Maxband User Guide
Contents
1. The Intel Thermal Monitor helps control the processor temperature by activating the TCC when the processor silicon reaches its maximum operating temperature The temperature at which Intel Thermal Monitor activates the thermal control circuit TCC is not user configurable and is not software visible The Intel Thermal Monitor controls the processor temperature by modulating starting and stopping the processor core clocks or by initiating an Enhanced Intel SpeedStep technology transition when the processor silicon reaches its maximum operating temperature The Intel 13 Intel Confidential Software Features 5 2 5 3 5 4 5 5 5 6 14 intel Thermal Monitor uses two modes to activate the TCC Automatic mode and On Demand mode If both modes are activated Automatic mode takes precedence TAT monitors an MSR bit for Thermal Monitor Activity There is a window for each core that states Thermal Monitor Idle or Active Caution The Intel Thermal Monitor Automatic Mode must be enabled via BIOS for the processor to be operating within specifications Frequency Monitor Displays Current Operating Frequency on each core for the Yonah processor On Demand Throttling On Demand throttling reduces the processor frequency by MSR bits Default or by Chipset Advanced Preferences in 12 5 decrements 0 full frequency This can be done on each Yonah core separately for CPU option If Chipset option is chosen then both cores2. and the y intercept is the measured system effect Tsystem Intel Confidential 7 2 1 12019 Sample Data Collection Process Verifying TDP TDP is defined in the following two ways e Thermal Design Power Application Ratio TDP AR e Thermal Design Power TDP Typical Design Power Application Ratio is what TAT uses to define its TDP workload option This value is a ratio of worst case synthetic workload and worst case sustained off the shelf application peak power e The power draw achieved will vary slightly from part to part due to high or low leakage Typical Design Power is the power achieved by a worst case part running the TDP AR Most CPU parts will achieve a power below the TDP value e This is more of an estimate of what CPU power will be when it gets closer to the end of the CPU manufacturing process life cycle Or as the processor frequency is increased over time it will be able to achieve TDP AR values closer to the TDP How to check if your system can maintain the TDP workload and stay within thermal Specification 1 Setup your system to run TAT in the environmental conditions specified in Section 3 2 Choose the TDP workload in TAT and start the workload 3 Monitor CPU diode temperature until stable 4 Make note if any throttle activity is recorded in the results window If there is no throttle activity and your processor temperature remained below the thermal specification your system can maintain
3. Thermal states represent different operating environment temperatures within thermal zones of a system A system can have one or more thermal zones each thermal zone is the volume of space around a particular temperature sensing device The transitions from one thermal state to another are marked by trip points which are implemented to generate an SCI when the temperature in a thermal zone moves above or below the trip point temperature Critical Trip Point Thermal zone object that returns critical trip point in tenths of a degree Kelvin Note in TAT this is converted to Celsius Thermal zone polling frequency in tenths of a second Temperature change events Thermal zone object that contains thermal constant for Passive cooling Thermal zone object that contains thermal constant for Passive cooling Thermal zone object that returns current temperature in tenths of degrees Kelvin Note in TAT we convert this to Celsius Thermal zone object that returns list of passive cooling device objects Thermal zone object that contains thermal sampling period for Passive cooling Thermal zone object that returns Passive trip point in tenths of degrees Kelvin Note in TAT we convert this to Celsius Thermal zone object containing a list of cooling device objects 15 Intel Confidential Software Features 16 intel The Following is From SYSTEM_POWER_POLICY on http msdn microsoft com library default asp url library en us power base
4. processor power Repeat the above mentioned test at the same power level of 100 and change On Demand Throttle settings to 37 5 25 12 5 and 0 This will ensure that the internal ambient temperatures are not erroneously high There may be a 2 C to 5 C offset that can be assumed or perform a system testing in controlled environment thermal chamber The processor diode and ambient temperatures should be pulled from each stabilization point Figure 3 The delta between diode and ambient temperatures and processor power should then be plotted as in Figure 4 Collecting temperature and power values at five different throttle levels will help in minimizing error in t sys value calculation 21 Intel Confidential Sample Data Collection Process 22 Figure 6 Stabilized Temperature Measurement Example J Cc Tsys Measurement Temperature C kA D Ot oO Cc EH GH CH C3 el o 50 10C ER 200 250 300 Junctior Se ee ee Si Time min 45 00 40 00 T sys calculation y 1 3785x 8 2372 R 0 9932 35 00 30 00 25 00 20 00 e Tdiode Ta 15 00 Linear Tdiode Ta 10 00 5 00 0 00 0 00 5 00 15 00 20 00 25 00 Figure 7 Graph For T sys Calculation A trend line through the data points will reveal a linear fit y mx b where the slope m is the thermal resistance of the system 6
5. software simply run the Self Extracting EXE file obtained from your Intel support representative The system must be re booted before running the software for the first time At this point you may run the application from Start All Programs Intel Thermal Analysis Tool Thermal Analysis Tool To remove the software use the uninstall feature provided with Windows XP Go to the Control Panel gt Add Remove Programs gt Thermal Analysis Tool Go through this un installation process to ensure that all components are properly removed from the operating system 11 Intel Confidential Software Requirements 12 This page intentionally left blank Intel Confidential 5 1 5 1 1 5 1 2 5 1 3 12019 Software Features Software Features Thermal Sensor Monitor The Intel mobile processor line specifically Yonah processor incorporates three methods of monitoring die temperature the Intel Thermal Monitor two Digital Thermal sensors and the Thermal diode The Intel Thermal Monitor discussed in Section 5 3 must be used to determine when the maximum specified processor junction temperature has been reached The second method is to use the two digital thermal sensors for thermal management These should be used as the main method of thermal management as the locations are in each core The third method the thermal diode may be used to monitor the die temperature of the processor for thermal management or instrumentation pur
6. 5 CPU Workload Level um DI Start Workload Level 100 D Start On demand throttle 0 x Start On demand throttle ox D Start Results i i Workload library returns Context 0x1 Polling Period 2000 mSec On Demand Clock Modulation Core 0 Chipset 0 2 Processor 0 1 On Demand Clock Modulation Core 1 Chipset 0 2 Processor 0 1 15 41 53 Monitor Started 15 41 53 Core 0 CState C0 C1 gt C3 15 41 53 Core 1 CState CO C1 gt C3 15 41 53 ACPINThermaZone TZ00_0 TMP 45 C 15 41 53 ACPINThermaZone4 TZ01_0 TMP 43 C 15 41 53 Core 0 DIGITAL TMP 42 C 15 41 55 Core 1 DIGITAL TMP 43 C PP LA Start Logging Output Results 4 Itis possible to run multiple workload tests unattended This option workload test can be selected in the advanced preferences You must also set a time for this feature This will determine how long each workload will run If you set 1 hour then when you run this test each selected workload will run for 1 hour 18 Intel Confidential intel Figure 4 TAT Advanced 12019 m TAT Advanced Preferences m Mode C Monitor GE See Iw Poll for Processor changes si o Run Max Text m Test Duration Workload test mode only When the Workload test is selected each workload power level runs for an explicit period of time prior to evalutating frequency throttle and processor performance levels Set the time peri
7. not being utilized or in response to thermal events PO_THROTTLE_NONE No processor performance control is applied This policy always runs the processor at its highest possible performance level This policy will not engage processor clock throttling except in response to thermal events Pasted from lt http msdn microsoft com library en us power base processor_performance_control_policy_constants asp frame true gt Intel Confidential Software Operation 6 Software Operation The Intel Thermal Analysis Tool Application is provided with an easy to use user interface that runs on a Windows XP operating system Before running the software make sure that all of the hardware and environmental requirements have been met 1 Ensure that all other applications have been closed before running the Thermal Analysis Tool Application Execute the program by running the shortcut Start Menu gt All Programs gt Intel Thermal Analysis Tool gt Thermal Analysis Tool The program starts with a disclaimer screen You must accept the agreement before using TAT for the first time Figure 2 TAT Disclaimer 3 12019 Intel Thermal Analysis Tool Software License Agreement Carefully read the following Intel Software License Agreement and make selection below INTEL SOFTWARE LICENSE AGREEMENT IMPORTANT READ BEFORE COPYING INSTALLING OR USING Do not use or load this software and any associated materials collectivel
8. system_power_policy_str asp on MSDN FanThrottleTolerance e Lower limit that the processor may be throttled down to prior to turning on system fans in response to a thermal event expressed as a percentage ForcedThrottle e Processor throttle level to be imposed by the system expressed as a percentage DynamicThrottle e Processor throttle level to be imposed by the system expressed as a percentage The Following is From the Performance Control Policy Constants at http msdn microsoft com library default asp url library en us power base processor_performance_control_policy_constants asp on MSDN PO_THROTTLE_ADAPTIVE Attempts to match the performance of the processor to the current demand This policy will use both high and low voltage and frequency states This policy will lower the performance of the processor to the lowest voltage available whenever there is insufficient demand to justify a higher voltage This policy will engage processor clock throttling if the C3 state is not being utilized and in response to thermal events PO_THROTTLE_CONSTANT Does not allow the processor to use any high voltage performance states This policy will not engage processor clock throttling except in response to thermal events PO_THROTTLE_DEGRADE Does not allow the processor to use any high voltage performance states This policy will engage processor clock throttling when the battery is below a certain threshold if the C3 state is
9. will throttle at the same time Note Because of overhead associated with throttling in each method the reported frequency should be correct Calculating the of frequency would be incorrect Workload Stress Options This option is based on a stress algorithm that is the highest known workload for the processor 100 We have tuned several percentages below this to allow for some strategic thermal testing One key workload is the Thermal Design Power TDP achieves a sustainable workload similar to a high powered sustained peak from an off the shelf application This TDP value has yet to be determined and will be implemented in the final version of TAT Results Window The window displays all current activity e Processor Cstate transitions e Thermal Diode DTS changes e OnDemand frequency changes e Throttle activity Start Stop Monitor Logging Options The following have editable target locations in Options gt Output Preferences Intel Confidential 5 7 12019 Software Features e Logtoa file O O O CPU Frequency DTS values ACPI values e Output Results O Sends all current day in the Results window to a text file OSPM Settings Config The Following is From Chapter 12 in the ACPI 2 0c SPEC available at www acpi info OSPM e Thermal Zones e _CRT _TZP SCI _TC1 _TC2 _TMP _PSL _TSP _PSV _Alx Operating System Directed Configuration and Power Management Thermal States
10. Intel Thermal Analysis Tool TAT User Guide September 2005 Revision 2 0 Intel Confidential Overview Information in this document is provided in connection with Intel products NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel retains the right to make changes to its test applications at any time without notice The hardware vendor remains solely responsible for the design sale and functionality of its product and any business decisions made using data from the test application Other brands and names are the property of their respective owners Copyright Intel Corporation 2005 Intel Confidential intel Overview Contents a fF Go N Figures Tables 12019 EE 5 Hardware Heouirements A 7 Environmental Heouirements 9 Software Heouirements aaa aiana aanas 11 Software Fee ruceni a a a E E a a AA O EEAS 13 5 1 Thermal Sensor Monitor ssesssesssesssesssesseesssesssessnsrsnsrnensrsnsrinsrnnstnnstnnntnnntnnnnnnnt 13 5 1 1 Digi
11. e 12 Revised 1 7 gt 2 0 BETA 2 Single gt Dual Core 2005 Processors 2 0 RC July 31 Updated the version number from 2 0 BETA 2 gt 2 0 RC 2005 2 0 RC 2 August 31 Updated the version number from 2 0 RC gt 2 0 RC 2 2005 2 0 Gold September Updated the version number from 2 0 RC 2 gt 2 0 Gold 20 2005 Intel Confidential Overview 1 Overview The Intel Thermal Analysis Tool TAT provides capabilities to analyze an OEM s thermal design Features include the ability to stress CPU monitor CPU temperature reduce CPU frequency Monitor CPU throttle activity and log CPU activity to a file Table 1 Terminology Term Definition TAT Thermal Analysis Tool DDR II Double Data Rate OEM Original Equipment Manufacturer MCH Memory Controller Hub also referred to as chipset Toys System temperature effect on CPU Taie Temperature of the die surface at center measured by a thermocouple T junction Temperature of the CPU from the internal temperature sensor Prochot See Intel Thermal Monitor in section 5 2 TC Thermocouple 12019 Intel Confidential Overview This page intentionally left blank Intel Confidential 12019 Hardware Requirements Hardware Requirements The Intel Thermal Analysis Tool TAT is designed to operate on systems utilizing Intel brand mobile chipsets and Intel Mobile brand processors Specifically vers
12. ion 2 0 is intended to be used on the Napa platform moving forward It will not be backward compatible with previous generation platforms To make use of the temperature monitoring feature the sensor in the processor must be accessible by the BIOS and the ACPI thermal zones must be implemented in the Operating system Intel Confidential Hardware Requirements This page intentionally left blank Intel Confidential 3 Environmental Requirements Environmental Requirements During testing the notebook system should be placed in a still air environment where it is isolated from any sources of air currents such as Heating Ventilating and Air Conditioning HVAC vents Ideally an environmental chamber should be used to isolate the system and test under elevated ambient temperatures based on OEM design specifications Ambient design specification for notebooks is typically 35 C When using an environmental chamber place a thick wooden surface underneath the notebook to simulate conditions on a tabletop similar to the setup shown in Figure 1 If these conditions are not met the test will yield measured temperatures that could be lower than what would be expected under typical operating conditions This will lead to over estimating the thermal limit of the chipset Most environmental chambers include a re circulation system with fans that try to maintain an even distribution of temperature within the chamber The re circulation fans should o
13. nfidential 7 1 12019 Sample Data Collection Process Sample Data Collection Process Thermal Testing Using TAT in the thermal resistance calculation is the additional temperature of the processor due to additional heat that the remainder of the system adds to the thermal resistance In a notebook environment components are affected by other heat generating devices in the system This effect is denoted as Tsystem and is represented by the increase in junction temperature due to the heating affects of other components in the system Failure to measure Tsystem Can result in either overestimating or underestimating the system capability Both instances will produce problems with thermal capability evaluation If Tsystem is understimated then the system may throttle unexpectedly If Tsystem is overestimated then higher speed processors could have been installed thus the life of the system would be unduly shortened Measurement of Tsystem for a system requires thermal analysis tool or another application that can maintain a single power load It would be preferable to use an application that stresses multiple components with in the system as Tsys will vary based on how much and how many components are stressed Run the workload level at 100 and throttle set to 50 Let the system temperatures stabilize less than half a degree change in half an hour At the end of the test record the diode heat pipe beginning ambient temperatures and
14. nly be used prior to testing while preheating the chamber to the setpoint temperature Once the chamber has been preheated to a setpoint temperature the fans should be turned off otherwise the circulation of air within the chamber will increase the amount of convective cooling around the notebook and this will not be representative of typical operating conditions At this point if the oven temperature continues to rise adjust an opening to the chamber to compensate for the ambient rise This should have minimal effects on air currents If testing in an environmental chamber is not feasible the testing may be conducted at room temperature with the assumption that all of the temperature measurements need to be scaled up to the ambient design specification For example if the temperature data is gathered at a room temperature of 22 C and the ambient design specification is 35 C the difference between the two temperatures 13 C should be added to all of the measurements Scaling data from a lower ambient is not enough to ensure functionality at 35 C It is still recommended to conduct testing at 35 C Figure 1 Notebook in Environmental Chamber 12019 Intel Confidential Environmental Requirements 10 This page intentionally left blank Intel Confidential intel 4 12019 Software Requirements Software Requirements To run the Intel Thermal Analysis Tool you will need to run under Windows XP To install the
15. od 1 1000 minutes 30 minutes Poll Period Monitor and Workload test modes Set the frequency at which the Monitor or Workload test if the Poll option is selected checks for thermal changes 2000 milliseconds Thermal Zone Monitor and Workload test modes Select the thermal zone to be displayed in the temperature graph This option may be blank if no Thermal Zone is exposed through ACPI ACPI ThermaZone THRM_O e On Demand Clock Modulation Control Monitor mode only Select the desired On Demand Clock Modulation control mechanism This selection is used by the On Demand Control object when running in Monitor mode e Chipset Processor Cancel This brings up the following user interface Intel Confidential Software Operation Now when you hit Start Test you have the option to choose which workloads will be run 19 Software Operation 20 Figure 5 TAT Workload Options Workload Test Preferences Test Type Ze Run loads per core in order Run loads in order per core Core 0 Core 1 Dual Core Iw 50 Iw 50 Iw 50 Iw 70 Iw 70 M 70 Iw 80 Iw 80 Iw 80 lw 90 Iw 390 Iw 90 100 100 W 100 Select All Clear All Ok When you hit OK the selected workloads will run from lowest to highest with the exception of TDP which gets run last Each workload will run for the amount of time set in the advanced preferences Intel Co
16. poses but cannot be used to indicate that the maximum Tj of the processor has been reached This method should be used as a backup to DTS Contact your FAE for the most up to date processor information in the EMTS Digital Thermal Sensor Reading The Intel Yonah processor has two digital thermal sensors 1 is placed in the hotspot of each core TAT has the ability to monitor these two DTS locations either directly through the MSR bits or through ACPI if being reported Thermal Diode Reading TAT monitors the Thermal Diode in the CPU This is done by monitoring the ACPI Thermal Zone for the CPU If CPU Diode is enabled using other methods TAT will not be able to monitor this The location of the diode for Yonah has been moved It is now in between the two cores Previously in Pentium M it was located near the hotspot Note The reading of the external thermal sensor on the motherboard connected to the processor thermal diode signals will not necessarily reflect the temperature of the hottest location on the die This is due to inaccuracies in the external thermal sensor on die temperature gradients between the location of the thermal diode and the hottest location on the die and time based variations in the die temperature measurement Time based variations can occur when the sampling rate of the thermal diode by the thermal sensor is slower than the rate at which the Tj temperature can change Thermal Monitor Prochot TCC Trigger
17. tal Thermal Sensor PHeacdimg 13 5 1 2 Thermal Diode Reading cceccceceeeeeseceeeeeceaeeeeaeeseeeeeseaeeeenaeeeenees 13 5 1 3 Thermal Monitor Prochot TCC Trigger 13 5 2 FIEQUENCY MOMO csond eccsnted episdencncscabe Reg ee seeauans EES ENEE eege dead 14 5 3 O Demand ThrottliNg TEE 14 5 4 Workload Stress Opttons nnt 14 5 5 Deeulte VD ex 7eten egge eeee esgReSdE SERGE get 14 5 6 Logging Options EE 14 5 7 OSPM Settings CONT E 15 Software QPSLAONM deeg hpesees Le teen nak cava levassda paktea caldvbieheseutea shee snudea casted cubtansnnd edd 17 Sample Data Collection Process 0 cccccceeececeeeeeeeeeeeeaeeeeeeeeeeeeeeeaeeseeeeseneeesaeeesaeeneeeeee 21 7 1 Thermal Testing Using TATA 21 7 2 Vening RE 23 7 2 1 How to check if your system can maintain the TDP workload and stay within thermal Specification cccccceseeseeeeeeeeeeseeeeeeeeseeeeeeseaeeteneeeeaes 23 Figure 1 Notebook in Environmental Chamber 9 Fig re 2 TAT RTE TEEN 17 Figure 3 TAT GU EE 18 Figure 4 TAT Advan EE 19 Figure 5 TAT Workload Options c cccceceeesceceeeeeceeeeeeeaeeeeeeeseeaeeesaaeeeeaeeseeeesaeeesaeeeenees 20 Figure 6 Stabilized Temperature Measurement Example ssesseesseesseeeseeseeereereeerre nee 22 Figure 7 Graph For T sys CGalculaiton 22 Table 1 Terminology EE 5 3 Intel Confidential Overview Revision History Rev Document Date Reason for Changes Number 2 0 BETA 2 Jun
18. the TDP workload and should be able to handle most off the shelf application without going over spec Note It is difficult to test for all possible applications on the market There may be an application that draws more power from the CPU than the TDP workload in TAT This should be taken into consideration if you are on the board of the thermal specification If this is the case improvements to your thermal solution are recommended 23 Intel Confidential
19. y the Software until you have carefully read the following terms and conditions By loading or using the Software you agree to the terms of this Agreement If you do not wish to so agree do not install or use the Software LICENSE You may copy the Software onto your organization s computers for your organization s use and you may make a reasonable number of back up copies of the Software subject to these conditions 1 rou may not copy modify rent sell distribute or transfer any part of the Software except as provided in this Agreement and you agree to prevent unauthorized copying of the Software Zou may not reverse engineer decompile or disassemble the Software 3 You may not sublicense the Software 4 The Software may include portions offered on terms in addition to those set out here as set out in a license accompanying those portions v Accept License Reject License The following is a sample of the default user interface 17 Intel Confidential Software Operation P Figure 3 TAT GUI ES ST Intel Thermal Analysis Tool 7 o B Fie Options Help Processor Details intel Processor Pentium M Maximum Frequency 1666 Mhz CPUID 5 6EXh ACPI Thermal Zone Temp 45 C CPU Monitor CPU 0 CRU Digital Temp C Frequency MHz Digital Temp C Frequency MHz C State esi C State Io Thermal Monitor Idle Thermal Monitor Idle CPU Control Ke CPU 0
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