 Socket 51 0644 807 Manuf Yamaichi 17 PCB 1 78 x 75mm 4 layers 18 4 select appropria
97. K 5 DL DQ 1 IP 2 100 6 30 R4 J R2 1 DNP UCC 01 QF P100PZ Socket Yamaichi 1 201 1004 008 PLA DNP If BSL is used If external supply voltage remove R11 and add R10 8 C11 100nF DUCC4 zit c9 18uF 6 3U R3 D1 5 1 ale 3308 MSP43 Target Socket MSP TS430P2100A for F471xx TITLE MSP TS430P2100R Document Number Date 8 28 2008 12 43 14 PM Sheet 1 1 Figure B 49 MSP TS430PZ100A Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 106 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumper JP3 1 2 int Power supply via JTAG interface 2 3 ext External Power Supply Jumper JP1 Open to measure current rz 10 Vcc 2 3 RIG R11 JTAG oT ext m B OTST 95 J3 GND 75 70 85 2 86 55 vec 2 amp 862 80 f 5 5438 2100 Orient Pin 1 of Device c5 C6 952 30 R5 cem 1 26 J1 15 2 5 10 20 000
98. LAU278Q May 2009 Revised February 2014 48 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 4 TEXAS INSTRUMENTS MSP TS430PW28 www ti com 7 MSP TS430PW28 10uFA0 JTAG Mode selection 4 JTAG Set jumpers JP4 to JP9 to position 2 3 2 wire SpyBiWire Set jumpers to JP9 to position 1 2 R7 330R TEST SBWTCK 3 3 2 P1 5 TMS 1 JP9 R1 330R TST P1 7 VCC P1 6 2 5 P1 5 VSS P1 4 XOUT P1 3 XIN P12 RST P1 1 P20 P1 0 P2 1 P2 4 P22 P23 P3 0 P3 7 P3 1 P3 6 P3 2 P3 5 P3 3 P3 4 Socket OTS 28 0 65 01 GND If external supply voltage remove R11 and add R10 0 Ohm MSP TS430PW28 Target Socket Board for MSP430 s in PW28 package TITLE MSP TS43 PW28 Document Number Date 11 15 2007 4 05 56 PM Sheet 1 1 Figure B 13 MSP TS430PW28 Target Socket Module Schematic 49 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated TEXAS INSTRUMENTS MSP TS430PW28 www ti com Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode 14 000000 60000092 Jumper JP1 JP1 JTAG 1 2 int Power supply via JTAG interface
99. MSP430 Hardware Tools User s Guide X TEXAS INSTRUMENTS Literature Number SLAU278Q May 2009 Revised February 2014 5 INSTRUMENTS Contents caudate sted ecueeuunieanevedes 7 1 Get Started Now 10 14 Flash Emulation Tool FET Overview eie cose ee 11 1 2 Kit Contents 5 tin Te 1 3 Kit Gontents eZ430 20 138 2 DRE 12 1 4 eZ430 T2012 ut caca ita nt aaa VE ERR DR RM MS 12 1 5 Kit Contents eZ430 RE 2500 PY UTERE 12 1 6 Kit Gontents ezZ430 RF25OOT eraris 12 1 7 Kit Gontents eZ430 RF2500 SEH 12 1 8 Kit Gontents 67430 CHrONOS XXX 13 1 9 Kit Contents ro rau rre
100. Manager lists a new entry as shown in Figure C 3 Figure C 4 or Figure C 5 B Device Manager lt Human Interface Devices H E IDE ATA ATAPI controllers p IEEE 1394 Bus host controllers gt Keyboards 77 Mice and other pointing devices t Modems Monitors 5 8 Network adapters 8 1394 Net Adapter 3 Broadcom 57xx Gigabit Controller Cisco Systems VPN Adapter Intel R Wireless WiFi Link 4965AGN EH adapters Ports amp LPT 7 BT Port 10 BT Port COM11 BT Port COM12 BT Port COM13 BT Port COM14 BT Port COM20 BT Port 21 BT Port 22 BT Port COM6 BT Port COM Communications Port COM1 ECP Printer Port LPT1 7 5 VCP 49 Processors Smart card readers Sound video and game controllers 9 System devices Figure C 3 Device Manager Using USB Debug Interface using VID PID 0x2047 0x0010 148 Hardware Installation Guide SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Batteries 4 Bluetooth Devices Computer Disk drives Display adapters 2 DVD CD ROM drives Human Interface Devices IDE controllers Infrared devic
101. P1 3 40 45 1 3 sw2 Switch SW1 Device reset 13 HF and LF Oscillators with Capacitors and Resistors to connect Pinheads Figure B 30 MSP TS430RGZ48C Target Socket Module PCB Table B 16 MSP TS430RGZ48C Revision History Revision Comments 1 2 Initial release LFOSC pins swapped at SV1 9 10 1 3 HFOSC pins swapped at SV1 6 7 BOOTST pin 4 now directly connected to the device RST SBWTDIO pin 74 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGZ48C Table B 17 MSP TS430RGZ48C Bill of Materials Number Pos Ref Des Per Description Part Number Comment Board 1 SV1 SV2 SV3 4 12 pin header TH DNP headers and receptacles enclosed with kit SV4 Keep vias free of solder SAM1029 12 ND Header Receptacle 14 SV1 SV2 5 3 4 12 pin receptable TH DNP headers and receptacles enclosed with kit SV4 Keep vias free of solder Header SAM1213 12 ND Receptacle JP1 JP2 JP9 2 pin header male TH SAM1035 02 ND Place jumper on header JP10 JP11 2 pin header male TH SAM1035 02 ND DNP J1 JP5 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP6 JP7 JP8 J2 1 3 pin header male SAM1035 03 ND JP1 JP2
102. P430FR5969IRGZ ond four female MSP430F13x MSP430F14x MSP430F14x1 MSP430F15x MSP430F16x MSP430F16x1 MSP430F23x TS Kit MSP TS430PM64 64 pin PM Eight 1x16 pin headers four male green PCB QFP ZIF Mir and four female MSP430F261x 2 x MSP430F417IPM and MSP430F41x 2 x MSP430F169IPM MSP430F42x MSP430F42xA MSP430FE42x MSP430FE42xA MSP430FE42x2 MSP430FW42x MSP TS430PM64A 64 pin PM Eight PCB 1x16 pin headers four male red PCB QFP ZIF MSP430F41x2 2 x MSP430F41521PM rd our MSP TS430RGC64B 64 RGC Eight 1 16 headers four male blue PCB OPN ZIF MSP430F530x 2 x MSP430F5310IRGC ear female MSP430F522x MSP430F521x M iod MSP430F523x 2 x MSP430F5229IRGC 4 MSP430F524x MSP430F525x MSP TS430RGC64USB 64 RGC 5 2 x MSP430F5510IRGC Eight PCB 1 16 headers four male green PCB QFN ZIF MSP430F552x 2 x MSP430F5528IRGC and four female MSP430F241x MSP430F261x MSP430F43x 5 eee ai MSP430F43x1 2 x MSP430FG439 PN 9 MSP430FG43x MSP430F47x MSP430FG47x MSP TS430PN80A 80 pin PN Eight PCB 1x20 pin headers four male red PCB QFP ZIF MSP430F532x 2 MSP430F5329IPN Bod four female MSP TS430PN80USB 80 pin PN MSP430F552x Eight PCB 1x20 pin headers four male green PCB QFP ZIF MSP430F551x 2 x MSP430F5529IPN and four female MSP430F43x MSP430F43x1 MSP TS430PZ100 100
103. R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 S1 0 PB P12225STB ND DNP 46 S2 0 PB P12225STB ND DNP 46 S3 1 PB P12225STB ND 47 USB1 1 USB RECEPTACLE FARNELL 117 7885 92 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PN80 B 21 MSP TS430PN80 payquasse you 2 5 st 9 3 p sse you 92 22 NEI 3781 ecu IHN 1Su 1 1183208 10 080 10221 31111 BErdSW gt 100 9002 61 21 5 1 54 XIXZ4 pue 204 BNdBEFSL dSW 3205 det 30 5 5 165 5 st 168 I 9bei oA 99 eusaixe 11 940 pue uado NOTE MSP430F47x MSP430FG47x devices Connect pins 7 and 10 GND externally to see data sheet Connect load capacitance 60 when 5016 is used see data sheet For use of BSL connect pin 1 of
104. R5 R6 15 R4 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 28 0 65 01 Manuf Enplas 17 PCB 1 63 5 x 64 8 mm 2 layers Adhesive Approximately 6mm 4 18 plastic feet 4 width 2mm height So Part No SJ Apply to corners at bottom side 19 MSP430 2 MSP430G2553IPW28 DNP enclosed with kit supplied by Hardware SLAU278Q May 2009 Revised February 2014 54 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 4 TEXAS INSTRUMENTS MSP TS430DA38 www ti com B 9 MSP TS430DA38 JTAG Mode selection 4 wire JTAG Set jumpers JP4 to JP9 to position 2 3 2 SpyBiWire Set jumpers to JP9 to position 2 1 Ext_PWR R1 330R R5 47k C8 TESTISAWTCK on 1 5 DNP GND MSP430F2274IDA 3 3 3 Jeune firm Jews JP6 JP7 JP8 JP9 TEST SBWTCK P1 7 TDO DVCC P1 6 TDI P2 5 P1 5 TMS DVSS 1 4 2 7 P1 3 P2 6 P1 2 RST SBWDAT P1 1 P2 0 P1 0 P2 1 P2 4 P2 2 P2 3 P3 0 U1 P3 7 P3 1 P3 6 P3 2 P3 5 P3 3 P3 4 AVSS P4 7 AVCC P4 6 P4 0 Socket P4 5 P4 1 P4 4 P4 2 189 0382 037 4 3 R3 560R P10 Lt Ab TEST SBWTCK _ 1 1 GND If external supply voltage remove R11 and add R10
105. RUMENTS www ti com MSP TS430RSB40 Table B 12 MSP TS430RSB40 Bill of Materials Pos Ref Des No Per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 Bees 3 10uF 10V SMD 0805 445 1371 1 ND DNP C12 3 100nF 5 00805 311 1245 2 ND DNP C11 4 C5 1 2 2nF 5 00805 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 Jt J2 J3 J4 4 10 pin header TH Vias DNP headers and receptacles enclosed with kit 74 4 10 pin header TH Keep vias free of solder Header Receptacle JP1 JP4 JP5 8 6 7 9 3 pin header male TH SAM1035 03 ND JP8 JP9 J5 JP10 9 JP2 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH PNR viasiree oi solder QFN 40B 0 4_ 12 a 1 ENPLAS SOCKET Micro Crystal MS3V T1R 13 Q1 0 Crystal 32 768kHz C Load PNP Q1 Keep vias free of solder 12 5pF Place on JP1 JP2 JP3 15 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 16 R1 R7 2 330R SMD0805 R2 R3 R5 17 R6 R8 R9 3 OR SMD0805 DNP R2 R3 R5 R6 R10 18 R4 1 47k SMD0805 DNP enclosed with kit Is 19 MSP430 2 MSP430F5132 supplied by TI 20 Rubber stand 4 select appropriate for apply to corners at bottom off example Buerklin 20H1724 side
106. S430 production programmers thus providing an easy way to program prototype boards if desired Figure 2 1 shows the connections between the 14 pin FET interface module connector and the target device required to support in system programming and debugging for 4 wire JTAG communication Figure 2 2 shows the connections for 2 wire JTAG mode Spy Bi Wire The 4 wire JTAG mode is supported on most MSP430 devices except devices with low pin counts for example MSP430G2230 The 2 wire JTAG mode is available on selected devices only See the Code Composer Studio for MSP430 User s Guide SLAU157 or Embedded Workbench Version 3 for MSP430 User s Guide SLAU138 for information on which interface method can be used on which device The connections for the FET interface module and the MSP GANG 430 or MSP PRGS430 are identical Both the FET interface module and MSP GANG430 can supply Vec to the target board through pin 2 In addition the FET interface module MSP GANG and MSP GANG430 have Vec sense feature that if used requires an alternate connection pin 4 instead of pin 2 The feature senses the local Vec present on the target board that is a battery or other local power supply and adjusts the output signals accordingly If the target board is to be powered by a local then the connection to pin 4 on the JTAG should be made and not the connection to pin 2 This uses the Vec sense feature and p
107. T1K 12 Q1 0 Crystal 32 768kHz C Load solder 12 5 13 1 1 330 5 00805 541 330ATR ND 14 R2 R3 0 0 SMD0805 541 000 15 R4 1 47k SMD0805 541 47000ATR ND 16 U1 1 Socket QFN 40B 0 5 01 Manuf Enplas 17 PCB 1 79 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom TB Plastic feet 6mm width emm height Part No SJ 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F2370IRHA supplied by Hardware SLAU278Q May 2009 Revised February 2014 60 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated X5 TEXAS INSTRUMENTS MSP TS430RSB40 www ti com 11 MSP TS430RSB40 JTAG Mode selection 4 uire JTAG Set jumpers JP4 to to position 2 3 2 vire Set jumpers JP4 to to position 1 2 UCC430 3 3 IESI SBHICK 2 DIO P L4 TDI 4 P L 3 TCK a 1 a JP 3308 PLA 01 9 4055 gt UUUUUUUUU GI 11 16 MSP TS430RSB4 Target Socket Board for MSP430F51x2IRSB TITLE MSP TS430RSB40 Document Number Date 8 11 2010 12 38 55 PM Sheet 1 1 GFN 40B 0 4 001 61 Hardwa
108. T1K 15 01 a2 Crystal 32 768kHz C Load DAP keopvias free of solder 12 5pF 16 R3 R7 2 330 0 SMD0805 541 330ATR ND R1 R2 R4 R6 R8 R9 4 DNP R6 R8 R9 R10 R11 17 R10 R11 3 0 O SMD0805 541 000ATR ND R12 R12 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 Socket 357 1004 53 Manuf Yamaichi 20 PCB 1 90 x 82 mm 2 layers Rubber Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI SLAU278Q May 2009 Revised February 2014 Hardware 117 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PZ100USB www ti com 29 MSP TS430PZ100USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V R18 27 TT 1280 af 142 m w 1 UT 8 a eB 8 11 2 1 11 1 E L 2 H sg n D zl 5 e n 2 5 18 EE ez 2 101 in io 102 104 B E H E B 515 BRONPBESLRGRGSES ES E Jon sat 9930S
109. TS430PM64 TEXAS INSTRUMENTS www ti com 16 MSP TS430PM64 reserved for future enhancement R12 jou Ajddns jeujejxe 0 634 ppe pue gy 1 s not assembled 1 JP1Q 10uF 6 3 i 191 33 10uF 10V 408 90 1891 jou 1ueunooq jou 08 97 01 9002 7 6 314 pue 10 Ajddns 0 pue 0 9 0 v9lNd 9490S PINdOEPS1L dSW 168 104 ZH 98 WYO 0 OLY 0 Wy 39945 NOTE Connections between the JTAG header pins longer required and should not be made Figure B 31 MSP TS430PM64 Target Socket Module Schematic 76 Hardware SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5
110. TS430RGZ48C www ti com C3 C4 LFGND QUARZS OR R6 0 SV1 1uF 10V 100nF connection by via OR R5 R8 OR EELS NOU 0 R9 OR 57 i QUARZ5 UUUUUUUUU BABOON 5 N o t t Ooctzotctzoxoero 00220250 lt lt lt 1 6 111 6981 NY aM gs 5 59 TREX 85 st LO 00 O NY 36 DVSS 35 4 6 34 33 P44 32 1 7 31_ 1 6 30 P3 7 29 P3 6 28 P3 5 27 P34 26 22 25 P2 1 i turo 100nF GND BOOTST DNP 9 T TEST SBWICK 1 DNP external supply volta RO Ohn 65 ORR12 055 ORR13 l 5 d sF n R14DNP 03 ale red DNP JP11 02 yellow DNP FF JP10 R1 3308 2 JP9 ND MSP TS430RGZ48C Target Socket Board for MSP430FR58xx FR59xx IRGZ TITLE MSP TS430RGZ248C Document Number Date 8 7 2012 11 20 36 AM
111. XP430FR5739 MSP EXP430F5529 The installation procedure for other supported versions of Windows is very similar and therefore not shown here Topic Page Gal Hardware Installation TIEREN 146 SLAU278Q May 2009 Revised February 2014 Hardware Installation Guide 145 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Hardware Installation www ti com Hardware Installation Table C 1 shows the USB VIDs and PIDs used in MSP430 tools Table C 1 USB VIDs and PIDs Used in MSP430 Tools Tool USB VID USB PID INF File Name 7430 2013 0 0451 OxF430 usbuart3410 inf eZ430 RF2500 0x0451 OxF432 430CDC inf 7430 2780 0 0451 OxF432 430CDC inf 7430 2560 0 0451 OxF432 430CDC inf MSP WDSxx Metawatch 0x0451 OxF432 430CDC inf eZ430 Chronos 0x0451 OxF432 430CDC inf MSP FET430UIF 0x2047 0x0010 msp430tools inf LaunchPad MSP EXP430G2 0x0451 OxF432 430CDC inf MSP EXP430FR5739 0x0451 OxF432 430CDC inf MSP EXP430F5529 0x0451 OxF432 430CDC inf older MSP FET430UIF used with IAR versions before v5 20 x CCS versions before v5 1 has VID 0x0451 PID OxF430 With the firmware update it is updated to the 0 2047 and 0x0010 respectively 1 Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of IDEs CCS or IAR should be in
112. ace Device Properties dg Dies e A S PCMCIA adapters 27 Ports amp LPT USBNWID 0451 amp PID F4325MI 7 35050001 7 Communications Port COMI 7 ECP Printer Port y Toshiba BT Port COM10 Toshiba BT Port COM11 Toshiba BT Port COM12 7 Toshiba BT Port COM13 27 Toshiba BT Port COM14 7 Toshiba BT Port 20 7 Toshiba BT Port COM21 7 Toshiba BT Port COM40 7 Toshiba BT Port COM6 47 Toshiba BT Port COM7 Processors Smart card readers Sound video and game controllers 3 System devices Figure C 5 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF432 150 Hardware Installation Guide SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Document Revision History Document Revision History Version Changes SLAU278 Initial release SLAU278A Updated USB driver installation according to CCE v3 1 SR1 and CCS v4 SLAU278B Added information about MSP FET430U80USB MSP TS430PN80USB and eZ430 Chronos SLAU278C Added bills of materials and updated some PCBs in Appendix B Added information about MSP TS430DA38 MSP TS430DL48 MSP TS430PW14 MSP TS430PW28 SLAU278D Added information about MSP TS430L092 MSP TS430RS
113. als Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 2 C5 0 2 2nF SMD0805 DNP C12 3 C3 C7 2 10uF 10V SMD0805 5 DNP C11 4 2 100nF SMD0805 478 3351 2 ND 5 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit Keep vias free of 7 Er d 4 10 pin header TH so der Header Receptacle DNP headers and receptacles enclosed with kit Keep vias free of 7 1 4 10 solder Header Receptacle J5 JP1 JP4 JP5 Place jumper on 1 2 of JP4 JP9 8 JP6 7 8 3 pin header male TH SAM1035 03 ND Place on 1 2 on JP4 JP8 JP9 9 JP2 JP3 2 pin header male TH SAM1035 02 ND place jumper on header 10 Jumper 15 38 1024 ND see Pos 8 9 11 JTAG 1 tapin male HRP14H ND 12 BOOTST 0 DNP Keep vias free of solder 13 U1 1 Socket QFN 40B 0 5 01 Manuf Enplas Micro Crystal MS3V T1R 14 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 R1 R7 2 330R SMD0805 541 330ATR ND R2 R3 16 R5 R6 2 0 Ohm 5 00805 541 000ATR ND DNP R2 R3 R5 R6 R8 R9 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 2 layers select appropriate for 19 stand off 4 example Buerklin apply to corners at bottom side 20H1724 20 MSP430 2 MSP430N5736IRHA a enclosed with kit Is supplied by 66 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas I
114. as shown in Table B 4 Table B 4 MSP TS430L092 JP1 Settings Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function Off On The active cable receives power from target socket For this option the target socket must have its own power supply On Off The active cable receives power from the JTAG connector The JTAG connector powers the active cable and the target socket For On On this option the target socket must not have its own power source as this would cause a not defined state e JP2 is for reset For the standard MSP TS430L092 this jumper must be set It sets the reset pin to high and can also control it Without this jumper on the MSP TS430L092 reset is set to zero gt 20000000 10000000 1092 Active RoHS Rev 1 4 2 Figure B 8 MSP TS430L092 Active Cable Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Hardware 41 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430L092 Active Cable www ti com Table B 5 MSP TS430L092 Active Cable Bill of Materials Pos Ref Des Description DigiKey Part No Comment Board ML 4 100nF SMD0603 2 C2 C4 1uF SMD0805 3 R1 R10 10K SMD0603 4 R2 4K7 SMD0603 5 R3 R6 R7 4 100 SMD0603 R9 6 R8 1 680k SMD060
115. aterials Pos Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND 3 eer 4 100nF 5 00805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 311 1245 2 ND DNP C10 C12 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND D1 1 green LED SMD0805 P516TR ND DNP headers and 7 4 20 pin header SAM1029 20 ND Ea with solder DNP headers and receptacles enclosed with kit Keep vias free of 7 1 4 20 pin header TH solder SAM1213 20 ND Header Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 5 JP6 9 ae 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header JP4 1 SAM1035 02 ND Jumper only 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP5 JP6 7 JP8 9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 Q1 0 Crystal 2276840 Coad 2 Keep vias free of 5pF 15 Q2 1 Crystal 2 16 R3 R7 2 330 SMD0805 541 330ATR ND 1 R2 R4 17 R6 R8 R9 2 0 SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 R12 18 R10 1 100 SMD0805 Buerklin 07E500 18 R11 0 1M O SMD0805 DNP 18 R5 1 47k SMD0805 541 47000ATR ND 19 U1 1 1 201 0804 014 Yamaichi 20 1 79 77 2 lay
116. ce contains important safety information about temperatures and voltages For additional information on TI s environmental and or safety programs please visit www ti com esh or contact TI No license is granted under any patent right or other intellectual property right of covering or relating to any machine process combination in which such products or services might be or are used currently deals with a variety of customers for products and therefore our arrangement with the user is not exclusive Tl assumes no liability for applications assistance customer product design software performance or infringement of patents or services described herein REGULATORY COMPLIANCE INFORMATION As noted in the EVM User s Guide and or EVM itself this EVM and or accompanying hardware may or may not be subject to the Federal Communications Commission FCC and Industry Canada IC rules For EVMs not subject to the above rules this evaluation board kit module is intended for use for ENGINEERING DEVELOPMENT DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause i
117. ching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control A side issue is that if the UIF firmware has entered this switch on and switch off loop it is not possible to turn off the power supply to the target by calling 5 430 VCC 0 A power cycle is required to remove the device from this state KickStart and Code Composer Essentials that have the MSP430 dll version 2 04 00 003 and higher do not show this problem Update the software development tool to this version or higher to update the MSP FET430UIF firmware Some PCs do not supply 5 V through the parallel port Device identification problems with modern PCs because the parallel port often does not deliver 5 V as was common with earlier hardware 1 When connected to a laptop the test signal is clamped to 2 5 V 2 When the external becomes less than 3 V up to 10 mA is flowing in the adapter through pin 4 sense Measure the voltage level of the parallel port If it is too low provide external 5 V to the Voc pads of the interface The jumper on the target socket must be switched to external power 28 Frequently Asked Questions and Known Issues SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 APPENA B SLAU278Q May 2009 Revised February 2014 INSTRUMENTS Hardware This appendix con
118. dentified using the EVM schematic located in the EVM User s Guide When placing measurement probes near these devices during normal operation please be aware that these devices may be very warm to the touch As with all electronic evaluation tools only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs Agreement to Defend Indemnify and Hold Harmless You agree to defend indemnify and hold its licensors and their representatives harmless from and against any and all claims damages losses expenses costs and liabilities collectively Claims arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory and even if the EVM fails to perform as described or expected Safety Critical or Life Critical Applications If you intend to evaluate the components for possible use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification then you must specifically notify of such intent and enter into a separate Assurance and Indemnity Agreement Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Cop
119. e that supports 2 wire JTAG communication in 4 wire JTAG mode the upper limit for C1 should not exceed 2 2 nF This applies to both TI FET interface modules LPT and USB FET Figure 2 1 Signal Connections for 4 Wire JTAG Communication SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Design Considerations for In Circuit Programming Copyright 2009 2014 Texas Instruments Incorporated 21 5 INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com Importantto connect MSP430F xxx lt 1 J1 see Note e 1 92 see Note A 2 R1 gt 10yF 47 Note i VCC TOOL e RST NMI SBWTDIO VCC TARGET TEST VPP TCK GND R2 3300 TEST SBWTCK 1 2 2nF Note 22 local target power supply is used make connection J1 If power from the debug programming adapter is used make connection J2 The device RST NMI SBWTDIO pin is used in 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper limit for C1 is 2 2 nF when using current tools R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow
120. ect device supply with boost converter They can be opened to measure device current consumption For default operation they should be closed 713 ecco c 0 R8 850 DRO 9 5 1 00000008 2 gt 1C189 0142 146 TEXAS MSP TS430L092 9 INSTRUMENTS Rev 1 1 E Figure 6 MSP TS430L092 Target Socket Module 38 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430L092 Table B 3 MSP TS430L092 Bill of Materials Pos Ref Des No nor Description DigiKey Part No Comment 1 C1 C2 2 330nF SMD0603 2 C5 1 100n SMD0603 3 C6 1 10u SMD0805 4 C10 1 100n SMD0603 5 EEPROM1 1 M95512 SO08 SO8 ST Micro M95160R Digikey 497 8688 1 ND DNP headers and receptacles enclosed with kit 7 J1 J2 2 7 header TH Keep vias free of solder SAM1213 07 ND Header SAM1035 07 ND Receptacle 8 J3 1 3 pin header male TH SAM1035 03 ND 9 J4 J5 2 FE4L FE4H 4 pol Stiftreihe DNP free of solder Reichelt MicroMaTch 11 J13 1 MICRO_STECKV_10 Connector MM FL 10G 12 JP1 JP2 JP3 3 2 pin header male TH SAM1035 02 ND place jumper on header 15 L1 1 33uH SMD0806 LQH2MCN330K02L Farnell 151 5557 16 LED1 LED4 2 LEDCHIPLED_0603 Fa
121. edback Copyright 2009 2014 Texas Instruments Incorporated 138 MSP FET430PIF Hardware 34881 juger ue Tm gt gt 25 284 5 m B B 3 23 23 25 B o mi Figure 68 MSP FET430PIF FET Interface Module 5 INSTRUMENTS www ti com zi z lt T N BEE B 3 5 5 11 221 on ba cion E o 2 gt o 2 uj SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 4 TEXAS INSTRUMENTS MSP FET430UIF www ti com B 35 MSP FET430UIF GND 18uF 6 3U SETUCCT JE 10uF 6 3U C2 T 335 Qi 8MHz Ci TDO TDI 5 UF2TEST UF 2TDI UCCTON 208 TEST BST 3410 TxD SETUF TGTRST SCL SDA USBFET
122. eedback SLAU278Q May 2009 Revised February 2014 Hardware 96 Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug 4 wire mode Orient Pin 1 of MSP430 device R18 8 821124 5509 88 75 78 J4 65 61 Open to disconnect LED 01 R3 D1 LED connected to E e 9 Doerr 16 le C4 217 nci 69 92 UL o e Ez 543212 LED 21 25 12 38 69 35 48 9 0000000000000000000 MSP TS43 PN8 A Rev 1 0 RoHS Figure B 44 MSP TS430PN80A Target Socket Module PCB SLAU278Q May 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated MSP TS430PN80A Connector J5 External power connector Jumper JP3 to ext If the system should be supplied LDOI J6 close JP4 and set JP3 to external Hardware 97 5
123. ers 21 2 2 4 Buerklin 20H1724 eid to corners at bottom 22 MSP430 2 MSP430F5529 22 Insulating http www ettinger de Art 3 disk to Q2 1 Insulating disk to Q2 Detail cfm ART_ARTNUM 70 08 121 27 C33 1 220n Buerklin 53D2074 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright O 2009 2014 Texas Instruments Incorporated Hardware 101 13 5 INSTRUMENTS MSP TS430PN80USB www ti com Table B 25 MSP TS430PN80USB Bill of Materials continued Pos Ref Des pon Description DigiKey Part No Comment 28 C35 1 10p Buerklin 56D102 29 C36 1 10p Buerklin 560102 30 C38 1 220n Buerklin 53D2074 31 C39 1 4u7 Buerklin 53D2086 32 C40 1 0 1u Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 IC7 1 TPD4E004 Manu 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 852 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 d 5 0 470R Buerklin 07E564 DNP 41 R33 1 1k4 Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 1 0 P12225STB ND DNP 46 52 0 P12225STB ND DNP 46 53 1 P12225STB ND 47 0581 1 USB_RECEPTACLE FARNELL 117 7885 Hardware SLAU278Q May 2009 Revised February 2014 102 Copyright 2009 2014 Texas Instruments Incorporated
124. es Keyboards B Mice and other pointing devices Modems Monitors B P multi port serial adapters MSP FET430UIF TI USB FET Adapter E Network adapters PCMCIA adapters 5 9 Ports COM amp LPT 7 Bluetooth Communications Port 4 Communications Port COM1 7 ECP Printer Port LPT1 E MSP FET430UIF Serial Port COM19 87 Processors Smart card readers Sound video and game controllers System devices Universal Serial Bus controllers BB Hardware Installation Figure C 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware Installation Guide 149 TEXAS INSTRUMENTS Hardware Installation www ti com Device Manager File Action Sea 0797344 Batteries 4 Computer Disk drives 88 Display adapters Human Interface Devices Bluetooth HID port from TOSHIBA Bluetooth HID port from TOSHIBA Bluetooth HID port from TOSHIBA HID compliant consumer control device HID compliant device USB Human Interface Device USB Human Interface Device IDE ATA ATAPI controllers General Driver Details Keyboards T5 Mice and other pointing devices ay USB Human Interface Device Monitors USB Human Interf
125. f Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 31 i 1 9 15x9 15ximm THRM PAD CC430F6147 u IC Step Down Converter with Bypass Mode 33 U2 1 for Low Power Wireless 562370 4 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 JP6 JP8 3 Pin Connector 1x3pin 61300311121 WUERTH 36a ro i 4 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 38 C7 1 Capacitor Ceramic 1206 16V X5R 20 GRM31CR61C226ME15L MURATA 38 C8 9 2 CAP SMD Ceramic 0402 2 2uF X5R GRM155R60J225ME15D MURATA 38 C041 1 n SMD Ceramic 0603 4 7uF 16V 1096 MURATA 136 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP FET430PIF 34 MSP FET430PIF 02456211 28 und 1x3 8 9 R44 330k 330k 9 83 10024541 9 Y brZOHUPZ 22 9 2 R30 R29 optional optional R25 R24 27 KE kon aeg 9113 001 10027720792 AI E dL34 dSW 2 50 a ejaeiu 1Di uonie u3 uset4 jI0 vd134 dSH SINAWNYLSNI SUX3L Figure B 67 FET Interface Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 137 Submit Documentation Fe
126. f cc430 CON4 spare CONS 1 2 XOUT Vdd GND Vcore LCDCAP Vddai Vdda2 GND AGND 8 JTAG BASE JTAG Port CON Vdd GND AGND Figure B 61 EM430F5137RF900 Target board Schematic 125 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS EM430F5137RF900 www ti com JTAG connector Jumper JP2 ASUTE CUNMENE mu Close EXT for external supply Jump Close INT for supply External power connector 2 mod CON12 JPi a JTAG GND Jumper JP1 Close JTAG osition to Open to disconnect LEDs debug in jumper JP5 JP10 JTAG mode 1 SBW position debug in s ooo to Spy Bi Wire mode Push button S2 LED D1 green connected connected to P17 to P1 0 via JP5 Footprint for 32kHz crystal Use 00 resistor for R431 R441 to make XIN XOUT available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA Figure B 62 EM430F5137RF900 Target board The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 126 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorp
127. get Socket Module PCB 116 Hardware SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ5x100 Table B 30 MSP TS430PZ5x100 Bill of Materials Pos Ref Des Description Part 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation 1 C3 C4 47pF SMDOBOS Check your crystal spec 2 C6 C7 2 10uF 10V Tantal Size B 511 1463 2 ND C5 C10 3 C11 C12 4 100nF SMD0805 311 1245 2 ND DNP C12 C14 C13 C14 4 C8 0 2 2nF SMD0805 DNP 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 67 1553 1 ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 0 25 header TH Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP9 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 JP5 12 9 Jumper 15 38 1024 ND JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH DNP Keep free of solder Q1 Micro Crystal MS1V
128. get Socket Module Schematic 70 28 MSP TS430RGZ48B Target Socket Module 0 82 71 B 29 MSP TS430RGZ48C Target Socket Module Schematic 73 B 30 MSP TS430RGZ48C Target Socket Module 0 6 0 nnne 74 B 31 MSP TS430PM64 Target Socket Module 76 32 MSP TS430PM64 Target Socket Module 00 8 nnne 77 B 33 MSP TS430PM64A Target Socket Module 79 B 34 MSP TS430PM64A Target Socket Module 80 B 35 MSP TS430RGC64B Target Socket Module 82 B 36 MSP TS430RGC64B Target Socket Module 006 00 83 B 37 MSP TS430RGC64C Target Socket Module 8 1 86 38 MSP TS430RGC64C Target Socket Module nenne 87 39 MSP TS430RGC64USB Target Socket Module Schematic 89 40 MSP TS430RGC64USB Target Socket Module PCB 90 41 MSP TS430PN80 Target Socket Module 0 93 42 MSP TS430PN80 Target Socket Module 0 0 1 94 B 43 MSP TS430PN80A Target Socket Module Schematic 0
129. granted under any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which components or services are used Information published by regarding third party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from under the patents or other intellectual property of Reproduction of significant portions of information data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice Tl is not responsible or liable for any such statements Buyer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in i
130. ight 2009 2014 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS www ti com List of Figures 2 1 Signal Connections for 4 Wire JTAG II m n nen 21 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx 22 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx 5 DEVICES NE 23 1 MSP TS430D8 Target Socket Module Schematic eens 31 B 2 MSP TS430D8 Target Socket Module 32 B 3 MSP TS430PW14 Target Socket Module Schematic 34 B 4 MSP TS430PW14 Target Socket Module PCB 0 8 1 35 B 5 MSP TS430L092 Target Socket Module 37 B 6 MSP TS430L092 Target Socket Module 0 8 nnne 38 B 7 MSP TS430L092 Active Cable Target Socket Module 222 2 40 B 8 MSP TS430L092 Active Cable Target Socket Module 22 1 2 2 2 41 9 MSP TS430PW24 Target Socket Module Schematic 43 10 MSP TS430PW24 Target Socket Module PCB
131. in socket SAM1029 04 ND 11 1 508 Socket 369 0082 Manuf Yamaichi 12 D1 1 red LED 0603 DNP enclosed with kit Is 13 MSP430 2 MSP430x supplied by 14 PCB 1 50 0mmx44 5mm 77722 SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 33 www ti com Xi TEXAS INSTRUMENTS B 2 MSP TS430PW14 MSP TS430PW14 RST NMI SBWTCK TMS TDI TDO SBWTDIO TEST SBWTCK R2 R5 47K 330R 3 3 3 3 gt 3 3 TEST SBWTCK RST SBWTDIO f P1 7 TDO P1 6 TDI f P1 5 TMS 1 4 1 1 1 1 1 1 SBW gt J7 J8 J9 J10 J11 J12 C8 2 2nF 2 _ to measure supply current DNP JTAG Mode selection 4 wire JTAG Set jumpers J7 to J12 to position 2 3 I 2 wire SpyBiWire Set jumpers J7 to J12 to position 2 1 C5 1f J6 GND 10uF 10 VCC430 128 XOUT DN TEST SBWICK RSTI SBWTDIO c1 j DNP PT 5 TMS 1207 E DN 100nF Socket ENPLAS Type OTS 14 065 R3 green pi MSP TS430PW14 Target Socket Board TITLE MSP TS430PW14 Document Number Date 7 16 2007 8 22 36 AM Sheet 1 1 Submit Documentation Feedback SLAU278Q May 2009 Revised February
132. ion Root gt Embedded Workbench x x 430 drivers TIUSBFETeZ430 UART or Installation Root Embedded Workbench x x 430 drivers lt Win_OS gt depending of firmware version of the tool The USB driver is installed automatically Detailed driver installation instructions can be found in Appendix C After connecting to a PC the USB FET performs a self test during which the red LED may flash for approximately two seconds If the self test passes successfully the green LED stays on Use the 14 conductor cable to connect the USB FET interface module to a target board such as an MSP TS430xxx target socket module Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with circular indentation on the top surface aligns with the 1 mark on the PCB Compared to the parallel port debug interface the USB FET has additional features including JTAG security fuse blow and adjustable target Vec 1 8 V to 3 6 V Supply the module with up to 60 mA Hardware Installation 2430 MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 To install eZA30 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 tools follow instructions 1 and 2 of Section 1 15 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 Follow these steps to install the hardware for the MSP FET430Uxx and MSP TS430xxx tools 1 2 3 Follow instructions 1 and 2 of Section 1 15 Co
133. it for C1 is 2 2 nF when using current tools Figure 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx and MSP430F6xx Devices SLAU278Q May 2009 February 2014 Submit Documentation Feedback Design Considerations for In Circuit Programming Copyright 2009 2014 Texas Instruments Incorporated 23 5 INSTRUMENTS External Power www ti com 2 2 2 3 24 External Power The MSP FET430UIF can supply targets with up to 60 mA through pin 2 of the 14 pin connector Note that the target should not consume more than 60 mA even as a peak current as it may violate the USB specification For example if the target board has a capacitor on Vec than 10 uF it may cause inrush current during capacitor charging that may exceed 60 mA In this case the current should be limited by the design of the target board or an external power supply should be used The Vec for the target can be selected between 1 8 V and 3 6 in steps of 0 1 V Alternatively the target can be supplied externally In this case the external voltage should be connected to pin 4 of the 14 pin connector The MSP FET430UIF then adjusts the level of the JTAG signals to external Vec automatically Only pin 2 MSP FET430UIF supplies target or pin 4 target is externally supplied must be connected not both at the same time When target socket module is powered from an external supply the externa
134. ki IAR Embedded Workbench Version 3 for MSP430 tm User s Guide literature number SLAU138 IAR Embedded Workbench KickStart installer literature number SLACO50 2430 2013 Development Tool User s Guide literature number SLAU176 eZ430 RF2480 Demonstration Kit User s Guide literature number SWRU151 eZ430 RF2500 Development Tool User s Guide literature number SLAU227 eZA30 HF2500 SEH Development Tool User s Guide literature number SLAU273 2430 Development Tool User s Guide literature number SLAU292 Spectrum Analyzer MSP SA430 SUB1GHZ User s Guide literature number SLAU371 MSP EXP430F5529 Experimenter Board User s Guide literature number SLAU330 MSP EXP430F5438 Experimenter Board User s Guide literature number SLAU263 MSP EXP430G2 LaunchPad Experimenter Board User s Guide literature number SLAU318 MSP Gang Programmer MSP GANG User s Guide literature number SLAU358 MSP430 Gang Programmer MSP GANG430 User s Guide literature number SLAU101 MSP430 device user s guides MSP430x1xx Family User s Guide literature number SLAU049 MSP430x2xx Family User s Guide literature number SLAU144 MSP430x3xx Family User s Guide literature number SLAUO12 MSP430x4xx Family User s Guide literature number 56 MSP430x5xx and MSP430x6xx Family User s Guide literature number SLAU208 CC430 Family User s Guide literature number SLAU259 We 2 I 8 Read This First SLAU278Q May 2009 Revised February 2014 Sub
135. l supply powers the device on the target socket module and any user circuitry connected to the target socket module and the FET interface module continues to be powered from the PC through the parallel port If the externally supplied voltage differs from that of the FET interface module the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module so that it may adjust its output voltage levels accordingly See the target socket module schematics in Appendix B The PC parallel port can source a limited amount of current Because of the ultra low power requirement of the MSP430 a standalone FET does not exceed the available current However if additional circuitry is added to the tool this current limit could be exceeded In this case external power can be supplied to the tool through connections provided on the target socket modules See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors Note that the MSP is not recommended for new design Bootstrap Loader BSL The JTAG pins provide access to the memory of the MSP430 and CC430 devices On some devices these pins are shared with the device port pins and this sharing of pins can complicate a design or sharing may not be possible As an alternative to using the JTAG pins most 5 4 devices contain a program a bootstrap loader that permit
136. le for compliance with all legal and regulatory requirements in connection with such use TI has specifically designated certain components as meeting ISO TS16949 requirements mainly for automotive use In any case of use of non designated products TI will not be responsible for any failure to meet ISO TS16949 Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity dataconverter ti com www dlp com www ti com clocks interface ti com logic ti com microcontroller ti com www ti rfid com www ti com omap Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space Avionics and Defense Video and Imaging E2E Community www ti com wirelessconnectivity www ti com computers www ti com consumer apps www ti com energy www ti com industrial www ti com medical www ti com security www ti com space avionics defense www ti com video Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2014 Texas Instruments Incorporated
137. matic 4 of 4 1 1 2 2 1 142 B 73 MSP FET430UIF USB Interface 143 C 1 Windows XP Hardware WIZ ard mnn Tara neo ma cu A E 146 C 2 Windows XP Driver Location Selection 0 2 12 2 2 147 Device Manager Using USB Debug Interface using VID PID 0 2047 0 0010 148 C 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 4 149 C 5 Device Manager Using USB Debug Interface with VID PID 0 0451 0 4 2 150 SLAU278Q May 2009 Revised February 2014 List of Figures 5 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 6 13 5 INSTRUMENTS www ti com List of Tables 1 1 Flash Emulation Tool FET Features and Device 11 1 2 Individual Kit Contents 5430 14 B 1 843008 Bill Of 33 B 2 MSP TS430PW14 Bill of
138. me of MSP TS430xx board can be derived from the name of the MSP FET430xx kit for example the MSP FET430U28A kit contains the MSP TS430PW28A board Refer to the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on the device errata may also be found in the device bug database at www ti com sc cgi bin buglist cgi SLAU278Q May 2009 Revised February 2014 Get Started Now 13 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Kit Contents FET430F6137RF900 1 11 Kit Contents FET430F6137RF900 One READ ME FIRST document 1 12 One legal notice One interface module Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB Two battery packs Four AAA batteries Two 868 MHz or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers One USB cable One 14 pin JTAG conductor cable Kit Contents MSP TS430xx One READ ME FIRST document One 32 768 kHz crystal from Micro Crystal except MSP TS430PW24 One target socket module TEXAS INSTRUMENTS www ti com 2x7 pin male JTAG connector is also present on the PCB see different setup for 1092 MSP430 Device samples see Table 1 2 for sample type Table 1 2
139. mit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com If You Need Assistance MSP430FR57xx Family User s Guide literature number SLAU272 MSP430FR58xx and MSP430FR59xx Family User s Guide literature number SLAU367 If You Need Assistance Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments Product Information Center PIC Contact information for the PIC can be found on the web site at www ti com support The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers engineers and other experts Additional device specific information can be found on the MSP430 web site SLAU278Q May 2009 Revised February 2014 Read This First 9 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Chapter 1 SLAU278Q May 2009 Revised February 2014 Get Started Now This chapter lists the contents of the FET and provides instruction on installing the hardware Topic Page 1 1 Flash Emulation Tool EET Overview 222222222 11 12 Kit Contents MSP EETA4SOBIE 12 4532 TKE Contents ez430 F2013 22 12 1 4 Kit Contents eZ430 T2012 222 27 22 2222 2222722 77 12 1 5 Kit Contents 2430 2500 2222222 222 222222222 12 1 6 Ki Contents eZ430 RE2500T5
140. mitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Cet appareil num rique de la classe A ou B est conforme la norme NMB 003 du Canada Les changements ou les modifications pas express ment approuv s par la partie responsable de la conformit ont pu vider l autorit de l utilisateur pour actionner l quipement Concernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement Concernant les EVMs avec antennes d tachables Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain
141. mpers J4 to J7 SLAU278Q Section B 19 In last sentence corrected jumper Removed RF Emission Testing section NOTE Page numbers for previous revisions may differ from page numbers in the current version SLAU278Q May 2009 Revised February 2014 Revision History 151 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated EVALUATION BOARD KIT MODULE EVM ADDITIONAL TERMS Texas Instruments provides the enclosed Evaluation Board Kit Module EVM under the following conditions The user assumes all responsibility and liability for proper and safe handling of the goods Further the user indemnifies from all claims arising from the handling or use of the goods Should this evaluation board kit not meet the specifications indicated in the User s Guide the board kit may be returned within 30 days from the date of delivery for full refund THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES EXPRESSED IMPLIED OR STATUTORY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES Please read the User s Guide and specifically the Warnings and Restrictions notice in the User s Guide prior to handling the product This noti
142. n menu at top of Debug View must be selected For C SPY Release JTAG On Go must be selected 10 As an alternative to sharing the JTAG and port pins on low pin count devices consider using an MSP430 device that is superset of the smaller device A very powerful feature of the MSP430 is that the family members are code and architecturally compatible so code developed on one device for example one without shared JTAG and port pins ports effortlessly to another assuming an equivalent set of peripherals 26 Frequently Asked Questions and Known Issues SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Hardware FAQs 11 Information memory may not be blank erased to OxFF when the device is delivered from TI Customers should erase the information memory before its first use Main memory of packaged devices is blank when the device is delivered from TI 12 The device current is higher then expected The device current measurement may not be accurate with the debugger connected to the device For accurate measurement disconnect the debugger Additionally some unused pins of the device should be terminated See the Connection of Unused Pins table in the device s family user s guide 13 The following ZIF sockets are used in the FET tools and target socket modules 8 pin device D package Yamaichi IC369
143. n of the tool For IAR Embedded Workbench the default folder is Installation Root gt Embedded Workbench x x 430 drivers TIUSBFET eZ430 UART or Installation Root gt Embedded Workbench 430 drivers lt Win_OS gt Found New Hardware Wizard Please choose your search and installation options S Search for the best driver in these locations Use the check boxes below to limit or expand the default search which includes local paths and removable media The best driver found will be installed C Search removable media floppy CD ROM Include this location in the search C Program Files AR Systems Embedded Workben Don t search will choose the driver to install Choose this option to select the device driver from a list Windows does not guarantee that the driver you choose will be the best match for your hardware Figure C 2 Windows XP Driver Location Selection Folder 5 The Wizard generates a message that an appropriate driver has been found SLAU278Q May 2009 February 2014 Hardware Installation Guide Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 147 TEXAS INSTRUMENTS Hardware Installation www ti com 6 The wizard installs the driver files 7 The wizard shows a message that it has finished the installation of the software USB Debug Interface 8 The USB debug interface is installed and ready to use The Device
144. nnect the MSP FET430PIF or MSP FET430UIF debug interface to the appropriate port of the PC Use the 14 conductor cable to connect the FET interface module to the supplied target socket module Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with a circular indentation on the top surface aligns with the 1 mark on the PCB Ensure that the two jumpers LED and VCC near the 2x7 pin male connector are in place Illustrations of the target socket modules and their parts are found in Appendix B SLAU278Q May 2009 Revised February 2014 Get Started Now 17 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Important MSP430 Documents on the Web www ti com 1 18 Important MSP430 Documents on the Web The primary sources of MSP430 information are the device specific data sheet and user s guide The MSP430 web site www ti com msp430 contains the most recent version of these documents PDF documents describing the CCS tools CCS IDE the assembler the C compiler the linker and the librarian are in the msp430 documentation folder A Code Composer Studio specific Wiki page FAQ is available and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page PDF documents describing the IAR tools Workbench C SPY the assembler the C compiler
145. nstruments Incorporated Submit Documentation Feedback 4 TEXAS INSTRUMENTS MSP TS430DL48 www ti com 13 MSP TS430DL48 Ext_PWR RST NMI R5 1 Fon 51 1387 5 15186 t I 10uF 1ov 100nF 02 on Q1 C1 C2 not assembled MSP TS430DL48 Target Socket 0148 TITLE MSP TS430DL48 Document Number Date 11 14 2006 1 24 44 PM Sheet 1 1 Figure B 25 MSP TS430DL48 Target Socket Module Schematic 67 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430DL48 www ti com 114 5710 00000001 000001 Jumper J5 JTAG BOOTST Open to measure current int LED connected Connector J3 to P1 0 External power connector Jumper JP1 to ext 000000000000 000000000000 U 1 Jumper 94 disconnect LED 000000000000 000000000000 Orient pin 1 of MSP430 device Figure B 26 MSP TS430DL48 Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 68 Hardware Submit Doc
146. nterference with radio communications in which case the user at his own expense will be required to take whatever measures may be required to correct this interference General Statement for EVMs including a radio User Power Frequency Use Obligations This radio is intended for development professional use only in legally allocated frequency and power limits Any use of radio frequencies and or power availability of this EVM and its development application s must comply with local laws governing radio spectrum allocation and power limits for this evaluation module It is the user s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental development licenses from local regulatory authorities which is responsibility of user including its acceptable authorization For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to
147. oard 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 DNP C3 C4 2 C6 C7 2 10uF 6 3V Tantal Size 511 1463 2 ND C5 C11 3 C13 C14 6 100nF SMD0805 311 1245 2 ND C19 C20 C10 C12 31 1817 0 100nF 5 00805 311 1245 2 ND DNP C10 12 18 C17 C8 1 2 2nF SMD0805 Buerklin 53 D 292 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND J1 J2 J3 DNP headers and receptacles enclosed 7 J4 4 25 SAM1029 25 ND with kit Keep vias free of solder DNP headers and receptacles enclosed 7 1 4 25 SAM1213 25 ND with kit Keep vias free of solder 8 J5 J6 2 3 pin header male TH SAM1035 03 ND JP5 JP6 9 6 3 pin header male SAM1035 03 ND place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 1 JP4 1 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 JP4 JP5 JP6 12 10 Jumper 15 38 1024 ND JP7 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 15 Q1 0 Crystal dri Q1 Keep vias free of solder 16 Q2 1 Crystal DNP Q2 Keep vias free of solder 17 R3 R7 2 330 Ohm SMD0805 541 330ATR ND R1 R2 R4 R6 R8 R9 18 R10 R11 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12
148. om EM430F6137RF900 B 32 EM430F6137RF900 y psi B 55 pass nus Pza mysa 729 P2S IBS AS VREF VenEF oen over aver Pise PSVXOUT avss SBWTEK m 35 65 09 os 9 9 TNEI Pon 01 21 20 01 1 29 2 898 193 79 00633 519385 21194 SNOISIAGU 01 71 20 XXXXX Z u33 V 8 88 888g gt gt 2 Is
149. operate the equipment FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense FCC Interference Statement for Class EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the
150. opyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PZ100B www ti com DuDSvs AS R10 R11 JTAG S BOOTST Connector J5 15 connector 8 Jumper JP1 to ext se 55 es gle ra Jumper JP1 Open to measure current 8 gj e 1 C29 nacz je Orient Pin 1 of MSP430 device n 9 D e C16 11011 pore JP11 JP12 JP13 Jumpers JP5 to JP10 e 8 e Connect 1 2 to connect Close 1 2 to debug in Spy Bi Wire mode e AUXVCCx with DVCC Close 2 3 to debug in 4 wire JTAG mode e MC TT AE drive AUXVCCx externally AUXU 5 JP1 nci NI connected to es me ED x9 D1 LED ted to P1 0 1 ux TEED 45 20 passe 00000006 000000000000 1 Jumper 2 Open to disconnect LED Figure B 52 MSP TS430PZ100B Target Socket Module PCB 110 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Te
151. opyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Kit Contents eZ430 Chronos xxx 1 8 Kit Contents eZ430 Chronos xxx 433 868 915 One QUICK START GUIDE document One ez430 Chronos emulator One screwdriver Two spare screws eZ430 Chronos 433 One 433 eZ430 Chronos watch battery included One 433 MHz eZ430 Chronos access point eZ430 Chronos 868 One 868 MHz eZ430 Chronos watch battery included One 868 MHz eZ430 Chronos access point eZ430 Chronos 915 One 915 2 eZ430 Chronos watch battery included 915 MHz eZ430 Chronos access point 1 9 Kit Contents MSP FET430UIF One READ ME FIRST document One MSP FET430UIF interface module One USB cable One 14 conductor cable 1 10 Kit Contents MSP FET430xx One READ ME FIRST document One MSP FET430UIF USB interface module This is the unit that has a USB B connector on one end of the case and a 2x7 pin male connector on the other end of the case One USB cable One 32 768 kHz crystal from Micro Crystal if the board has an option to use the quartz A2xT pin male JTAG connector is also present on the PCB see different setup for L092 One 14 Pin JTAG conductor cable One small box containing two 5 430 device samples See table for Sample Onetarget socket module To determine the devices used for each board and a summary of the board see Table 1 2 The na
152. orated 5 INSTRUMENTS www ti com EM430F5137RF900 Table B 33 EM430F5137RF900 Bill of Materials No per Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment CUSTOMER SUPPLY CRYSTAL 1 Q1 1 SMT 26MHz 26 ASX 531 CS ELECTRONIC C1 C5 C082 C222 C271 2 C281 C311 14 7 SMT 0402 16 0402 104 2 AVX C321 C341 C412 C452 CAPACITOR SMT 0603 CERAMIC 3 C071 1 SUF IN 0 XER 0 47uF 0603YD474KAT2A AVX 4 R401 1 RES0402 47 0K 47kQ 77 DALE HEADER THU MALE 14P 2X7 5 CON11 1 251 09 18 514 6323 HARTING HEADER THU MALE 10P 2X5 6 CON10 21 09 18 510 6323 HARTING DNP 7 D1 1 LED SMT 0603 GREEN 2 1V active APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V active APT1608EC KINGBRIGHT UNINSTALLED CRYSTAL SMT 3P MICRO 9 08 0 Customer Supply CRYSTAL BNF HEADER THU MALE 3P 1x3 10 CON12 1 is 22 03 5035 MOLEX 11 C251 C261 2 50V 5 27pF 27 GRM36COG270J50 MURATA 12 L341 1 FERRITE 5 0402 1 0 250mA BLM15HG1025N1D MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H101JZ 13 100pF 0 25pF COG NPO 100PF o4 INDUCTOR SMT 0402 2 2nH 0 1nH 5 14 L304 1 SOOMUS 0 0022uH LOP15MN2N2B02 MURATA INDUCTOR SMT 0402 15nH
153. ot transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shinjuku 6 chome Shinjuku ku Tokyo Japan http www tij co jp ORMOMRRTY LESBEWVCZOROZRSE E 59 7 UA TULE KEFEN ETN CCHRB lt K 1 RUSSE ARS C EO lt 18328 1735 CEOSHLEREESO MBM C C 2 lt 3 2 1546 1 12 lt BEAIBALZURY RE 9 AU EAS 1 99 BATEYA Rae ie 6 782 412815 http Awww tij co jp EVALUATION BOARD KIT MODULE EVM WARNINGS RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only in Laboratory Development Environments Unless otherwise indicated this EVM is not a finished electrical equipment and not intended for consumer use It is intended solely for use for preliminary feasibility evaluation in laboratory development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsy
154. pin 6 and RST SBWTDIO socket pin 7 in system debugging can disturb the LFXT1 low frequency crystal oscillator operation ACLK This behavior applies only to the Spy Bi Wire 2 wire JTAG configuration and only to the period while a debug session is active Workarounds e Use the 4 wire JTAG mode debug configuration instead of the Spy Bi Wire 2 wire JTAG configuration This can be achieved by placing jumpers JP4 through JP9 accordingly Use the debugger option Run Free that can be selected from the Advanced Run drop down menu at top of Debug View This prevents the debugger from accessing the MSP430 device while the application is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock source to drive XIN directly With current interface hardware and software there is a weakness when adapting target boards that are powered externally This leads to an accidental fuse check in the MSP430 device This is valid for PIF and UIF but is seen most often on the UIF A solution is being developed Workarounds Connect the RST NMI pin to the JTAG header pin 11 LPT and USB tools are able to pull the RST line which also resets the device internal fuse logic e Use the debugger option Release JTAG On Go that can be selected from the IDE drop down menu This prevents the debugger from accessing the MCU while the a
155. pplication is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock source to drive XIN directly The 14 conductor cable that connects the FET interface module and the target socket module must not exceed 8 inches 20 centimeters in length The signal assignment on the 14 conductor cable is identical for the parallel port interface and the USB FET To use the on chip ADC voltage references the capacitor must be installed on the target socket module See the schematic of the target socket module to populate the capacitor according to the data sheet of the device To use the charge pump on the devices with LCD Module the capacitor must be installed on the target socket module See the schematic of the target socket module to populate the capacitor according to the data sheet of the device Crystals or resonators Q1 and Q2 if applicable are not provided on the target socket module For MSP430 devices that contain user selectable loading capacitors see the device and crystal data sheets for the value of capacitance Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or C SPY as any required clocking and timing is derived from the internal DCO and FLL On devices with multiplexed port or JTAG pins to use these pin in their port capability For CCS Run Free in Run pulldow
156. r Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 JP1 JP2 10 JP4 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Micro Crystal MS1V T1K 14 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 Q2 1 Crystal Q2 4MHz Buerklin 780134 16 R3 R7 2 330 0 SMD0805 541 330ATR ND R1 R2 R4 17 R6 R8 R9 3 0 Q SMD0805 541 000ATR ND DNP R6 R8 R9 R12 R12 18 R10 1 100 Q SMD0805 Buerklin 07E500 18 R11 1 1M Q SMD0603 not existing in Rev 1 0 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 Socket IC201 1004 008 Manuf Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand 4 Buerklin 20H1724 apply to corners at bottom off side DNP enclosed with kit Is 22 MSP430 2 MSP430F5529 supplied by TI Insulatin http www ettinger de Art De 23 9 1 Insulating disk to Q2 tail cfm ART_ARTNUM 70 0 disk to Q2 8 121 24 C16 1 4 7 nF SMD0603 27 C33 1 220n SMD0603 Buerklin 53D2074 28 C35 C36 2 10p SMD0603 Buerklin 56D102 120 Hardware SLAU278Q 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated
157. re Schemati TS430RSB40 Target Socket Module Figure B 21 MSP SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated TEXAS INSTRUMENTS MSP TS430RSB40 www ti com 14 18 5 0000000 00000 00000002 00 5125 Connector J5 e e External power connector onc Jumper JP1 to ext JP7 JP6 JP5 JP4 74 Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 JTAG mode Jumper JP2 1 10 Open to measure current ROBES ERS ins C2 C4 C2 Orient Pin 1 of MSP430 device wn 0000000000 lt lt 2 1 00000000800 Open to disconnect LED _ 01 LED connected to P1 0 INSTRUMENTS 54 5 4 Rev 1 2 Figure 22 MSP TS430RSB40 Target Socket Module PCB 62 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INST
158. re SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430D8 www ti com 14 pin connector for debugging only in Spy Bi Wire mode 4 Wire JTAG not available D1 LED connected to P1 2 Connector 15 External power connector Jumper JP3 to ext Jumper JP2 Open to disconnect LED a e x u m e gt 7 gt X Figure 2 MSP TS430D8 Target Socket Module PCB 32 Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430D8 Table B 1 MSP TS430D8 Bill of Materials ea No per PE Position Ref Des Board Description DigiKey Part No Comment 1 J4 J6 2 2 pin header male TH SAM1035 02 ND place jumper on header 2 J5 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 3 SBW 1 10 pin connector male TH HRP10H ND 4 J3 1 3 pin header male TH SAM1035 03 ND 5 C8 1 2 2nF CSMD0805 Buerklin 53 D 292 6 C7 1 10uF 10V 1210ELKO 478 3875 1 ND 7 R5 1 47K 0805 541 47000ATR ND 8 C5 1 100nF CSMD0805 311 1245 2 ND 9 R2 R3 2 330R 0805 541 0 DNP headers enclosed with kit 10 J1 J2 2 4 pin header TH SAM1029 04 ND Keep vias free of solder 10 1 2 1 4 p
159. revents any contention that might occur if the local on board Vec were connected to the Vec supplied from the FET interface module MSP GANG or the MSP GANG430 If the feature is not necessary that is if the target board is to be powered from the FET interface module MSP GANG or MSP GANG430 the Vec connection is made to pin 2 on the JTAG header and no connection is made to pin 4 Figure 2 1 and Figure 2 2 show a jumper block that supports both scenarios of supplying Voc to the target board If this flexibility is not required the desired Vc connections may be hard wired to eliminate the jumper block Pins 2 and 4 must not be connected at the same time Note that in 4 wire JTAG communication mode see Figure 2 1 the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4 wire JTAG communication mode However when using devices that support 2 wire JTAG communication mode in 4 wire JTAG mode the RST connection must be made The MSP430 development tools and device programmers perform a target reset by issuing JTAG command to gain control over the device However if this is unsuccessful the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset Design Considerations for In Circuit Programming SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 201
160. rget device DVIO input voltage supplied via header J6 see Figure B 37 This development platform does not supply the 1 8 V DVIO rail on board and it MUST be provided by external power supply for proper device operation For correct JTAG connection programming and debug operation it is important to follow this procedure 1 2 3 4 5 Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V Enable the 1 8 V external DVIO power supply Enable the 1 8 V to 3 6 V VCC power supply alternatively this supply can be provided from the MSP FET430UIF JTAG debugger interface Connect the MSP FET430UIF JTAG connector to the target board Start the debug session using IAR or CCS IDE For more information on debugging the MSP4and MSP430F525x see the device specific data sheets MSP430F522x SLAS718 MSP430F525x SLAS903 and Designing with MSP430F522x and MSP430F521x Devices SLAA558 For debugging of devices MSP430F524x and MSP430F523x without use of the DVIO power domain short JP4 with the jumper SLAU278Q May 2009 Revised February 2014 Hardware 85 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430RGC64C
161. rnell 1686065 17 Q2 1 BC817 16LT1SMD BC817 16LT1SMD SOT23 BEC 18 RO R6 R7 3 2 7 SMD0603 19 R1 1 1k SMD0603 20 R2 1 47k SMD0603 R4 R5 R8 21 R10 RC RD 6 10k SMD0603 22 RA 1 3 9k SMD0603 23 RB 1 6 8k SMD0603 24 Ut 1 da Socket 1 189 0142 Manuf Yamaichi DNP Enclosed with kit Is 22 MSP430 2 MSP430L092PWR supplied by TI SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 39 X TEXAS INSTRUMENTS www ti com 4 74804 IC26 2 74RUC26125 1 46 2 7480 26125 3692 74RUC26125 Submit Documentation Feedback SLAU278Q May 2009 Revised February 2014 Copyright 2009 2014 Texas Instruments Incorporated 4 MSP TS430L092 Active Cable MSP TS430L092 Active Cable 092 Active Cable TITLE MSP TS43 PW14_L 92_ActiveCable Document Number Sheet 1 1 Date 8 31 2009 4 21 17 PM Figure B 7 MSP TS430L092 Active Cable Target Socket Module Schematic Hardware 40 5 INSTRUMENTS www ti com MSP TS430L092 Active Cable Figure B 8 shows the PCB layout for the Active Cable The following pinning is possible JP1 has two jumpers Jumper 1 and Jumper 2 that can be set
162. s the flash memory to be erased and programmed using a reduced set of signals The MSP430 Programming Via the Bootstrap Loader User s Guide SLAU319 describes this interface See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind that is suggests providing access to these signals by for example a header See FAQ Hardware 10 for a second alternative to sharing the JTAG and port pins Design Considerations for In Circuit Programming SLAU278Q 2009 February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 2780 2009 February 2014 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP FET430 hardware Topic Page ATO Hardware sete cae EE oc 26 28 SLAU278Q May 2009 February 2014 Frequently Asked Questions and Known Issues 25 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Hardware FAQs www ti com Hardware FAQs 1 MSP430F22xx Target Socket Module MSP TS430DA38 Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN P2 6 socket
163. sing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active Use the 14 conductor cable to connect the parallel port debug interface module to a target board such as an MSP TS430xxx target socket module Module schematics and PCBs are shown in Appendix B Get Started Now SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated l www ti com TEXAS INSTRUMENTS Hardware Installation MSP FET430UIF 1 15 Hardware Installation MSP FET430UIF Follow these steps to install the hardware the MSP FET430UIF tool 1 2 Install the IDE CCS or IAR you plan to use before connecting USB FET interface to PC The IDE installation installs drivers automatically Use the USB cable to connect the USB FET interface module to a USB port on the PC The USB FET should be recognized as the USB device driver is installed automatically If the driver has not been installed yet the install wizard starts Follow the prompts and point the wizard to the driver files The default location for CCS is c ti ccsv5 ccs_base emulation drivers msp430 USB_CDC c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XX depending of firmware version of the tool The default location for IAR Embedded Workbench is Installat
164. stalled The IDE installation isntalls also drivers for USB Debug Interfaces without user interaction After IDE installation the USB Debug Interface can be connected and will be ready to work within few seconds 2 The driver can be also installed manually After plug in the USB Debug Interface to USB port of the PC the Hardware Wizard starts automatically and opens the Found New Hardware Wizard window 3 Select Install from a list or specific location Advanced see Figure C 1 Found New Hardware Wizard This wizard helps you install software for MSP FET430UIF USB FET Adapter If your hardware came with an installation CD or floppy disk insert it now What do you want the wizard to do Install the software automatically Recommended Click Next to continue lt Back Next gt Cancel Figure 1 Windows Hardware Wizard 146 Hardware Installation Guide SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Hardware Installation 4 Browse to the folder where the driver information files are located see Figure C 2 For CCS the default folder is c tiiccsv5 ccs_base emulation drivers msp430 USB_CDC or c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XxX or c ti ccsv5 ccs_base emulation drivers msp430 USB_eZ RF depending of firmware versio
165. stems It should not be used as all or part of a finished end product Your Sole Responsibility and Risk You acknowledge represent and agree that 1 You have unique knowledge concerning Federal State and local regulatory requirements including but not limited to Food and Drug Administration regulations if applicable which relate to your products and which relate to your use and or that of your employees affiliates contractors or designees of the EVM for evaluation testing and other purposes 2 You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements and also to assure the safety of any activities to be conducted by you and or your employees affiliates contractors or designees using the EVM Further you are responsible to assure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard 3 Since the EVM is not a completed product it may not meet all applicable regulatory and safety compliance standards such as UL CSA VDE CE RoHS and WEEE which may normally be associated with similar items You assume full responsibility to determine and or assure compliance with any such standards and related certifications as may be applicable You will employ reasonable safeguards
166. struments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW24 Table B 6 MSP TS430PW24 Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 C7 2 10uF 10V SMD0805 4 C4 C6 C8 3 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND n7 DNP Headers and receptacles 6 J1 J2 0 12 pin header TH 1 enclosed with kit Keep vias free of solder Header amp Receptacle 45 JP5 Place jumper 1 2 of JP4 JP9 7 JP6 JP7 8 3 pin header male SAM1035 03 ND Place on 1 2 on JP1 JP8 JP9 8 JP2 JP3 2 pin header male SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see Pos7an8 10 JTAG 1 22 connector male HRP14H ND 11 Q1 0 Crystal DNP keep vias free of solder 12 R1 R7 2 330 SMD0805 541 330ATR ND 13 BR BS 2 0 5 00805 541 000ATR ND DNP R5 R6 14 R4 1 47k Ohm SMD0805 541 47000ATR ND Socket OTS 24 28 15 U1 1 065 02 00 Manuf Enplas 16 PCB 1 68 5 x 61 mm 2 layers for example Adhesive Approximately 6mm 5 17 plastic feet 4 width 2mm height 2 5 Apply to corners at bottom side 18 MSP430 2 MSP430AFE2xx DNP enclosed with kit supplied by SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Ins
167. tains information relating to the FET hardware including schematics PCB pictorials and bills of materials BOMs All other tools such as eZ430 series are described in separate product specific user s guides SLAU278Q May 2009 February 2014 Hardware 29 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Appendix B www ti com Topic Page 5430082 2 4400 0 2 2 2 31 Bi2 9MSPZTSASO0PWIA 02 34 3 543010927 22222 37 MSP T95430L092 Active Cable 40 54 2 43 6 54300 285 214 46 4 2 7 7 UOS REN UE TE 49 B 8 54 28 52 9 5430 55 10 754300 23 0 58 Bit MSP TS430RSBA0 61 12 6 6430 64 13 5 48 2 22 22 67 14 MSP TS430RGZ48B es E 70 15 54308 62486 73 16 5230 6 2 76 17 5230 6 79 18 523 066 82 5 85 20 5 89 B21 54 80 2 400424 2 93 B 222 MSP rS430PN80A 96 23 5
168. te to corners at bottom 19 MSP430 2 MSP430F4152IPM SD SLAU278Q May 2009 February 2014 Hardware 81 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430RGC64B 18 MSP TS430RGC64B UCC o L SBHITCI A 24 2 2nFl p5 R1 uF 6 3U 9 R2330R JP5 JP10 1 2 3 UCC1 47K RST NMI SBHTDIO P6 A CBL AL 2 2 2 26 4 CB4 A4 P6 5 CB5 85 P5 8 AB UREF UeREF P5 1 89 UREF UeREF AUCCL P5 4 XIN P5 5 XQUT 4551 pucca 00551 P1 8 TA CLK ACLK 1 2 PJ 1 TOL TCLK ST SBHT us 3 XT20UT P5 P5 2 XT2IN F53XX Socket Yamaichi C201 0804 014 P4 3 T80 2 4 5 762 4 6 TALCLK CBI 2 T81 8 Q TR1 A A TAL2 2 TR2CLK SMI 2 4 2 1 5 TA2 2 4 7 _ 4 6 _ XTLGND2 GND BSL Interface lt SBW lt JTAG GND 98 R11 OR ucc DNP P4 5 PH_UCALRXD PM_ucAisont 46 46 _ 0 _ 51 459 45 P4 3 PM_UCBLCLK PM_ucAsTE 44 34 4 2
169. the development software systems For details of these items see the appropriate documents listed in Section 1 18 This manual applies to the following tools and devices MSP FET430PIF debug interface with parallel port connection for all MSP430 flash based devices MSP FET430UIF debug interface with USB connection for all MSP430 flash based devices e eZ430 F2013 USB stick form factor interface with attached MSP430F 2013 target for all MSP430F20xx MSP430G2x01 MSP430G2x11 MSP430G2x21 MSP430G2x31 devices e eZ430 T2012 three MSP430F2012 based target boards e eZ430 RF2500 USB stick form factor interface with attached MSP430F2274 and CC2500 target for all MSP430F20xx MSP430F21x2 MSP430F22xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices e eZ430 RF2500T MSP430F2274 and CC2500 target board including battery pack e eZ430 RF2500 SEH USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module e eZ430 Chronos xxx USB stick form factor interface with CC430F6137 based development system contained in a watch Includes 1 GHz RF USB access point Stand alone target socket modules without debug interface named as MSP TS430TSxx Tools named MSP FET430Uxx contain the USB debug interface MSP FET430UIF and the respective target socket module MSP TS430TSxx where xx is the same for both names Following tools contain also the USB deb
170. the linker and the librarian are in the common doc and 430 doc folders Supplements to the documents that is the latest information are available in HTML format in the same directories A IAR specific Wiki Page is also available 18 Get Started Now SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated j TEXAS Chapter 2 SLAU278Q May 2009 February 2014 INSTRUMENTS Design Considerations for In Circuit Programming This chapter presents signal requirements for in circuit programming of the MSP430 Topic Page 2 4 Signal Connections for In System Programming and Debugging 20 2 2 aP 24 23 Bootstrap Loader eet 24 SLAU278Q May 2009 Revised February 2014 Design Considerations for In Circuit Programming 19 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com 2 1 20 Signal Connections for In System Programming and Debugging MSP FET430PIF MSP FET430UIF MSP GANG MSP GANG430 MSP PRGS430 With the proper connections the debugger and an FET hardware JTAG interface such as the MSP FET430PIF and MSP FET430UIF can be used to program and debug code on the target board In addition the connections also support the MSP GANG430 or MSP PRG
171. truments Incorporated Hardware 45 Xi TEXAS INSTRUMENTS www ti com MSP TS430DW28 6 MSP TS430DW28 If external supply voltage remove 8 and add 9 0 Ohm R1 C1 C2 RST NMI R5 50K VCC Ext_PWR TCK IMS IDI TST VPP not assembled TST VPP RST NMI J4 SMD Footprint F123 TST VCC P2 5 VSS XOUT P1 3 XIN RST P2 0 2 1 2 2 P3 0 P3 1 P3 2 P3 3 Socket Yamaichi Type 189 0282 042 SOCK28DW not assembled P17 P1 6 P1 5 P1 4 P1 2 P1 1 P1 0 P24 P2 3 P3 7 P3 6 P3 5 P3 4 If external supply voltage remove R11 and add R10 0 Ohm MSP TS430DW28 Target Socket DW28 TITLE MSP TS430DW28 Document Number Date 11 14 2006 1 26 04 PM Sheet 1 1 Figure B 11 MSP TS430DW28 Target Socket Module Schematic SLAU278Q May 2009 Revised February 2014 Hardware 46 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DW28 LED connected to P1 0 Jumper J5 Jumper J4 p Open to measure current Open to disconnect LED Connector J3 External power connector Remove R8 and jumper R9 70000
172. ts applications notwithstanding any applications related information or support that may be provided by Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial actions Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety critical applications In some cases components may be promoted specifically to facilitate safety related applications With such components 8 goal is to help enable customers to design and create their own end product solutions that meet applicable functional safety standards and requirements Nonetheless such components are subject to these terms No TI components are authorized for use in FDA Class III or similar life critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use Only those TI components which has specifically designated as military grade or enhanced plastic are designed and intended for use in military aerospace applications or environments Buyer acknowledges and agrees that any military or aerospace use of components which have not been so designated is solely at the Buyer s risk and that Buyer is solely responsib
173. ue changed from 330R to 100R U1 U7 F1612 can reset TUSB3410 R44 OR added TARGET CON pins 6 10 12 13 14 disconnected from GND Firmware upgrade option through BSL R49 R52 R53 R54 added R49 R52 are currently DNP Pullups on TCK and TMS R78 R79 added U2 Changed from SN74LVC1G125DBV to SN74LVC1GO7DBV NOTE Using a locally powered target board with hardware revision 1 4 Using an MSP FET430UIF interface hardware revision 1 4 with populated R62 in conjunction with a locally powered target board is not possible In this case the target device RESET signal is pulled down by the FET tool It is recommended to remove R62 to eliminate this restriction This component is located close to the 14 pin connector on the MSP FET430UIF PCB See the schematic and PCB drawings in this document for the exact location of this component Assembly change on 1 4a January 2006 R62 not populated Hardware SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Appendix C SLAU278Q May 2009 Revised February 2014 Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP e MSP FET430UIF eZ430 F2013 e eZ430 RF2500 e eZ430 Chronos 7430 2780 e eZ430 RF2560 e MSP WDSxx Metawatch e LaunchPad MSP EXP430G2 MSP E
174. ug interface MSP FET430UIF FET430F5137RF900 CC430F513x devices in 48 RGZ packages green PCB e FET430F6137RF900 for CC430F612x and CC430F613x devices 64 packages green PCB These tools contain the most up to date materials available at the time of packaging For the latest materials data sheets user s guides software application information and so on visit the MSP430 web site at www ti com msp430 or contact your local TI sales office SLAU278Q 2009 Revised February 2014 Read This First 7 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS Information About Cautions and Warnings www ti com Information About Cautions and Warnings This document may contain cautions and warnings CAUTION This is an example of a caution statement A caution statement describes a situation that could potentially damage your software or equipment WARNING This is an example of a warning statement A warning statement describes a situation that could potentially cause harm to you The information in a caution or a warning is provided for your protection Read each caution and warning carefully Related Documentation From Texas Instruments MSP430 development tools documentation Code Composer Studio v5 4 for MSP430 User s Guide literature number SLAU157 Code Composer Studio v5 x Core Edition CCS Mediawi
175. umentation Feedback Copyright 2009 2014 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DL48 Table B 14 MSP TS430DL48 Bill of Materials Pos Ref Des Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C4 C7 2 10uF 10V Tantal Size 511 1463 2 ND 3 C3 C5 2 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 yellow LED TH 3mm T1 511 1251 DNP Headers and receptacles enclosed with 6 J1 J2 0 24 pin header TH kit Keep vias free of solder SAM1034 12 ND Header SAM1212 12 ND Receptacle UR Place jumper on header 7 J3 JP1 JP2 2 3 pin header male TH SAM1035 03 ND JP1 Pos 1 2 DNP JP2 8 94 95 2 2 header male SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 J4 J5 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load solder 12 5 13 1 560 SMD0805 541 560ATR ND 14 loud 2 0 SMD0805 541 000ATR ND DNP R6 R7 15 R5 1 47k O SMD0805 541 47000ATR ND Socket 51 1387 KS 16 U1 1 15186 Manuf Yamaichi 17 PCB 1 58 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom 18 Plastic feet width 2mm height Part No SJ 5302 side DNP Enclosed with kit 19 MSP430
176. wer connector CON12 Open to disconnect LEDs jumper JP5 JP10 LED D2 red connected to P3 6 via JP10 VCC GND GND JTAG connector LED D1 green connected 0 4 cc o to P1 0 via JP5 ER 2 gt 5 5 o 5 5 ii S Ut bw o C562 R55 a 5 o9 cat a2 27719 RF Crystal 01 26 MHz gt az lt 45 R554 E M 00004 3 88900 0 RF Signal SMA ee 55400 us onsets INSTRUMENTS 0440 C511 EM430F6147RF900 Rev 4 0 c 0 5 INSTRUMENTS www ti com Jumper JP6 1 2 Bypass 2 3 TPS mode Jumper JP8 1 2 Bypass 2 3 TPS mode TPS62730 Jumper JP2 Close EXT for external supply Close INT for JTAG supply Jumper JP1 Spy Bi Wire mode Close SBW position to debug in Spy Bi Wire mode Jumper JP1 Close JTAG position to debug in JTAG mode Push button S2 connected to P1 7 32kHz crystal Use 00 resistor for R554 R551 to makeP5 0 P5 1 available on connector 5 Reset button S1 Figure B 66 EM430F6147RF900 Target Board PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 134 Hardware SLAU278Q
177. wo female package MSP TS430DA38 38 pin DA 42 5 k IDA Four PCB 1x19 pin headers two male green PCB TSSOP ZIF MSP430G2x55 2 x MSP430G2955IDA and two female MSP TS430QFN23x0 40 pin RHA Eight PCB 1x10 pin headers four male green PCB QEN ZIF MSP430F23x0 2 x MSP430F2370IRHA and four female 14 Get Started Now SLAU278Q May 2009 Revised February 2014 Copyright O 2009 2014 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com Kit Contents MSP TS430xx Table 1 2 Individual Kit Contents MSP TS430xx continued Part Number Socket Type Supported Devices Included Devices Headers and Comment MSP TS430RSB40 40 pin RSB MSP430F51x1 Eight PCB 1x10 pin headers four male green PCB QEN ZIF MSP430F51x2 2 x MSP430F5172IRSB and four female MSP TS430RHA40A 40 pin RHA MSP430FR572x Eight PCB 1x10 pin headers four male red PCB QFN ZIF MSP430FR573x 2 x MSP430FR5739IRHA and four female MSP TS430DL48 48 pin DL Four PCB 2x12 pin headers two male green TSSOP ZIF MSP430F42x0 2 x MSP430F4270IDL and two female MSP TS430RGZ48B 48 pin RGZ Eight PCB 1x12 pin headers four male blue PCB MSP430F534x 2 x MSP430F5342IRGZ and four demais MSP TS430RGZ48C 48 pin RGZ MSP430FR58xx and Eight PCB 1x12 pin headers four male black PCB QFN ZIF MSP430FR59xx 2 x MS
178. x MSP430F67791IPEU gru rure E 2 rn MSP430F676x1 eaders two male and two female MSP430F674x1 See the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on the device errata may also be found in the device bug database at www ti com sc cgi bin buglist cgi Kit Contents EM430Fx1x7RF900 One READ ME FIRST document One legal notice Two target socket module MSP EM430F5137RF900 Two EM430F5137RF900 target socket modules This is the PCB on which is soldered a CC430F5137 device in a 48 pin RGZ package A 2x7 pin male connector is also present on the PCB MSP EM430F6137RF900 Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB MSP EM430F6147RF900 Two EM430F6147RF900 target socket modules This is the PCB on which is soldered a CC430F6147 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB Two battery packs Four AAA batteries Two 868 or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers Hardware Installation MSP FET430PIF Follow these steps to install the hardware for the MSP FET430PIF tools 1 Use the 25 conductor cable to connect the FET interface module to the parallel port of the PC The necessary driver for acces
179. xas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100B Table B 28 MSP TS430PZ100B Bill of Materials Position Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C4 C5 2 C6 C7 6 100nF SMD0805 311 1245 2 ND C8 C9 3 C10 C26 2 470 nF SMD0805 478 1403 2 ND C11 C12 1 10 uF 6 3 SMD0805 C12 DNP C13 C14 5 C16 C18 6 4 7 uF SMD0805 C19 C29 6 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 25 ND DNP Headers and receptacles 7 iu bd 0 25 pin header TH Header SAM1213 25 enclosed with kit Keep vias free of 94 ND Receptacle solder 8 J5 1 3 pin header male TH pue place jumpers on pins 2 3 on JP5 9 JP8 9 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers pins 1 2 on JP10 JP1 JP2 10 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 11 ie 3 4 pin header male TH lace jumper on header 1 2 JP12 JP13 place jump 12 13 Jumper 15 38 1024 ND See Pos 9 and Pos 10 and Pos 11 15 JTAG 1 n connector male HRP14H ND 16 BOOTST 0 Keep vias free of solder 17 Q1 0 Crystal DNP Q1 Keep vias free of solder 21 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 22 Rs RIO 2 0 Ohm SMD0805 541 000ATR ND DNP R4 R6 R8 R10 R11 R11 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 Socket 357 1004 53 Manuf
180. y damage the chip Connector J5 External power connector for DVCC Set jumper JP3 to ext IMPORTANT NOTE Rev1 0 of the board does not have connection from pin 4 of BOOTST to pin 64 of MCU To use BSL these pins should be connected by a wire Figure B 38 MSP TS430RGC64C Target Socket Module PCB SLAU278Q May 2009 Revised February 2014 Submit Documentation Feedback Copyright 2009 2014 Texas Instruments Incorporated Hardware 87 5 INSTRUMENTS MSP TS430RGC64C www ti com Table B 21 MSP TS430RGC64C Bill of Materials Item Qty Reference Value Description Comment Supplier No 1 0 C1 C2 12pF CAP SMD Ceramic 0805 DNP C1 C2 2 0 C3 C4 tbd CAP SMD Ceramic 0805 DNP C3 C4 4 3 C5 C7 C10 10uF CAP SMD Ceramic 0805 5 5 C8 13 15 100nF CAP SMD Ceramic 0805 DigiKey 311 1245 2 ND 5 5 C8 2 2nF CAP SMD Ceramic 0805 6 1 C9 470nF CAP SMD Ceramic 0805 DigiKey 478 1403 2 ND 7 1 C16 4 7uF CAP SMD Ceramic 0805 8 1 D1 Green LED LED SMD 0805 DNP headers and receptacles enclosed with Pin header 1x16 Grid 100mil kit Keep vias free of 9 4 J1 J4 16 pin header 2 54 mm solder Header SAM1029 16 ND Receptacle SAM1213 16 ND 3 Pin header 1x3 100mil 10 2 45 6 3 pin header male TH 2 54 mm SAM1035 03 ND JP5 JP6 JP7 Pinheader 1x3 Grid 100mil 11 JP8 JP9 JP10 3 pin header male TH 2
181. yright O 2014 Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries reserve the right to make corrections enhancements improvements and other changes to its semiconductor products and services per JESD46 latest issue and to discontinue any product or service per JESD48 latest issue Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All semiconductor products also referred to herein as components are sold subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty terms and conditions of sale of semiconductor products Testing and other quality control techniques are used to the extent deems necessary to support this warranty Except where mandated by applicable law testing of all parameters of each component is not necessarily performed Tl assumes no liability for applications assistance or the design of Buyers products Buyers are responsible for their products and applications using components To minimize the risks associated with Buyers products and applications Buyers should provide adequate design and operating safeguards does not warrant or represent that any license either express or implied is

MSP430 Hardware Tools User's Guide (Rev. Q)

Contents

Download Pdf Manuals

Related Search

Related Contents