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MSP430(tm) Hardware Tools User's Guide (Rev. L)

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Contents

1. 1 2 3 4 5 6 4 5 JP6 JP7 JP8 JP10 J5 R7 gt i ijs ijs SBW 1 330R RSTDVCC SHWIDIO m gt MO D 02 31 lt _ GND 318 RSTINMIL gt a tcea Tus moes fpo gt a z HEAD 1X3 PINHEAD 1X3 PINHEAD 1X3 PINHEAD 1X3 1X3 1X3 PINHEAD 1X3 ca TEST SBWTCK T I ae GND DVCC RS IE OR lt y lt HORTCUT2 R10 5 ext ay R e tbd C4 vecja HH aH S55555855 BSL JP3 lt 0 2 2nF 47K 9 0 COL JP1 12 1401 2 2 RSTDVCC_SBWTDIO P1 1 E 1 1 0 0 gt 1 R2 3 5 BOOTST PINHEAD 1X2 OR BeEseLSRZIRE ERE c _105 100nF 10uF BCUCETESE J1 5 be DVCC js 1 P47IPM_NoNE 48 16 Ri C30 2 2 pesce Nove 47 18 DVIO Power Circle 62 2 P45IPM_UCA1RXD s 4 PAAIPM UCAtTXD 45 13 a 5 44 121 SHC1 100nF 6 Pe5ICBSIA5 p4 21PM_ucBisom 43 111 PINHEAD_1X3 2 14 mL 7 P4 APM UcBisiMO 42 101 3 ng 2 4 aje 8 Ut ucatsre 41 9s 2s 1 LS 120 a
2. JTAG Mode selection GND 4 wire JTAG Set jumpers JP3 to JP8 to position 2 3 2 wire SpyBiWire Set jumpers JP3 to JP8 to position 1 2 TCK SBWTCK J2 DO SBWTDIO Ext PWR VCC TEST SBWTCK1 mE ape TEST SBWICK J Loro 5 Te 2 Dvoc o x x C3 C4 25 2 cS 8 T 1uFM0V 100nF LFGND QUARZS or lt a ow 5 C7 C6 tuy 100nF connection by via GND o t Vss OR R12 ONE ZHEZNH 5 DNP 99520520158 amp amp amp TEST SBWICK 7 DNP 0 58 95 6 2 5 eT uy R 3 2 1_ 1 0 gt 36_DVSS 1 2 P14 35_P4 6 sE 3 P12 34 P4 5 DNP C 4 P3 0 U1 33 P44 R14DNP 5 P3 1 32 P17 6 P32 31 P1 6 7 P333 30 P3 7 gt 8 P47 29 P3 6 9 P13 28 P3 5 D3 ale 10 P1 es 27 P34 TRUE Ti 1 5 26 22 If external supply voltage JP11 12 P4 25 25_P2 1 remove R3 and add RO Ohn ww RIODNP m DA fo NAGONA NES R10DNP MER D2 1 yellow DNP t NRA JP10 R1 330R MSP TS430RGZ48C Lor aa Target Socket Board for MSP430FR58xx FR59xx IRGZ green TT ER JP9 TITLE 5 543086248 Document Number Date 8 7 2012 11 20 36 AM Submit Documentation Feedback SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Figure B 29 MSP TS430RG
3. pus P36 S16 55 passis nus Pza mysa Vo 729 P2S IBS AS VREF VenEF Pasu orn over aver PS0 XN PSVXOUT ovec NRST NMI SBWTOID SBWTEK m 5 65 09 os 9 9 TNEI Pon 250 01 21 20 01 1 29 2 898 193 79 0263H ET9 JOE vW3 21194 SNOISIAGU 01 71 20 XXXXX Z u33 v 3 88 823E E z z z 2 F g Ez 5 lI II gt II II lI i i I lt SS 0e uos I o zd a o 2 gt RV 8 5 3 8 882985 9 ye Z c9 G 288 88582 aO lt gt m
4. 62 B 22 MSP TS430RSB40 Target Socket Module PCB 63 B 23 MSP TS430RHA40A Target Socket Module Schematic 2 65 24 MSP TS430RHA40A Target Socket Module 66 B 25 MSP TS430DL48 Target Socket Module Schematic ene 68 B 26 MSP TS430DL48 Target Socket Module 69 B 27 MSP TS430RGZ48B Target Socket Module Schematic 71 28 MSP TS430RGZ48B Target Socket Module PCB 72 B 29 MSP TS430RGZ48C Target Socket Module Schematic 74 B 30 MSP TS430RGZ48C Target Socket Module 6 8 1 75 B 31 MSP TS430PM64 Target Socket Module 32 MSP TS430PM64 Target Socket Module PCB 78 B 33 MSP TS430PM64A Target Socket Module Schematic 80 B 34 MSP TS430PM64A Target Socket Module PCB 81 B 35 MSP TS430RGC64B Target Socket Module
5. 5 10 Close 1 2 debug Spy Bi Wire mode Close 2 3 to debug in Rev 1 1 RoHS 4 wire JTAG mode ox m 8 2 2 2 40 gt Facs Orient Pin 1 of sii non or MSP430 device P 4 L 4 s gt 4 D1 27 LED connected to P1 0 c nne ud Jumper JP2 Open to disconnect LED 5 INSTRUMENTS www ti com Connector J6 External power connector to supply DVIO Jumper JP4 Close if only one power supply is used for VCC and DVIO and if VCC is not higher then 1 98 V Otherwise supply DVIO over J6 IMPORTANT NOTE Do not close if VCC gt 1 98 V as it may damage the chip Connector J5 External power connector for DVCC Set jumper JP3 to ext IMPORTANT NOTE Rev1 0 of the board does not have connection from pin 4 of BOOTST to pin 64 of MCU To use BSL these pins should be connected by a wire Figure B 38 MSP TS430RGC64C Target Socket Module PCB 88 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430RGC64C Table B 21 MSP TS430RGC64C Bill of Materials Item Qty Reference Value Description Comment Supplier No 1 0 C1 C2 12pF CAP SMD Ceramic 0805 DNP C1 C2 2 0 C3 C4
6. 15 1441 Contents FET430F6T37RF900 16 1 12 Kit Contents Sub 1 GHz RF Spectrum Analyzer Tool MSP SA430 SUB1GHZ 16 1 13 Contents 5430 17 1 14 Kit Gontents 4 1 7 0 18 1 15 Hardware Installation 4 4 1 nnns 18 1 16 Hardware Installation MSP FET430UIF 7 4 19 1 17 Hardware Installation eZ430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 19 1 18 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 19 1 19 Important MSP430 Documents on the Web l 19 2 Design Considerations for In Circuit Programming 20 2 1 Signal Connections for In System Programming and Debugging 21 2 2 External POW 25 2 3 Bootstrap loaden BSL uuu suena stele 25 A Frequently Asked Qu
7. Socket Yamaichi Type IC189 0282 042 SOCK28DW not assembled P1 7 P1 6 P1 5 P14 P1 2 P1 1 P1 0 P24 P2 3 P3 7 P3 6 P3 5 P3 4 If external supply voltage remove R11 and add R10 0 Ohm MSP TS430DW28 Target Socket DW28 TITLE MSP TS430DW28 Document Number Date 11 14 2006 1 26 04 PM Sheet 1 1 Figure B 11 MSP TS430DW28 Target Socket Module Schematic 47 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430DW28 www ti com LED connected to P1 0 Jumper J5 Jumper J4 p Open to measure current Open to disconnect LED Connector J3 External power connector Remove R8 and jumper R9 700000080 10000000 Orient Pin 1 of MSP430 device Figure 12 MSP TS430DW28 Target Socket Module 48 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DW28 Table B 7 MSP TS430DW28 Bill of Materials Position Ref Des Description DigiKey Part No Comment DNP C1 C2 Cover holes while 1 1 C2 0 12pF SMD0805 soldering 2
8. 104 48 MSP TS430PZ100 Target Socket Module PCB 105 49 MSP TS430PZ100A Target Socket Module Schematic 107 B 50 MSP TS430PZ100A Target Socket Module 00 0 108 B 51 MSP TS430PZ100B Target Socket Module Schematic 110 52 MSP TS430PZ100B Target Socket Module PCB 111 B 53 MSP TS430PZ100C Target Socket Module Schematic 1 2 2 113 B 54 MSP TS430PZ100C Target Socket Module PCB 114 B 55 MSP TS430PZ5x100 Target Socket Module Schematic 117 B 56 MSP TS430PZ5x100 Target Socket Module PCB 118 B 57 MSP TS430PZ100USB Target Socket Module Schematic 120 B 58 MSP TS430PZ100USB Target Socket Module PCB 121 59 MSP TS430PEU128 Target Socket Module Schematic 124 B 60 MSP TS430PEU128 Target Socket Module PCB
9. 125 B 61 EM430F5137RF900 Target board Schematic 127 B 62 EM430F5137RF900 Target board 128 B 63 EM430F6137RF900 Target board 2122 131 B 64 EM430F6137RF900 Target board PCB 132 B 65 EM430F6147RF900 Target Board Schematic 135 66 EM430F6147RF900 Target Board PCB 136 67 MSP FET430PIF FET Interface Module 139 B 68 MSP FET430PIF FET Interface Module 140 B 69 MSP FET430UIF USB Interface Schematic 1 of 4 141 B 70 MSP FET430UIF USB Interface Schematic 2 of 4 142 B 71 MSP FET430UIF USB Interface Schematic 3 of 4 143 B 72 MSP FET430UIF USB Interface Schematic 4 4 II 144 B 73 MSP FET430UIF USB Interface PCB UE pn 145 C 1 Windo
10. INSTRUMENTS MSP TS430PZ100B www ti com Table B 28 MSP TS430PZ100B Bill of Materials Position Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C4 5 2 6 C7 6 100nF SMD0805 311 1245 2 ND C8 C9 3 10 26 2 470 nF SMD0805 478 1403 2 ND 4 C11 C12 1 10 uF 6 3 V SMD0805 C12 DNP C13 C14 5 C16 C18 6 4 7 uF SMD0805 C19 C29 6 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 25 ND DNP Headers and receptacles 7 zu bo 0 25 pin header TH Header SAM1213 25 enclosed with kit Keep vias free of J4 ND Receptacle solder 8 J5 1 3 pin header male TH pue T place jumpers on pins 2 3 on JP5 9 JP8 JP9 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place jumpers on pins 1 2 JP10 JP1 JP2 10 JP4 3 2 header male SAM1035 02 ND Place jumper on header 11 JP11 3 4 pin header male TH lace jumper on header 1 2 JP12 JP13 place jump 12 13 Jumper 15 38 1024 ND See Pos 9 and Pos 10 and Pos 11 15 JTAG 1 n connector male HRP14H ND 16 BOOTST 0 C DNP Keep vias free of solder 17 Q1 0 Crystal DNP Q1 Keep vias free of solder 21 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 22 Bs RIO 2 0 Ohm SMD0805 541 000ATR ND DNP R4 R6 R8 R10 R11 R11 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 Socket 1C357 1004 53N Manuf Yamaichi 25 PCB 1 90 x 82 mm 2 layers for example 3M Adhesive Approximately
11. 43 B 6 MSP TS430PW24 Bill of 2 1 2 2 2 2242447 46 B 7 MSP TS430DW28 Bill of nen 49 B 8 MSP TS430PW28 Bill of Materials 52 9 MSP TS430PW 8A Bill of Materials 55 B 10 5430 38 Bill of Materials u U ua nat ease Pra tena 58 11 MSP TS430QFN23x0 Bill of 61 B 12 MSP TS430RSB40 Bill of Materials 64 B 13 MSP TS430RHA40A Bill of Materials 67 B 14 MSP TS430DL48 Bill of Materials 70 B 15 MSP TS430RGZ48B Bill of Materials 73 16 MSP TS430RGZ48C Revision History 75 17 MSP TS430RGZ48C Bill of Materials 76 18 MSP TS430PM64 Bill of Materials 79 B 19 M
12. mo 9 5 1208 2 2 s3 n ed z ExTL6NDt s m T8 aL Sh H SFE 12 TA es 3 gt H leg D Eg Lites 2 MW RU m 03 5 i h 3 t H 6 l n glio go E 49 5 1 7 59 818 8 NSN 2 2 h Sy H imam GLEE BEBR See 28S Lolo o ele ool R R 11 101 ucc 2 102 104 E 3 4 2 GND 103 Tum 26 8 04 004 2 29 26 gll 29 min a E 55 989 U i 31 825 l 32 REA 9 ai 0 2 59 x 8 9 5 3 07 D F 37 2 38 iil 38 lt MSS 5 X s 8 1 hk E 5 2 P 8 5 a E d e X A Zeusom 5 alle s lt PuR 55 e bu 8 0P 5 vg 5 8 ag z H 2 ol 5 ahe S o are S 39 15 Bo z 9 CR 04 8 Bitar PHR3 E x n T g 4208 gt R15 Bg a m x Al also o LED2 470R F D A W 2 8 5 EL 5 3 01g p R16 D 9 o o ol 7 b S 3 og o LED3 4708 de ty 6 3 ol O x A R13 S d
13. 3 EE T 2 uBus DUR S8 BP sg 5 Ll 5 g 3 2 5 P 5 ETSI uce 1990 lyan wir z sar 15 ano o LED1 470R L T 5 R15 g s n o alsa LED2 4798 9 F 8 5 9 5 R16 m 6 ns LED3 70n o J S 3 ae 2 ge e x 9 v c 8 8 D S 8 2 8 g 3 IN R Figure B 57 MSP TS430PZ100USB Target Socket Module Schematic 120 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100USB ucc S J3 GND GND 8 Ci J 75 55 68 55 51 nie Ww se 2 120 lt 18 INSTRUMENTS ee i7 n ee 22 eu n e 2 42 235 C19 e S Ite Ha C36 c39 02 000000000 GND e e oA o e v z es C18 C11 e 1 oucc ED de s R12 eee 75 p2 e LED gt e Olin e lea 9 n e e
14. 24 2 2nFl p5 R2330R JP5 JP10 1 2 3 UCC1 47K R1 R guF 6 3U 9 RST NMI SBHTDIO P6 A CBL AL 2 2 2 P6 3 CB3 A3 26 4 CB4 A4 P6 5 CB5 05 P5 0 B UREF UeREF P5 1 S UREF UeREF AUCCL P5 4 XIN P5 5 XQUT 4551 pucca 00551 P1 8 TA CLK ACLK PA 1 TR0 0 P4 2 TRG 1 PJ 1 TOL TCLK ST SBHT 3 XT20UT P5 P5 2 XT2IN F53XX Socket Yamaichi 20 0804 014 P4 3 T80 2 5 4 6 TALCLK CBI 2 T81 8 Q TR1 A A TAL2 2 TR2CLK SMI 3 T82 0 4 2 1 5 T02 2 p2 6 RTI 4 7 _ 4 6 _ XTLGND2 Il GND BSL Interface lt SBH lt JTAG GND R12 98 R11 OR ucc DNP P4 5 PH_UCALRXD PM_ucAisont 46 46 P4 4 pr_ucatTxo PM_ucaisino 459 45 P4 3 PM_UCBLCLK PM_ucAsTe 44 34 p4 2 Pu_uceasomivpn_uceiscL 43 43 LDOI LDOO p41 pn Uce1sIYo Pn ucB1eon 42 42 P4 2 PM_UCBLSTE PM_UCALCLK 41 41 C11 180nF D je Note If the system should be supplied via LDOI J6 close JP4 and set JP3 to external pa t ucBesonivucsasc _35 35 CLK DMAEO 34 34 LDOI Interface MSP430 Target Socket MSP TS430RGC64B for F53xx TITLE MSP TS430RGC64B Document Number
15. 2 83 B 36 MSP TS430RGC64B Target Socket Module PCB 84 B 37 MSP TS430RGC64C Target Socket Module Schematic 87 38 MSP TS430RGC64C Target Socket Module PCB 88 B 39 MSP TS430RGC64USB Target Socket Module Schematic 90 40 MSP TS430RGC64USB Target Socket Module PCB 91 41 MSP TS430PN80 Target Socket Module 0 94 42 MSP TS430PN80 Target Socket Module 6 95 B 43 MSP TS430PN80A Target Socket Module Schematic 97 List of Figures SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com 44 MSP TS430PN80A Target Socket Module 98 B 45 MSP TS430PN80USB Target Socket Module Schematic 100 B 46 MSP TS430PN80USB Target Socket Module PCB 101 47 MSP TS430PZ100 Target Socket Module Schematic
16. 5 INSTRUMENTS www ti com MSP TS430PZ100B DuDSYS eese Tt R10 R11 JTAG amp 6 BOOTST Connector J5 15 External power connector 8 eecececcesccescesescececece Jumper JP1 to ext i se 2o 9 es gle e e Jumper JP1 Open to measure current gg e se C29 26 je e Bett Orient Pin 1 of MSP430 device e n 9 C16 m e HC1i1 nu pore T mco JP11 JP12 JP13 Jumpers JP5 to JP10 e 8 ACS e Connect 1 2 to connect Close 1 2 to debug in Spy Bi Wire mode AUXVCCx with DVCC or Close 2 3 to debug in 4 wire JTAG mode MC TT AE drive AUXVCCx externally AUXU C8 S JP1 nci p NI connected to es Bre ED 25 2 D1 LED ted to P1 0 1 ux TEED 45 20 posse 00000006 000000000000 1 Jumper JP2 Open to disconnect LED Figure B 52 MSP TS430PZ100B Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Hardware 111 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5
17. Topic Page 2 1 Signal Connections for In System Programming and Debugging 21 22 Extemal 25 2 Bootstrap Loader 25 20 Design Considerations for In Circuit Programming SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Signal Connections for In System Programming and Debugging 2 1 Signal Connections for In System Programming and Debugging MSP FET430PIF MSP FET430UIF MSP GANG MSP GANG430 MSP PRGS430 With the proper connections the debugger and an FET hardware JTAG interface such as the MSP FET430PIF and MSP FET430UIF can be used to program and debug code on the target board In addition the connections also support the MSP GANG430 or MSP PRGS430 production programmers thus providing an easy way to program prototype boards if desired Figure 2 1 shows the connections between the 14 pin FET interface module connector and the target device required to support in system programming and debugging for 4 wire JTAG communication Figure 2 2 shows the connections for 2 wire JTAG mode Spy Bi Wire The 4 wire JTAG mode is supported on most MSP430 devices except of small pin count devices e g MSP430G2230 The 2 wire JTAG mode is available on selected devices only See the CCS User s Guide for MSP430 SLAU157 or IAR for MSP430 User s Guide SLAU138 for
18. to measure supplu current JP2 R 330R RST SBWTDIO JTAG gt 2g3 TEST SBHTCK 1 SBW gt Jpg R4 JP6 LI 47K UCC430 1 2 P108 2 P1 1 TAG B 4 1 2 0 4 14 14 5 43062 GND MSP4 4 P3 3 T81 2 2 uire SpuBiHire R5 DNP XIN P2 6 TR2 1 XOUT P2 7 TEST SBUTCK 1 7 00 P1 6 TDI 1 5 5 P1 4 1 a JTAG Mode selection 4 uire JTAG Set jumpers 17 to J12 to position 2 3 JP5 JP4 et Jumpers J7 to J12 to position 2 1 BSL Interface BOOTST 2 98 L 5 P1 SZTHSBSL p GND P1 1 T160 SL DNP P2 4 181 2 P2 3 T61 8 3 4 180 e G2XXX PW28 ENPLASSOCKET Socket ENPLAS 0 5 28 0 65 01 RST SBWTDIO MSP TS43 PW28A Socket Board for G2XXX F20XX TITLE MSP TS43 PW28A Document Number Date 10 14 2010 9 34 34 AM Sheet 1 1 Ic Schemati TS430PW28A Target Socket Module 15 MSP igure F 53 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PW28A Jumper JP2 Open to measure current Orient Pin 1 of MSP430 device Jumper JP3 Open to disconnect LED D1 LED connected to P1 0
19. jess 7 RS c9 ve R15 an e g e ot e e 5 1 1l e 01 a nacio e 7 13 DB se 5 ns cs le 252 ee n R8 C1 C2R6 R2 ej C6 Ql 719 5 deje 1 5 18 15 20 25 2 0000000000000000000000000 Figure 58 MSP TS430PZ100USB Target Socket Module SLAU278L May 2009 Revised December 2012 Hardware 121 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PZ100USB www ti com Table B 31 MSP TS430PZ100USB Bill of Materials Pos Ref Des MOr Description DigiKey Part No Comment Board 1 1 2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND C5 C11 3 C13 C14 5 100nF SMD0805 311 1245 2 ND C19 C10 C12 3 1 C18 C17 0 100nF SMD0805 311 1245 2 ND DNP C10 C12 C18 C17 4 C8 1 2 2nF SMD0805 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 4 25 pin header TH SAM1029 25 ND Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with kit 7 1 4 25 pin header TH SAM1213 25 ND Keep vi
20. green MSP TS43 RHA4 A JP3 Target Socket Board for MSP43 FR572x FR573x IRHA GND TITLE MSP TS43 RHA4 A Document Number Date 4 21 2010 1 23 27 PM Sheet 1 1 Hardware 65 Schemati TS430RHA40A Target Socket Module Copyright 2009 2012 Texas Instruments Incorporated igure B 23 MSP F SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback MSP TS430RHA40A 14 000000 00000002 5110 000090 000092 JTAG oie TAG R2 z int SBW E GND D JP8 JP7 JP6 1 5 JP4 q 2 20 15 11 Jumper 2 Open measure current 4 000000000 91 35 40 MSP TS43 RHA4GA INSTRUMENTS Rev 1 2 RoHS TEXAS INSTRUMENTS www ti com Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode D1 LED connected to P1 0 Jumper JP3 Open to disconnect LED Orient Pin 1 of MSP430 device Figure 24 MSP TS430RHA40A Target Socket Module 66 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instr
21. ien on o SIN SOUT a SDA SCL P30 P3 1 P33 P34 OO ha ro In Joo loo o x1 x2 100nF 012 SN75240PW EG E1 ER ee USBFET VSS VCC 2100128094 TITLE 5 430 _ 1 4upd Document Number Date 10 05 2005 09 39 37a Sheet 4 4 Submit Documentation Feedback SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Figure B 72 MSP FET430UIF USB Interface Schematic 4 of 4 Hardware 144 5 INSTRUMENTS www ti com MSP FET430UIF c sio aJ sio s O ae 5 TARGET CON Figure B 73 MSP FET430UIF USB Interface SLAU278L May 2009 Revised December 2012 Hardware 145 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP FET430UIF www ti com 35 1 MSP FET430UIF Revision History Revision 1 3 Initial released hardware version Assembly change on 1 3 May 2005 R29 R51 R42 R21 R22 R74 value changed from 330R to 100R Changes 1 3 to 1 4 Aug 2005 J5 VBUS and RESET additionally connected R29 R51 R42 R21 R22 R74 value changed from 330R to 100R U1 U7 F1612 can reset TUSB3410 R44 OR added TARGET CON pins 6 10 12 13 14 disconnected from GND Firmware upgrade option through BSL R49 R52 R53 R54 added R49 R52 are currently DNP e Pullups on and TMS R78 R79 add
22. 2 8 8 5 B RST NMI SBHITDIO tio Erg 52565 5838 s S s TE 3 33 28 EE 9 Hox E ORE P6 1 UCBOSONL UCBOSCL P 2 UCBOSIMO UCBOSDR P 3 UCBBSTE UCRBCLK 83 CR5 UeREF UREF P 4 UCBRCLK UCADSTE A4 CA6 UeREF UREF P 5 UCABRXD UCABSOMI A5 P6 6 UCABTXD UCARSINO AS Duce XIN 1 U Duss P6 7 A7 CA7 SUSIN P4 7 ADCAGCLK SO 4 6 51 P4 5 52 4 4 63 4 3 54 Socket Yamaichi IC51 0644 807 3 Te1 4 S12 P2 2 TAL 3 S43 2 1 81 2 514 pi o taeo sa1 53 P4 4 TAQ Q MCLK S30 P2 0 TAL 1 S15 2nF IM DNP GND 3 3 3 1 C D f E JP6 JP8 P1 2 TAQ 1 S29 P1 3 TAL B SUSOUT S28 Pa 7 TAQCLK CAQUT CAL P3 4 CA0UT 519 1 4 81 0 527 4 5 TABCLK CADUT S26 MSP430F 41x2 P3 3 TAQ B TALCLK S28 P5 2 R13 LCDREF P1 6 ACLK CAQ P7 6 T60 2 525 5 0 61 1 524 R33 LCDCAP P5 1 R23 P5 3 R03 P5 4 COM3 P5 5 C0M2 P5 6 C0M1 5 7 P3 0 TAL 2 823 P3 1 T61 3 522 P3 2 T01 4 521 R1 0 DN JP9 2 P7 3 TC HF ADD LCD CAP pes GND If supplied by interface populate R11 OR remove 10 If supplied locally populate R10 OR remove R11 MSP TS430PM64A Target Socket for F4152 TITLE MSP TS430PM64A Document Number Date 3 29 2011 3 07 02 PM Sheet 1 1 Figure B 33 MSP TS430PM64A Target Socket Module Schematic
23. 1 s assembled 1 JP1Q 10uF 6 3 i 10uF 10V 208 790 191 1ueunooq VINdOEVSIL dSN 31lll pue xt d 10 05 97 01 9002 7 6 IEC v9lNd 9490S Jebel PINdOEPS1L dSW Wy 3eeus Pa quiesse jou 4 jou pue 0 uedo 0 Ajddns eujejxe WYO 0 OLY d0 trdSIQN 0 168 104 ZH 9H 0 uedo uedo Q NOTE Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be made Figure B 31 MSP TS430PM64 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 77 MSP TS430PM64 TExAS INSTRUMENTS www ti com 32 414 r1 12 0000000 00000 00000002 000002 JTAG R8 R5 RA BOOTST LED connected R3 4 Connector J5 to pin 12 y 3 08 n WC Re Uc 9 Externa
24. 4 J Communications Port COM1 7 ECP Printer Port LPT1 E MSP FET430UIF Serial Port COM19 5 Processors Smart card readers 2 Sound video and game controllers System devices Universal Serial Bus controllers BB a Figure 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 SLAU278L May 2009 Revised December 2012 Hardware Installation Guide 151 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS Hardware Installation www ti com C Device Manager File Action View Help lt CNN0797344 patteries Computer lt Disk drives 3 Display adapters Human Interface Devices Bluetooth HID port from TOSHIBA Bluetooth HID port from TOSHIBA Bluetooth HID port from TOSHIBA HID compliant consumer control device gj HID compliant device gg USB Human Interface Device Ga USB Human Interface Device IDE ATA ATAPI controllers General Driver Details 5 gt Keyboards 7 Mice and other pointing devices ay USB Human Interface Device Monitors 88 Network adapters PCMCIA adapters Ports COM B LPT USBWID 04518PID F4328MI_01N782C60AFE35080001 Communications Port COM1 7 ECP Printer Port LPT1 USB Human Interface Device Properties y Toshiba BT Port 10 Toshiba BT Port COM11 7 Toshiba BT Port COM12 7 Toshiba BT Port COM
25. 9 auss DOGGRPPRBRBRP UUUUUUUUU N P S m O N 11 16 GI GFN 40B 0 4 001 3 4 PJ 3 ICK 1 9 MSP TS430RSB40 Target Socket Board for MSP430F51x2IRSB TITLE MSP TS430RSB40 Document Number Date 8 11 2010 12 38 55 PM Sheet 1 1 Schemati SLAU278L May 2009 Revised December 2012 TS430RSB40 Target Socket Module B 21 MSP igure F Hardware 62 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com 0000000 00000002 14 510 E BS 0000900 000002 BOOTSTES 55555 JPS Jumper JP2 1 578 10 Open to measure current REH ERS ins C1 C2 C4 Orient Pin 1 of MSP430 device 00000000800 Open to disconnect LED JP8 2 7 JP6 JP5 JP4 14 C2 0000000000 N O1 999 6666 16 D1 LED connected 1 0 O OS rs MSP TS430RSB40 Rev 1 2 oo 321H MSP TS430RSB40 Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debu
26. P3 1 UCBOSOML UCBESCL P3 4 UCA RXD UCAQSOMI P3 2 UCBOCLK UCA STE P3 3 UCA TXD UCAQSIMO MSP430F 534X Socket Yamaichi 0 117048 008 8101121 UCORE ps 32 7337 P4 8 TARCLK ACLK _36 36 1 2 4 5 _ 34 34 33 33 2 P44 PH_UCA1TXD PH_UCA1SIMD C11 1 8 ND 38 7 37 XTLGND2 d 5 430 Target Socket MSP TS430R6248B for F534x TITLE MSP TS430RG248B Document Number Sheet 1 1 Date 10 15 2010 11 44 25 Schemati TS430RGZ48B Target Socket Module igure B 27 MSP F 71 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430RGZ48B TEXAS INSTRUMENTS www ti com Ucc 14 5110 e oo eeeoeo 5655 Connector J5 Jumpers JP5 to JP10 5 External power connector Close 1 2 to debug in Spy Bi Wire mode ss ss ss I Jumper JP1 to ext Close 2 3 to debug in 4 wire JTAG mode nc elelelelele R1 R11 Meee m ejejejejeje Jumper JP1 Open to
27. If high current is detected the lc monitor algorithm stays in a loop of frequently switching on and off the target power supply This power switching puts some MSP430 devices such as the MSP430F5438 in a state that requires a power cycle to return the device to JTAG control A side issue is that if the UIF firmware has entered this switch on and switch off loop it is not possible to turn off the power supply to the target by calling MSP430 VCC 0 A power cycle is required to remove the device from this state IAR KickStart and Code Composer Essentials that have the MSP430 dll version 2 04 00 003 and higher do not show this problem Update the software development tool to this version or higher to update the MSP FET430UIF firmware Some PCs do not supply 5 V through the parallel port Device identification problems with modern PCs because the parallel port often does not deliver 5 V as was common with earlier hardware 1 When connected to a laptop the test signal is clamped to 2 5 V 2 When the external Vcc becomes less than 3 V up to 10 mA is flowing in the adapter via pin 4 sense Measure the voltage level of the parallel port If it is too low provide external 5 V to the Voc pads of the interface The jumper on a the target socket must be switched to external power SLAU278L May 2009 Revised December 2012 Frequently Asked Questions and Known Issues 29 Submit Documentation Feedback Copyright 2009 2012 Texas Instrum
28. QN MSP TS43 PN88USB o o PLOY _ Rev 1 2 RoHS SLNAWNUISN svxaj of 04 BSL invoke button 53 Figure 46 MSP TS430PN80USB Target Socket Module SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 101 5 INSTRUMENTS MSP TS430PN80USB www ti com Table B 25 MSP TS430PN80USB Bill of Materials Pos Ref Des Bu Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size 511 1463 2 ND 3 222 j 4 100nF SMD0805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 311 1245 2 ND DNP C10 C12 C8 1 2 2nF SMD0805 C9 1 470 5 00805 478 1403 2 ND D1 1 green LED SMD0805 P516TR ND DNP headers and 7 4 20 pin header SAM1029 20 ND ae with solder DNP headers and receptacles enclosed with kit Keep vias free of 7 1 4 20 pin header TH solder SAM1213 20 ND Header Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 PN 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header JP4 1 SAM1035 02 ND ded jumper only on one 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 1
29. TS Kit ET 64 pin PM E p c ier EE Eight PCB 1x16 pin headers four male QFP ZIF F42x A EE42x A FE42x2 2 x MSP430F417IPM and and four female FW42x 2 x MSP430F169IPM 64 pin PM Eight PCB 1x16 pin headers four male MSP TS430PM64A QFP ZIF MSP430F41x2 2 x MSP430F4152IPM and four female 64 pin RGC Eight PCB 1x16 pin headers four male MSP TS430RGC64B QFN ZIF MSP430F530x 2 x MSP430F5310IRGC and four female 64 pin RGC Eight PCB 1x16 pin headers four male MSP TS430RGC64C QFN ZIF MSP430F522x F521x 2 x MSP430F5229IRGC and four female T 64 pin RGC MSP430F550x F551x 2 x MSP430F5510IRGC or Eight PCB 1x16 pin headers four male MSP TS430RGC64USB QFN ZIF F552x 2 x MSP430F5528IRGC and four female MSP430F241x F261x x 80 pin PN Eight 1 20 headers four male MSP TS430PN80 QFP ZIF F43x u C s F47x 2 x MSP430FG439IPN and four female SLAU278L May 2009 Revised December 2012 Get Started Now 17 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 1 15 5 INSTRUMENTS Kit Contents EM430Fx1x7RF900 www ti com Table 1 2 Individual Kit Contents MSP TS430xx continued Target Socket Module Socket Type Supported Devices Included Devices Headers and Comment _ 80 Eight 1 20 headers four male MSP TS430PN80A QFP ZIF MSP430F532x 2 x MSP430F5329IPN and four female la 80 pi
30. www ti com gt Tf alla ES d o 1 2 5 8E I BI BEE 8 C11 cion GESE E o 5 gt 11 201 Sg og Ea eno 7 c D e C4 L g uj Figure B 68 MSP FET430PIF FET Interface Module PCB SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP FET430UIF B 35 MSP FET430UIF M3MOd A 9 0 30 A 9 3n0 4 1 NIX 9d 9 9 9d 5 5 9d 70 2 gt U Scu ALt szy Lizz 1924 99 31111 xv vH iueun2og 60 8002 80 01 9120 65 TAY 410 amp gt 1 4 45 19245 Figure 69 MSP FET430UIF USB Interface Schematic 1 of 4 SLAU278L May 2009 Revised December 2012 Hardware 141 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP FET430UIF SN74LVC1G125DBV C15 100nF 1 GND 4 98 SN74LVC1G07DBV U4 AQY211EHA U14 AQY211EHA R63 47k U2 R42 IGTRST gt 5 1008 SN74LVC1G125DBV SELT assembled SN74LVC1G07DBV SN75240 T
31. 5 500MA QW15AN12NJ00 MURATA 250MHz C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pF 21 oe o GRM1555C1H2R0CZ01 MURATA Inductor SMD 0805 2 2uH 20 600 L OM21PN2R2MCO m 50MHz ULTRA SMALL TACTILE SWITCH SMT 2P 23 51 52 2 SPST NO 1 2x3x2 5mm 0 05A 12V B3U 1000P OMRON R1 R7 R551 RESISTOR JUMPER SMT 0402 0 O 5 24 p 2772 ERJ 2GE0R00X UN PANASONIC 25 R2 R3 R6 RESISTOR SMT 0402 THICK FILM 5 ERJ 2GEJ331 PANASONIC 1 16W 330 CAPACITOR SMT 0402 CER 2200pF 27 C511 i eae aoe ECJ 0EB1H222K PANASONIC C111 C251 CAPACITOR SMT 0603 CERAMIC 1 CZ dE ECJ 1VB0J105K PANASONIC 28a C041 1 CAP CERAMIC 4 7UF 6 3V X5R 0603 ECJ 1VB0J475M PANASONIC 29 R441 PANASONIC 30 xi 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Hardware 137 Copyright O 2009 2012 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS EM430F6147RF900 www ti com Table B 35 EM430F6147RF900 Bill of Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 31 i 1 9 15x9 15ximm THRM PAD CC490r6147 Step Down Converter with Bypass Mode 33 u2 1 for Low Power Wireless TPS62370 T 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 JP6 JP8 3 Pin Connector 1x3pin 6
32. 86 1 2 3 4 5 Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully discharged to 0 V Enable the 1 8 V external DVIO power supply Enable the 1 8 V to 3 6 V VCC power supply alternatively this supply can be provided from the MSP FET430UIF JTAG debugger interface Connect the MSP FET430UIF JTAG connector to the target board Start the debug session using IAR or CCS IDE For more information on debugging the MSP430F522x see the device data sheet SLAS718 and Designing with MSP430F522x and MSP430F521x Devices SLAA558 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430RGC64C www ti com
33. DEP 71 BAS MSP 1S450RGZ486 gs a awana yawa cu DEM EU 74 2 Contents SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com 16 MSP TS4390PM64 tele Ad 77 17 MSP TS430PM64A nee ee RD 80 BAS 83 19 MSP TS430RGC64GC a mami v 86 B 20 MSP TS430RGC64USB uuu uu k uui dean aca stamens 90 21 MSP TS430PN80 2 6 94 B 22 5430 8 6 97 23 MSP TS430PN80USB 4 100 B24 uuu aa N MSS EUN EC UN NR 104 B 25 lt gt uu uu au T a a sra oe 107 26
34. Date 10 13 2010 5 25 05 PM Sheet 1 1 IC Schemati TS430RGC64B Target Socket Module 35 MSP igure F 83 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430RGC64B Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to 1 0 Jumper JP2 Open to disconnect LED 14 18 jtag eeeeeee ext in eeeee 2257 000002 66 5 JP3 QQQ 800787 Pei e z H E En RZ 03 N el 1 Wp Texas JP4 INSTRUMENTS e 3 2 1164 49 R2 C4C3 NS z R10 EBR ERS 2986 1 e 1 se E1645 ae e n 15 pda GFN11T864 006 e 9 e 9 R6 000000 e e e e Bo ce e e 5 HH ON 2 e e ete ete Ecs 00000 5 3 C13 e 00000 e be Clamshell SB Bey 53 17 32 cip S 5 543085 64 Rev 1 1 5 INSTRUMENTS www ti com Conne
35. E 0000000 00000002 0090900 009002 10 BOOTST 5 R28 HR3 ucc 1 2 OTS 28 0 65 01 00 WW TEXAS INSTRUMENTS MSP TS43 PW28A Rev 1 8 RoHS e eere amp 5 INSTRUMENTS www ti com Connector J5 External power connector Jumper JP1 to ext Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Figure B 16 MSP TS430PW28A Target Socket Module PCB Red 54 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW28A Table 9 MSP TS430PW28A Bill of Materials Position Ref Des ponant Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 1 10uF 10V 5 00805 4 C4 C6 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles 6 J1 J2 0 14 pin header TH enclosed with kit Keep vias free of solder Header amp Receptacle J5 JP1 JP4 JP5 ARD Place jumper on 1 2 of JP4 JP9 7 JP7 8 3 pin header male SAM1035 03 ND Place on 1 2 on JP1 JP8 JP9 8 JP2 JP3 2 pin hea
36. Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430QFN23x0 www ti com 10 MSP TS430QFN23x0 c3 18uF 18U J5 Ext PAR R1 330R P1 0 R mr JP3 ico i on Joa DUCC XIN P2 6 XOUT P2 7 P1 0 P1 1 P1 2 P1 3 P1 4 P1 5 P1 6 P1 7 P2 0 P2 1 P2 2 P2 3 P2 4 P2 5 P3 0 P3 1 P3 2 01 RUCC 0 8055 RST NMI TCK TMS TDI TDO P4 7 P4 6 P4 5 4 4 P4 3 P4 2 P4 1 P4 0 P3 7 P3 6 P3 5 P3 4 P3 3 Socket Enplas QFN 4 B 0 5 01 GND If external supply voltage remove R11 and add R10 0 Ohm MSP TS430F 23x0 Target Socket Board for MSP43 F23x IRHA TITLE MSP TS430F23x0 Document Number Date 3 05 2007 09 31 46 Sheet 1 1 Schemati TS430QFN23x0 Target Socket Module B 19 MSP Figure 59 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430QFN23x0 Jumper JP2 Open to
37. SAM1029 16 ND Header SAM1213 16 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 2 Jumper 15 38 1024 ND Place on J6 J7 12 JTAG 1 14 pin connector male TH HRP14H ND 13 BOOTST 0 10 pin connector male TH DNP Keep free of solder Q1 Micro Crystal MS1V T1K 14 02 0 Crystal 32 768kHz C Load solder 12 5pF 15 R3 1 330 SMD0805 541 330ATR ND R1 R2 R4 R6 R7 R8 16 R9 R10 3 0 5 00805 541 000 PNP Ra R6 BR9 R10 R11 R12 R13 R14 R11 R12 R13 R14 17 R5 1 47k SMD0805 541 47000ATR ND 18 U1 1 Socket IC51 0644 807 Manuf Yamaichi 19 PCB 1 78 x 75 mm 2 layers Rubber Apply to corners at bottom 20 standoff 4 select appropriate side MSP430F2619IPM DNP Enclosed with kit 22 MSP430F417IPM supplied by TI SLAU278L May 2009 Revised December 2012 Hardware 79 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430PM64A B 17 MSP TS430PM64A VCC430 ce 1OuF 6 3V as S psa m coo No lt o 330R JP1 Open JP1 if LCD is connected CC430 R4 47k C3 58 58 P7 3 TCK S35 P7 2 TMS S34 p7 e roo To1 s32 54 54 2 lt
38. SLAU278L May 2009 Revised December 2012 Hardware 80 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PM64A Jumper JP3 1 2 int Power supply via JTAG interface 2 3 ext External Power Supply Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode BOOTST 3 RoR 0 025 veeta 4 lt SBW 06 5 F F ramp enple 4 Jumper JP2 H Ei R4 E R6 RoHS JP5 JP9 JP8 JP7 JP6 cs GR J t B 64 60 55 49 ge e aa Orient Pin 1 of Device 1C51 0644 807 e ES gt 45 e g e Jp i e at Jumper JP1 E mu 5 Open to disconnect LED v3 RSG 9 Clamshell 359 m 01 17 20 J32 25 30 32 le o000000905000000 LED D1 connected to P5 1 Figure 34 MSP TS430PM64A Target Socket Module SLAU278L 2009 Revised December 2012 Hardware 81 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PM64A www ti com Table B 19 MSP TS430PM64A Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2
39. U 137 C 1 USB VIDs and PIDs Used MSP430 Tools 148 List of Tables SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 Preface SLAU278L May 2009 Revised December 2012 INSTRUMENTS Read This First About This Manual This manual describes the hardware of the Texas Instruments MSP FET430 Flash Emulation Tool FET The FET is the program development tool for the MSP430 ultralow power microcontroller Both available interface types the parallel port interface and the USB interface are described How to Use This Manual Read and follow the instructions in Chapter 1 This chapter lists the contents of the FET provides instructions on installing the hardware and according software drivers After you see how quick and easy it is to use the development tools Tl recommends that you read all of this manual This manual describes the setup and operation of the FET but does not fully describe the MSP430 microcontrollers or the development software systems For details of these items see the appropriate TI documents listed in Section 1 19 This manual applies to the following tools and devices MSP FET430PIF debug interface with parallel port connection for all MSP430 flash based devices MSP FET430UIF debug interface with USB
40. 1 5 VSS P1 4 XOUT P1 3 XIN P12 RST P1 1 P20 P1 0 P2 1 P2 4 P22 P23 P3 0 P3 7 P3 1 P3 6 P3 2 P3 5 P3 3 P3 4 Socket OTS 28 0 65 01 GND If external supply voltage remove R11 and add R10 0 Ohm MSP TS430PW28 Target Socket Board for MSP430 s in PW28 package TITLE MSP TS43 PW28 Document Number Date 11 15 2007 4 05 56 PM Sheet 1 1 Figure B 13 MSP TS430PW28 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 50 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW28 Jumper JP4 to JP9 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode 14 00000001 00000002 Jumper JP1 JP1 JTAG 1 2 int Power supply via JTAG interface 2 3 External Power Supply Jumper JP2 Open to measure current o Orient Pin 1 of Device e OTS 28 0 65 01 00 Jumper JP3 z Open to disconnect LED MSP TS430PW28 pif BR Rev 3 1 LED D1 connected to 5 1 Figure B 14 MSP TS430PW28 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Hardware 51 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INST
41. 2 MSP430x supplied by TI 14 PCB 1 50 0mmx44 5mm E Rev Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback MSP TS430PW14 2 MSP TS430PW14 4 TEXAS INSTRUMENTS www ti com RST NMI SBWTCK TMS TDI TDO SBWTDIO TEST SBWTCK R2 R5 47K 330R 3 3 3 3 JTAG gt 3 3 TEST SBWTCK RST SBWTDIO P1 7 TDO P1 6 TDI 1 5 5 P1 4 TCK 1 1 1 1 1 1 SBW gt J7 J8 J9 J10 J11 J12 C8 2 2nF 2 _ to measure supply current DNP JTAG Mode selection 4 wire JTAG Set jumpers J7 to J12 to position 2 3 1 2 wire SpyBiWire Set jumpers J7 to J12 to position 2 1 C5 1f J6 GND 10uF 10 VCC430 128 E XOUT DN TEST SBWTCK RST SBWTDIO C31 j DNP PT5 TMS P16 TDI 1207 E L XIN DN 100nF Socket ENPLAS Type OTS 14 065 R3 L1 D4 330R J4 green MSP TS430PW14 Target Socket Board TITLE MSP TS430PW14 Document Number Date 7 16 2007 8 22 36 AM Sheet 1 1 35 Hardware Copyright 2009 2012 Texas Instruments Incorporated Figure B 3 MSP TS430PW14 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback 5 INSTRUMENTS MSP TS430P
42. 5 1 100nF SMD0805 3 1 10uF 10V Tantal Elko 4 C8 1 10nF SMD0805 5 D1 1 LEDS3 T1 3mm yellow RS 228 4991 Micro Crystal MS1V T1K 6 Q1 0 QUARZ Crystal 32 768kHz C Load DNP Cover holes while soldering 12 5pF DNP Headers and receptacles enclosed with kit Keep vias free of 7 J1 J2 2 14 pin header TH male Soler Header Receptacle DNP Headers and receptacles enclosed with kit Keep vias free of 14 pin header TH solder 1 2 female Header Receptacle 8 J3 1 3 Pin Connector male 9 J4 45 2 2 Pin Connector male With jumper 10 BOOTST 0 ML10 10 RS 482 115 DNP Cover holes while soldering 11 JTAG 1 ML14 14 Pin RS 482 121 R1 R2 R6 R7 12 8 9 4 OR SMD0805 DNP R1 R2 R9 R10 R10 R11 13 R3 1 560R SMD0805 14 R5 1 47K SMD0805 15 Ut 1 SOP28DW socket 16 02 0 TSSOP DNP SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 49 Xi TEXAS INSTRUMENTS www ti com MSP TS430PW28 7 MSP TS430PW 28 10uFA0 JTAG Mode selection 4 JTAG Set jumpers JP4 to JP9 to position 2 3 2 wire SpyBiWire Set jumpers JP4 to JP9 to position 1 2 R7 330R TEST SBWTCK 3 3 2 P1 5 IMS J P1 4 TCK JP9 R1 330R TST PIT VCC P1 6 P25
43. 9 9 psoJA8NVEREF MSP430F5229 40 lg Tom 1 21 wHo 10 P5 1 A9 VEREF pvss 39 1 1 j PINHEAD 4X2 a1 11 avec AJUCADRXD UCADSOMI 6 le t 12 5 R6 P5ADXIN P3 3 UCAOTXDIUCADSIMO Q1 R R8 g 13 13 pssxour Pa2IucBocLKucAosrE 36 41 100nF 4 7uF OR Tat AVS amp gt 14 avss 35 jd ET DVCC 15 w 5 x P3 ciucagimoruceospa 34 21 2 ta 16 16 pvss d 8 8 33 is 12 g 8 8 18 GND A a a o m J3 022103538 34222424 822343445224 244 10uF HoonF E Ep ES Ez S pt o 2 ye RR Di i 4 R3 GND 27 330R Raph gg y EE 470nF OR Jalal j TEXAS GND q BS m m g m pre m m m m m m ools 5 INSTRUMENTS comment TI Friesing Date Name Design 12 1410 SG MSP TS430RGC64C Appr Title of Schematic Rev Drawing Revision 1 1 MSP TSA30RGCBAC sch 1 of 1 Mentor Pads Logic V9 size 1 2 3 4 5 I 6 Figure B 37 MSP TS430RGC64C Target Socket Module Schematic 87 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430RGC64C ET i s s s
44. AVSS AVCC P4 0 P4 1 P4 2 3 3 3 3 J P1 7 TDO T P1 6 TDI 1 5 1 5 J P14 TCK JP6 JP7 JP8 JP9 P1 6 TDI P1 5 TMS P1 4 TCK P1 3 P12 P1 0 P24 P2 3 U1 P3 7 P3 6 P3 5 P3 4 4 7 4 6 Socket 4 5 Yamaichi P44 1C189 0382 037P4 3 TEST SBWTCK _ 1 1 GND If external supply voltage remove R11 and add R10 0 Ohm MSP TS430DA38 Target Socket Board for MSP430F2247IDA TITLE MSP TS430DA38 Document Number Date 6 18 2008 11 04 56 AM Sheet 1 1 Figure B 17 MSP TS430DA38 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 56 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DA38 Jumpers JP4 to JP9 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG Mode LED connected to P1 0 Jumper JP3 Open to disconnect LED 6600000006 Orient pin 1 of 999999299 MSP430 device Jumper JP2 Open to measure current 0000000000 Connector J3 External power connector Jumper JP1 to ext 20 25 gt 30 35 38 Figure B 18 MSP TS430DA38 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Hardware 57 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorpor
45. E ae PE Te oe oe SD St SE RSS o o o o o 3 9 9 e z Supports MSP430 CC430 flash based devices F1xx 2 F4xx F5xx x x F6xx G2xx L092 FR57xx Supports only F20xx G2x01 G2x11 x G2x21 G2x31 Supports MSP430F20xx F21x2 F22xx 02 01 02 11 02 21 02 31 G2x53 Supports MSP430F20xx 21 2 F22xx x G2x01 G2x11 G2x21 G2x31 Supports F5438 F5438A x Supports BT5190 F5438A x Supports only F552x x Supports FR57xx F5638 F6638 x Supports only CC430F613x x Allows fuse blow x Adjustable target supply voltage x Fixed 2 8 V target supply voltage x Fixed 3 6 V target supply voltage x x x x x x x x x 4 wire JTAG x x 2 wire JTAG x x x x x x x x x x Application UART x x x x x x x x Supported by CCS for Windows x x x x x x x x x x x Supported by CCS for Linux x Supported by IAR x x x X x x x x x x x MSP FET430PIF is for legacy device support only This emulation tool will not support any new devices released after 2011 The 2 wire JTAG debug interface is also referred to as Spy Bi Wire SBW interface SLAU278L May 2009 Revised December 2012 Get Started Now 13 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Kit Contents MSP FET430PIF www ti com 1 2 Kit Contents MSP FET430PIF One READ ME FIRST document One MSP FET430PIF interface module One 25 conductor cable O
46. battery included One 433 MHz eZ430 Chronos access point eZ430 Chronos 868 One 868 MHz eZ430 Chronos watch battery included One 868 MHz eZ430 Chronos access point eZ430 Chronos 915 One 915 2 eZ430 Chronos watch battery included One 915 MHz eZ430 Chronos access point 1 9 Kit Contents MSP FET430UIF One READ ME FIRST document One MSP FET430UIF interface module One USB cable One 14 conductor cable 1 10 Kit Contents MSP FET430xx U8 U14 U092 U24 U28 U28A U38 U23x0 U40 U40A U48 U48B U64 U64A 64 U64C 06406 U80 8006 U100 U100A U100B U100C U5x100 U100USB U128 One READ ME FIRST document One MSP FET430UIF USB interface module This is the unit that has a USB B connector on one end of the case and a 2x7 pin male connector on the other end of the case One USB cable e One 32 768 2 crystal from Micro Crystal except MSP FET430U24 A2xT pin male JTAG connector is also present on the PCB see different setup for L092 One 14 Pin JTAG conductor cable One small box containing two MSP430 device samples See table for Sample Type Onetarget socket module To check the devices used for each board and a summary of the board see Table 1 2 MSP TS430xx below is the target socket module for each MSP FET430Uxx kit MSP FET430U8 One MSP TS430D8 target socket module MSP FET430U14 One MSP TS430PW14 target socket module MSP FET430U092 On
47. connected ee D 4 cc o to P1 0 via JP5 ER 2 O gt i 5 o 5 a Lu CN 5 ii S Ut bw o C562 e R55 a 5 o o9 cat a2 E ie RF Crystal Q1 26 MHz lt R554 00004 BA 3 33310 o En RF Signal SMA os ee 55400 us onsets INSTRUMENTS C44 D N EM430F6147RF900 Rev 4 0 eec 5101 5 INSTRUMENTS www ti com Jumper JP6 1 2 Bypass 2 3 TPS mode Jumper JP8 1 2 Bypass 2 3 TPS mode TPS62730 Jumper JP2 Y Close EXT for external supply Close INT for JTAG supply oR aug CO Jumper JP1 Spy Bi Wire mode Close SBW position to debug in Spy Bi Wire mode Jumper JP1 Close JTAG position to debug in JTAG mode Push button S2 connected to 1 7 32kHz crystal Use 00 resistor for R554 R551 to makeP5 0 P5 1 available on connector port5 Reset button S1 Figure B 66 EM430F6147RF900 Target Board PCB The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 136 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F6147RF900
48. disconnect the debugger 13 The following ZIF sockets are used in the FET tools and target socket modules 8 pin device D package Yamaichi IC369 0082 14 pin device PW package Enplas OTS 14 065 01 14 pin package for L092 PW package Yamaichi IC 189 0142 146 24 pin package PW package Enplas OTS 24 28 0 65 02 28 pin device DW package Wells CTI 652 0028 28 pin device PW package Enplas OTS 28 0 65 01 38 pin device DA package Yamaichi IC189 0382 037 40 pin device RHA package Enplas QFN 40B 0 5 01 40 pin device RSB package Enplas QFN 40B 0 4 48 pin device RGZ package Yamaichi QFN11T048 008 A101121 001 48 pin device DL package Yamaichi IC51 0482 1163 64 pin device PM package Yamaichi IC51 0644 807 64 device RGC package Yamaichi 117064 006 80 pin device PN package Yamaichi IC201 0804 014 100 pin device PZ package Yamaichi IC201 1004 008 128 pin device PEU package Yamaichi 500 1284 009 Enplas www enplas com Wells CTI www wellscti com Yamaichi www yamaichi us Frequently Asked Questions and Known Issues SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com A 2 Known Issues MSP FET430UIF Problem Description Solution MSP FET430PIF Problem Description Solution Known Issues Current detection algorithm of the UIF firmware
49. 17 1 44 Kit Contents EM430Fx1x7RF900 18 1 15 Hardware Installation MSP FET430PIF 18 1 16 Hardware Installation MSP FET430UIF 19 1 17 Hardware Installation eZ430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP 5 5 2 19 1 18 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 y sta 19 1 19 Important 5 430 Documents on the Web 19 12 Get Started Now SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Flash Emulation Tool FET Overview 1 1 Flash Emulation Tool FET Overview TI offers several flash emulation tools according to different requirements Table 1 1 Flash Emulation Tool FET Features and Device Compatibility lt 9 E 6 gt lt o z eo 5 A n 17 ive E o u e e eo gt o o iD i E e e e 9 N o t q N a E c Tuc G bu T x
50. 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Hardware FAQs 1 Hardware FAQs 1 MSP430F22xx Target Socket Module MSP TS430DA38 Important Information Due to the large capacitive coupling introduced by the device socket between the adjacent signals XIN P2 6 socket pin 6 and RST SBWTDIO socket pin 7 in system debugging can disturb the LFXT1 low frequency crystal oscillator operation ACLK This behavior applies only to the Spy Bi Wire 2 wire JTAG configuration and only to the period while a debug session is active Workarounds Use the 4 wire JTAG mode debug configuration instead of the Spy Bi Wire 2 wire JTAG configuration This can be achieved by placing jumpers JP4 through JP9 accordingly Use the debugger option Run Free that can be selected from the Advanced Run drop down menu at top of Debug View This prevents the debugger from accessing the MSP430 while the application is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock source to drive XIN directly With current interface hardware and software there is a weakness when adapting target boards that are powered externally This leads to an accidental fuse check in the MSP430 This is valid for PIF and UIF but is mainly seen on UIF A solution is being developed Workarounds Connect RST NM
51. 2453406 20 2 R3 R7 330 Ohm 5 00805 541 330ATR ND 2 1 R5 47k Ohm 5 00805 RES SMD 0805 1 8W 541 47000ATR ND R1 R2 R4 22 R6 8 R9 Ohm SMD0805 RES SMD 0805 1 8 DNP R6 8 R9 10 541 oogaTR ND R11 R12 R10 R11 R12 28 1 U1 Socket QFN11T064 006 N Manuf Yamaichi HSP IC MCU SMD 9 15x9 15mm 24 2 MSP430 MSP430F5229IRGCR 1 MOU SMD 9 1559 25 4 Rubber stand Rubber stand off apply to comers at Bottom Buerklin 20H1724 26 1 PCB 84 x 76 mm 84 x 76 mm SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 89 5 INSTRUMENTS MSP TS430RGC64USB www ti com 20 MSP TS430RGC64USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V meo E g 1998 77 53 w m 78 28 gt D in Nm 5 5 an 9 0 5 alte n 2 Dye 3 sla la 10ur 6 3U 5 818 it 55 usu 313 wall EE 11 101 ucc 2 102 104 E 3 4 2 GND 103 Tum yeee Ze
52. 2v amp 92 e je Se r2 lt 1x Xe 5 eee U HI e s 22 299 Q 5 O 2 elo e See ese ess C3 le sie Y e e a le a 5 z C6 o o e L e gt om e meee ce 52 R1 je ej 7 E c2E JF E mcs e 2 Efe ale Z R2 E Ji 12 15 20 P S Figure B 42 MSP TS430PN80 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated MSP TS430PN80 Connector J5 External power connection Remove R8 and jumper R9 Hardware 95 5 INSTRUMENTS MSP TS430PN80 www ti com Table B 23 MSP TS430PN80 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 DNP Only recommendation 8 SMD0805 Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with 6 J1 J2 J3 J4 0 25 pin header TH kit Keep vias free of solder SAM1029 20 ND Header SAM1213 20 ND Receptacle 7 J5 JP1 2 3 pin header male TH SAM1035 03 ND 8 J6 JP2 2 2 pin header male TH S
53. 41 8 MSP TS430L092 Active Cable Target Socket Module 2 2 4 7 22 42 B 9 MSP TS430PW24 Target Socket Module Schematic 44 B 10 MSP TS430PW24 Target Socket Module PCB 45 B 11 MSP TS430DW28 Target Socket Module Schematic 47 B 12 MSP TS430DW28 Target Socket Module PCB 48 B 13 MSP TS430PW28 Target Socket Module Schematic 50 B 14 MSP TS430PW28 Target Socket Module PCB 15 MSP TS430PW28A Target Socket Module 53 16 MSP TS430PW28A Target Socket Module PCB Red 54 17 MSP TS430DA38 Target Socket Module Schematic 56 18 MSP TS430DA38 Target Socket Module 57 19 MSP TS430QFN23x0 Target Socket Module Schematic 59 20 MSP TS430QFN23x0 Target Socket Module 60 B 21 MSP TS430RSB40 Target Socket Module Schematic
54. 59430 7 100 5554 RUN T 110 B27 5430 7100 6 aa ul aRAERRAREEEERESEREDERURREEEEERERERERERERRBRRRBRRARREIRREEDERUMUAE 113 28 MSP TS430PZ5X100 117 29 5430 7100 2 ui SSS Sua 120 B 30 430 28 R canas s aaa Vra ar ayauya us 124 31 EM430F5137RF9007 uu sasa CEN TEARS 127 32 430 6137 900 5 E ACE FRE RENE 131 B33 EM430F6147RF900 S2u u i L haya akawa as 135 34 enun nana nuu unu Rua GRECO since nce TR RR 139 B 35 11e nina aa uw o a 141 B 35 1 MSP FET430UIF Revision Hist ry Uu cru nr manna nant ianea 146 Hardware Installation Guide 0 10222 147 C 1 Hardware InstallatiOn gu ua aruta A Dad 148
55. 5pF 16 R3 1 330 O SMD0805 541 330ATR ND R1 R2 R4 R7 R8 DNP R4 R6 R7 R8 R9 17 R9 R10 2 0 Q SMD0805 541 000ATR ND R10 R11 R12 R11 R12 18 R5 1 47k SMD0805 541 47000ATR ND 19 U1 1 Socket 1 357 1004 53 Manuf Yamaichi 20 PCB 1 90 x 82 mm 4 layers Rubber Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 109 Xi TEXAS INSTRUMENTS www ti com MSP TS430PZ100B 26 MSP TS430PZ100B ucc R2330R 4 JPS JP10 1 lt SBH 2 3 lt JTAG p1 0 Psst AUXUCC1 H QFP100PZ Socket Yamaichi 1 201 1004 008 C6 near Pin 25 C14 C9 near Pin 20 MSP430 Target Socket MSP TS430PZ100B for F67xx TITLE 5 5430 2100 Document Number Date 8 3 2010 1 05 54 PM Sheet 1 1 Schemati TS430PZ100B Target Socket Module 51 MSP igure F SLAU278L May 2009 Revised December 2012 Hardware 110 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated
56. C Load DP keopvias solder 12 5pF 16 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 4 R6 R8 R9 5 DNP R6 R8 R9 R10 R11 17 R10 R11 3 0 O SMD0805 541 000ATR ND R12 R12 18 R5 1 47k SMD0805 541 47000ATR ND 19 U1 1 Socket IC357 1004 53N Manuf Yamaichi 20 PCB 1 90 x 82 mm 2 layers Rubber Apply to corners at bottom 21 standoff 4 Select appropriate side DNP Enclosed with kit 22 MSP430 2 MSP430F5438IPZ supplied by TI SLAU278L May 2009 Revised December 2012 Hardware 119 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PZ100USB www ti com 29 MSP TS430PZ100USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V auo 4 O jog SB 165 2 oa2ejaaiuJ gsn da seJ 52 QN9 T x 1 yw ude Seu OUI TOL SH Xu IHN7ISU XUIMHS7IS3I Jon E 5 SH een z ijs or E E i 2 8 D 83 Bal oH N 82 3 2 Tasn
57. CERAMIC GRM1555C1H1ROW 1 C291 1 1pF 50V 0 05pF COG NPO 12 701 MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H8R2W 18 C303 1 8 2pF 50V 0 05pF COG NP0 82pF 701 C292 301 CAPACITOR SMT 0402 CERAMIC GRM1555C1H1R5W 19 02 C304 1 50V 0 05pF COG NPO TAPE 201 MURATA INDUCTOR SMT 0402 12nH 2 20 1291 1301 0 012uH 1 15 12 000 MURATA C282 C312 0312 CAPACITOR SMT 0402 CERAMIC GRM1555C1H2R0B 21 0351 0361 savor 2 0pF 20 Murata INDUCTOR SMT 0402 6 2nH 0 1nH 22 L1 1 doom 6 2nH LQP15MN6N2BO2 Murata ULTRA SMALL TACTILE SWITCH SMT m See 2 SPST NO 1 2x3x2 5mm 0 05A 12V OMRON R4 R5 R051 R051 UNINSTALLED RESISTOR JUMPER 24 R061 R431 O Eb 0402 00 00 ERJ 2GE0R00X PANASONIC DNP 24a R7 1 P UM JUMPER SMT 0402 0 G 00 ERJ 2GE0R00X PANASONIC RESISTOR SMT 0402 THICK FILM 25 R2 R3 R6 er ew SG 3300 ERJ 2GEJ331 PANASONIC CAPACITOR SMT 0402 CER 12pF 26 C431 C441 SV sec NPO 12 ECJ OEC1H120J PANASONIC CAPACITOR SMT 0402 CER 2200pF 27 C401 1 EV 0 0022uF ECJ OEB1H222K PANASONIC 28 R331 1 RESISTOR SMT THICK FILM 56K 56kQ ERJ 2GEJ563 PANASONIC 1 16W 5 C081 C221 CAPACITOR SMT 0603 CERAMIC si 4 E EN OXEA 10uF ECJ 1VB0J106M_ PANASONIC SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 20
58. Document Revision History u uUuu uuu u EEEE 153 SLAU278L May 2009 Revised December 2012 Contents 3 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 13 TEXAS INSTRUMENTS www ti com List of Figures 2 1 Signal Connections for 4 Wire JTAG mn nemen 22 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx 1222 2 nnn nennen nnn 23 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx and MSP430F6xX Devices p uuu aaa Ea 24 1 MSP TS430D8 Target Socket Module Schematic 32 2 MSP TS430D8 Target Socket Module PCB 33 B 3 MSP TS430PW14 Target Socket Module Schematic 35 B 4 MSP TS430PW14 Target Socket Module 36 B 5 MSP TS430L092 Target Socket Module 38 B 6 MSP TS430L092 Target Socket Module 6 2 39 B 7 54301092 Active Cable Target Socket Module Schematic
59. Hardware Wizard Please choose your search and installation options Ry S Search for the best driver in these locations Use the check boxes below to limit or expand the default search which includes local paths and removable media The best driver found will be installed C Search removable media floppy CD ROM Include this location in the search C Program Files AR Systems Embedded Workben Don t search will choose the driver to install Choose this option to select the device driver from a list Windows does not guarantee that the driver you choose will be the best match for your hardware Figure C 2 Windows XP Driver Location Selection Folder 5 The Wizard generates a message that an appropriate driver has been found SLAU278L May 2009 Revised December 2012 Hardware Installation Guide 149 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Hardware Installation www ti com 6 The wizard installs the driver files 7 The wizard shows a message that it has finished the installation of the software USB Debug Interface 8 The USB debug interface is installed and ready to use The Device Manager lists a new entry as shown in Figure C 3 Figure C 4 or Figure C 5 EITTITCCERENEENNENENESSSS iol x Re Human Interface Devices IDE ATAJATAPI controllers t IEEE 1394 Bus host controllers gt Keyboards 7
60. IO O X 0 0 0 0 for F532x GND gt Note If the system should supplied via LDOI 762 close and set JP3 to external LDOI b sel a MSP430 Target Socket MSP TS430PN80B TITLE MSP TS43 PN8 A Document Number Date 8 25 2010 12 43 41 PM Sheet 1 1 Schemati TS430PN80A Target Socket Module igure B 43 MSP F 97 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PN80A Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device Jumper JP2 Open to disconnect LED D1 LED connected to P1 0 88 75 78 J4 65 61 e R12 9 Doerr 1 16 le C4 oy 15 92 UL o e e e e er dB Ez sx 543212 LED 21 25 22 35 40 0000000000000000000 MSP TS430PN80R Rev 1 0 RoHS Ao R3 ol SS ly eecc00000000000000000 69 13 TEXAS INSTRUMENTS www ti com ext int 00000 Connector J5 Extern
61. Pos 13 15 JTAG 1 ce connector male HRP14H ND 16 BOOTST 0 one DNP Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 18 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder http Awww ettinger de Ar 19 0 Insulating disktoQ2 t Detail cfm ART ART NUM 70 08 121 20 D3 D4 2 LL103A Buerklin 2453406 21 R3 R7 2 330 O SMD0805 541 330ATR ND R1 R2 R4 R6 22 R8 3 0 Ohm 5 00805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 23 R5 1 47k O SMD0805 541 47000ATR ND 24 U1 1 1 201 0804 014 Manuf Yamaichi 25 PCB 1 77 x 91 mm 2 layers Adhesive Approximately 6mm L 26 plastic feet 4 width 2mm height EINE Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F5329IPN DNP enclosed with kit supplied by SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 99 5 INSTRUMENTS MSP TS430PN80USB www ti com 23 MSP TS430PN80USB Due to the use of diodes in the power chain the voltage on the MSP430F5xx device is approximately 0 3 V lower than is set by the debugging tool Set the voltage in the IDE to 0 3 V higher than desired for example to run the MCU at 3 0 V set it to 3 3 V
62. S m B 4 E o m c 2 s x Bio E d gt S P a 8 o 51 5 2 rm O 2 1 2 gt 9 52 t 0 mMm 12 o p gt U amp 2 2 5 p oO SE NOTE R11 should be populated Figure B 45 MSP TS430PN80USB Target Socket Module Schematic 100 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com Jumper JP3 USB Connector 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply Jumper JP1 Ucc Open to measure current Jumper JP5 to JP10 Close 1 2 to debug in Spy Bi MSP TS430PN80USB Connector J5 External power connector Jumper JP3 to ext Jumper JP4 Close for USB bus powered device Wire mode T 0 Close 2 3 to debug 4 e se 7S 14 5 ei ce JTAG mode e ge e ege Se e 333 LED connected to P1 0 ges 224 amp e or 0000000 ole Jumper JP2 Open to disconnect LED 29 321 21 25 J2 39 35 49 ooo 0990000e9009000000090 015 LEO Zn p
63. TExAS INSTRUMENTS www ti com Jumper JP2 Open to disconnect LED LED D1 connected to P5 1 Figure B 50 MSP TS430PZ100A Target Socket Module PCB 108 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ100A Table B 27 MSP TS430PZ100A Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal spec 2 C7 C9 2 10uF 10V Tantal Size B 511 1463 2 ND 3 3 100nF SMD0805 311 1245 2 ND 4 C8 1 10nF SMD0805 478 1358 1 ND 5 C6 0 470nF SMD0805 478 1403 2 ND DNP 6 D1 1 green LED SMD0805 67 1553 1 ND DNP Headers and receptacles enclosed with 7 J1 a J3 0 25 pin header TH kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND pPlace jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 12 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH Die Keep vias Tree o solder Q1 Micro Crystal MS1V 15 Q1 Q2 0 Crystal TAK 32 768kHz C Load DNP Keep vias free of solder 12
64. Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGC64USB Table B 22 MSP TS430RGC64USB Bill of Materials continued Pos Ref Des 52 Description DigiKey Part No Comment 34 IC7 1 TPD4E004 Manu TI 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 852 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 0 470R Buerklin 07 564 DNP 41 R33 1 1k4 1k5 Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 S1 0 PB P12225STB ND DNP 46 S2 0 PB P12225STB ND DNP 46 S3 1 PB P12225STB ND 47 USB1 1 USB_RECEPTACLE FARNELL 117 7885 SLAU278L May 2009 Revised December 2012 Hardware 93 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Xi TEXAS INSTRUMENTS www ti com MSP TS430PN80 21 MSP TS430PN80 RST NMI TCK not assembled THS TDI XT2IN a TDO XT20UT c5 Gr DUCC1 R2 104 6 3098 10uF 6 3U not assembled LFXTCLK J6 R3 5 C 5608 JPIG Open J6 if LCD is connected 1 21 12pF QF P8 PN Socket Yamaichi IC201 0804 014 41 41 X
65. connection for all MSP430 flash based devices eZ430 F2013 USB stick form factor interface with attached MSP430F2013 target for all MSP430F20xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices eZ430 T2012 three MSP430F2012 based target boards eZ430 RF2500 USB stick form factor interface with attached MSP430F2274 and CC2500 target for all MSP430F20xx MSP430F21x2 MSP430F22xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices eZ430 RF2500T one MSP430F2274 and CC2500 target board including battery pack eZ430 RF2500 SEH USB stick form factor interface with attached MSP430F2274 and CC2500 target and solar energy harvesting module eZ430 Chronos xxx USB stick form factor interface with CC430F6137 based development system contained in a watch Includes lt 1 GHz RF USB access point The following tools contain the USB debug interface MSP FET430UIF and the respective target socket module MSP FET430U8 for MSP430G2210 and MSP430G2230 devices in 8 pin D packages green PCB MSP FET430U14 for MSP430F20xx MSP430F20xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices in 14 pin PW packages green PCB MSP FET430U092 for MSP430FL092 devices in 14 pin PW packages green PCB MSP FET430U24 for MSP430AFE2xx devices 24 PW packages green MSP FET430U28 for MSP430F11xx A devices in 20 and 28 DW or PW packages MSP FET430U28A for MSP430F20xx and MSP430G2xxx devices in 1
66. has specifically designated as military grade or enhanced plastic are designed and intended for use in military aerospace applications or environments Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer s risk and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use TI has specifically designated certain components as meeting ISO TS16949 requirements mainly for automotive use In any case of use of non designated products TI will not be responsible for any failure to meet ISO TS16949 Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity dataconverter ti com www dlp com www ti com clocks interface ti com logic ti com microcontroller ti com www ti rfid com www ti com omap Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space Avionics and Defense Video and Imaging E2E Community www ti com wirelessconnectivity www ti com computers www ti com consumer apps www ti com energy www ti com industrial www
67. interference in which case the user will be required to correct the interference at his own expense FCC Interference Statement for Class devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES 003 Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority
68. measure current C8R5 75430 82488 e s Orient Pin 1 of MSP430 device Ut a OFN111048 008 8101121 uS e 6 14 e nou 9 ej E e R1 mg e 5 Clamshell Jumper JP2 953 00 e i uM R2 1 Open to disconnect LED AD m INSTRUMENTS 18 D1 LED connected to P1 0 T 2 Figure B 28 MSP TS430RGZ48B Target Socket Module PCB 72 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430RGZ48B Table B 15 MSP TS430RGZ48B Bill of Materials Position Ref Des pant Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 B C7 3 10uF 6 3V SMD0805 C12 C5 C11 4 C13 C14 4 100nF SMD0805 311 1245 2 ND 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 D1 1 green LED SMD0805 P516TR ND Ji J2 J3 SAM1029 12 ND DNP Headers and receptacles 8 0 12 Header SAM1213 12 enclosed with kit Keep vias free of J4 i ND Receptacle solder 9 J5 1 3 pin header male TH d a place jumpers on pins 2 3 JP5 10 JP8 JP9 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 p
69. solder Header amp Receptacle J5 JP1 JP4 JP5 ARS Place jumper on 1 2 of JP4 JP9 7 JP7 8 3 pin header male SAM1035 03 ND Place on 1 2 on JP1 JP8 JP9 8 JP2 JP3 2 pin header male SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see Pos 7 an 8 10 JTAG 1 connector male iRp44H ND 11 Q1 0 Crystal DNP keep vias free of solder 12 R1 R7 2 330 Q SMD0805 541 330ATR ND 13 BR BS 2 0 Ohm 5 00805 541 000ATR ND DNP R5 R6 14 R4 1 47k Ohm SMD0805 541 47000ATR ND Socket OTS 24 28 15 U1 1 065 02 00 Manuf Enplas 16 PCB 1 68 5 x 61 mm 2 layers for example 3M Adhesive Approximately 6mm 3 x 17 plastic feet 4 width 2mm height EU aun Part No SJ Apply to corners at bottom side 18 MSP430 2 MSP430AFE2xx enclosed with kit supplied by Hardware SLAU278L May 2009 Revised December 2012 46 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 4 TEXAS INSTRUMENTS MSP TS430DW28 www ti com 6 MSP TS430DW28 If external supply voltage remove 8 and add 9 0 Ohm RST NMI R5 50K VCC Ext_PWR TCK TMS TDI TDO R1 C1 C2 TST VPP not assembled TST VPP RST NMI SMD Footprint F123 TST VCC P2 5 VSS XOUT P1 3 XIN RST P2 0 P2 1 P2 2 P3 0 P3 1 P3 2 P3 3
70. to operate the equipment Concerning EVMs including radio transmitters This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concerning EVMs including detachable antennas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Cet appareil num rique de la classe A ou B est conforme la norme NMB 003 du Canada Les changements ou les modifications pas express ment approuv s par la partie responsable de la conformit ont pu vider l autorit de l utilisateur pour actionner l quipement C
71. wire JTAG communication mode see Figure 2 1 the connection of the target RST signal to the JTAG connector is optional when using devices that support only 4 wire JTAG communication mode However when using devices that support 2 wire JTAG communication mode in 4 wire JTAG mode the RST connection must be made The MSP430 development tools and device programmers perform a target reset by issuing a JTAG command to gain control over the device However if this is unsuccessful the RST signal of the JTAG connector may be used by the development tool or device programmer as an additional way to assert a device reset SLAU278L May 2009 Revised December 2012 Design Considerations for In Circuit Programming 21 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 22 TEXAS INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com Voc Jl see Note A Ve AV C DV J see Note A 2 R1 10 O1uF 47 KQ _ MSP430Fxxx see Note B JTAG mE RST NMI VCC TOOL TDO TDI TDO TDI VCC TARGET TDI VPP TDI VPP TMS TMS TEST VPP TCK TCK GND RST see Note D I 9 u TEST VPP see Note C C1 10 nF 2 2 nF Veg AV gg DV 55 see Notes B and E local target power supply is used make connection J1 If power from the debug or programming adapter is used make connectio
72. 0 24 104 B 25 54 2 107 26 MSP TS430PZ100B n D a 110 277 MSP TS430PZ100G na 22222 7 113 285 6 5430 25 100 117 29 54 2 u un su ta suasana 120 B 30 54 0 28 124 1 EM430F5137RF900 222222222272 22 4 127 327 0 131 61 27 135 34 nocet EINEN 139 B 35 70 141 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X TEXAS INSTRUMENTS www ti com MSP TS430D8 MSP TS430D8 B 1 SBWICK RST SBWTDIO TST SBWTCK 2 to measure supply current J6 R2 330R TST SBWTCK R5 47K RST SBWTDIO i C7 100nF 10uF 10V Dvss TST SBWTCK P1 2 TA1 A2 TST SBWTCK P1 5 TA0 AS SCLK RST SBWTDIO RSTISBWIDIO P1 6 TA1 A6 SDO SCL 1 7 7 50 50 MSP TS430D8 Socket YAMAICHI Type IC369 0082 MSP TS430D8 Target Socket Board TITLE MSP TS430D8 Document Number Sheet 1 Date 28 07 20111 03 35 Figure B 1 MSP TS430D8 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 32 Submit Documentation Feedback Copyright 2009 2
73. 0 MSP430 2 MSP430N5736IRHA a enclosed with kit Is supplied by SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 67 Xi TEXAS INSTRUMENTS www ti com MSP TS430DL48 13 MSP TS430DL48 Ext_PWR RST NMI R5 1 Fon 51 1387 5 15186 t I CIE 5 10uF 1ov 100nF i Jon on Q1 C1 C2 not assembled MSP TS430DL48 Target Socket DL48 TITLE MSP TS430DL48 Document Number Date 11 14 2006 1 24 44 PM Sheet 1 1 Figure 25 MSP TS430DL48 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 68 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430DL48 T 10 00000001 000000 82 5 JP1 JTAG cos BOOTST Open to measure current int LED connected Connector J3 to P1 0 External power connector Jumper JP1 to ext 000000000000 000000000000 U 1 Jumper J4 Open to disconnect LE
74. 00q ATddns siD2 uuo5 95 2 70 68 21 edh 94120 8 SNG 8 6 SNG 6 5500 ETNId bt Y 2200 euo fituo ju 02 JONG 49 deg neauseieg 2172691 QTd IWN 154 d 001 101 V2d SWL 9 Zzd 21 2691 20 ZNId 2 90 9NId 9 S0 GNId S Zhetoa Q Zd 2 150080 l TNId 5540 2200 1x3 r 2200 5500 UT0HL OT 302315 SNId Figure B 5 MSP TS430L092 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 38 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430L092 Settings of the MSP TS430L092 Target Socket Figure B 6 shows the PCB layout of the MSP TS430L092 target socket The following pinning is recommended JP1 is write enable for the EPROM If this is not set the EPROM can only be read e JP2 connect device supply with boost converter They can be opened to measure device current consumption For default operation they should be closed P1 e e e 1 189 0142 146 5 54301 092 W oas Rev 1 1 Fig
75. 012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430D8 14 pin connector for debugging only in Spy Bi Wire mode 4 Wire JTAG not available D1 LED connected to P1 2 Connector J5 External power connector Jumper JP3 to ext Jumper JP2 Open to disconnect LED q gt X ER T Figure B 2 MSP TS430D8 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Hardware 33 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated MSP TS430D8 34 TEXAS INSTRUMENTS www ti com Table B 1 MSP TS430D8 Bill of Materials Position Ref Des aba Description DigiKey Part No Comment 1 J4 J6 2 2 pin header male TH SAM1035 02 ND place jumper on header 2 J5 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 3 SBW 1 10 pin connector male TH HRP10H ND 4 J3 1 3 pin header male TH SAM1035 03 ND 5 C8 1 2 2nF CSMD0805 Buerklin 53 D 292 6 C7 1 10uF 10V 1210ELKO 478 3875 1 ND 7 R5 1 47K 0805 541 47000ATR ND 8 C5 1 100nF CSMD0805 311 1245 2 ND 9 R2 R3 2 330R 0805 541 330ATR ND DNP headers enclosed with kit 10 J1 J2 2 4 pin header TH SAM1029 04 ND Keep vias free of solder 10 1 2 1 4 pin socket SAM1029 04 ND 11 1 508 Socket 1 369 0082 Manuf Yamaichi 12 D1 1 red LED 0603 DNP enclosed with kit Is 13 5 430
76. 0805 445 1372 2 ND 13 C12 1 10uF 6 3V CSMD0805 445 1372 2 ND DNP 14 C1 2 2 12pF CSMD0805 490 5531 2 ND DNP 15 R5 1 47K 0805 311 47KARTR ND C4 C5 C6 C7 C8 100nF CSMD0805 311 1245 2 ND 16 6 C15 17 C9 1 100nF CSMD0805 311 1245 2 ND DNP 18 R3 R7 2 330R 0805 541 330ATR ND 19 C10 C26 2 470nF CSMD0805 587 1282 2 ND 20 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 21 JTAG 1 14 pin connector male TH HRP14H ND 22 IC1 Socket 1 Socket 500 1284 009 Manuf Yamaichi 23 IC1 2 MSP430F67791IPEU DNP enclosed with kit Is supplied by TI 24 J5 1 3 pin header male TH SAM1035 03 ND 25 Q1 1 Crystal MS3V T1R 32 768kHz DNP Crystal enclosed with kit Keep vias 12 5pF 20ppm free of solder 26 TP1 TP2 2 Test point DNP keep vias free of solder 27 J2 J4 2 26 pin header TH SAM1029 26 ND DNP Headers enclosed with kit Keep vias free of solder 28 J2 J4 2 26 pin receptable TH SAM1213 26 ND DNP Receptacles enclosed with kit Keep vias free of solder 38 pin header TH SAM1029 38 ND DNP Headers enclosed with kit Keep vias 29 J1 J3 2 free of solder 38 pin receptable TH SAM1213 38 ND DNP Receptacles enclosed with kit Keep 30 J1 J3 2 vias free of solder 31 Rubber feet 4 Rubber feet Buerklin 20H1724 apply to bottom side corners Hardware SLAU278L May 2009 Revised December 2012 126 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS
77. 09 2012 Texas Instruments Incorporated Hardware 129 5 INSTRUMENTS EM430F5137RF900 www ti com Table B 33 EM430F5137RF900 Bill of Materials continued No per Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment 30 R1 1 RESISTOR JUMPER SMT 0402 0 00 ERJ 2GE0R00X PANASONIC 5 1 16W UNINSTALLED CAP CERAMIC 4 7UF 31 C041 0 6 3V X5R 0603 4 7uF ECJ 1VB0J475K Panasonic DNP 32 X1 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER 33 Q2 0 Crystal SMT 32 768 kHz 32 768k MS3V T1R Micro Crystal DNP DUT SMT PQFP RGZ 48 0 5mmLS m D 1 7 15x7 15x1mm THRM PAD CC430F52x1 n 35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 36 1 9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP 37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH 38 52 3 Pin Connector 1x2pin 61300211121 WUERTH 38a JP7 CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP 39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP 40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 130 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F6137RF900 B 32 EM430F6137RF900 y
78. 13 7 Toshiba BT Port COM14 Toshiba BT Port COM20 7 Toshiba BT Port COM21 7 Toshiba BT Port COM40 7 Toshiba BT Port COM6 47 Toshiba BT Port COM7 Processors Smart readers Sound video and game controllers y System devices Figure C 5 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF432 152 Hardware Installation Guide SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Document Revision History Document Revision History Version Changes SLAU278 Initial release SLAU278A Updated USB driver installation according to CCE v3 1 SR1 and CCS v4 SLAU278B Added information about MSP FET430U80USB MSP TS430PN80USB and eZ430 Chronos SLAU278C Added bills of materials and updated some PCBs in Appendix B Added information about MSP TS430DA38 MSP TS430DL48 MSP TS430PW14 MSP TS430PW28 SLAU278D Added information about MSP TS430L092 MSP TS430RSB40 MSP TS430RGC64USB MSP TS430PZ100USB MSP FET430F5137RF900 SLAU278E Added jumper information ior MSP TS430L092 PCBs to Appendix B Added new supported devices in Chapter 1 Added information about MSP TS430PW24 MSP TS430PW28A MSP TS430RHA40A MSP TS430RGZ48B MSP SLAU278F TS430RGC64B MSP TS430PN80A and MSP TS430PZ100B Updated MSP TS430RSB40 schematics SLAU278G A
79. 1300311121 WUERTH 36a 4 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 38 C7 1 Capacitor Ceramic 1206 16V X5R 2096 GRM31CR61C226ME15L MURATA 38 C8 9 2 CAP SMD Ceramic 0402 2 2uF X5R GRM155R60J225ME15D MURATA 38 C041 1 n SMD Ceramic 0603 4 7uF 16V 10 MURATA 138 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP FET430PIF 34 MSP FET430PIF 09999911 28 1x3 8 9 QbZIHYbZ 8 22 9 2 R44 330k 330k 83 GNI 10024541 9 Y brZOHUPZ bEzOHURZ R30 R29 optional optional R25 R24 27 KE kon aeg 9113 Igzzn11 001 Sp Il I00z 20 97 AI E dL34 dSW 2 50 a ejaeiu 1Di uonie u3 uset4 jI0 vd134 dSH SINAWNYLSNI SUX3L Figure B 67 MSP FET430PIF FET Interface Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 139 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 140 MSP FET430PIF Hardware 3 394001 juger is Hc ue Tm gt gt 5 M25HP284 tp 27 E is my B B 3 23 23 53 B o 5 INSTRUMENTS
80. 195905 ON9 221 6068 40E bdSW 3 2 isd 2 sart 5 X 5 8 5 8 z P 8 23 Mp s wee BUS 28 HA a X A lla s lt TEUR S8 55 3 vg 85 a D H 2 S g gee 15 Bo aa E ES gt 04 2 8 9 PH L var 2 LEDI 4708 P R15 5 5 S a o L D2 4208 Hp d n be e R16 S 3 03 4708 Id T 2 z n X m E R13 m N 5 i 2 2 v N 9 E a a 51 5 5 2 3 be 9 3 9 g ty 1 52 d m e T o pm Figure B 39 MSP TS430RGC64USB Target Socket Module Schematic 90 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com Figure B 40 MSP TS430RGC64USB Target Socket Module PCB Wie INSTRUMENTS ov Bs god GND 8 9000000000000000 USB1 9 a 1333 Bo 11 m N C10 40 Se 3 ee 22 e C409
81. 30U100C One MSP TS430PZ100C target socket module MSP FET430U5x100 One MSP TS430PZ5x100 target socket module MSP FET430U100USB One MSP TS430PZ100USB target socket module MSP FET430U128 One MSP TS430PEU128 target socket module Consult the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on the device errata may also be found in the device bug database at www ti com sc cgi bin buglist cgi Kit Contents FET430F6137RF900 One READ ME FIRST document One legal notice One MSP FET430UIF interface module Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device a 64 RGC package 2x7 pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868 MHz or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers One USB cable One 14 pin JTAG conductor cable Kit Contents Sub 1 GHz RF Spectrum Analyzer Tool MSP SA430 SUB1GHZ MSP SA430 SUB1GHZ Spectrum Analyzer Antenna USB cable CD with a Microsoft Windows Graphical User Interface GUI and documentation Quick start guide Get Started Now SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com 1 13 Kit Contents MSP TS430xx Kit Contents MSP TS4
82. 30xx D8 PW14 11092 PW24 DW28 PW28 PW28A DA38 QFN32x0 RSB40 DL48 RGZ48B RGZ48C PM64 PM64A RGC64B RGC64C RGC64USB 80 PN80A PN80USB PZ100 PZ100A PZ100B PZ100C PZ5x100 PZ100USB PEU128 One READ ME FIRST document One 32 768 kHz crystal from Micro Crystal except MSP TS430PW24 One target socket module 2x7 pin male JTAG connector is also present on the PCB see different setup for 1092 One small box containing two MSP430 device samples see Table 1 2 for sample type Table 1 2 Individual Kit Contents MSP TS430xx Target Socket Module Socket Type Supported Devices Included Devices Headers and Comment 8 pin D 1 x MSP430G2210 and Two PCB 1 4 headers two male and MSP TS430DS TSSOP zip MSP430G2210 02230 1 MSP430G2230 two female 14 pin PW MSP430F20xx G2x01 Four PCB 1 7 headers two male and MSP TS430PW14 TSSOP ZIF G2x11 G2x21 G2xa1 2 X MSP430F2013IPW two female Four PCB 1x7 pin headers two male and two female A Micro MaTch 10 pin 14 pin PW female connector is also present on the MSP TS430L092 TSSOP ZIF MSP TS430L092 2 x MSP430L0921PW PCB which connects the kit with an Active Cable PCB this Active Cable PCB is connected by 14 pin JTAG cable with the FET430UIF 24 pin PW Four PCB 1x12 pin headers two male MSP TS430PW24 TSSOP ZIF MSP430AFE2xx 2 x MSP
83. 4 20 and 28 pin PW MSP FET430U38 for MSP430F22x2 and MSP430F22x4 devices in 38 pin DA packages MSP FET430U23x0 for MSP430F23x0 devices in 40 pin RHA packages MSP FET430U40 for MSP430F51x1 MSP430F51x2 devices in 40 pin RSB packages MSP FET430U40A for MSP430FR572x MSP430FR573x devices in 40 pin RHA packages MSP FET430U48 for MSP430F22x2 and MSP430F22x4 devices 48 DL packages MSP FET430U48B for MSP430F534x devices in 48 pin RGZ packages SLAU278L May 2009 Revised December 2012 Read This First 7 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS How to Use This Manual www ti com MSP FET430U48C for MSP430FR58xx and MSP430FR59xx devices in 48 pin RGZ packages MSP FET430U64 for MSP430F 13x MSP430F14x MSP430F14x1 MSP430F 15x MSP430F 16x 1 MSP430F23x MSP430F24x MSP430F24xx MSP430F261x MSP430F41x MSP430F42x A MSP430FE42x A MSP430FE42x2 and MSP430FW4ex devices in 64 PM packages MSP FET430U64A for MSP430F41x2 devices in 64 pin PM packages red PCB MSP FET430U64B for MSP430F530x devices 64 pin RGC packages blue PCB MSP FET430U64C for MSP430F522x and MSP430F521x devices 64 pin RGC packages black PCB MSP FET430U64USB for MSP430F550x MSP430F551x MSP430552x devices in 64 pin RGC packages MSP FET430U80 for MSP430F241x MSP430F261x MSP430F43x MSP430F43x1 MSP430FG43x MSP430F47x and MSP430FG47x devices
84. 4 pin RGC packages blue PCB MSP TS430RGC64C for MSP430F522x and MSP430F521x devices in 64 pin RGC packages black PCB MSP TS430RGC64USB for MSP430F550x MSP430F551x MSP430F552x devices in 64 pin RGC packages green PCB MSP TS430PN80 for MSP430F241x MSP430F261x MSP430F43x MSP430F43x1 MSP430FG43x MSP430F47x and MSP430FG47x devices in 80 pin PN packages green PCB MSP TS430PN80A for MSP430F532x devices in 80 pin PN packages red PCB MSP TS430PN80USB for MSP430F551x and MSP430F552x devices with USB peripheral 80 pin PN packages green PCB MSP TS430PZ100 for MSP430F43x MSP430F43x1 MSP430F 44x MSP430FG461x and MSP430F47xx devices in 100 pin PZ packages green PCB MSP TS430PZ100A for MSP430F471xx devices in 100 pin PZ packages red PCB MSP FET430PZ100B for MSP430F67xx devices in 100 pin PZ packages blue PCB MSP TS430PZ100C for MSP430F643x and MSP430F533x devices 100 PZ packages black PCB MSP TS430PZ5x100 for MSP430F54xx A and the MSP430BT5190 devices in 100 PZ packages green PCB MSP TS430PZ100USB MSP430F663x and MSP430F563x devices 100 PZ packages green PCB MSP TS430PEU128 for MSP430F67xx and MSP430F67xx1 devices in 128 pin PEU packages green PCB EM430F5137RF900 with integrated CC430F5137 IC in a 48 pin RGZ package green PCB EM430F6137RF900 with integrated CC430F6137 IC in a 64 pin RGC package green PCB EM430F6147RF900 with integrated CC
85. 430AFE253IPW and two female MSP430F11x1 F11x2 _ 28 DW 12 F12x2 21 Four 1 12 headers two male MSP TS430DW28 SSOP ZIF Supports devices in 20 and 2 X MSP430F123IDW and two female 28 pin DA packages 28 pin PW MSP430F11x1 F11x2 Four PCB 1x12 pin headers two male MSP TS430PW28 TSSOP ZIF F12x F12x2 F2ixx 2 X MSP430F2132IPW and two female MSP430F20xx 4 MSP TS430PW28A MSP430G2xxx in 14 20 2 x MSP430G2452IPW20 5 B 28 PW packages 38 DA Four PCB 1 19 headers two male MSP TS430DA38 TSSOP ZIF MSP430F22xx 2 x MSP430F22741DA and two female 40 pin RHA Eight PCB 1x10 pin headers four male MSP TS430QFN23x0 QEN ZIF MSP430F23x0 2 x MSP430F2370IRHA and four female 40 pin RSB Eight PCB 1x10 pin headers four male MSP TS430RSB40 QEN ZIF MSP430F51x1 F51x2 2 x MSP430F5172IRSB and four female 40 pin RHA Eight PCB 1x10 pin headers four male MSP TS430RHA40A QFN ZIF MSP430FR572x FR573x 2 x MSP430FR5739IRHA and four female 48 pin DL Four PCB 2x12 pin headers two male MSP TS430DL48 TSSOP ZIF MSP430F42x0 2 x MSP430F4270IDL and two female 5 48 RGZ Eight 1 12 headers four male MSP TS430RGZ48B QFN ZIF MSP430F534x 2 x MSP430F5342IRGZ and four female 48 RGZ MSP430FR58xx Eight 1 12 headers four male MSP TS430RGZ48C QFN ZIF MSP430FR59xx 2 x MSP430FR5969IRGZ and four female MSP430F 13x F14x F14x1
86. 430F6147 IC in a 64 pin RGC package red PCB These tools contain the most up to date materials available at the time of packaging For the latest materials data sheets user s guides software application information etc visit the MSP430 web site at www ti com msp430 or contact your local sales office SLAU278L May 2009 Revised December 2012 Read This First 9 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Information About Cautions and Warnings www ti com Information About Cautions and Warnings This document may contain cautions and warnings CAUTION This is an example of a caution statement A caution statement describes a situation that could potentially damage your software or equipment WARNING This is an example of a warning statement A warning statement describes a situation that could potentially cause harm to you The information in a caution or a warning is provided for your protection Read each caution and warning carefully Related Documentation From Texas Instruments MSP430 development tools documentation CCS for MSP430 User s Guide literature number SLAU157 Code Composer Studio v5 x Core Edition CCS Mediawiki IAR for MSP430 User s Guide literature number SLAU138 IAR Embedded Workbench KickStart literature number SLACO50 2430 2013 Development Tool User s Guide literature number SLAU17
87. 48 SLAU278L May 2009 Revised December 2012 Hardware Installation Guide 147 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Hardware Installation www ti com C 1 Hardware Installation Table C 1 shows the USB VIDs and PIDs used in MSP430 tools Table C 1 USB VIDs and PIDs Used in MSP430 Tools Tool USB VID USB PID INF File Name 7430 2013 0 0451 OxF430 usbuart341 0 inf 7430 2500 0 0451 OxF432 430CDC inf 7430 2780 0 0451 OxF432 430CDC inf eZ430 RF2560 0x0451 OxF432 430CDC inf MSP WDSxx Metawatch 0x0451 OxF432 430CDC inf eZ430 Chronos 0x0451 OxF432 430CDC inf MSP FET430UIF 0x2047 0x0010 msp430tools inf LaunchPad MSP EXP430G2 0x0451 OxF432 430CDC inf MSP EXP430FR5739 0x0451 OxF432 430CDC inf MSP EXP430F5529 0x0451 OxF432 430CDC inf The older MSP FET430UIF used with IAR versions before v5 20 x and CCS versions before v5 1 has VID 0 0451 and PID 0xF430 With the firmware update it is updated to the 0x2047 and 0x0010 respectively 1 Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of IDEs CCS or IAR should be installed The IDE installation isntalls also drivers for USB Debug Interfaces without user interaction After IDE installation the USB Debug Interface can be connected and will be ready to work within few seconds 2 The driver can be al
88. 4H ND Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13 R2 R3 2 330 SMD0805 541 330ATR ND 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 14 0 65 01 Manuf Enplas 17 PCB 1 56 x 53 mm 2 layers For example 3M Adhesive Approximately 6mm 18 plastic feet 4 width 2mm height Saa Part No SJ Apply to corners at bottom side 19 MSP430 2 MSP430F2013IPW DNP enclosed with kit supplied by SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 37 i Texas INSTRUMENTS www ti com MSP TS430L092 3 MSP TS430L092 T T nasus Wd 0147 6002 21 8 28180 PASQUNN JUSOWNRAEH se you seop gylf furpeuon2un 398043 35 35 Atddns 2601 0 51 5 31111 p4eog 193505 126461 ZE 1 EFS1 dSW 510 ssna T Zd SWL Ing 901 pattddns ued paeog seu e qe2 eui jo paeoq Atddns 404 ZNId NId oa1n 1n Iain n SWLATNA 21n n ano S 2 2 6 iSunin B 31892 301129 16 uu 3N 9 8 WOd 3 150091 Z Cd IQL 41224 S THOUd33 b 150091 i1ue44n2 o pausdo aq sep Edf 1s
89. 5 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 Q1 0 Crystal B2 Coad H 2 Keep vias free of 5pF 15 Q2 1 Crystal a a 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 17 R6 R8 R9 2 0 SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 12 18 10 1 100 5 000805 Buerklin 07 500 18 11 0 1 5 00805 DNP 18 R5 1 47k Q SMD0805 541 47000ATR ND 19 U1 1 1 201 0804 014 Manuf Yamaichi 20 PCB 1 79 x 77mm 2 layers 21 211 4 Buerklin 20H1724 67 to corners at bottom 22 MSP430 2 MSP430F5529 eae Insulating http www ettinger de Art_ 3 disk to Q2 1 Insulating disk to Q2 Detail cfm ART_ARTNUM 70 08 121 27 C33 1 220n Buerklin 53D2074 102 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PN80USB Table B 25 MSP TS430PN80USB Bill of Materials continued Pos Ref Des poe Description DigiKey Part No Comment 28 C35 1 10p Buerklin 56D102 29 C36 1 10p Buerklin 56D102 30 C38 1 220n Buerklin 53D2074 31 C39 1 4u7 Buerklin 53D2086 32 C40 1 0 1u Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 1 TPD4E004 Manu TI 36 LED 0 JP3QE SAM1032 03 ND DNP 37 LED1 0 LEDCHIPLED_0603 FARNELL 8
90. 50V GJM1555C1H1ROCB01D MURATA 18 20 GRM1555C1H8R20Z01 MURATA C402 411 CAPACITOR SMT 0402 CERAMIC 1 5pF ig ed GRM1555C1H1R5CZ01 MURATA 20 L401 L411 2 SMT 0402 12nH 5 500 QW15AN12NJ00 MURATA C46 C48 CAPACITOR SMT 0402 CERAMIC 2 0pE 5122211 GRM1555C1H2ROCZO Murata 22 L1 1 0402 6 2nH 0 1nH LQW15AN6N2D00 Murata ULTRA SMALL TACTILE SWITCH SMT 2P 23 51 52 2 SPST NO 1 2x3x2 5mm 0 05A 12V PSU OS OMRON 24 R7 1 0 1 SMT 0402 0 9 5 2GEOROOX UN PANASONIC 25 R2 R3 R6 dus PANASONIC 27 C511 1 21 2 1 0402 2200pF ECJ 0EB1H222K PANASONIC PANASONIC 28a C041 1 CAP CERAMIC 4 7UF 6 3V X5R 0603 ECJ 1VB0J475M PANASONIC 29 R441 1 SMT THICK FILM 56K 1 16W ERJ 2RKF5602 PANASONIC 30 R1 1 JUMPER SMT 0402 0 Q 5 ERJ 2GE0R00X PANASONIC 31 1 SMA STRIGHT JACK SMT 32K10A 40ML5 ROSENBERGER SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated Hardware 133 5 INSTRUMENTS EM430F6137RF900 www ti com Table B 34 EM430F6137RF900 Bill of Materials continued No Pos Ref Des per Description Part No Manufacturer Board DUT SMT PQFP RGC 64 0 5mmLS 33 1 915 9 15 THRM PAD CC430F6137 TI 34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH 35 JP2 1 Pin Con
91. 5137RF900 Bill of Materials No per Manufacturer s Part Item Reference Board Description Value Number Manufacturer Comment CUSTOMER SUPPLY CRYSTAL 1 1 SMT 4P 26MHz 26 ASX 531 CS ELECTRONIC C1 C5 C082 C222 C271 2 C281 C311 14 EA SMT 0402 CER 16V 0402YC104KAT2A AVX C321 C341 C412 C452 CAPACITOR SMT 0603 CERAMIC 3 C071 1 DUE dev TOE 0 47 0603YD474KAT2A AVX 4 R401 1 RES0402 47 0K 47kQ DALE HEADER THU MALE 14P 2X7 5 CON11 1 2222 09 18 514 6323 HARTING HEADER THU MALE 10P 2X5 6 CON10 22 09 18 510 6323 HARTING DNP 7 51 1 LED 5 0603 GREEN 2 1V active APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V active APT1608EC KINGBRIGHT UNINSTALLED CRYSTAL SMT MICRO 9 0 MSIV Customer Supply 32 768k MS1V TIK UN CRYSTAL BNF HEADER THU MALE 3P 1x3 10 CON12 1 deas qur 22 03 5035 MOLEX 11 C251 C261 2 50V 5 27pF 27pF GRM36COG270J50 MURATA 12 L341 1 FERRITE SMT 0402 1 0kO 250mA 1kQ BLM15HG102SN1D MURATA CAPACITOR SMT 0402 CERAMIC GRM1555C1H101JZ 13 100pF 50V 0 25pF COG NPO 100PF o4 MURATA INDUCTOR SMT 0402 2 2nH 0 1nH E 14 L304 1 ERA COOL 0 0022uH LOP15MN2N2B02 MURATA INDUCTOR SMT 0402 15nH 2 15 L303 L305 Era 0 015uH LOW15AN15NGOO MURATA INDUCTOR SMT 0402 18nH 2 16 L292 1302 amp ou esM 0 018uH 1 15 18 000 MURATA CAPACITOR SMT 0402
92. 52 9833 DNP 38 LED2 0 LEDCHIPLED_0603 FARNELL 852 9868 DNP 39 LED3 0 LEDCHIPLED_0603 FARNELL 852 9841 DNP 40 i 0 470R Buerklin 07E564 DNP 41 R33 1 1k4 Buerklin 07E612 42 R34 1 27R Buerklin 07E444 43 R35 1 27R Buerklin 07E444 44 R36 1 33k Buerklin 07E740 45 1 0 P12225STB ND DNP 46 52 0 P12225STB ND DNP 46 53 1 P12225STB ND 47 USB1 1 USB_RECEPTACLE FARNELL 117 7885 SLAU278L May 2009 Revised December 2012 Hardware 103 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PZ100 24 MSP TS430PZ100 104 100201752 0 60 BEEN 31LIL 48qunN 500 001240 lt 51 5 Xppj PUE 1 40 QBIZd EbS1 dSW 194205 Je 5 INSTRUMENTS www ti com m oo dns pai28uuca st 021 1 9r uedo 188nF assenblec 621 I 1193208 8 1 D gt D N 52 1 uF 76 3 1 6 3U EL d 83 SH Doe pue ge IOWA abei OA T 991 FE25 1A4 g rdSH 4 1S8 31 9bei OA h ddns jeussixe j zp sn 51 uyo pue NOTE Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be Hardware made Figu
93. 6 eZ430 RF2480 User s Guide literature number SWRA176 eZ430 HF2500 Development Tool User s Guide literature number SLAU227 eZA30 HF2500 SEH Development Tool User s Guide literature number SLAU273 eZ430 Chronos Development Tool User s Guide literature number SLAU292 Sub 1 GHz RF Spectrum Analyzer Tool literature number SLAU371 MSP430F5529 USB Experimenter s Board MSP EXP430F5529 literature number SLAU330 MSP430F5438 Experimenter Board MSP EXP430F 5438 literature number SLAU263 MSP430 LaunchPad Value Line Development kit MSP EXP430G2 literature number SLAUS18 MSP430 device user s guides MSP430x1xx Family User s Guide literature number SLAU049 MSP430x2xx Family User s Guide literature number SLAU144 MSP430x3xx Family User s Guide literature number SLAUO12 MSP430x4xx Family User s Guide literature number SLAUO56 MSP430x5xx and MSP430x6xx Family User s Guide literature number SLAU208 CC430 Family User s Guide literature number SLAU259 MSP430FR57xx Family User s Guide literature number SLAU272 MSP430FR58xx and MSP430FR59xx Family User s Guide literature number SLAU367 1 Read This First SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com If You Need Assistance If You Need Assistance Support for the 5 430 devices and the FET development tools is provided by the Texas Instruments Produ
94. 6mm 26 plastic feet 4 width 2mm height E ii Part No SJ Apply to corners at bottom side 27 MSP430 2 MSP430F6733IPZ DNP enclosed with kit supplied by TI Hardware SLAU278L May 2009 Revised December 2012 112 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ100C B 27 MSP TS430PZ100C UJ 2 e 3 m 5 D 3 5 8 o gt 3 gt 5 E o vcc L H B b PEEB B Drak sez B Sis F s M 4 55 ps 99800 k 5 355 Q PE ge TI e 5 9 os TL 2 a 5 8 Uc TUS oum Pu o woe 188 5 T ET Losa gS T 8 e oR O g 8 6 E N FFS 2 TITOzIX g a 1 QNS J2 F J eat au001 019 iio QNS o FT 4 39 25 83 J5 O 2 56 of of a PWR3 o ol 4 2 o q E 5 S m A N u P 3 2 S 7 z 8 S Q S e S 3 4 2 B og 9 o pl 719 8 EN s o N 5 o n 4 A 8 m m M Figure 53 MSP TS430PZ100C Target Socket Module Sch
95. 7 Mice and other pointing devices te Modems Monitors 8 Network adapters 1394 Net Adapter 3 Broadcom Netxtreme 57xx Gigabit Controller Cisco Systems VPN Adapter Intel R Wireless WiFi Link 4965AGN E PCMCIA adapters 5 9 Ports COM amp LPT 7 Port 10 Port 11 BT Port COM12 BT Port COM13 BT Port COM14 BT Port COM20 BT Port COM21 BT Port COM22 BT Port COM6 f BT Port Communications Port 1 ECP Printer Port LPT1 MSP FET430UIF 49 4 Processors X Smart card readers Sound video and game controllers 9 System devices e eee eee Figure C 3 Device Manager Using USB Debug Interface using VID PID 0x2047 0x0010 150 Hardware Installation Guide SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Hardware Installation amp Device Manager Batteries 4 Bluetooth Devices Computer Disk drives E Display adapters DVD CD ROM drives 1 Human Interface Devices IDE controllers 32 Infrared devices Keyboards B Mice and other pointing devices k Modems Monitors 51 30 multi port serial adapters MSP FET430UIF TI USB FET Adapter BS Network adapters PCMCIA adapters 5 Ports COM amp LPT 7 Bluetooth Communications Port
96. 7 Q1 1 BC817 25LT1SMD SOT23 Digi Key 817 BEC 25LT1GOSCT ND 18 U1 U2 2 TLVH431IDBVR SOT23 5 Manu TI SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 43 xi TEXAS INSTRUMENTS www ti com MSP TS430PW24 B 5 MSP TS430PW24 JTAG Mode selection 4 uire JTAG Set jumpers JP4 to JP9 to position 2 3 2 vire SpyBildire Set jumpers JP4 to JP9 to position 1 2 330R TEST SBLTCI JTAG gt 1 SBW gt JP4 3 mot P2 0 IDI I 1 1 JP JP8 P2 0 STE TAG TOI TCLK PL 7 UCLKQ TAL TOO TOI P1 6 SOMI TAZ TCK P1 5 SIMO SUSOUT THS P4 4 URXDB SD2DO P4 3 UTXD0 SD1DO P1 2 TAB SD DO 21 330R P1 1 T81 S0CLK DUcC P2 2 XT20UT P2 6 XT2IN Duss Socket EnplasOTS 28 65 B1 MSP430RFE2XX P1 0 k DNP XT20UT P2 7 12pF f 1H c1 XTLGND ono o 12 1 2 DNP GUARZ5 C2 11 e XT2IN P2 6 12pF DNP MSP TS43 PW24 Target Socket Board for MSP43 s AFE2xx ICs PW24 package TITLE MSP TS43 PW24 Document Number Date 04 08 2010 13 36 04 Sheet 1 1 Ic Schemati TS430PW24 Target Socket Module B 9 MSP igure F SLAU278L May 2009 Revised December 2012 Hardware 44 Submi
97. 87 KS a 16 U1 1 15186 Manuf Yamaichi 17 PCB 1 58 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 6mm width 2mm height Part No SJ 5302 side DNP Enclosed with kit 19 MSP430 2 MSP430F4270IDL supplied by TI Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X5 TEXAS INSTRUMENTS MSP TS430RGZ48B www ti com 14 MSP TS430RGZ48B UCC TES R 23308 4 5 JP10 428 4 29 1d ig lt SB 2 2 I 2 o 2 w F lt JTAG BSL Interface one BOOTST Rio 98 2 2nF 8 m E 10uF 6 3U FE12 1 1 R44 OR P1 2 160 1 1 1 40 0 DNP Thermal Pad P 3 CB3 63 P6 2 CB2 A2 P6 4 CB4 A4 P6 1 CB1 A1 P6 5 CB5 A5 RST NHL SBHTOIO P5 0 UREF UeREF AB PJ 3 TCK P5 UREF eREF h9 PJ 2 TMS PJ A TDI TCLK P5 4 XIN PJ 8 T00 P5 5 X0UT 20551 P5 3 XT20UT P5 2 XT2IN 0551 0553 P4 6 PM_NONE 1 4 82 3 Ducc2 P1 5 T 8 4 Duss2 P1 6 TA1CLK CBOUT P4 3 PH UCB1CLK P1 7 TA1 0 P4 2 PH UCB1SOHI P2 7 UCB STE UCARCLK P4 1 PH_UCB4SIHO P3 0 UCB SIMOZ UCB SDA P4 0 PM UCB1STE
98. AM1034 10 ND Header SAM1212 10 ND Receptacle Place header 7 45 JP1 2 3 pin header male SAM1035 03 ND JP1 Pos 1 2 8 JP2 JP3 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 JP2 JP3 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH DP Keep vias ea solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load 22 solder 12 5pF 13 R1 1 330 SMD0805 541 330ATR ND 14 R2 R3 0 0 SMD0805 541 000ATR ND DNP 15 R4 1 47k SMD0805 541 47000ATR ND 16 U1 1 Socket QFN 40B 0 5 01 Manuf Enplas 17 PCB 1 79 x 66 mm 2 layers Adhesive for example 3M Bumpons Apply to corners at bottom TB Plastic feet 6mm width 2mm height Part No SJ 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F2370IRHA supplied by TI SLAU278L May 2009 Revised December 2012 Hardware 61 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated xi TEXAS INSTRUMENTS www ti com MSP TS430RSB40 11 MSP TS430RSB40 JTAG Mode selection 4 uire JTAG Set jumpers JP4 to 9 to position 2 3 2 vire SpyBiWire Set jumpers JP4 to JP9 to position 1 2 UCC430 5 5 3 lt 2 DIO mot P L4 TDI a 1 JP R1 330R PLA iG 7H
99. AM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND E on J6 JP2 JP1 Pos1 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH o solder Q1 Micro Crystal MS1V T1K 12 01 02 0 Crystal 32 768kHz C Load solder 12 5pF 13 R3 1 560 O SMD0805 541 560ATR ND R1 R2 R4 14 R6 R7 R10 2 0 Q SMD0805 541 000ATR ND R10 RTT R12 R11 R12 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket 201 0804 014 Manuf Yamaichi 17 PCB 1 77 x 77 mm 2 layers Adhesive E for example 3M Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height I Part No SJ 5302 side DNP Enclosed with kit 19 MSP430 2 MSP430FG439IPN supplied by TI 96 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X TEXAS INSTRUMENTS MSP TS430PN80A www ti com B 22 MSP TS430PN80A UCC 9 10 2 33 R JP5 lt SBH XTLGND2 Il DNP c12 L C13 I ieur ieenr l GND buy R3 330R lt JTAG GND BSL Interface BOOTST C11 100nF DUCC1 I QF P8 PN Socket Yamaichi C201 0804 014 2 4441
100. ARGET CON USBFET MSP FETU43 IF _Rev1 4upd Document Number Date 10 05 2005 09 39 37a Sheet 2 4 MSP FET430UIF USB Interface Schematic 2 of 4 Figure B 70 SLAU278L May 2009 Revised December 2012 Hardware 142 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 4 TEXAS INSTRUMENTS MSP FET430UIF www ti com R16 R18 VCC 3061 0 1 30k1 0 1 R17 R19 22k1 0 1 T 10nF GND GND 22k1 0 1 T 10nF GND GND J1 RIN ROUT BUCHSE2 DOUT DN 2 J4 gt 1 VBUS BUCHSE2 1 GND VF 3 6V 6 6V 100u 16V R48 39k2 0 1 R47 22k1 0 1 i GND GND TPS76601D GND GND 39 2 0 1 R15 VCCR 30k1 0 1 6 22k1 0 1 IN2 OUT2 GND RES EN FB TPS77301DGK USBFET TITLE MSP FETU430IF Document Number Date 10 05 2005 03 38 37a VCCT 1 8V 5V 7 2u2 16 30k1 0 1 GND VCC 3 6V Figure B 71 MSP FET430UIF USB Interface Schematic 3 of 4 Revi 4upd Sheet 3 4 143 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated www ti com X TEXAS INSTRUMENTS MSP FET430UIF RST_3410 VREGEN a RESET WAKEUP SUSPEND CLKOUT B R46 33R 5 D Ld D C35 41 Ras 100k 22p i SHIELD GND GND SHIELD1 100 1 USB_RECEPTACLE R31 Type B TUSB3410VF 33k
101. C3 0 2 2nF SMD0805 DNP 3 C6 1 10uF 10V Tantal Size 511 1463 2 ND 4 C4 C5 2 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with kit 6 J1 J2 J3 J4 0 16 header Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Receptacle J5 JP3 JP4 JP5 JP6 7 JP7 JP8 8 3 pin header male TH SAM1035 03 ND JP9 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 2 Jumper 15 38 1024 ND Place on J6 J7 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH PMP Keep vias ee solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load DNP Keep vias free of solder 12 5pF 13 R3 R6 2 330 Q SMD0805 541 330ATR ND R1 R2 R5 R7 R9 R10 DNP R5 R7 R9 R10 R11 14 R11 R13 2 0 SMD0805 541 000ATR ND R13 R14 R14 15 R4 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket IC51 0644 807 Manuf Yamaichi 17 PCB 1 78 x 75 4 layers Rubber stand Apply to corners at bottom 18 off 4 select appropriate side 19 MSP430 2 MSP430F4152IPM DNP Enclosed with kit supplied by TI 82 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback X TEXAS INSTRUMENTS MSP TS430RGC64B www ti com 18 MSP TS430RGC64B UCC o IESIZ SBHICI
102. D 000000000000 000000000000 Orient pin 1 of MSP430 device Figure B 26 MSP TS430DL48 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Hardware 69 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated MSP TS430DL48 70 TExAS INSTRUMENTS www ti com Table B 14 MSP TS430DL48 Bill of Materials Pos Ref Des a per Description DigiKey Part No Comment oard 1 C1 C2 0 12pF SMD0805 DNP 2 C4 C7 2 10uF 10V Tantal Size 511 1463 2 ND 3 C3 C5 2 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 D1 1 yellow LED TH 3mm 1 511 1251 DNP Headers and receptacles enclosed with 6 J1 J2 0 24 pin header TH kit Keep vias free of solder SAM1034 12 ND Header SAM1212 12 ND Receptacle Place header 7 J3 JP1 JP2 2 3 pin header male TH SAM1035 03 ND JP1 Pos 1 2 DNP JP2 8 J4 45 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 3 Jumper 15 38 1024 ND Place on JP1 J4 J5 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH DP Keep Mies Tree or solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load solder 12 5pF 13 R3 1 560 SMD0805 541 560ATR ND 14 2 0 Q 5 00805 541 000ATR ND DNP R6 R7 15 R5 1 47k Q SMD0805 541 47000ATR ND Socket 51 13
103. EM430F5137RF900 www ti com 31 EM430F5137RF900 REVISIONS ECR 20 20 09 09 MPK Vect 33t0hms PLANCUS ALINARE IURE PAS GS AS NREF NE mEmm ut 20 09 09 DATE 28 09 09 SCHEMATIC EM430F5137RF 322 Rev 8 2 868 915MHz DATE 20 09 08 XXXXXXX Power Management VCC01 external VCC Vdd DVCC Vddai A DD RF A CC RF Vdda2 A CC Port connectors CONI CON3 Port Port3 of cc430 CON4 spare CONS 1 XIN 2 XOUT CON6 Vdd GND Vcore COMO LCDCAP CON7 Vddai Vdda2 GND AGND 8 JTAG BASE JTAG Port CON Vdd GND A
104. EZVEOCLET aigX SPIRU a Up ik amp BATEYA Raw ie 6 J B 2 4815 http www tij co jp EVALUATION BOARDIKIT MODULE WARNINGS RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only in Laboratory Development Environments Unless otherwise indicated this EVM is not a finished electrical equipment and not intended for consumer use It is intended solely for use for preliminary feasibility evaluation in laboratory development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsystems It should not be used as all or part of a finished end product Your Sole Responsibility and Risk You acknowledge represent and agree that 1 You have unique knowledge concerning Federal State and local regulatory requirements including but not limited to Food and Drug Administration regulations if applicable which relate to your products and which relate to your use and or that of your employees affiliates contractors or designees of the EVM for evaluation testing and other purposes 2 You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements and also to assure the safety of any activities to be conducted by you and or yo
105. GND 127 Hardware Figure B 61 EM430F5137RF900 Target board Schematic SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS EM430F5137RF900 www ti com JTAG connector Jumper JP2 asure current mu Close EXT for external supply Jump Close for supply External power connector 2 mod CON12 JPi a JTAG GND Jumper JP1 Close JTAG osition to Open to disconnect LEDs debug in jumper JP5 JP10 mode 1 SBW position o debug in s ooo to Spy Bi Wire mode Push button S2 LED D1 green connected connected to P17 to P1 0 via JP5 Footprint for 32kHz crystal Use 00 resistor for R431 R441 to make XIN XOUT available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA Figure 62 EM430F5137RF900 Target board The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 128 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F5137RF900 Table B 33 EM430F
106. I to JTAG header 11 LPT and USB tools are able to pull the RST line which also resets the device internal fuse logic e Use the debugger option Release JTAG On Go that can be selected from the IDE drop down menu This prevents the debugger from accessing the MSP430 while the application is running Note that in this mode a manual halt is required to see if a breakpoint was hit See the IDE documentation for more information on this feature Use an external clock source to drive XIN directly The 14 conductor cable connecting the FET interface module and the target socket module must not exceed 8 inches 20 centimeters in length The signal assignment on the 14 conductor cable is identical for the parallel port interface and the USB FET To utilize the on chip ADC voltage references the capacitor must be installed on the target socket module See schematic of the target socket module to populate the capacitor according to the data sheet of the device To utilize the charge pump on the devices with LCD Module the capacitor must be installed on the target socket module See schematic of the target socket module to populate the capacitor according to the data sheet of the device Crystals or resonators Q1 and Q2 if applicable are not provided on the target socket module For MSP430 devices that contain user selectable loading capacitors see device and crystal data sheets for the value of capacitance Crystals or re
107. MSP430 Hardware Tools User s Guide X TEXAS INSTRUMENTS Literature Number SLAU278L May 2009 Revised December 2012 13 TEXAS INSTRUMENTS Contents uay DER 7 1 Get Started Now 12 1 1 Flash Emulation Tool FET OVerVIeW eene enr era cece cn we 18 1 2 Kit eror m MT gi RII e 14 1 3 Kit Gontents eZ430 F20 3 adis 14 1 4 Kit Gontents CZ4 302120 1 2 ua ER aS 14 1 5 5 8 430 2500 2 425 uu upa qaqa uci dil NIU 14 1 6 Kit Contents eZ430 RF2500T p nnn nnn 14 1 7 Kit Contents eZ430 RF2500 SEH nnn 14 1 8 Kit Gontents eZ430 GhfOllOS XX a uana Susu uu s 15 1 9 Kit Contents MSP FETA3S3OUIE 2 Ern Dn eR Ea 15 140 Kit Gonterits
108. N 23 MSP430 2 MSP430F643x DNP enclosed with kit Is supplied by 24 16 1 4 7 nF SMD0603 Buerklin 53 D 2042 26 D3 D4 2 LL103A Buerklin 24S3406 27 JP11 1 4 pin header male TH SAM1035 04 ND Place jumper on Pin 1 and Pin 2 28 C15 1 4 7 SMD0805 Buerklin 53 D 2430 29 C21 1 220nF SMD0805 Buerklin 53 D 2381 SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated Hardware 115 5 INSTRUMENTS MSP TS430PZ100C www ti com 116 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PZ5x100 X5 TEXAS INSTRUMENTS B 28 MSP TS430PZ5x100 www ti com UCC RZ 338R 1JP5 MS DI DO 2 2nF C8 XTLGND2 RST NMI DNP If BSL is used If external supply voltage remove R11 and add R10 0 NI QFP100PZ XTLGND1 m Socket Yamaichi 1C201 1004 008 NN O IO O X O D G OO x 10 O D S Q 00 00 00 00 00 00 00 00 CO O HSP430 Target Socket HSP TS430Pz5x100 for F543x TI
109. OTST 0 DNP Keep vias free of solder Micro Crystal MS3V T1R 17 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 18 Q2 0 Crystal 780134 DNP Q2 Keep vias free of solder Insulatin http Awww ettinger de Art LE disketo Os 0 Insulating disk to Q2 _Detail cfm ART_ARTNU M 70 08 121 20 R3 R7 2 330 5 00805 541 330ATR ND R1 R2 R4 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R11 R12 22 R5 1 47k Q SMD0805 541 47000ATR ND Socket QFN11T064 006 inhi 23 U1 1 N HSP Manuf Yamaichi 24 PCB 1 85 x 76 mm 2 layers for example Adhesive Approximately 6mm I 25 plastic feet 4 width 2mm height ENIM Part No SJ Apply to corners at bottom side 26 D3 D4 27 MSP430 2 MSP430F5310 RGG DNP enclosed with kit supplied by TI SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 85 5 INSTRUMENTS MSP TS430RGC64C www ti com 19 MSP TS430RGC64C The MSP TS430RGC64C target board has been designed to operate with the target device DVIO input voltage supplied via header J6 see Figure B 37 This development platform does not supply the 1 8 V DVIO rail on board and it MUST be provided by external power supply for proper device operation For correct JTAG connection programming and debug operation it is important to follow this procedure
110. R SMD0805 R2 R3 R5 17 R6 R8 R9 3 OR SMD0805 DNP R2 R3 R5 R6 R10 18 R4 1 47k SMD0805 DNP enclosed with kit Is 19 MSP430 2 MSP430F5132 supplied by TI 20 Rubber stand 4 select appropriate for apply to corners at bottom off example Buerklin 20H1724 side 64 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback MSP TS430RHA40A X TEXAS INSTRUMENTS 12 MSP TS430RHA40A www ti com JTRG Mode selection vire JTAG Set jumpers JP4 to JP9 to position 2 3 2 uire SpyBilire Set jumpers JP4 to JP9 to position 1 2 ext pS Ucc 2 int 1 RZ 330R 2 lt 3 L TEST SBWTC IDO wH2 PJ 1 TDI 2 DJ 3 ICK JP2 1 L JP 1 9 1 uF 1gU 180nF i GNO ez C6 180uF 1Q0U100nF BOOTST connection bu via 139 6055 D P2 0 J3 70 3_TCK OUUUUUUUDU o 8 T as 1 2 2 t 2 3 8 is co Jos foo co viov co Io e E O O Q Ol Q N gt Bopp gt P Po SP NaO M ls 1 TDI 11 PJ GND external supplu voltage 1 RA 330R remove R3 and add RZ 0 Ohm LD P
111. R13 R7 3 0R 0805 541 000ATR ND 9 C5 1 1 1nF CSMD0805 490 1623 2 ND 10 C3 C7 2 1uF 10V CSMD0805 490 1702 2 ND 11 R4 1 47k 0805 541 47000ATR ND 12 C4 C6 2 100nF CSMD0805 311 1245 2 ND 13 R1 1 330R 0805 541 330ATR ND 14 C1 C2 C8 C9 4 DNP CSMD0805 DNP 15 SW1 SW2 2 EVQ 11L05R P8079STB ND DNP Lacon 1251459 16 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 17 JTAG 1 14 pin connector male TH HRP14H ND 18 Q1 1 DNP MS3V TR1 32768kHz depends on application Micro Crystal DNP enclosed in kit keep vias 20ppm 12 5pF free of solder 19 Q2 1 DNP Christal depends on application DNP keep vias free of solder 20 1 Socket QFN11T048 008 Manuf Yamaichi 101121 001 20 1 U1 1 MSP430 DNP enclosed with kit Is supplied by TI 21 D1 1 green LED DIODE0805 P516TR ND 22 D3 1 red DNP DIODE0805 DNP 23 D2 1 yellow DNP DIODE0805 DNP 24 TP1 TP2 2 Testpoint DNP keep pads free of solder 25 Rubber stand off 4 Buerklin 20 1724 apply to corners at bottom side 26 PCB 1 79 6 x 91 0 mm MSP TS430RGZ48C 2 layers black solder mask Rev 1 2 Hardware SLAU278L May 2009 Revised December 2012 76 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PM64 16 MSP TS430PM64 reserved for future enhancement R12 jou Ajddns jeujejxe JI 0 634 ppe pue gy
112. RUMENTS MSP TS430PW28 www ti com Table B 8 MSP TS430PW28 Bill of Materials Pos Ref Des Bo Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 T e holes 2 C3 1 10uF 10V Tantal Elko B 3 C4 1 100nF SMD0805 4 C5 0 2 2nF SMD0805 DNP 5 D1 1 LED green SMD0603 Micro Crystal MS1V T1K DNP Cover holes and 6 Q1 0 QUARZ Crystal 32 768kHz C Load neighboring holes while 12 5pF soldering DNP Headers and receptacles enclosed with 7 J1 J2 2 14 pin header TH male kit Keep vias free of solder Header Receptacle DNP headers and receptacles enclosed with 71 2 14 pin header TH female kit Keep vias free of solder Header Receptacle 8 J5 IP1 1 3 Pin Connector male JP1 JP4 8a T a 7 3 Pin Connector male Jumper on Pos 1 2 JP9 9 JP2 JP3 2 2 Pin Connector male with Jumper 10 BOOTST 0 ML10 10 Pin Conn m RS 482 115 2 while 11 JTAG 1 ML14 14 Pin Conn m RS 482 121 12 R1 R7 2 330R SMD0805 12 R2 e R5 0 OR SMD0805 DNP 14 R4 1 47K SMD0805 15 U1 1 SOP28PW socket Enplas OTS 28 0 65 01 52 0 66 x 79 mm two layers Rubber stand off four pieces Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback X5 TEXAS INSTRUMENTS MSP TS430PW28A www ti com 8 MSP TS430PW28A RST NMI SBWTCK Ext_PWR TMS TDI TDO SBWTDIO TEST SBWTCK
113. Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback MSP TS430L092 Active Cable 4 74RUG IC26 2 74RUC26125 1 46 2 74RUC26125 Ds IC36 2 74RUC26125 41 Hardware Copyright 2009 2012 Texas Instruments Incorporated B 4 MSP TS430L092 Active Cable X TEXAS INSTRUMENTS www ti com 092 Active Cable TITLE MSP TS43 PW14_L 92_ActiveCable Document Number Sheet 1 1 Date 8 31 2009 4 21 17 PM Figure B 7 MSP TS430L092 Active Cable Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback MSP TS430L092 Active Cable TEXAS INSTRUMENTS www ti com Figure B 8 shows the PCB layout for the Active Cable The following pinning is possible JP1 has two jumpers Jumper 1 and Jumper 2 that can be set as shown in Table B 4 Table B 4 MSP TS430L092 JP1 Settings Jumper 1 Jumper 2 Description Off Off The active cable has no power and does not function Off On The active cable receives power from target socket For this option the target socket must have its own power supply On Off The active cable receives power from the JTAG connector The JTAG connector powers the active cabl
114. SMD Ceramic 0805 DNP C3 C4 4 3 C5 C7 C10 10uF CAP SMD Ceramic 0805 5 5 C8 C6 C13 15 100nF CAP SMD Ceramic 0805 DigiKey 311 1245 2 ND 5 5 C8 2 2nF CAP SMD Ceramic 0805 6 1 C9 470nF CAP SMD Ceramic 0805 DigiKey 478 1403 2 ND 7 1 C16 4 7uF CAP SMD Ceramic 0805 8 1 D1 Green LED LED SMD 0805 DNP headers and receptacles enclosed with Pin header 1x16 Grid 100mil kit Keep vias free of 9 4 J1 J4 16 pin header 2 54 mm solder Header SAM1029 16 ND Receptacle SAM1213 16 ND Pin header 1 3 Grid 100mil 10 2 J5 J6 3 pin header male TH 2 54 mm SAM1035 03 ND JP5 JP6 JP7 Pinheader 1x3 Grid 100mil JP8 JP9 JP10 3 pin header male TH 2 54 mm place jumpers on pins 2 3 SAM1035 03 ND Pin header 1x3 Grid 100mil 12 JP3 3 pin header male TH 2 54 mm place jumper on pins 1 2 SAM1035 03 ND 13 JP1 JP2 JP4 2 pin header male TH 4 1x2 Grid 100mil jumper header SAM1035 02 ND Place on JP1 JP2 JP3 14 10 Jumper JP4 JP5 JP6 JP7 JP8 15 38 1024 ND JP9 JP10 Header THD Male 2 7 Pin 15 1 JTAG 2x7Pin Wanne Wanne 100mil spacing HRP14H ND Header THD Male 2x5 Pin 16 0 BOOTST 2x5Pin Wanne Wanne 100mil spacing DNP CRYSTAL SMD 5x3MM 17 1 26MHz ASX53 Only Kit 18 0 Q2 26MHz ASX53 CHYSTAPSSMDI BONN 300 8219 1 ND 26MHz DIODE SMD SOD123 a 19 1 D3 LL103A Buerklin
115. SP TS430PM64A Bill of Materials 82 20 MSP TS430RGC64B Bill of Materials 0 85 21 MSP TS430RGC64C Bill of Materials 89 B 22 MSP TS430RGC64USB Bill of 92 B 23 MSP TS430PN80 Bill of Materials 96 B 24 MSP TS430PN80A Bill of Materials 99 B 25 MSP TS430PN80USB Bill of Materials nennen 102 B 26 MSP TS430PZ100 Bill of heme nnne 106 B 27 MSP TS430PZ100A Bill of 0000 nn n nnne nennen 109 B 28 MSP TS4930PZ100B Bill of Materials l rre ra t 112 29 MSP TS430PZ100C Bill of 5 01 115 B 30 MSP TS430PZ5x100 Bill of Materials 119 31 MSP TS430PZ100USB Bill of Materials 122 32 MSP TS430PEU128 Bill of Materials 126 33 EM430F5137RF900 Bill of Materials 2 2 129 34 EM430F6137RF900 Bill of Materials 1 nnn nnn enne nennen nnne 133 B 35 EM430F6147RF900 Bill of Materials
116. TCLKI If BSL is used R4 R6 R MSP430F 43x 2 8 MSP430F2xlx open open 0 If external supply voltage R12 open open remove R11 and add R10 0 Ohm MSP43 Target Socket MSP TS430PN80 for F43x and F2xlx TITLE 5 5430 80 Document Number Date 12 19 2006 01 50 13 Sheet 1 1 NOTE For MSP430F G 47x devices Connect pins 7 and 10 GND externally to DVss see data sheet Connect load capacitance on V e pin 60 when 5016 is used see data sheet Figure B 41 MSP TS430PN80 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 94 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com LED connected to 12 Jumper J6 Open to disconnect LED Orient Pin 1 of MSP430 device 2218 090902 Ucci 21 00 5 018 v Com Rm JTAG ggg d 2 2 00000000000000000000 Sc 55 50 13 45 41 J5 E 06150 9 9 e 2 e e je Bas Ze e e 4 e 0000000 05
117. TLE MSP TS430P25x100 Document Number Date 3 20 2008 08 03 58a Sheet 1 1 117 Hardware schematic TS430PZ5x100 Target Socket Module Copyright 2009 2012 Texas Instruments Incorporated B 55 MSP Figure SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback MSP TS430PZ5x100 Connector J5 External power connector Jumper J3 to ext Jumper JP1 Open to measure current Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Jumper JP3 TEXAS INSTRUMENTS www ti com 1 2 int Power supply via JTAG debug interface 2 3 ext External power supply 0000000 00000002 JT G CD 000000000000000000000000 GND 75 78 65 68 55 51 ucc ej 5 sje INSTRUMENTS e e R4 e e Bcia 5 ez z e cs de e r lt ei a le i Jom 5 Si e 2 4 seu JTRG 8 052 J2 eeje n je e 4 40 qe le e dire 00000000 le e jp e 00000000 e e ie Loewe RN e 24 5 CS 01 uw oe BEB ERs se R 5 2 Ll n e c8 e R2 e es E LED connected to P1 0 1 5 19 2115 20 Jumper JP2 Open to disconnect LED Figure B 56 MSP TS430PZ5x100 Target Socket M
118. Table B 35 EM430F6147RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 4P 26MHz ASX 531 CS ELECTRONIC 1 5 C112 C252 C381 2 C391 C421 14 SMT 0402 16V 10 0402YC104KAT2A C431 C451 C522 C562 CAPACITOR SMT 0603 CERAMIC 0 47uF 3 C101 e aoe ee 0603YD474KAT2A AVX 4 R511 1 50402 47 0K CRCW04024702F100 DALE HEADER THU MALE 14P 2X7 5 CON11 222 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V APT1608EC KINGBRIGHT HEADER THU MALE 3P 1x3 10 CON12 o 22 03 5035 MOLEX 11 C361 C371 2 SOV 5 27pF GRM36COG270J50 MURATA 12 L451 1 Inductor SMD 0402 12nH 5 370mA LQW15AN12NJ00 MURATA CAPACITOR SMT 0402 CERAMIC 100pF 13 C403 GRM1555C1H101JZ01 MURATA INDUCTOR SMT 0402 2 2nH 0 2nH 14 L414 LQW15AN2N2C10 MURATA 15 L413 1 Inductor SMD 0402 15nH 5 370mA LOW15AN15NJ00 MURATA 250MHz 15 L415 1 0 d CE LQW15AN15NJOO MURATA 16 L402 L412 2 Inductor SMD 0402 18nH 5 460mA LQW15AN18NJ00 MURATA 250MHz CAPACITOR SMT 0402 CER 1pF 50V 17 C401 GJM1555C1H1ROCBO1D MURATA CAPACITOR SMT 0402 CERAMIC 8 2pF 18 C413 2 GRM1555C1H8R2CZ01 MURATA C402 C411 CAPACITOR SMT 0402 CERAMIC 1 5pF 1555 1 1 5 201 MURATA 20 L1 L401 L411 INDUCTOR SMT 0402 12nH
119. Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100A B 25 MSP TS430PZ100A ica fea h i os ototo tototo 800 7001 10221 m b 194205 a 26 a P75 01 44 p72 gt i vy gt 46 2148 P46 2148 P45 50 4 ejeq JILIL J quinN juawnooq XX 10 Wd 1 70 2 800Z 0 01 VYOOLZdOEPSL dSW 19420 1 1 0 r JSIN V00lZd0erSL dSW Ajddns JI p sn si 4S8 JI WYO 0 OLY ppe pue LiH Figure 49 MSP TS430PZ100A Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 107 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PZ100A Jumper JP3 1 2 int Power supply via JTAG interface 2 3 ext External Power Supply Jumper JP1 Open to measure current rz 10 Vcc 2 3 RIG R11 JTAG oT ext 1 1 BOOTST J5 J3 GND 75 70 85 PE 86 55 vec 2 4 862 ne 80 f Orient Pin 1 of Device cs rs C6 Ka R2 30 R5 Et cam 6 1 26 J1 15 2 5 10 20 00000000000000000000000060 2 io MSP TS438PZ2100A 2 0 Rev
120. Titel 5 430 Target Socket Bearb Petersen MSP TS430PEU128 for F6779 Dok 1080 1 001 01 1 MSP TS430PEU128 Datum 22 05 2012 09 37 33 Seite 1 1 Figure B 59 MSP TS430PEU128 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Hardware 124 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com JP11 JP12 JP13 Connect 1 2 to connect AUXVCCx with DVCC or drive AUXVCCx externally e nR D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED y IH R3 015 Orient Pin 1 of MSP430 device Lz Lz e e e e e Lz Lz e e e e e Lz e e e e A0 R1 AUXVCC2 JP12 RST NMI TCK TMS TDI GND TDO TEST SBWTCK AUXVCC3 ISAUXVCC 1234 C19 macs mci mci 4 TEXAS INSTRUMENTS MSP TS430PEU128 Rev 1 1 RoHS 45 50 55 60 64 J MSP TS430PEU128 Jumper JP1 Open to measure current Connector J5 External power connector Jumper JP1 to ext Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Figure 60 MSP TS430PEU1 28 Target Socket Module NOTE MSP TS430PEU128 Rev 1 1 ships with the f
121. W14 www ti com Connector J3 External power connector Jumper J5 to ext LED connected to P1 0 Jumpers J7 to J12 Close 1 2 to debug in Spy Bi Wire Mode Close 2 3 to debug in 4 wire JTAG mode Jumper J4 Open to disconnect LED fee Orient Pin 1 of Jumper J6 MSP430 device e Open to measure current ul lt 5 75430 4 Rev 2 0 Figure 4 MSP TS430PW14 Target Socket Module 36 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW14 Table B 2 MSP TS430PW14 Bill of Materials Position Ref Des pad Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C7 1 2 10 Tantal Size 511 1463 2 ND 3 C3 C5 1 100nF SMD0805 478 3351 2 ND DNP C3 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 ND DNP Headers and receptacles enclosed with kit Keep vias free of i solder 6 J1 J2 0 7 pin header TH SAM1029 07 ND Header SAM1213 07 ND Receptacle J3 J5 J7 disc pete P Place jumpers on headers 45 J7 J8 7 J8 J9 J10 8 3 header male SAM1035 03 ND J9 J10 J11 J12 Pos 1 2 J11 J12 8 J4 J6 2 2 pin header male SAM1035 02 ND Place jumper on header 9 9 Jumper 15 38 1024 ND Place on J5 J7 J12 Pos 1 2 10 JTAG 1 1 connector male HRP1
122. Z48C Target Socket Module Schematic Hardware 74 5 INSTRUMENTS www ti com MSP TS430RGZ48C 10 Connector JTAG 000001 Connector BOOTST For JTAG Tool 000002 For BSL Tool Jumper J1 J1 TCK TMS IDI TDO C5 Bo Ext Power select extII JTAG KB ONT owe 2552 we Connector J2 ext for external supply Vec ae eae EX TEXAS GN External Power int for tool supply JP8 JP4 Jp3 8 INSTRUMENTS ND J1 connect to ext JP7 JP6 4 12 Jumper JP1 bidon RST SBWTDIO TEST SBWTCK Power measurement zz MSP TS430RGZ48C 2 Jumper JP2 20 15 S A Analog Digital Power TEM o 20 Clamshell 0000 Jumper JP3 8 Connect 1 2 for SpyBiWire Connect 2 3 for JTAG Debugging b LEDs connected to P1 0 P1 1 P1 2 via JP9 JP10 JP11 only D1 assembled R1 D1 sa sm pi o R10 D2 wa e R11 D3 88 8BP 2 m QFN11T048 008 A101121 Device Pin 1 Switch SW2 connected to P1 3 40 45 1 3 Sw2 Switch SW1 Device reset 13 HF and LF Oscillators with Capacitors and Resistors to connect Pinheads Figure B 30 MSP TS430RGZ48C Targ
123. adio in legally acceptable frequency space and within legally mandated power limitations Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental development licenses from local regulatory authorities which is responsibility of user including its acceptable authorization For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful
124. al power connector 2 BOOTST oo c Jumper JP3 to ext z B s 10 8 211 124 5 O RZ D3 P 9 0095 2005 If the system should be supplied via LDOI J6 close JP4 and set JP3 to external Figure B 44 MSP TS430PN80A Target Socket Module PCB 98 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PN80A Table B 24 MSP TS430PN80A Bill of Materials Position Ref Des pant Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP C6 C7 3 C10 C12 3 10uF 6 3V SMD0805 DNP C10 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND J1 J2 J8 SAM1029 20 ND DNP Headers and receptacles 10 dT DG 0 20 pin header TH Header SAM1213 20 enclosed with kit Keep vias free of 44 ND Receptacle solder 11 J5 46 2 3 pin header male TH re e place jumpers on pins 2 3 on JP5 12 JP8 7 3 pin header male SAM1035 03 ND JP6 JP7 JP8 JP9 JP10 place d jumpers on pins 1 2 on JP10 JP1 JP2 13 JP4 3 2 header male SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and
125. as free of solder Header Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 JP1 JP2 10 JP4 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Micro Crystal MS1V T1K 14 Qi 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 Q2 1 Crystal Q2 4MHz Buerklin 78D134 16 R3 R7 2 330 Q SMD0805 541 330ATR ND R1 R2 R4 17 R6 R8 9 3 0 O SMD0805 541 000ATR ND DNP R6 R8 R9 R12 R12 18 R10 1 100 SMD0805 Buerklin 07E500 18 R11 1 1M Q SMD0603 not existing in Rev 1 0 18 R5 1 47k O SMD0805 541 47000ATR ND 19 U1 1 Socket IC201 1004 008 Manuf Yamaichi 20 PCB 1 79 x 77 mm 2 layers 21 Rubber stand 4 Buerklin 20H1724 apply to corners at bottom off side DNP enclosed with kit Is 22 MSP430 2 MSP430F5529 supplied by TI Insulatin http www ettinger de Art De 23 9 1 Insulating disk to Q2 tail cfm ART_ARTNUM 70 0 disk to Q2 8 121 24 C16 1 4 7 nF SMD0603 27 C33 1 220n SMD0603 Buerklin 53D2074 28 C35 C36 2 10 SMD0603 Buerklin 56D102 122 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instrum
126. ated MSP TS430DA38 58 TExAS INSTRUMENTS www ti com Table B 10 MSP TS430DA38 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 1 10uF 10 Tantal Size 511 1463 2 ND 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 0 2 2nF SMD0805 DNP 5 D1 1 green LED SMD0603 475 1056 2 ND DNP headers and receptacles enclosed with 6 J1 J2 0 19 pin header TH kit Keep vias free of solder SAM1029 19 ND Header SAM1213 19 ND Receptacle Es ge Place jumpers on headers 7 I 8 3 pin header male TH SAM1035 03 ND JP1 JP4 JP5 JP6 JP7 JP6 JP7 JP8 JP9 Pos 1 2 JP8 JP9 d 8 JP2 JP3 2 2 pin header male TH SAM1035 02 ND Place jumper on header 9 9 Jumper 15 38 1024 ND m on JP1 JP9 Pos 1 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH ONP Keep vias Iree o solder Micro Crystal MS1V T1K 12 Q1 0 Crystal 32 768kHz C Load solder 12 5pF 13 R1 R3 2 330 SMD0805 541 330ATR ND 14 10 11 0 0 Q SMD0805 541 000ATR ND DNP 15 R5 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket IC189 0382 037 Manuf Yamaichi 17 PCB 1 67 x 66 mm 2 layers Adhesive for example Bumpons Apply to corners at bottom 18 Plastic feet 4 6mm width 2mm height Part No SJ 5302 side DNP enclosed with kit 19 MSP430 2 MSP430F2274IDA supplied by
127. ce port pins and this sharing of pins can complicate a design or sharing may not be possible As an alternative to using the JTAG pins most MSP430F xxx devices contain a program a bootstrap loader that permits the flash memory to be erased and programmed using a reduced set of signals The MSP430 Programming Via the Bootstrap Loader User s Guide SLAU319 describes this interface See the MSP430 web site for the application reports and a list of MSP430 BSL tool developers suggests that MSP430Fxxx customers design their circuits with the BSL in mind that is suggests providing access to these signals by for example a header See FAQ Hardware 10 for a second alternative to sharing the JTAG and port pins SLAU278L May 2009 Revised December 2012 Design Considerations for In Circuit Programming 25 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Appendix A SLAU278L 2009 Revised December 2012 Frequently Asked Questions and Known Issues This appendix presents solutions to frequently asked questions regarding the MSP FET430 hardware Topic Page 1 Hardware FAQS E sem ce nena ne Senne NOS 27 2 T Knownilss es 222222222 22 222227 21 1 142 29 26 Frequently Asked Questions Known Issues SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009
128. ceptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP9 JP10 10 xl riu 3 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 12 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND Q1 Micro Crystal MS1V T1K DNP Q1 14 Q1 0 Crystal 2 C Load Keep vias free of solder 5pF 15 Q2 1 Crystal Q2 4MHz Buerklin 78D134 16 R3 R7 2 330 5 00805 541 330ATR ND R1 R2 R4 17 R6 sr R9 2 0 SMD0805 541 000ATR ND DNP R4 R6 R8 R9 R12 18 R10 1 100 SMD0805 Buerklin 07E500 18 R11 1 1M O SMD0805 18 R5 1 47k O SMD0805 541 47000ATR ND 19 U1 1 Socket QFN11T064 006 Manuf Yamaichi 20 PCB 1 79 x 77 mm 2 layers 2 4 Buerklin 20H1724 to corners at bottom 22 MSP430 2 MSP430F5509 RGC 2 WIES Insulating f f http www ettinger de Art De 3 disk to Q2 1 Insulating disk to Q2 PLE 27 C33 1 220n SMD0603 Buerklin 53D2074 28 C35 1 10p SMD0603 Buerklin 56D102 29 C36 1 10p SMD0603 Buerklin 56D102 30 C38 1 220n SMD0603 Buerklin 53D2074 31 C39 1 4u7 SMD0603 Buerklin 53D2086 32 C40 1 0 1u SMD0603 Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 92 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012
129. cs and PCBs are shown in Appendix B Get Started Now SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated l TEXAS INSTRUMENTS www ti com Hardware Installation MSP FET430UIF 1 16 Hardware Installation MSP FET430UIF Follow these steps to install the hardware for the MSP FET430UIF tool 1 Install the IDE CCS or IAR you plan to use before connecting USB FET interface to PC The IDE installation installs drivers automatically 2 Use the USB cable to connect the USB FET interface module to a USB port on the PC The USB FET should be recognized as the USB device driver is installed automatically If the driver has not been installed yet the install wizard starts Follow the prompts and point the wizard to the driver files The default location for CCS is c ti ccsv5 ccs_base emulation drivers msp430 USB_CDC c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XX depending of firmware version of the tool The default location for IAR Embedded Workbench is lt Installation Root gt Embedded Workbench x x 430 drivers TIUSBFET eZ430 UART or Installation Root gt Embedded Workbench x x 430 drivers lt Win_OS gt depending of firmware version of the tool The USB driver is installed automatically Detailed driver installation instructions can be found in Appendix C 3 After connecting to a PC the USB FET performs a self test during which
130. ct Information Center PIC Contact information for the PIC can be found on the TI web site at www ti com support The Texas Instruments E2E Community support forums for the MSP430 provide open interaction with peer engineers TI engineers and other experts Additional device specific information can be found on the MSP430 web site SLAU278L May 2009 Revised December 2012 Head This First 11 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Chapter 1 SLAU278L 2009 Revised December 2012 Get Started Now This chapter lists the contents of the FET and provides instruction on installing the hardware Topic Page 11 Flash Emulation Tool FET Overview 1112 13 1 2 Contents 222222222222 22222 2 14 3 Kit 67430 22013 14 Contents 67430 72 14 1 52 KitiGontents eZA430 RE2500 m eee P 22000 14 16 Contents eZ430 RE2500T n U asas asa 14 17 Kit Contents eZ430 RE2500 SEEIL 14 18 Kit Gontents eZ430 Ghronoss G06c uu U a ea eean see a SEE EET 15 1 9 Kit Contents 15 1 10 Kit Gontents MSP sEET430xx n 077222 7700070 AEE RE 15 KitContents FET430F6137RF900 16 1 12 Kit Contents Sub 1 GHz RF Spectrum Analyzer Tool MSP SA430 SUB1GHZ 16 KibGontents 5 4 30
131. ctor J5 External power connector Jumper JP3 to ext If the system should be supplied via LDOI J6 close JP4 and set JP3 to external Figure B 36 MSP TS430RGC64B Target Socket Module PCB 84 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430RGC64B Table B 20 MSP TS430RGC64B Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C3 C4 0 47pF SMD0805 DNP 3 C6 C7 C10 3 10uF 6 3V SMD0805 C5 C11 4 C13 C14 5 100nF SMD0805 311 1245 2 ND C15 5 C8 1 2 2nF SMD0805 6 C9 1 470nF SMD0805 478 1403 2 ND 7 C16 1 4 7uF SMD0805 8 C17 1 220nF SMD0805 9 D1 1 green LED SMD0805 P516TR ND J1 J2 J3 SAM1029 16 ND DNP Headers and receptacles 10 A gt 0 16 Header 5 1213 16 enclosed with kit Keep vias free of J4 e ND Receptacle solder 11 J5 J6 2 3 pin header male TH je no place jumpers on pins 2 3 on JP5 JP6 12 j 7 3 pin header male TH SAM1035 03 ND JP7 JP8 JP9 JP10 place jumpers on JP8 JP9 pins 1 2 on JP3 JP10 JP1 JP2 13 3 2 pin header male TH SAM1035 02 ND Place jumper on header 14 10 Jumper 15 38 1024 ND See Pos 12 and Pos 13 15 JTAG 1 connector male 4RP14H ND 16 BO
132. d to CON12 Ensure correct battery insertion regarding the polarity as indicated in battery holder 132 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com EM430F6137RF900 Table B 34 EM430F6137RF900 Bill of Materials No Pos Ref Des per Description Part No Manufacturer Board CUSTOMER SUPPLY CRYSTAL SMT AKER 1 Q1 1 26MHz ASX 531 CS ELECTRONIC C1 C5 C112 C252 C381 2 391 421 14 Cup ERES SMT 0402 CER 16V 10 0402YC104KAT2A AVX C431 C451 C522 C562 3 C101 1 AN NOE MN 0603 CERAMIC 0 470 0603YD474KAT2A AVX 4 R511 1 RES0402 47 0K CRCW04024702F100 DALE 5 CON11 1 apre id 09 18 514 6323 HARTING 7 D1 1 LED SMT 0603 GREEN 2 1V APT1608MGC KINGBRIGHT 8 D2 1 LED SMT 0603 RED 2 0V APT1608EC KINGBRIGHT 10 CON12 WE i l 22 03 5035 MOLEX 11 C361 C371 2 SOV 5 27pF GRM36COG270J50 MURATA 12 L451 1 FERRITE SMT 0402 1 0kQ 250mA BLM15HG102SN1D MURATA 13 C403 1 DDV aD COGNO TPF GRMISSSCIH101JZ01 MURATA 14 L414 1 0402 2 2nH 0 2nH LQW15AN2N2C10 MURATA 15 L413 L415 2 ce SMT 0402 15nH 5 460MA QW15AN15NJ00 MURATA 16 1402 L412 2 SMT 0402 18nH 5 370MA QW15AN18NJ00 MURATA 17 C401 1 SMT 0402 1pF
133. dded information for MSP TS430PZ100C SLAU278H Added information for MSP TS430D8 and MSP TS430RGC64C Updated Table 1 1 Replaced Figure 2 2 SLAU278I Added Figure 2 3 Replaced Figure B 37 and Figure B 67 Added Table C 1 Editorial changes throughout SLAU278J Added EM430F6147RF900 Section B 33 Added battery pack connection information to all EM430Fx1x7RF900 kits SLAU278K Added information for MSP TS430RGZ48C and MSP TS430PEU128 Updated Figure B 38 SLAU278L Changed descriptions in Section B 19 and Section B 30 Changed Figure B 60 NOTE Page numbers for previous revisions may differ from page numbers in the current version SLAU278L 2009 Revised December 2012 Revision History 153 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated RF EMISSION TESTING All MSP TS430xxx kits and kits listed below have been tested for compliance with Part 15 of the FCC and Canadian ICES 003 rules See REGULATORY COMPLIANCE INFORMATION for details on compliance with these rules All other kits described in this document either have not been tested or have the statement in their documentation which is listed in Related Documentation From Texas Instruments MSP FET430UIF EVALUATION BOARD KIT MODULE EVM ADDITIONAL TERMS Texas Instruments provides the enclosed Evaluation Board Kit Module EVM under the following conditions The user assumes all responsibility and liability for proper and
134. der male SAM1035 02 ND Place jumper on header 9 Jumper 15 38 1024 ND see Pos 7 an 8 10 JTAG 1 zm connector male HRP14H ND 11 BOOTST 0 DNP Keep vias free of solder Micro Crystal MS3V 12 Q1 0 Crystal 32 768kHz C Load DNP keep vias free of solder 12 5pF 13 R1 R7 2 330 O SMD0805 541 330ATR ND ip 0 0 Ohm 5 00805 541 000ATR ND DNP R2 R3 R5 R6 15 R4 1 47k Q SMD0805 541 47000ATR ND 16 U1 1 Socket OTS 28 0 65 01 Manuf Enplas 17 PCB 1 63 5 64 8 2 layers Adhesive Approximately 6mm 18 plastic feet 4 width 2mm height crm Part No SJ Apply to corners at bottom side 19 MSP430 2 MSP430G2553IPW28 DNP enclosed with kit supplied by TI SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 55 www ti com JTAG Mod lection eite TAG Set jumpers JP4 to JP9 to position 2 3 2 wire SpyBiWire Set jumpers JP4 to JP9 to position 2 1 Xi TEXAS INSTRUMENTS MSP TS430DA38 B 9 MSP TS430DA38 Ext_PWR R1 JP5 TESI SBWICK R3 560R P10 T L Ab JP3 330R R5 47k C8 a 10nF RST SRWT L DNP GND MSP430F2274IDA TEST SBWTCK P1 7 TDO DVCC P2 5 DVSS P2 7 P2 6 RST SBWDAT P1 1 P2 0 P2 1 P2 2 P3 0 P3 1 P3 2 P3 3
135. e MSP TS430L092 target socket module with Active Cable MSP FET430U24 One MSP TS430PW24 target socket module MSP FET430U28 One MSP TS430PW28 target socket module MSP FET430U28A One MSP TS430PW28A target socket module MSP FET430U38 One MSP TS430DA38 target socket module MSP FET430U23x0 One MSP TS430QFN23x0 former name MSP TS430QFN40 target socket module MSP FET430U40 One MSP TS430RSB40 target socket module MSP FET430U48 One MSP TS430DL48 target socket module SLAU278L May 2009 Revised December 2012 Get Started Now 15 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Kit Contents FET430F6137RF900 www ti com MSP FET430U48B One MSP TS430RGZ48B target socket module MSP FET430U48C One MSP TS430RGZ48C target socket module MSP FET430U64 One MSP TS430PM64 target socket module MSP FET430U64A One MSP TS430PM64A target socket module MSP FET430U64B One MSP TS430RGC64B target socket module MSP FET430U64C One MSP TS430RGC64C target socket module MSP FET430U64USB One MSP TS430RGC64USB target socket module MSP FET430U80 One MSP TS430PN80 target socket module MSP FET430U80A One MSP TS430PN80A target socket module MSP FET430U80USB One MSP TS430PN80USB target socket module MSP FET430U100 One MSP TS430PZ100 target socket module MSP FET430U100A One MSP TS430PZ100A target socket module MSP FET430U100B One MSP TS430PZ100B target socket module MSP FET4
136. e and the target socket For On On this option the target socket must not have its own power source as this would cause a not defined state JP2 is for reset For the standard MSP TS430L092 this jumper must be set It sets the reset pin to high and can also control it Without this jumper on the MSP TS430L092 reset is set to zero 1092 Active Cab RoHS Rev 1 4 2 Figure B 8 MSP TS430L092 Active Cable Target Socket Module PCB 42 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430L092 Active Cable Table B 5 MSP TS430L092 Active Cable Bill of Materials Pos Ref Des RON PEF Description DigiKey Part No Comment Board ML i 4 100nF SMD0603 2 C2 C4 1uF SMD0805 3 R1 R10 10K SMD0603 4 R2 4K7 SMD0603 Hes Re R7 4 100 SMD0603 R9 6 R8 1 680k SMD0603 7 R11 R15 2 1K SMD0603 8 R12 0 SMD0603 DNP 9 R13 0 SMD0603 DNP 10 R14 1 0 SMD0603 11 IC1 1 SN74AUC1G04DBVR Manu 12 IC2 IC3 IC4 3 SN74AUC2G125DCTR Manu Reichelt MicroMaTch 13 J2 1 MICRO_STECKV_10 Connector MM FL 10G Put jumper on Position 1 and 14 JP1 1 2x2 Header JP2Q 2 Do not mixdirection 15 JP2 1 2 pin header male TH SAM1035 02 ND place jumper on header 16 JTAG 1 14 pin connector male TH HRP14H ND 1
137. e of the TI product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification then you must specifically notify of such intent and enter into a separate Assurance and Indemnity Agreement Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright O 2012 Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections enhancements improvements and other changes to its semiconductor products and services per JESD46 latest issue and to discontinue any product or service per JESD48 latest issue Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All semiconductor products also referred to herein as components are sold subject to terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty in 5 terms and conditions of sale of semiconductor products Testing and other quality control techniques are used to the extent deems necessary to support this warranty Except where mandated by applicable law testing of all parameters of each component is not necessarily performed TI assumes no liability for app
138. e two jumpers LED and VCC near the 2x7 pin male connector are in place Illustrations of the target socket modules and their parts are found in Appendix B Important MSP430 Documents on the Web The primary sources of MSP430 information are the device specific data sheet and user s guide The MSP430 web site www ti com msp430 contains the most recent version of these documents PDF documents describing the CCS tools CCS IDE the assembler the C compiler the linker and the librarian are in the msp430 documentation folder A Code Composer Studio specific Wiki page FAQ is available and the Texas Instruments E2E Community support forums for the MSP430 and Code Composer Studio v5 provide additional help besides the product help and Welcome page PDF documents describing the IAR tools Workbench C SPY the assembler the C compiler the linker and the librarian are in the common doc and 430 doc folders Supplements to the documents that is the latest information are available in HTML format in the same directories A IAR specific Wiki Page is also available SLAU278L May 2009 Revised December 2012 Get Started Now 19 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 1 2 TEXAS SLAU278L 2009 Revised December 2012 INSTRUMENTS Design Considerations for In Circuit Programming This chapter presents signal requirements for in circuit programming of the MSP430
139. ease contact a TI field representative During normal operation some circuit components may have case temperatures greater than 60 C as long as the input and output are maintained at a normal ambient operating temperature These components include but are not limited to linear regulators switching transistors pass transistors and current sense resistors which can be identified using the EVM schematic located in the EVM User s Guide When placing measurement probes near these devices during normal operation please be aware that these devices may be very warm to the touch As with all electronic evaluation tools only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs Agreement to Defend Indemnify and Hold Harmless You agree to defend indemnify and hold TI its licensors and their representatives harmless from and against any and all claims damages losses expenses costs and liabilities collectively Claims arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory and even if the EVM fails to perform as described or expected Safety Critical or Life Critical Applications If you intend to evaluate the components for possible use in safety critical applications such as life support where a failur
140. ed U2 Changed from SN74LVC1G125DBV to SN74LVC1G07DBV NOTE Using a locally powered target board with hardware revision 1 4 Using an MSP FET430UIF interface hardware revision 1 4 with populated R62 in conjunction with a locally powered target board is not possible In this case the target device RESET signal is pulled down by the FET tool It is recommended to remove R62 to eliminate this restriction This component is located close to the 14 pin connector on the MSP FET430UIF PCB See the schematic and PCB drawings in this document for the exact location of this component Assembly change on 1 4 January 2006 R62 not populated 146 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 Appena C SLAU278L May 2009 Revised December 2012 INSTRUMENTS Hardware Installation Guide This section describes the hardware installation process of the following USB debug interfaces on a PC running Windows XP e MSP FET430UIF 7430 2013 e eZ430 RF2500 e eZ430 Chronos 7430 2780 e eZ430 RF2560 MSP WDSxx Metawatch e LaunchPad MSP EXP430G2 e MSP EXP430FR5739 e MSP EXP430F5529 The installation procedure for other supported versions of Windows is very similar and therefore not shown here Topic Page oa ene nee acre ne re 1
141. eiT ASS XIN XOUT AUXVCC3 RTCCAP1 RTCCAP0 P1 5 SMCLK CBO AS P1 4 MCLK SDCLK CB1 A4 P1 3JADC10CLKITACLKIRTCCLK A3 P12JACLKITA3 1 A2 P1 1 TA2 1 VEREF A1 P1 0 TA1 1 TA0 0 VEREF A0 P2 4 PM_TA2 0 P2 5 PM_UCBOSOMI PM_UCBOSCL P2 6 PM_USBOSIMO PM_UCBOSDA PZ TIPM UCBOCLK P3 0PM UCAORXD PM UCAOSOMI UCAOTXD PM UCAOSIMO P3 2JPM_UCA0CLK P3 3IPM UCATCLK P3 4 PM_UCA1RXD PM_UCA1SOMI P3 5 PM_UCATXD PM_UCA1SIMO COMO P1 6 COM2 1 P5 0 COM4 P5 1 COMS P5 2 COM6 P5 3 COM7 LCDCAP R33 P5 A SDCLK R23 P5 5 SDODIO LCDREFIR13 P5 6 SD1DIO RO3 P5 7 SD2DIO CB2 P6 0 SD3DIO P3 6 PM_UCA2RXD PM_UCA2S P3 TIPM UCAZTXD PM UCAZSII P4 0 PM_UCA2CLK P4 5 PM_UCB1SIMO PM_UCB1SDA P4 2 PM_UCA3TXD PM_UCA3SIMO GRXDIPM UCASSOMI P4 1 PM_UCR P4 3 PM UCA3CLK P44 PM UCBISOMIPM UCBISCL UCB1CLK PA TIPM TA3 0 P6 1 SD4DIO S39 P6 2 SD5DIO S38 P6 3 SDEDIO S37 MSP430F677XIPEU 10 3 55 RST NMISBWTDIO PJ 3ITCK PJ 2TMS PJAITDITCLK PJ UTDO TEST SBWTCK P23 PM TA1 0 22 0 2 Bootst 810 10 P2 1 PM TAQ 1 P2 0 PM TAO 0 P11 5 TACLK RTCCLK P11 4 CBOUT 11 3 2 1 11 2 1 1 P11 1 TA3 1 CB3 P11 0 80 P10 7 S1 P10 6 52 P10 5 53 10 4 54 P10 2 56 P10 1 57 10 0 58 9 7 59 P9 6 S10 P9 5 S11 P9 4 S12 P9 3 S13 P9 2 S14 9 1 515 P9 0 S16 Dvss2 DVsYs P8 7 S17 P8 6 S18 Toon Tutor
142. ematic SLAU278L May 2009 Revised December 2012 Hardware 113 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated MSP TS430PZ100C Jumpers JP5 to JP10 Close 1 2 to debug in Spy Bi Wire mode Close 2 3 to debug in 4 wire JTAG mode Orient Pin 1 of MSP430 device D1 LED connected to P1 0 Jumper JP2 Open to disconnect LED TEXAS 09 vH 60H Ei MSP TS430P2100C 1 R3 JPZ z Rev 1 1 INSTRUMENTS www ti com JP11 JP3 Opes Bey TES DOOREN 9 Connector J5 O 8 3 9 BOOTST External power connector zum Ox Jumper JP3 to ext 79 If the system should be supplied via LDOI J6 close JP4 and set JP3 to external O Figure B 54 MSP TS430PZ100C Target Socket Module PCB 114 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ100C Table B 29 MSP TS430PZ100C Bill of Materials Number Pos Ref Des Per Description Digi Key Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 DNP C3 C4 2 C6 C7 2 10uF 6 3V Tantal Size 511 1463 2 ND C5 C11 3 C13 C14 6 100nF SMD0805 311 1245 2 ND C19 C20 C10 C12
143. ents Incorporated 5 INSTRUMENTS www ti com MSP TS430PZ100USB Table B 31 MSP TS430PZ100USB Bill of Materials continued Pos Ref Des No Per Description DigiKey Part No Comment Board 30 C38 1 220n SMD0603 Buerklin 53D2074 31 C39 1 4u7 SMD0603 Buerklin 53D2086 32 C40 1 0 1u SMD0603 Buerklin 53D2068 33 D2 D3 D4 3 LL103A Buerklin 2453406 34 1 TPD4E004 Manu TI 35 LED 0 JP3QE SAM1032 03 ND DNP 36 0 LEDCHIPLED 0603 FARNELL 852 9833 DNP geo 0 470R SMD0603 Buerklin 07 564 DNP 38 R33 1 1k4 1k5 SMD0603 Buerklin 07 612 39 R34 1 27R SMD0603 Buerklin 07E444 40 R35 1 27R SMD0603 Buerklin 07E444 41 R36 1 33k SMD0603 Buerklin 07 740 42 51 52 S3 1 P12225STB ND DNP S1 and S2 Only S3 43 USB1 1 USB_RECEPTACLE FARNELL 117 7885 44 JP11 1 4 pin header male TH SAM1035 04 ND place jumper only on Pin 1 SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 123 Xi TEXAS INSTRUMENTS www ti com MSP TS430PEU128 B 30 MSP TS430PEU128 veci JP4 10UF 6 3V JP5 2 3 4JP7 1196 2 2 2 RST NMLS Ick 3 IMS 3 JP10 119 E 1 lt SBW ToL 4 3 lt 2 GND 10uF 6 3V DNP GND
144. ents Incorporated TEXAS B SLAU278L 2009 Revised December 2012 INSTRUMENTS Hardware This appendix contains information relating to the FET hardware including schematics PCB pictorials and bills of materials All other tools such as the eZ430 series are described in separate product specific user s guides 30 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated TEXAS INSTRUMENTS www ti com Appendix B Topic Page Bal A 32 B2 5 2 24 0 02 35 B 3 5430109255 2 222 2 22 2 2 38 B 4 MSP TS430L092 Active 41 B 5ToNMSP TS430PW24 mau a E ST INED TR EUER saa 44 B 6 5430 0 28 2 2224 47 54 282 224 masan as aa 50 8 MSP TS430PW2 8A n ass asa sasa 53 nar E 56 B 10 MSP T5430QFN23X0 E CENE 59 B 11 MSP TS430RSBA40 un eei 62 B2 MSP TSA30RHA40A RIDERE aa a aR as na NERONI OUEST 65 B 13 MSP TS430DI 48 2 2 68 71 15 MSP TS430RGZ48G 74 16 MSP TS430PM64 77 MSP TS430PM64A 80 5 754308 64 eere 83 19 5230 6 86 20 524308 662405 90 B21 5230 0 94 B22 MSP IS430PNS0A 97 23 MSP TS430PN80USB asa 10
145. er B device RST NMI SBWTDIO pin is used 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper limit for C1 is 2 2 nF when using current TI tools Figure 2 3 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F5xx and MSP430F6xx Devices SLAU278L May 2009 Revised December 2012 24 Design Considerations for In Circuit Programming Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated l TEXAS INSTRUMENTS www ti com External Power 2 2 2 3 External Power The MSP FET430UIF can supply targets with up to 60 mA through pin 2 of the 14 pin connector Please note that the target should not consume more than 60 mA even as a peak current as it may violate the USB specification E g if the target board has a capacitor on VCC more than 10 uF it may cause inrush current during capacitor charging that may exceed 60 mA In this case the current should be limited by the design of the target board or an external power supply should be used The Vec for the target can be selected between 1 8 V and 3 6 V in steps of 0 1 V Alternatively the target can be supplied externally In this case the external voltage should be connected to pin 4 of the 14 pin connector The MSP FET430UIF then adjusts the level of the JTAG signal
146. estions and Known Issues 26 A 1 Hardware 27 A 2 ASI INED r E aA EA 29 B acr ua nna e NO E EEEE N aa 30 B 1 MSP TS430D8 I 32 B 2 MSP IS430PW14 dome tox deoa cease vade vac rev ald isa aka ovx 35 3 5430092 00 38 B 4 54301092 Active Cable n nnns nnn 41 B5 430 24 L UI a aa qa yaw aa cece 44 6 5430 26 C esns 47 BZ IMSP TS4590PW28 uu u a nie E E dE Reese aio EIE ege 50 B8 2 E EG 53 9 MSP IS430DA98 O aE E E uqhari Giaa u 56 10 5430 2 D UE E 59 Bild 5430 5 40 2 62 12 54 2 unu u isa aksa 65 BAS 54 8 Samay 68 14 5430 748
147. et Socket Module PCB Table B 16 MSP TS430RGZ48C Revision History Revision Comments 1 2 Initial release LFOSC pins swapped at SV1 9 10 1 3 HFOSC pins swapped at SV1 6 7 BOOTST pin 4 now directly connected to the device RST SBWTDIO pin SLAU278L May 2009 Revised December 2012 Hardware 75 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430RGZ48C www ti com Table B 17 MSP TS430RGZ48C Bill of Materials Number Pos Ref Des Per Description DigiKey Part Number Comment Board 1 SV1 SV2 SV3 4 12 pin header TH DNP headers and receptacles enclosed with kit 4 Keep vias free of solder SAM1029 12 ND Header Receptacle 1 1 SV1 SV2 SV3 4 12 pin receptable TH DNP headers and receptacles enclosed with kit 4 Keep vias free of solder Header SAM1213 12 ND Receptacle JP1 JP2 JP9 2 pin header male TH SAM1035 02 ND Place jumper on header JP10 JP11 2 pin header male TH SAM1035 02 ND DNP J1 JP3 JP4 JP5 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP6 JP7 JP8 J2 1 3 pin header male TH SAM1035 03 ND JP1 JP2 J1 10 Jumper 15 38 1024 ND Place on JP1 JP2 JP9 J1 JP3 JP4 JP5 JP6 JP3 JP4 JP5 JP7 JP8 JP6 JP7 JP8 7 R2 R3 R5 R6 9 DNP 0805 DNP R8 R9 R10 R11 R14 8 R12
148. g in 4 wire JTAG mode Figure 22 MSP TS430RSB40 Target Socket Module SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated Hardware 63 5 INSTRUMENTS MSP TS430RSB40 www ti com Table B 12 MSP TS430RSB40 Bill of Materials Pos Ref Des MOREL Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP C1 C2 3 10uF 10V SMD 0805 445 1371 1 ND DNP C12 x a 3 100nF SMD0805 311 1245 2 ND DNP C11 4 C5 1 2 2nF SMD0805 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J4 J2 J3 J4 4 10 pin header TH KEEP VOS 066 OSO QEN Header Receptacle DNP headers and receptacles enclosed with kit 71 4 10 pin header TH Keep vias free of solder Header Receptacle JP1 JP4 JP5 sgi 2 8 JPG 7 9 3 pin header male TH SAM1035 03 ND i pt ue 2 JP8 JP9 J5 JP10 9 JP2 JP3 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 JTAG 1 14 pin connector male TH HRP14H ND 11 BOOTST 0 10 pin connector male TH solder QFN 40B 0 4_ LS 1 ENPLAS SOCKET Enplas Micro Crystal MS3V T1R 13 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Place on JP1 JP2 JP3 15 10 Jumper 15 38 1024 ND JP4 JP5 JP6 JP7 JP8 JP9 JP10 16 R1 R7 2 330
149. i 3 1 1817 0 100nF SMD0805 311 1245 2 ND DNP C10 C12 C18 C17 C8 1 2 2nF SMD0805 Buerklin 53 D 292 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND J1 J2 J3 DNP headers and receptacles enclosed 7 J4 4 25 SAM1029 25 ND with kit Keep vias free of solder DNP headers and receptacles enclosed 7A 4 25 pin header TH SAM1213 25 ND with kit Keep vias free of solder 8 J5 J6 2 3 pin header male TH SAM1035 03 ND JP5 JP6 9 Jes dba 6 3 pin header male TH SAM1035 03 ND place jumpers on pins 2 3 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 1 JP4 1 2 pin header male TH SAM1035 02 ND place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND place jumper on pins 1 2 Place on JP1 JP2 JP3 JP4 JP5 JP6 12 10 Jumper 15 38 1024 ND JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 1 10 pin connector male TH HRP10H ND DNP keep vias free of solder 15 Q1 0 Crystal Q1 Keep vias free of solder 16 Q2 1 Crystal DNP Q2 Keep vias free of solder 17 R3 R7 2 330 Ohm SMD0805 541 330ATR ND R1 R2 R4 R6 R8 R9 18 R10 R11 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R12 19 R5 1 47k Ohm SMD0805 541 47000ATR ND 20 U1 1 Socket 1 357 1004 53 Manuf Yamaichi MSP TS430PZ100C 21 PCB 1 79 5 x 99 5 mm Rev 1 0 2 layers 22 Rubber 4 Buerklin 20H1724 apply to corners at bottom side stand off
150. in 80 pin PN packages MSP FET430U80A for MSP430F532x devices in 80 pin PN packages MSP FET430U80USB for MSP430F552x devices with USB peripheral in 80 pin PN packages MSP FET430U1 00 for MSP430F43x MSP430F43x1 MSP430F44x MSP430FG461x and MSP430F47xx devices in 100 pin PZ packages MSP FET430U100A for MSP430F471xx devices in 100 pin PZ packages red PCB MSP FET430U1 00B for MSP430F67xx devices in 100 PZ packages blue PCB MSP FET430U100C for MSP430F643x MSP430F533x devices 100 PZ packages black PCB MSP FET430U5x100 MSP430F54xx A devices and MSP430BT5190 100 pin PZ packages green PCB MSP FET430U100USB for MSP430F663x and MSP430F563x devices 100 PZ packages green PCB MSP FET430U1 28 for MSP430F67xx and MSP430F67xx1 devices in 128 pin PEU packages green PCB FET430F5137RF900 for CC430F513x devices in 48 pin RGZ packages green PCB FET430F6137RF900 for CC430F612x and CC430F613x devices in 64 pin RGC packages green PCB Stand alone target socket modules without debug interface MSP TS430D8 for MSP430G2210 and MSP430G2230 devices in 8 pin D packages green PCB MSP TS430PW14 for MSP430F20xx MSP430G2x01 MSP430G2x11 MSP430G2x21 and MSP430G2x31 devices in 14 pin PW packages green PCB MSP TS430L092 for MSP430FL092 devices 14 pin PW packages green PCB MSP TS430PW24 for MSP430AFE2xx devices in 24 pin PW packages green PCB MSP TS430DW28 f
151. information on which interface method can be used on which device The connections for the FET interface module and the MSP GANG MSP GANG430 or MSP PRGS430 are identical Both the FET interface module and MSP GANG430 can supply Vec to the target board via pin 2 In addition the FET interface module MSP GANG and MSP GANG430 have a Vcc sense feature that if used requires an alternate connection 4 instead of pin 2 The Vcc sense feature senses the local present on the target board that is a battery or other local power supply and adjusts the output signals accordingly If the target board is to be powered by a local Voc then the connection to pin 4 on the JTAG should be made and not the connection to pin 2 This utilizes the feature and prevents any contention that might occur if the local on board Voc were connected to the Vec supplied from the FET interface module MSP GANG or the MSP GANG430 If the Vcc sense feature is not necessary that is if the target board is to be powered from the FET interface module MSP GANG or MSP GANG430 the Voc connection is made to pin 2 on the JTAG header and no connection is made to pin 4 Figure 2 1 and Figure 2 2 show a jumper block that supports both scenarios of supplying Vec to the target board If this flexibility is not required the desired Vec connections may be hard wired eliminating the jumper block Pins 2 and 4 must not be connected simultaneously Note that in 4
152. l power connection 17 Open 16 if R14 GND Jumper J7 LCD connected osp Remove R8 and jumper R9 11 82 R1 DO O O OOOOO OoOO OOO O 54 J4 48 So Jumper J6 cf e Open to disconnect LED 1 51 0644 807 Orient Pin 1 of 95 odg MSP430 device o 90 998 988 096 olo o o Clamshell o o o 12 22 2 So 78 Hardware 32 DO OO OO OO OO OO OOO O0 Figure B 32 MSP TS430PM64 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PM64 Table B 18 MSP TS430PM64 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation 8 SMD0805 Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND DNP C6 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP Headers and receptacles enclosed with 7 J1 J2 J3 J4 0 16 pin header TH kit Keep vias free of solder
153. lace jumpers on pins 1 2 JP10 11 JP1 JP2 2 pin header male SAM1035 02 ND Place jumper on header 12 Jumper 15 38 1024 ND See Pos 10and Pos 11 13 JTAG 1 nm connector male HRP14H ND 14 BOOTST 0 connector male DNP Keep free of solder Micro Crystal MS3V T1R 15 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF Q2 4MHz Buerklin 16 Q2 0 Crystal 78D134 DNP Q2 Keep vias free of solder http www ettinger de Ar 17 2 0 Insulating diskto Q2 t Detailcfm ART_ART NUM 70 08 121 18 R3 R7 2 330 SMD0805 541 330ATR ND R1 R2 R4 R6 19 R8 3 0 Ohm SMD0805 541 000ATR ND DNP R6 R8 R9 R10 R11 R12 R9 R10 R11 R12 20 R5 1 47k O SMD0805 541 47000ATR ND Socket QFN11T048 21 U1 1 008 A101121 RGZ48 Manuf Yamaichi 22 PCB 1 81 x 76 mm 2 layers example 3M Adhesive Approximately 6mm 23 plastic feet 4 width 2mm height A Part No SJ Apply to corners at bottom side 24 MSP430 2 MSP430F5342IRGZ DNP enclosed with kit supplied by TI SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 73 www ti com Xi TEXAS INSTRUMENTS JTAG 15 MSP TS430RGZ48C MSP TS430RGZ48C
154. lications assistance or the design of Buyers products Buyers are responsible for their products and applications using Tl components To minimize the risks associated with Buyers products and applications Buyers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which TI components or services are used Information published by TI regarding third party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for
155. lt d G gt gt gt z o 9 8 a 5 z Figure B 63 EM430F6137RF900 Target board Schematic SLAU278L May 2009 Revised December 2012 Hardware 131 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 LED D1 green connected to P1 0 via JP5 connected to P1 7 INSTRUMENTS EM430F6137RF900 www ti com JTAG connector Jumper JP2 current Close EXT for external supply Jump Close INT for JAG supply External power connector bee 2 12 JP1 a JTAG GND Jumper JP1 2 Close JTAG osition to Open to disconnect LEDs DD in Tm jumper JP5 JP10 aes JTAG mode s position B a ee to Oo Spy Bi Wire mode Push button 52 e m m 2 INSTRUMENTS EM439F6137RF900 Rev 3 2 1 cio C522 Footprint for 32kHz crystal Use 00 resistor for R541 R551 to makeP5 0 P5 1 available on connector port5 RF Crystal Q1 26 MHz Reset button S1 RF Signal SMA R441 L451 L401 L411 A C422 2 421 C381 N C402 L412 L414 C413 414 1 415 L413 C412 Figure 64 EM430F6137RF900 Target board PCB The battery pack that is included with the EM430F6137RF900 kit may be connecte
156. measure current Jumper JP3 Open to disconnect LED LED connected to P1 0 60 Hardware 14 O 0000000 00000002 510 000090 000002 Jet JTAG ext cc int HI c5 H Ka R4 J4 BOOTST 440 ET m v N 35 1 00000000 0 c Ci JF J2 11 15 20 35 TEXAS INSTRUMENTS MSP TS430F23x0 2 2 TEXAS INSTRUMENTS www ti com Connector J5 External power connector Jumper JP1 to ext O Figure B 20 MSP TS430QFN23x0 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430QFN23x0 Table B 11 MSP TS430QFN23x0 Bill of Materials Pos Ref Des No per Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP 2 C3 1 10uF 10V Tantal Size B 511 1463 2 ND 3 C4 1 100nF SMD0805 478 3351 2 ND 4 C5 1 10nF SMD0805 478 1383 2 ND 5 D1 1 green LED SMD0603 475 1056 2 ND DNP headers and receptacles enclosed with 6 J1 J3 0 10 header TH kit Keep vias free of solder S
157. n Ye e e C35 e og D2 e 5833 O e S e eee e RE e Bs ri 9 eee e e cH 235 9 7 o a e c38 See 2 g e s Dos e uu 5 4 OM e 1 2 HE o a e e ei 52 aN e eee bod ee el J e xe Pos 2 01 Lm nci2 51 os 0in z Dir JP2 LED1 a 0000 I g no Qon ynag 16 2166 LEQ3 A Jt gm 9999999999999999 ti Q e 5 SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated MSP TS430RGC64USB Hardware 91 5 INSTRUMENTS MSP TS430RGC64USB www ti com Table B 22 MSP TS430RGC64USB Bill of Materials Pos Ref Des 1 Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 1 1 C3 C4 2 47pF SMD0805 2 C6 C7 2 10uF 6 3V Tantal Size B 511 1463 2 ND 3 Sa i 4 100nF SMD0805 311 1245 2 ND 3 1 C10 C12 0 10uF SMD0805 DNP 10 12 4 C8 1 2 2nF SMD0805 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit 7 J1 J2 J3 J4 4 16 pin header TH Keep vias free of solder SAM1029 16 ND Header SAM1213 16 ND Re
158. n J2 The configuration of R1 and C1 for the RST NMI pin depends on the device family See the respective MSP430 family user s guide for the recommended configuration The TEST pin is available only on MSP430 family members with multiplexed JTAG pins See the device specific data sheet to determine if this pin is available The connection to the JTAG connector RST pin is optional when using 4 wire JTAG communication mode capable only devices and not required for device programming or debugging However this connection is required when using 2 wire JTAG communication mode capable devices in 4 wire JTAG mode When using 2 wire JTAG communication capable devices in 4 wire JTAG mode the upper limit for C1 should not exceed 2 2 nF This applies to both FET interface modules LPT and USB FET Figure 2 1 Signal Connections for 4 Wire JTAG Communication Design Considerations for In Circuit Programming SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Signal Connections for In System Programming and Debugging Vcc 5 J1 see Note sae Fae o J2 see Note R1 47kQ MSP430Fxxx See Note B VCC TOOL VCC TARGET TDO TDI RST NMI SBWTDIO TEST VPP TEST SBWTCK C1 2 2nF 55 AV ss See Note B A local target power supply is used make connecti
159. n PN Eight PCB 1x20 pin headers four male MSP TS430PN80USB QFP ZIF MSP430F552x F551x 2 x MSP430F5529IPN and four female 100 PZ MSP430F43x F43x1 44 Eight 1 25 headers four male MSP TS430PZ100 QFP ZIF FG461x F47xx 2 x MSP430FG4619IPZ and four female 100 PZ Eight 1 25 headers four male MSP TS430PZ100A QFP ZIF MSP430F471xx 2 x MSP430F47197IPZ and four female _ 100 PZ Eight 1 25 headers four male MSP TS430PZ100B QFP ZIF MSP430F67xx 2 x MSP430F6733IPZ and four female 100 PZ MSP430F645x F643x Eight PCB 1x25 pin headers four male MSP TS430PZ100C QFP ZIF F535x F533x 2 x MSP430F6438IPZ and four female MSP430F543x MSP TS430PZ5x100 12 MSP430BT5190 2 x MSP430F5438IPZ UE oa headers four male MSP430SL5438A k 100 PZ MSP430F665x F663x Eight PCB 1x25 pin headers four male MSP TS430PZ100USB QFP ZIF F563x 2 x MSP430F6638IPZ and four female 128 PEU MSP430F677x F676x Four PCB 1x26 pin headers two male MSP TS430PEU128 DR ZIF F674x F677x1 F676x1 2 x MSP430F677911PEU and two female and four PCB 1x38 pin F674x1 headers two male and two female See the device data sheets for device specifications Device errata can be found in the respective device product folder on the web provided as a PDF document Depending on the device errata may also be found in the device bug database at www ti com sc cgi bin b
160. ne 14 conductor cable NOTE This part is obsolete and is not recommended to use in new design 1 3 Kit Contents eZ430 F2013 One QUICK START GUIDE document One eZ430 F2013 development tool including one MSP430F2013 target board 1 4 Kit Contents eZ430 T2012 Three MSP430F2012 based target boards 1 5 Kit Contents eZ430 RF2500 One QUICK START GUIDE document One eZ430 RF2500 CD ROM One eZ430 RF2500 development tool including one 5 430 2274 and CC2500 target board One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 1 06 Kit Contents eZ430 RF2500T One eZ430 RF2500T target board OneAAA battery pack with expansion board batteries included 17 Kit Contents eZ430 RF2500 SEH One MSP430 development tool CD containing documentation and development software One eZ430 RF USB debugging interface Two eZ430 RF2500T wireless target boards One SEH 01 solar energy harvester board OneAAA battery pack with expansion board batteries included 14 Get Started Now SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Kit Contents eZ430 Chronos xxx 1 8 Kit Contents eZ430 Chronos xxx 433 868 915 One QUICK START GUIDE document One ez430 Chronos emulator One screwdriver Two spare screws eZ430 Chronos 433 One 433 MHz eZ430 Chronos watch
161. nector 1x3pin 61300311121 WUERTH 36a JP5 JP10 3 Pin Connector 1x2pin 61300211121 WUERTH 38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH 134 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated X TEXAS INSTRUMENTS EM430F6147RF900 www ti com 33 EM430F6147RF900 zer reat 7 2pF I Cas C414 RF SINGLE 5 1 5pF 5 F AVCC RVCC_1 uninstalled 1210 uF L T T oT Correspondig Layout Revisions w 4 0 U1 direct soldered external VCC DVCC Digital VCC AVCC Analog VCC RVCC RF VCC Port connectors CONI CONS Port Port5 of cc430 CONG DVCC GND Vcore COMO LCDCAP CON7 RFVCC_1 AVCC GND AGND 8 JTAG_BASE JTAG Port CONO DVCC GND AGND Figure B 65 EM430F6147RF900 Target Board Schematic 135 Hardware SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated EM430F6147RF900 Jumper JP9 TPS status Open to measure current jumper JP3 External power connector CON12 Open to disconnect LEDs jumper JP5 JP10 LED D2 red connected to P3 6 via JP10 VCC GND GND JTAG connector LED D1 green
162. nfringement of patents or services described herein REGULATORY COMPLIANCE INFORMATION As noted in the EVM User s Guide and or EVM itself this EVM and or accompanying hardware may or may not be subject to the Federal Communications Commission FCC and Industry Canada IC rules For EVMs not subject to the above rules this evaluation board kit module is intended for use for ENGINEERING DEVELOPMENT DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case the user at his own expense will be required to take whatever measures may be required to correct this interference General Statement for EVMs including a radio User Power Frequency Use Obligations This radio is intended for development professional use only in legally allocated frequency and power limits Any use of radio frequencies and or power availability of this EVM and its development application s must comply with local laws governing radio spectrum allocation and power limits for this evaluation module It is the user s sole responsibility to only operate this r
163. o Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only 1b C3 C4 0 47pF SMD0805 recommendation Check your crystal spec 2 C6 C7 1 10uF 10V Tantal Size B 511 1463 2 ND DNP C6 3 C5 1 100nF SMD0805 478 3351 2 ND 4 C8 1 10nF SMD0805 478 1383 2 ND 5 C9 1 470nF 5 00805 478 1403 2 ND 6 D1 1 yellow LED TH 3mm T1 511 1251 DNP Headers and receptacles enclosed with 7 J1 a J3 0 25 pin header TH kit Keep vias free of solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND 9 J6 J7 2 2 pin header male TH SAM1035 02 ND place jumper on header 10 2 Jumper 15 38 1024 ND Place on J6 J7 11 JTAG 1 14 pin connector male TH HRP14H ND 12 BOOTST 0 10 pin connector male TH Pe Keep Vids iro oi solder Q1 Micro Crystal MS1V 13 Q1 Q2 0 Crystal TAK 32 768kHz C Load DNP Keep vias free of solder 12 5pF 14 R3 1 330 SMD0805 541 330ATR ND R1 R2 R4 15 R8 R9 R10 3 0 O SMD0805 541 000ATR ND DNP R4 R9 R10 R12 R11 R12 16 R5 1 47k SMD0805 541 47000ATR ND Socket 201 1004 008 or 17 U1 1 IC357 1004 53N Manuf Yamaichi 18 PCB 1 82 x 90 mm 2 layers Adhesive u for example 3M Bumpons Apply to corners at bottom 19 Plastic feet 6mm width 2mm height Part No 515109 side DNP enclosed with kit 20 MSP430 2 MSP430FG4619IPZ supplied by Hardware SLAU278L May 2009 Revised December 2012 106 Submit Documentation Feedback Copyright 2009 2012
164. odule PCB 118 Hardware SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ5x100 Table B 30 MSP TS430PZ5x100 Bill of Materials Pos Ref Des never Description DigiKey Part No Comment Board 1 C1 C2 0 12pF SMD0805 DNP DNP Only recommendation Th cae SMD0805 Check your crystal spec 2 C6 C7 2 10uF 10V Tantal Size B 511 1463 2 ND C5 C10 3 C11 C12 4 100nF SMD0805 311 1245 2 ND DNP C12 C14 C13 C14 4 C8 0 2 2nF SMD0805 DNP 5 C9 1 470nF SMD0805 478 1403 2 ND 6 D1 1 green LED SMD0805 67 1553 1 ND DNP headers and receptacles enclosed with kit 7 J1 42 J3 J4 0 25 pin header TH vias fee ot Solder SAM1029 25 ND Header SAM1213 25 ND Receptacle 8 J5 1 3 pin header male TH SAM1035 03 ND JP5 JP6 9 JP7 JP8 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 2 3 JP9 JP10 10 JP1 JP2 2 2 pin header male TH SAM1035 02 ND Place jumper on header 11 JP3 1 3 pin header male TH SAM1035 03 ND Place jumper on pins 1 2 Place on JP1 JP2 JP3 JP5 12 9 Jumper 15 38 1024 ND JP6 JP7 JP8 JP9 JP10 13 JTAG 1 14 pin connector male TH HRP14H ND 14 BOOTST 0 10 pin connector male TH DAP Keep vias Mee ol solder Q1 Micro Crystal MS1V T1K 15 Q1 Q2 0 Crystal 32 768kHz
165. ollowing modifications R7 value is changed to 0 instead of 330 e JTAG pin 8 is connected only to JP5 pin and not to pin 2 e JP5pin2 is connected to pin 97 e BOOTST pin 7 is connected to pin 97 SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated Hardware 125 5 INSTRUMENTS MSP TS430PEU128 www ti com Table B 32 MSP TS430PEU128 Bill of Materials No Per T Pos Ref Des Description DigiKey Part No Comment Board 94x119 4mm 4 layers MSP TS430PEU128 4 layers green solder mask 1 PCB 1 Rev 1 1 D1 1 green LED DIODE0805 516 1434 1 ND JP1 JP2 JP4 3 2 pin header male TH SAM1035 02 ND Place jumper on header 4 JP5 JP6 JP7 JP8 6 3 pin header male TH SAM1035 03 ND Place jumpers on pins 1 2 SBW JP9 JP10 JP11 JP12 JP13 3 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 JP3 1 4 pin header male TH SAM1035 04 ND Place jumpers on pins 1 2 JP1 JP2 JP3 JP4 Jumper WM4592 ND 7 JP5 JP6 JP7 JP8 13 JP9 JP10 JP11 JP12 JP13 R1 R2 R4 R6 R8 5 OR 0805 541 0 0ATR ND R10 R11 2 OR 0805 541 0 0ATR ND DNP 10 1 2 2nF CSMD0805 490 1628 2 ND DNP 11 C13 C14 C16 7 4 7uF 6 3V CSMD0805 587 1302 2 ND C17 C18 C19 C29 12 C11 1 10uF 6 3V CSMD
166. on J1 If power from the debug or programming adapter is used make connection J2 B device RST NMI SBWTDIO pin is used 2 wire mode for bidirectional communication with the device during JTAG access and any capacitance that is attached to this signal may affect the ability to establish a connection with the device The upper limit for C1 is 2 2 nF when using current TI tools C R2 protects the JTAG debug interface signal from the JTAG security fuse blow voltage that is supplied by the TEST VPP pin during the fuse blow process If fuse blow functionality is not needed R2 is not required populate 0 O and do not connect TEST VPP to TEST SBWTCK Figure 2 2 Signal Connections for 2 Wire JTAG Communication Spy Bi Wire Used by MSP430F2xx MSP430G2xx and MSP430F4xx Devices SLAU278L May 2009 Revised December 2012 Design Considerations for In Circuit Programming 23 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS Signal Connections for In System Programming and Debugging www ti com Vcc J1 see Note A Vec AV DV O o J2 see Note a E TI R1 47kQ MSP430Fxxx See Note B VCC TOOL TDO TDI RST NMI SBWTDIO VCC TARGET TCK GND TEST SBWTCK C1 Vss AV ss DVss 2 2 nF See Note B A Make connection J1 if a local target power supply is used or make connection J2 if the target is powered from the debug or programming adapt
167. oncernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement Concernant les EVMs avec antennes d tachables Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l imp dance requise pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur Important Notice for Users of this Product Japan This develo
168. or MSP430F11xx A devices 28 pin DW packages green PCB MSP TS430PW28 for MSP430F11xx A devices in 28 pin PW packages green PCB MSP TS430PW28A for MSP430F20xx and MSP430G2xxx devices in 14 20 and 28 pin PW red PCB MSP TS430DA38 for MSP430F22x2 and MSP430F22x4 devices in 38 pin DA packages green PCB MSP TS430QFN23x0 MSP TS430QFN40 MSP430F23x0 devices 40 RHA packages green PCB MSP TS430RSB40 for MSP430F51x1 MSP430F51x2 devices in 40 pin RSB packages green PCB MSP TS430RHA40A for MSP430FR572x MSP430FR573x devices in 40 RHA packages red PCB MSP TS430DL48 for MSP430F22x2 and MSP430F22x4 devices in 48 pin DL packages green PCB MSP TS430RGZ48B for MSP430F534x devices in 48 pin RGZ packages blue PCB MSP TS430RGZ48C for MSP430FR58xx and MSP430FR59xx devices in 48 RGZ packages black PCB Read This First SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com How to Use This Manual MSP TS430PM64 for MSP430F13x MSP430F14x MSP430F14x1 MSP430F15x MSP430F16x 1 MSP430F23x MSP430F24x MSP430F24xx MSP430F261x MSP430F41x MSP430F42x A MSP430FE42x A MSP430FE42x2 and MSP430FW42x devices 64 pin PM packages green PCB MSP TS430PM64A for MSP430F41 x2 devices 64 pin PM packages red PCB MSP TS430RGC64B for MSP430F530x devices in 6
169. pment kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan you are required by Radio Law of Japan to follow the instructions below with respect to this product 1 Use this product in a shielded room or any other test facility as defined in the notification 173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product or 3 Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shinjuku 6 chome Shinjuku ku Tokyo Japan http www tij co jp ZEATE T 27091 UA LFOUTHAOHBERM TULE lt KBEMHWETNCCHEB lt K EEM 1 AR S C EO lt RUI8ES H28 1735 CEOSHLEREESO MBM CEAR 2 SERIO aF HS FU IEEE 3 EREKTA Lito TEACO TORA Esa COB IU ABI BE BRT
170. re B 47 MSP TS430PZ100 Target Socket Module Schematic SLAU278L May 2009 Revised December 2012 Copyright 2009 2012 Texas Instruments Incorporated Submit Documentation Feedback 5 INSTRUMENTS www ti com MSP TS430PZ100 Jumper J6 Jumper J7 Open to disconnect LED Open to measure current 14 118 6000000 J 00000 000002 LED connected 12 JTAG nag B OTST 15 83 Open 16 if LCD connected Connector J5 5 0000000000000000000000000 75 78 65 6a 55 1 External power connection 9 x Remove 8 and jumper 9 a lol ii mars nce 4 9 gi a o 000000000 92 ES n D c 2 998 9890 o o9 o9 o o o9 o 960 12 o9 o9 o IS 800 di Al Orient Pin 1 of MSP430 device i E ee o e 8 R12 Ri JF z Bp cms S E m 5 ig J1 15 22 25 o000000000000000000000000 Figure B 48 MSP TS430PZ100 Target Socket Module PCB SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated Hardware 105 5 INSTRUMENTS MSP TS430PZ100 www ti com Table B 26 MSP TS430PZ100 Bill of Materials Pos Ref Des No per Description DigiKey Part N
171. s to external Vec automatically Only pin 2 MSP FET430UIF supplies target or pin 4 target is externally supplied must be connected not both at the same time When a target socket module is powered from an external supply the external supply powers the device on the target socket module and any user circuitry connected to the target socket module and the FET interface module continues to be powered from the PC via the parallel port If the externally supplied voltage differs from that of the FET interface module the target socket module must be modified so that the externally supplied voltage is routed to the FET interface module so that it may adjust its output voltage levels accordingly See the target socket module schematics in Appendix B The PC parallel port can source a limited amount of current Because of the ultralow power requirement of the MSP430 a standalone FET does not exceed the available current However if additional circuitry is added to the tool this current limit could be exceeded In this case external power can be supplied to the tool via connections provided on the target socket modules See the schematics and pictorials of the target socket modules in Appendix B to locate the external power connectors Note that the MSP FET430PIF is not recommended for new design Bootstrap Loader BSL The JTAG pins provide access to the flash memory of the MSP430Fxxx devices On some devices these pins are shared with the devi
172. safe handling of the goods Further the user indemnifies TI from all claims arising from the handling or use of the goods Should this evaluation board kit not meet the specifications indicated in the User s Guide the board kit may be returned within 30 days from the date of delivery for a full refund THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES EXPRESSED IMPLIED OR STATUTORY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES Please read the User s Guide and specifically the Warnings and Restrictions notice in the User s Guide prior to handling the product This notice contains important safety information about temperatures and voltages For additional information on TI s environmental and or safety programs please visit www ti com esh or contact No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine process or combination in which such TI products or services might be or are used TI currently deals with a variety of customers for products and therefore our arrangement with the user is not exclusive assumes no liability for applications assistance customer product design software performance or i
173. so installed manually After plug in the USB Debug Interface to USB port of the PC the Hardware Wizard starts automatically and opens the Found New Hardware Wizard window 3 Select Install from a list or specific location Advanced see Figure C 1 Found New Hardware Wizard This wizard helps you install software for MSP FET430UIF TI USB FET Adapter If your hardware came with an installation CD lt gt or floppy disk insert it now What do you want the wizard to do Install the software automatically Recommended ei Click Next to continue lt Back Next gt Cancel Figure C 1 Windows XP Hardware Wizard 148 Haraware Installation Guide SLAU278L May 2009 Revised December 2012 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com Hardware Installation 4 Browse to the folder where the driver information files are located see Figure C 2 For CCS the default folder is c ti ccsv5 ccs_base emulation drivers msp430 USB_CDC c ti ccsv5 ccs_base emulation drivers msp430 USB_FET_XP_XX or c ti ccsv5 ccs_base emulation drivers msp430 USB_eZ RF depending of firmware version of the tool For IAR Embedded Workbench the default folder is Installation Root Embedded Workbench x x 430 drivers TIUSBFETYeZA30 UART or Installation Root gt Embedded Workbench x x 430 drivers lt Win_OS gt Found New
174. sonators have no effect upon the operation of the tool and the CCS debugger or C SPY as any required clocking and timing is derived from the internal DCO and FLL On devices with multiplexed port or JTAG pins to use these pin in their port capability For CCS Run Free in Run pulldown menu at top of Debug View must be selected For C SPY Release JTAG On Go must be selected 10 As an alternative to sharing the JTAG and port pins on low pin count devices consider using an MSP430 device that is a superset of the smaller device A very powerful feature of the 5 430 is that the family members are code and architecturally compatible so code developed on one device for example one without shared JTAG and port pins ports effortlessly to another assuming an equivalent set of peripherals SLAU278L May 2009 Revised December 2012 Frequently Asked Questions and Known Issues 27 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 28 11 TExAS INSTRUMENTS Hardware FAQs www ti com Information memory may not be blank erased to OxFF when the device is delivered from Customers should erase the information memory before its first use Main memory of packaged devices is blank when the device is delivered from TI 12 The device current is higher then expected The device current measurement may not be accurate with the debugger connected to the device For accurate measurement
175. t Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS www ti com MSP TS430PW24 Connector J5 External power connector Jumper JP1 to ext Jumper JP2 Open to measure current 1 9 JP8 JP 6 JP5 1 4 J J2 Jumpers JP4 to JP9 NO a e Close 1 2 to debug in Spy Bi Wire mode e Close 2 3 to debug in 4 wire JTAG mode e e e n Orient Pin 1 of MSP430 device H 24 282 0 65 02 090 e e 1 e D1 LED connected to P1 0 MIELE 49 Texas SH BO Jumper JP3 INSTRUMENTS MSP TS43 PW24 Open to disconnect LED 2 Bev 1 0 Bo Figure 10 MSP TS430PW24 Target Socket Module PCB SLAU278L 2009 Revised December 2012 Hardware 45 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430PW24 www ti com Table B 6 MSP TS430PW24 Bill of Materials Position Ref Des Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP 2 C5 1 2 2nF SMD0805 3 C3 C7 2 10uF 10V SMD0805 4 C4 C6 C8 3 100nF SMD0805 478 3351 2 ND 5 D1 1 green LED SMD0805 P516TR ND 07 DNP Headers and receptacles 6 J1 J2 0 12 pin header TH Co enclosed with kit Keep vias free of
176. the associated component or service and is an unfair and deceptive business practice Tl is not responsible or liable for any such statements Buyer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial actions Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety critical applications In some cases components may be promoted specifically to facilitate safety related applications With such components goal is to help enable customers to design and create their own end product solutions that meet applicable functional safety standards and requirements Nonetheless such components are subject to these terms No TI components are authorized for use in FDA Class Ill or similar life critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use Only those TI components which TI
177. the red LED may flash for approximately two seconds If the self test passes successfully the green LED stays on 4 Use the 14 conductor cable to connect the USB FET interface module to a target board such as an MSP TS430xxx target socket module 5 Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with a circular indentation on the top surface aligns with the 1 mark on the PCB 6 Compared to the parallel port debug interface the USB FET has additional features including JTAG security fuse blow and adjustable target Vec 1 8 V to 3 6 V Supply the module with up to 60 mA Hardware Installation eZ430 XXXX MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 To install 7430 MSP EXP430G2 MSP EXP430FR5739 MSP EXP430F5529 tools follow instructions 1 and 2 of Section 1 16 Hardware Installation MSP FET430Uxx MSP TS430xxx FET430F6137RF900 EM430Fx137RF900 Follow these steps to install the hardware for the MSP FET430Uxx and MSP TS430xxx tools 1 Follow instructions 1 and 2 of Section 1 16 2 Connect the MSP FET430PIF or MSP FET430UIF debug interface to the appropriate port of the PC Use the 14 conductor cable to connect the FET interface module to the supplied target socket module 3 Ensure that the MSP430 device is securely seated in the socket and that its pin 1 indicated with a circular indentation on the top surface aligns with the 1 mark on the PCB 4 Ensure that th
178. ti com medical www ti com security www ti com space avionics defense www ti com video Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2012 Texas Instruments Incorporated
179. uglist cgi Kit Contents EM430Fx1x7RF900 One READ ME FIRST document One legal notice Two target socket module MSP EM430F5137RF900 Two EM430F5137RF900 target socket modules This is the PCB on which is soldered a CC430F5137 device in a 48 pin RGZ package A 2x7 pin male connector is also present on the PCB MSP EM430F6137RF900 Two EM430F6137RF900 target socket modules This is the PCB on which is soldered a CC430F6137 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB MSP EM430F6147RF900 Two EM430F6147RF900 target socket modules This is the PCB on which is soldered a CC430F6147 device in a 64 pin RGC package A 2x7 pin male connector is also present on the PCB Two CC430EM battery packs Four AAA batteries Two 868 or 915 MHz antennas Two 32 768 kHz crystals 18 PCB 2x4 pin headers Hardware Installation MSP FET430PIF Follow these steps to install the hardware for the MSP FET430PIF tools 1 Use the 25 conductor cable to connect the FET interface module to the parallel port of the PC The necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR Embedded Workbench installation Note that a restart is required after the CCS or IAR Embedded Workbench installation for the driver to become active Use the 14 conductor cable to connect the parallel port debug interface module to a target board such as an MSP TS430xxx target socket module Module schemati
180. uments Incorporated 5 INSTRUMENTS www ti com MSP TS430RHA40A Table B 13 MSP TS430RHA40A Bill of Materials Position Ref Des past Description DigiKey Part No Comment 1 C1 C2 0 12pF SMD0805 DNP C1 C2 2 C5 0 2 2nF SMD0805 DNP C12 3 C3 C7 2 10uF 10V SMD0805 5 DNP C11 4 C4 C6 2 100nF SMD0805 478 3351 2 ND 5 C9 1 470nF SMD0805 6 D1 1 green LED SMD0805 P516TR ND DNP headers and receptacles enclosed with kit Keep vias free of 7 usd 4 10 pin header TH 208 Header Receptacle DNP headers and receptacles enclosed with kit Keep vias free of 7 1 4 10 solder Header Receptacle J5 JP1 JP4 JP5 Place jumper on 1 2 of JP4 JP9 8 JP6 JP7 8 3 pin header male TH SAM1035 03 ND Place on 1 2 an JP4 JP8 JP9 9 JP2 JP3 2 pin header male TH SAM1035 02 ND place jumper on header 10 Jumper 15 38 1024 ND see Pos 8 9 11 JTAG 1 TA ii male HRP14H ND 12 BOOTST 0 DNP Keep vias free solder 13 U1 1 Socket QFN 40B 0 5 01 Manuf Enplas Micro Crystal MS3V T1R 14 Q1 0 Crystal 32 768kHz C Load DNP Q1 Keep vias free of solder 12 5pF 15 R1 R7 2 330R SMD0805 541 330ATR ND R2 R3 16 R5 R6 2 0 Ohm 5 00805 541 000ATR ND DNP R2 R3 R5 R6 R8 R9 17 R4 1 47k SMD0805 18 PCB 1 79 x 66 mm 2 layers Rubber select appropriate for 19 stand off 4 example Buerklin apply to corners at bottom side 20H1724 2
181. ur employees affiliates contractors or designees using the EVM Further you are responsible to assure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard 3 You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage injury or death even if the EVM should fail to perform as described or expected 4 You will take care of proper disposal and recycling of the EVM s electronic components and packing materials Certain Instructions It is important to operate this EVM within recommended specifications and environmental considerations per the user guidelines Exceeding the specified EVM ratings including but not limited to input and output voltage current power and environmental ranges may cause property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM User s Guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification pl
182. ure 6 MSP TS430L092 Target Socket Module SLAU278L May 2009 Revised December 2012 Hardware 39 Submit Documentation Feedback Copyright O 2009 2012 Texas Instruments Incorporated 5 INSTRUMENTS MSP TS430L092 www ti com Table B 3 MSP TS430L092 Bill of Materials Pos Ref Des No 1 Description DigiKey Part No Comment 1 C1 C2 2 330nF SMD0603 2 C5 1 100n SMD0603 3 C6 1 10u SMD0805 4 C10 1 100n SMD0603 5 EEPROM1 1 M95512 SO08 SO8 ST Micro M95160R Digikey 497 8688 1 ND DNP headers and receptacles enclosed with kit 7 J1 J2 2 7 pin header TH Keep vias free of solder SAM1213 07 ND Header SAM1035 07 ND Receptacle 8 J3 1 3 pin header male TH SAM1035 03 ND 9 J4 J5 2 FE4L FE4H 4 pol Stiftreihe DNP Keep vias free of solder Reichelt MicroMaTch 11 J13 1 MICRO STECKV 10 Connector MM FL 10G 12 JP1 JP2 JP3 3 2 pin header male TH SAM1035 02 ND place jumper on header 15 L1 1 33uH SMD0806 LQH2MCN330K02L Farnell 151 5557 16 LED1 LED4 2 LEDCHIPLED_0603 Farnell 1686065 17 Q2 1 BC817 16LT1SMD BC817 16LT1SMD SOT23 BEC 18 R6 R7 3 2K7 SMD0603 19 R1 1 1k SMD0603 20 R2 1 47k SMD0603 R4 R5 R8 21 R10 RC RD 6 10k SMD0603 22 RA 1 3 9k SMD0603 23 RB 1 6 8k SMD0603 24 U1 1 ae Socket 1 189 0142 Manuf Yamaichi 22 MSP430 2 MSP430L092PWR eee supplied by TI 40 Hardware SLAU278L May 2009
183. ws XP Hardware Wizard 2 2 1 2 2 5 6 148 C 2 Windows XP Driver Location Selection 149 Device Manager Using USB Debug Interface using VID PID 0 2047 0 0010 150 C 4 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF430 151 C 5 Device Manager Using USB Debug Interface with VID PID 0x0451 0xF432 152 SLAU278L May 2009 Revised December 2012 List of Figures 5 Submit Documentation Feedback Copyright 2009 2012 Texas Instruments Incorporated 6 13 TEXAS INSTRUMENTS www ti com List of Tables 1 1 Flash Emulation Tool FET Features and Device 13 1 2 Individual Kit Contents MSP TS430XxxX assesses 17 1 543008 Bill Of Materials UU UU 34 2 MSP TS430PW14 Bill of 37 3 MSP TS430L092 Bill of Materials 40 4 MSP TS4301 092 Ta RR Pe R 42 B 5 MSP TS430L092 Active Cable Bill of Materials

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