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Philips TDA8566 User's Manual
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1. detail X DIMENSIONS mm are the original dimensions A 1 UNIT mat A2 Ag Aq b p DO 3 5 3 5 0 08 16 0 i 3 2 0 04 15 8 Notes 1 Limits per individual lead 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION JEDEC JEITA PROJECTION SOT418 3 E 03 07 23 ISSUE DATE Fig 10 Package outline SOT418 3 HSOP20 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 13 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier HSOP24 plastic heatsink small outline package 24 leads low stand off height SOT566 3 detail X DIMENSIONS mm are the original dimensions A 1 UNIT mat A2 Ag Aq b p DO 3 5 3 5 0 08 16 0 i 3 2 0 04 15 8 Notes 1 Limits per individual lead 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EURO
2. 200 000e scenes 12 14 Package outline 000 cece ee eee 13 15 Soldering soss eececcnectivee samenen 16 15 1 Introduction to soldering 16 15 2 Wave and reflow soldering 16 15 3 Wave soldering 0 0 eee eee 16 15 4 Reflow soldering 200 17 16 Revision history 00e cece eee 19 17 Legal information 00 eeeeeeee 20 17 1 Data sheet status 2 0 20 17 2 Definitions 0 2 20000 200 eee 20 17 3 Disclaimers ccc 82c0ccec reebare inea 20 17 4 Trademarks 000000 aen 20 18 Contact information 0 0 006 20 19 CONTCMS ao ec eee eee ees wee es 21 Please be aware that important notices concerning this document and the product s described herein have been included in section Legal information founded by NXP B V 2007 All rights reserved For more information please visit http www nxp com For sales office addresses please send an email to salesaddresses nxp com Date of release 15 October 2007 Document identifier TDA8566_6
3. Low thermal resistance TDA8566TH1 is pin compatible with TDA1566TH founded by Philips NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 3 Quick reference data Table 1 Quick reference data Vp 14 4 V Tamb 25 C fi 1 kHz measured in test circuit of Figure 9 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Vp supply voltage 0l 6 144 18 V loRM repetitive peak output 7 5 A current lq quiescent current RL Q 115 180 mA Istb standby current 0 1 10 uA Zi input impedance differential 100 120 150 kQ Po output power R 4 Q9 THD 10 21 25 W RL 2 Q9 THD 10 33 40 W SVRR supply voltage ripple operating 2I 50 60 E dB rejection cs channel separation Po 25 W Rs 10 kQ 45 50 dB CMRR common mode rejection Rs 0 Q BI 60 75 dB ratio Gy closed loop voltage gain 25 26 27 dB Vico noise output voltage operating R 0 Q 4 85 120 uV 1 The circuit is DC adjusted at Vp 6 V to 18 V and AC operating at Vp 8 5 V to 18 V 2 Vrippie Vripple max 2 V p p Rs 0 Q 3 Common mode rejection ratio measured at the output over RL with both inputs tied together Voommon lt 3 5 V RMS fi 100 Hz to 10 KHz Rs 0 Q 4 Noise measured in a bandwidth of 20 Hz to 20 kHz 4 Ordering information Table 2 Ordering information Type number Package Name Description Version TDA8566TH HSOP20 plastic heatsink small outline package 20 lea
4. V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 10 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 Q stereo BTL car radio power amplifier Table 8 Dynamic characteristics continued Vp 14 4 V Tamo 25 C Ry 2Q fi 1 kHz measured in test circuit of Figure 9 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Vo mute Output signal Vin Vin max 1 V RMS 2 mV voltage in mute CMRR common mode Rs 0Q BI 60 75 2 dB rejection ratio R 45 ka 6 40 R dB 1 Dynamic distortion detector active pin CLIP is LOW 2 Frequency response externally fixed 3 Vripple Vripple max 2 V p p Rs 0 Q 4 Noise measured in a bandwidth of 20 Hz to 20 kHz 5 Common mode rejection ratio measured at the output over RL with both inputs tied together Voommon lt 3 5 V RMS fi 100 Hz to 10 KHz Rs 0 Q 6 Common mode rejection ratio measured at the output over R1 with both inputs tied together Veommon lt 3 5 V RMS fi 1 kHz Rg 45 kQ The mismatch of the input coupling capacitors is excluded 12 Application information 12 1 12 2 TDA8566_6 Diagnostic output Special care must be taken in the PCB layout to separate pin CLIP from pins IN1 IN1 IN2 and IN2 to minimize the crosstalk between the CLIP output and the inputs Mode select switch To avoid switch on plops it is advisable to keep the amplifier in the mute
5. heated to the peak temperature and cooling down It is imperative that the peak temperature is high enough for the solder to make reliable solder joints a solder paste characteristic In addition the peak temperature must be low enough that the packages and or boards are not damaged The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9 SnPb eutectic process from J STD 020C Package thickness mm Package reflow temperature C Volume mm lt 350 gt 350 lt 25 235 220 gt 25 220 220 Table 10 Lead free process from J STD 020C Package thickness mm Package reflow temperature C Volume mm lt 350 350 to 2000 gt 2000 lt 1 6 260 260 260 1 6 to 2 5 260 250 245 gt 2 5 250 245 245 Moisture sensitivity precautions as indicated on the packing must be respected at all times Studies have shown that small packages reach higher temperatures during reflow soldering see Figure 13 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 17 of 21 TDA8566 2 x 40 W 2 Q stereo BTL car radio power amplifier NXP Semiconductors maximum peak temperature MSL limit damage level temperature minimum peak temperature minimum soldering temperature peak temperature time 001aac844 MSL Moisture Sensitivity Level F
6. mode during gt 150 ms charging of the input capacitors at pins IN1 IN1 IN2 and IN2 The circuit in Figure 8 slowly ramps up the voltage at the mode select switch pin when switching on and results in fast muting when switching off Vp Pee S 10 kQ 100 Q K mode gt select switch 100 kQ mil mgd102 Fig 8 Mode select switch circuit 2 47 uF NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 11 of 21 NXP Semiconductors TDA8566 13 Test information 2 x 40 W 2 stereo BTL car radio power amplifier Vmone Rg 2 220 nF Vint D Rs 2 220 nF Rs 2 220nF Vin2 D Rs 2 220 nF Fig 9 Stereo BTL test diagram i oe oh 100 2200 pF ot Vp agi ey J 14 4V rh TDA8566 RL1 Vp Vp P gt ai kQ ka CLIP DIAGNOSTIC RL2 mgu359 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 12 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 14 Package outline HSOP20 plastic heatsink small outline package 20 leads low stand off height SOT418 3
7. profile Leaded packages packages with solder balls and leadless packages are all reflow solderable Key characteristics in both wave and reflow soldering are e Board specifications including the board finish solder masks and vias e Package footprints including solder thieves and orientation e The moisture sensitivity level of the packages e Package placement e Inspection and repair e Lead free soldering versus PbSn soldering 15 3 Wave soldering TDA8566_6 Key characteristics in wave soldering are e Process issues such as application of adhesive and flux clinching of leads board transport the solder wave parameters and the time during which components are exposed to the wave e Solder bath specifications including temperature and impurities NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 16 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 15 4 Reflow soldering Key characteristics in reflow soldering are e Lead free versus SnPb soldering note that a lead free reflow process usually leads to higher minimum peak temperatures see Figure 13 than a PbSn process thus reducing the process window e Solder paste printing issues including smearing release and adjusting the process window for a mix of large and small components on one board Reflow temperature profile this profile includes preheat reflow in which the board is
8. 357 Fig 5 Clip detection waveforms Short circuit diagnostic pin DIAG When a short circuit occurs at one or more outputs to ground or to the supply voltage the output stages are switched off until the short circuit is removed and the device is switched on again with a delay of approximately 20 ms after the removal of the short circuit During this short circuit condition pin DIAG is continuously LOW When a short circuit occurs across the load of one or both channels the output stages are switched off for approximately 20 ms After that time the load condition is checked during approximately 50 us to see whether the short circuit is still present Due to this duty cycle of 50 us 20 ms the average current consumption during the short circuit condition is very low approximately 40 mA During this condition pin DIAG is LOW for 20 ms and HIGH for 50 us see Figure 6 The power dissipation in any short circuit condition is very low current in output stage io short circuit over the load VDIAG v t s 50 us mgu360 Fig 6 Short circuit diagnostic timing diagram Temperature pre warning pin DIAG When the virtual junction temperature Tyj reaches 145 C pin DIAG will become continuously LOW Open collector diagnostic outputs Pins DIAG and CLIP are open collector outputs therefore more devices can be tied together Pins DIAG and CLIP can also be tied together An external pull up res
9. D1 n c OUT1 IN1 Vp4 IN1 CLIP SGND 001aag902 Fig 2 Pin configuration TDA8566TH HEATTAB Vp2 n c OUT2 PGND2 OUT2 OUT1 PGND1 OUT1 n c Vp1 CLIP Fig 3 Pin configuration TDA8566TH1 TDA8566TH1 DIAG IN2 IN2 n c n c n c MODE n c n c IN1 IN1 SGND IN1 IN1 SGND CLIP Vp1 OUT1 PGND1 OUT1 n c OUT2 PGND2 OUT2 Vp2 MODE DIAG IN2 IN2 Fig 4 Pin configuration TDA8566Q TDA8566Q 001aah059 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 4 of 21 NXP Semiconductors TDA8566 TDA8566_6 6 2 Pin description 2 x 40 W 2 stereo BTL car radio power amplifier Table 3 Pin description TDA8566TH and TDA8566TH1 Symbol Pin Description TDA8566TH TDA8566TH1 DIAG 1 1 short circuit and temperature pre warning diagnostic output IN2 2 2 channel 2 input positive IN2 3 3 channel 2 input negative n c 4 4 not connected n c 5 5 not connected n c 6 6 not connected n c 7 not connected n c 8 not connected n c 9 not connected IN1 8 10 channel 1 input positive IN1 9 11 channel 1 input negative SGND 10 12 signal ground CLIP 11 13 clip detection output Vp4 12 14 supply voltage 1 n c 15 not connected OUT1 13 16 channel 1 output positive PGND1 14 17 power ground 1 OUT1 15 18 channel 1 output negative n c not connec
10. PEAN VERSION JEDEC JEITA PROJECTION SOT566 3 E 03 07 23 ISSUE DATE Fig 11 Package outline SOT566 3 HSOP24 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 14 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier DBS17P plastic DIL bent SIL power package 17 leads lead length 12 mm SOT243 1 non concave NUUUUUUU view B mounting base side j A2d 4 DIMENSIONS mm are the original dimensions UNIT A A2 bp c DM d Dh 4 6 24 0 1 mn 44 23 6 0 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION JEDEC JEITA PROJECTION SOT243 1 E 03 03 12 ISSUE DATE Fig 12 Package outline SOT243 1 DBS17P TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 15 of 21 NXP Semiconductors TDA8566 15 Soldering 15 1 15 2 2 x 40 W 2 stereo BTL car radio power amplifier This text provides a very brief insight into a complex technology A more in dep
11. TDA8566 2 x 40 W 2 Q stereo BTL car radio power amplifier with differential inputs and diagnostic outputs Rev 06 15 October 2007 Product data sheet 1 General description 2 Features The TDA8566 is an integrated class B output amplifier which is available in several packages TDA8566TH is contained in a 20 lead small outline plastic package The TDA8566TH1 is a 24 lead small outline plastic package which is pin compatible with the I2C bus controlled amplifier TDA1566TH for one board layout TDA8566Q is a 17 pin DiL bent SIL package The device contains 2 amplifiers in a Bridge Tied Load BTL configuration The output power is 2 x 25 W ina 4 Q load or 2 x 40 W in a 2 Q load It has a differential input stage and 2 diagnostic outputs The device is primarily developed for car radio applications Differential inputs Very high Common Mode Rejection Ratio CMRR High common mode input signal handling Requires very few external components High output power 4 Q and 2 Q load driving capability Low offset voltage at output Fixed gain Diagnostic facility distortion short circuit and temperature pre warning Good ripple rejection Mode select switch operating mute and standby Load dump protection Short circuit proof to ground to Vp and across the load Low power dissipation in any short circuit condition Thermally protected Reverse polarity safe Protected against electrostatic discharge No switch on switch off plops
12. consistency or conflict with the short data sheet the full data sheet shall prevail 17 3 Disclaimers General Information in this document is believed to be accurate and reliable However NXP Semiconductors does not give any representations or warranties expressed or implied as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document including without limitation specifications and product descriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors products are not designed authorized or warranted to be suitable for use in medical military aircraft space or life support equipment nor in applications where failure or 18 Contact information malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications that are described herein for any of these products are for illustrative purposes only NXP Semicondu
13. ctors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification Limiting values Stress above one or more limiting values as defined in the Absolute Maximum Ratings System of IEC 60134 may cause permanent damage to the device Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied Exposure to limiting values for extended periods may affect device reliability Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale as published at http www nxp com profile terms including those pertaining to warranty intellectual property rights infringement and limitation of liability unless explicitly otherwise agreed to in writing by NXP Semiconductors In case of any inconsistency or conflict between information in this document and such terms and conditions the latter will prevail No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant conveyance or implication of any license under any copyrights patents or other industrial or intellectual property rights 17 4 Trademarks Notice All referenced brands product names service names and trademarks are the prop
14. ds low stand off height SOT418 3 TDA8566TH1 HSOP24 plastic heatsink small outline package 24 leads low stand off height SOT566 3 TDA8566Q DBS17P plastic DiL bent SIL power package 17 leads lead length 12 mm SOT243 1 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 2 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 Q stereo BTL car radio power amplifier 5 Block diagram IN1 nt gt OUT1 gt OUT1 n c standby MODE switch TDA8566 standby reference voltage mute switch SGND CLIP gt DIAG D mute reference voltage IN2 mute switch Ne gt OUT2 gt OUT2 HEATTAB ITI PGND2 PGND1 mgu358 1 Pin HEATTAB is available in TDA8566TH1 only Fig 1 Block diagram TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 3 of 21 NXP Semiconductors TDA8566 6 Pinning information 6 1 Pinning 2 x 40 W 2 stereo BTL car radio power amplifier MODE DIAG Vp2 IN2 OUT2 IN2 PGND2 n c OUT2 n c OUTI_ TDA8566TH a PGN
15. erature pre warning e Open collector diagnostic outputs e Differential inputs 7 1 Mode select switch pin MODE e Standby low supply current e Mute input signal suppressed e Operating normal on condition Since this pin has a very low input current lt 40 uA a low cost supply switch can be applied To avoid switch on plops it is advisable to keep the amplifier in the mute mode for a period of gt 150 ms charging the input capacitors at pins IN1 IN1 IN2 and IN2 This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Figure 8 7 2 Clip detection pin CLIP When clipping occurs at one or more output stages the dynamic distortion detector becomes active and pin CLIP goes LOW This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion The output level of pin CLIP is independent of the number of channels that are being clipped The clip detection circuit is disabled in a short circuit condition so if a fault condition occurs at the outputs pin CLIP will remain at a HIGH level The clip detection waveforms are illustrated in Figure 5 TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 6 of 21 NXP Semiconductors TDA8566 TDA8566_6 7 3 7 4 7 5 2 x 40 W 2 stereo BTL car radio power amplifier Vo M AAA 0 t s mgu
16. erty of their respective owners For additional information please visit http www nxp com For sales office addresses send an email to salesaddresses nxp com TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 20 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 19 Contents 1 General description 020e0eeee 1 2 Features 2c 2c0s diesen vad oecGuata es 1 3 Quick reference data 2020eeeeee 2 4 Ordering information 0 0006 2 5 Block diagram 00 eee eee eee 3 6 Pinning information 00 00 eens 4 6 1 PINNING aeie Sere aw aca ete wa ead 4 6 2 Pin description 2000 5 7 Functional description 00 0000s 6 7 1 Mode select switch pin MODE 6 7 2 Clip detection pin CLIP 6 7 3 Short circuit diagnostic pin DIAG 7 7 4 Temperature pre warning pin DIAG 7 7 5 Open collector diagnostic outputs 7 7 6 Differential inputs 8 8 Limiting values 0000 ee eee eee 8 9 Thermal characteristics 000005 8 10 Static characteristics 0 0000 9 11 Dynamic characteristics 505 10 12 Application information 4 11 12 1 Diagnostic output 000 11 12 2 Mode select switch 11 13 Test information
17. ig 13 Temperature profiles for large and small components For further information on temperature profiles refer to Application Note AN10365 Surface mount reflow soldering description NXP B V 2007 All rights reserved 18 of 21 TDA8566_6 Product data sheet Rev 06 15 October 2007 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 16 Revision history Table 11 Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8566_6 20071015 Product data sheet TDA8566Q_5 TDA8566TH_2 Modifications e The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors e Legal texts have been adapted to the new company name where appropriate e Section 9 Thermal characteristics changed value of Rthj c to 1 3 K W e Figure 7 values updated e Included TDA8566TH1 and TDA8566Q in the data sheet TDA8566Q_5 20010221 Product specification TDA8566TH_2 20030708 Product specification TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 19 of 21 NXP Semiconductors TDA8566 17 Legal information 17 1 Data sheet status 2 x 40 W 2 Q stereo BTL car radio power amplifier Document status I2 Product status Definition Objective short data sheet Development Preliminary short data sheet Qualification Product short da
18. istor is required NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 7 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 7 6 Differential inputs The input stage is a high impedance fully differential balanced input stage that is also capable of operating in a single ended mode with one of the inputs capacitively coupled to an audio ground It should be noted that if a source resistance is added input voltage dividers the CMRR degrades to lower values 8 Limiting values Table 5 Limiting values In accordance with the Absolute Maximum Rating System IEC 60134 Symbol Parameter Conditions Min Max Unit Vp supply voltage operating 18 V non operating 30 V load dump protection 45 V during 50 ms t 2 2 5 ms losm non repetitive peak output 10 A current lorm repetitive peak output 7 5 A current Tstg storage temperature 55 150 C Ty virtual junction temperature 150 C Tamb ambient temperature 40 85 C Vpsc short circuit safe voltage 18 V Vip reverse polarity voltage 6 0 V Piot total power dissipation 60 W 9 Thermal characteristics Table 6 Thermal characteristics Thermal characteristics in accordance with IEC 60747 1 Symbol Parameter Conditions Typ Unit Rih c thermal resistance from junction to case see Figure 7 1 3 K W Rih a thermal resistance from junction to ambient in free air 40 K W out
19. oduct data sheet Rev 06 15 October 2007 9 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 11 Dynamic characteristics Table 8 Dynamic characteristics Vp 14 4 V Tamb 25 C Ri 2 Q fi 1 kHz measured in test circuit of Figure 9 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Po output power THD 0 5 25 30 W THD 10 33 40 Ww THD 30 45 55 W Vp 13 5 V THD 0 5 25 W Vp 13 5 V THD 10 35 W THD 0 5 RL 4 16 19 WwW THD 10 RL 4Q 21 25 W THD 30 RL 40 28 35 WwW Vp 13 5 V 14 W THD 0 5 RL 4Q Vp 13 5 V THD 10 22 W RL 4Q THD total harmonic Po 1W 0 1 distortion Veup 0 6 V Hi 8 7 o Po 1W RL 42 0 05 B power bandwidth THD 0 5 Po 1 dB E 20to Hz with respect to 25 W 20000 frol low frequency roll 1 dB 2 25 Hz off froh high frequency roll 1 dB 20 s kHz off Gy closed loop voltage 25 26 27 dB gain SVRR supply voltage operating BI 50 60 dB ripple rejection mute 3 50 p dB standby B 80 dB Zi input impedance differential 100 120 150 kQ single ended 50 60 75 kQ IAZ l input impedance 2 mismatch Vaio noise output operating Rs 0 Q 4 85 120 uV voltage operating Rs 10 kQ 4 100 uV mute independent of Rs 4 60 uV Qecs channel separation P 25 W Rs 10 kQ 45 50 dB IAG channel unbalance 1 dB TDA8566_6 NXP B
20. put 1 output 2 virtual junction 2 2 K W 2 2 K W 0 2 K W case 001aaa155 Fig 7 Equivalent thermal resistance network TDA8566_6 NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 8 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier 10 Static characteristics Table 7 Static characteristics Vp 14 4 V Tamb 25 C measured in test circuit of Figure 9 unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Supply Vp supply voltage 0l 6 144 18 V lg quiescent current RL 0Q 115 180 mA Operating condition VmMoDE mode select switch 8 5 Vp V level IMODE mode select switch Vmop_e 14 4 V 15 40 uA current Vo output voltage B 7 0 V Voo output offset voltage 100 mV Mute condition VMODE mode select switch 3 3 6 4 V level Vo output voltage B 7 0 V Voo output offset voltage 60 mV AVoo output offset voltage with respect to 60 mV difference operating condition Standby condition VMODE mode select switch 0 2 V level Istb standby current 0 1 10 uA Diagnostic VpIAG diagnostic output during any fault 0 6 V voltage condition 1 The circuit is DC adjusted at Vp 6 V to 18 V and AC operating at Vp 8 5 V to 18 V 2 At Vp 18 V to 30 V the DC output voltage is lt 0 5Vp TDA8566_6 NXP B V 2007 All rights reserved Pr
21. ta sheet Production This document contains data from the objective specification for product development This document contains data from the preliminary specification This document contains the product specification 1 Please consult the most recently issued document before initiating or completing a design 2 The term short data sheet is explained in section Definitions 3 The product status of device s described in this document may have changed since this document was published and may differ in case of multiple devices The latest product status information is available on the Internet at URL http www nxp com 17 2 Definitions Draft The document is a draft version only The content is still under internal review and subject to formal approval which may result in modifications or additions NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information Short data sheet A short data sheet is an extract from a full data sheet with the same product type number s and title A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information For detailed and full information see the relevant full data sheet which is available on request via the local NXP Semiconductors sales office In case of any in
22. ted OUT2 16 19 channel 2 output positive PGND2 17 20 power ground 2 OUT2 18 21 channel 2 output negative n c 22 not connected Vp2 19 23 supply voltage 2 MODE 20 7 mode select switch input standby mute operating HEATTAB 7 24 connect to ground used for test purposes only Table 4 Pin description TDA8566Q Symbol Pin Description IN1 1 channel 1 input positive IN1 2 channel 1 input negative SGND 3 signal ground CLIP 4 clip detection output Vp1 5 supply voltage 1 OUT1 6 channel 1 output positive PGND1 7 power ground 1 OUT1 8 channel 1 output negative n c 9 not connected NXP B V 2007 All rights reserved Product data sheet Rev 06 15 October 2007 5 of 21 NXP Semiconductors TDA8566 2 x 40 W 2 stereo BTL car radio power amplifier Table 4 Pin description TDA8566Q continued Symbol Pin Description OUT2 10 channel 2 output positive PGND2 11 power ground 2 OUT2 12 channel 2 output negative Vp2 13 supply voltage 2 MODE 14 mode select switch input standby mute operating DIAG 15 short circuit and temperature pre warning diagnostic output IN2 16 channel 2 input positive IN2 17 channel 2 input negative 7 Functional description The TDA8566 contains 2 identical amplifiers and can be used for BTL applications The gain of each amplifier is fixed at 26 dB Special features of this device are e Mode select switch e Clip detection e Short circuit diagnostic e Temp
23. th account of soldering ICs can be found in Application Note AN10365 Surface mount reflow soldering description Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards PCBs to form electrical circuits The soldered joint provides both the mechanical and the electrical connection There is no single soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and Surface Mount Devices SMDs are mixed on one printed wiring board however it is not suitable for fine pitch SMDs Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder The wave soldering process is suitable for the following e Through hole components e Leaded or leadless SMDs which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered Packages with solder balls and some leadless packages which have solder lands underneath the body cannot be wave soldered Also leaded SMDs with leads having a pitch smaller than 0 6 mm cannot be wave soldered due to an increased probability of bridging The reflow soldering process involves applying solder paste to a board followed by component placement and exposure to a temperature
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