Intel Xeon 3.20GHz Processor
Contents
1. 9 g 6260200060 6 8 0 6666660666 6 5 666066606606 6666966066 g 9 6 5 05 5 44 mPGA604 Socket Mechanical Design Guide mPGA604 Socket Mechanical Design Guide Mechanical Drawings 452. egg eoo eg 006660960 9 o g 0 90209989 0098808060 CELEC p 5 p p 9 p amp amp amp 244 1 27 25 ROWS wwredboses un 1 305 050 1 LI fe 59 amd 6 254 1 A 152 10910 gt cu F A SCALE 20 1 INTE t RPOSER B UO TTTTITITTITITITTTTTITTTTTTTTTTI gt gt 40 mPGA604 Socket Mechanical Design Guide In tel 5 Mechanical Drawings Figure 9 7 603 Pin Interposer Assembly Drawing Sheet 3 of 6 lt 1HS SEALANT ET 3 17 19 20 PACKAGE A j x C n f INTERPOSER 2 032 WIP INS 1 DETAIL B MT SCALE 30 1 8 LAYER OLGA WITH 5mm 8 LAYER FCBGA WITH Sr 8 LAYER FCBGA2 WITH 3mm 10 LAYER FCBGA2 WITH ITEM E THS AND POLYMER TIM IHS AND POLYMER HS AND POLYMER TIN IHS AND POLYMER t Uie den 09595 012 8 2 378
3. 13 3 8 Orientation in Packaging Shipping and Handling 13 3 9 Contact Characteristics nn 13 3 9 4 Number of contacts pp 13 3 9 2 Base Material nnne nn nnne 13 3 9 3 Contact Area Plating aa ems 13 3 9 4 Solder Ball Attachment Area Plating 13 3 9 5 Solder Ball Characteristics 13 3 9 6 Lubricants hr ne x a de UR ala EN 13 3 10 Material and Recycling Requirement s 13 3 11 Lever Actuation Requirements pp 14 3 12 Socket Engagement Disengagement 14 3 13 Vis alAids uuu r 14 3 14 Socket BGA Co Planarity aee a aana aana eaaa nana a aana aana aana aana eaaa 14 3 15 Solder Ball True Position n 14 3 16 Crtitical o Function Dimensions 14 4 Electrical Requirements U 17 4 1 Electrical Resistance khaka 18 4 2 Determination of Maximum Electrical Resistance 22 4 3 116 51 11 CO a aa 23 4 3 1 Design Procedure for Inductance Measurements 24 4 3 2 Correlation of Measurement and Model Data Inductance 25 4 4 PIN tO PIN ass amis aaa ada d
4. 44 3 1 Package Critical To Function CTF Dimensions 15 4 1 Electrical Requirements for Sockets Nt 17 4 2 Definitions Sheet 1 of 2 060m KANA NAN KARANA KANGA GAK AKA pa 17 4 3 Resistance Test Fixture Netlist Sheet 1 of 2 21 4 4 Net list for FSETV4 Rev 1 Edge Fingers 26 5 1 Use Conditions Environment Ne 27 mPGA604 Socket Mechanical Design Guide Revision History Revision Pe e Initial release of the document October 2003 e Updated for 2005 Intel Xeon products March 2005 Note Not all revisions may be published mPGA604 Socket Mechanical Design Guide intel Re Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation Intel will review the modification and establish the necessary re validation procedure that the socket must pass Any testing that is required MUST be completed before the change is implemented Typical examples of significant changes include but are not limited to the following plastic material changes including base material or color contact changes including base material plating material or thickness and design modifications For details on validation testing requirements see Section 6 6 mPGA604 So
5. 2X 9 17 2x 6 18 2X 3 23 2X VIA KEEP QUT 2k 5 42 IN X HATCH AREA zx 1 61 c T A i 1 8 1 1 P 18 625 3 556 ALLOWABLE COMPONENT HEIGHT LJ MAX SMT COMPONENT EL y VOLUME ALLOWED E l 13 411 COMPONENT KEEP KEEP OUT M AREA i D N H 14 63 INTERPOSER CUTOUT 80 SHALL ALLOW CLEARANCI FOR PIN SHOULDERCS AND MATI FLUSH WITH THIS SURFACE 1 LL e LA F C 2X 4 344 section C C 1 245 SMT COMPONENT HEIGHT SMT COMPONENT VOLUME ALLOWED MAK SMT COMPONENT VOLUME ALLOWED 0 61 114 63 INTERPOSER CUTOUT 13 411 14 544 KEEP IN section E E mPGA604 Socket 43 Mechanical Design Guide Mechanical Drawings Figure 9 10 603 Pin Interposer Assembly Drawing Sheet 6 of 6 LASER MARK VIA KEEPOUT ZONE Lou fref 83 B sg 5 4 3 4 5 9 9 9 9 S 9 0 9 9 o 9 9 9 5 9 8 9 9 9 9 9 O
6. 9962 15 wt 48010189 5 0140801112 bo RSS 6 5 213 RSS 5 09520_229 RSS nyah 1 082 1 032 8 532 7 122 41 mPGA604 Socket Mechanical Design Guide Mechanical Drawings Figure 9 8 603 Pin Interposer Assembly Drawing OLGA Keepout Sheet 4 of 6 2X 6 18 2k 9 23 24 VIA KEEP DUT 2X 5 42 IN X HATCH AREA BRE 1 61 2X 1 27 F x V 2 9 2 3 92 2X 9 17 825 a e 3 556 ALLOWABLE COMPONENT HEIGHT MAX SMT COMPONENT E E VOLUME ALLOWED 411 2 ili N COMPONENT NEEP IN OMPONENT KEEP OUT x IN X HATCH AREA 1 ENT 14 63 NTERPOSER r LY CUTOUT L SOCKET SHALL ALLOW CLEARANCE 1 FOR PIN SHOULDER S AND MATE 1 Le FLUSH WITH THIS SURFACE 1 9 T r l 2K 3 92 i FA s t LJ C 2X 4 344 section C C F 1 245 MAX SMT COMPONENT HEIGHT MAK SMT COMPONENT VOLUME ALLOWED lt 0 41 14 0 60 14 63 INTERPOSER CUTOUT 13 411 14544 COMPONENT E SCALE KEEP IN TE 42 mPGA604 Socket Mechanical Design Guide In tel Mechanical Drawings Figure 9 9 603 Pin Interposer Assembly Drawing FCBGA2 Keepout Sheet 5 of 6 ra
7. Cover Hole Virtual Condition Pattern Locating Cover Hole Virtual Condition Feature Relating Cover Hole Field Depth wrt Seating Plane Cover Thickness in Hole Area Au Thickness Ni Thickness Alignment Post Virtual Condition Contact Depth from Seating Plane mPGA604 Socket Mechanical Design Guide 15 intel Mechanical Requirements 16 mPGA604 Socket Mechanical Design Guide 4 Electrical Requirements Socket electrical requirements are measured from the socked seating plane of the processor test vehicle PTV to the component side of the socket PCB to which it is attached All specification are maximum values unless otherwise stated for a single socket pin but includes effects of adjacent pins where indicated Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field Mechanical Design Guide Table 4 1 Electrical Requirements for Sockets 1 Mat lloop inductance Loop 4 33 nH Refer to Table 4 2 Item 1 2 Mated partial mutual inductance L Refer to Table 4 2 Item 2a 3 Maximum mutual capacitance C lt 1 pF Refer to Table 4 2 Item 3 4 Maximum Ave Contact Resistance lt 17 mQ Refer to Table 4 2 Item 4 Refer to Section 4 1 for more detail Refer to mPGA603 Socket Design Guidelines for electrical parameters with INT3 packages 5 Measurement frequency s for 400 MHz
8. Pin to Pin Connector to Connector capacitance 6 Measurement frequency s for 1 GHz Pin to Pin Connector to Connector inductance 7 Dielectric Withstand Voltage 360 Volts RMS 8 Insulation Resistance 800 MQ 9 Contact Current Rating Read amp record Table 4 2 Definitions Sheet 1 of 2 1 Mated loop inductance Lloop The inductance calculated for two conductors Refer to Table 4 1 Item 1 considering one forward conductor and one return conductor 2a Mated mutual inductance L The inductance on a conductor due to any Refer to Table 4 1 2 single neighboring conductor 3 Maximum mutual capacitance C The capacitance between two pins connectors Refer to Table 4 1 Item 3 mPGA604 Socket 17 Mel Electrical Requirements Table 4 2 Definitions Sheet 2 of 2 4 1 4 Maximum Average Contact The max average resistance target is originally Resistance Refer to Table 4 1 derived from max resistance of each chain Item 4 minus resistance of shorting bars divided by number of pins in the daisy chain This value has to be satisfied at all time Thus this is the spec valid at End of Line End of Life and etc Socket Contact Resistance The resistance of the socket contact interface resistance to the pin and the entire pin to the point where the pin enters the interposer gaps included 5 Measurement frequency s for Capacitively dominate region This is usually capacitance the lowest measurable frequency This should b
9. alone current source and voltmeter or the circuits of a data acquisition system Measurement accuracy in Q is specified as 0 1 of reading or 0 1 mQ whichever is greater The vendor is responsible for demonstrating that their instrument s can meet this accuracy Automation of the measurements can be implemented by scanning the chains through the edge or cable test connector using a switch matrix The matrix can be operated by hand or through software Measure Ra for each daisy chain of package socket motherboard unit Measure Riumper for each daisy chain of 30 package motherboard units Calculate jumper for each daisy chain There is 30 data for each daisy chain For each socket unit calculate R total 7 R jumper N Rreg is the average contact resistance for socket pin R Reg mPGA604 Socket Mechanical Design Guide Electrical Reguirements Inductance The bottom fixture for the inductance measurement is a ground plane on the secondary side of the motherboard with all pins grounded The component side of the socket PCB does not contain a plane The top fixture is the package which contains pins that will connect to the socket Figure 4 4 shows the inductance measurement fixture cross section and the inductance measurement methodology The first figure shows the entire assembly The second figure shows the assembly without the socket the socket seating plane of the package is directly mounted t
10. components Processors using flip chip pin grid array FC mPGA4 package technology are targeted to be used with the mPGA604 socket The assembled component may consist of a cooling solution heatsink fan and retention mechanism and processor package The processor Thermal Mechanical Design Guidelines document provides information for designing components compliant with the Intel reference design Relevant processor FC mPGA4 package and pin out information is given in the processor Electrical Mechanical and Thermal Specifications document mPGA604 Socket Mechanical Design Guide intel Assembled Component and Package Description i 10 mPGA604 Socket Mechanical Design Guide 3 1 3 2 3 2 1 3 2 2 3 3 3 4 Mechanical Requirements Attachment A retention system needs to isolate any load in excess of 222 41 N compressive from the socket during the shock and vibration conditions outlined in Section 5 The socket must pass the mechanical shock and vibration requirements listed in Section 5 with the associated heatsink and retention mechanism attached Socket can only be attached by the 603 contacts to the motherboard No external i e screw extra solder adhesive methods to attach the socket are acceptable Materials Socket Housing Thermoplastic or equivalent UL 94V 0 flame rating temperature rating and design capable of withstanding a temperature of 240 C for 40sec minimum typical of a reflow profile
11. for solder material used on the socket The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high operating temperature mounted on FR4type motherboard material Color The color of the socket can be optimized to provide the contrast needed for OEM s pick and place vision systems The base and cover of the socket may be different colors as long as they meet the above requirement Cutouts for Package Removal Recessed cutouts are required in the side of the socket to provide better access to the package substrate and facilitate the manual removal of inserted package see Section 9 Socket Standoffs Height Socket stand off height cover lead in and cover lead in depth must not interfere with package pin shoulder at worst case conditions The processor not the pin shoulder must sit flush on the socket standoffs and the pin field cannot contact the standoffs see Section 9 Proper seating mPGA604 Socket 11 Mechanical Design Guide Mechanical Reguirements 3 5 3 5 1 3 5 2 3 5 3 3 6 12 intel Markings All markings required in this section must be able to withstand a temperature of 240 C for 40 seconds minimum typical of a reflow profile for solder material used on the socket as well as any environmental test procedure outlined in Section 5 Name m PGA604 Font type is Helvetica Bold minimum 6 p
12. with the manufacture of units that meet the following environmental reference points The reliability targets in this section are based on the expected field use environment for a desktop product The test sequence for new sockets will be developed using the knowledge based reliability evaluation methodology which is acceleration factor dependent A simplified process flow of this methodology can be seen in Figure 5 1 Figure 5 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the Develop Speculative market expected use stress conditions based on environment for the historical data content technology experts and literature search Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and defermine acceleration factors A detailed description of this methodology can be found at http developer intel com design packtech 245 162 htm The use environment expectations assumed are for desktop processors based on an expected life of 7 years are listed in Table 5 1 The target failure rates are lt 1 at 7 years and lt 3 at 10 years Table 5 1 Use Conditions Environment Speculative Stress Condition 7 Year Life Expectation Temperature Cycle 1500 cycles with a mean AT 40 C THB HAST 62 000 hrs at 30 C 85 RH Power Cycle 7 500 cycles For additional information on mechanical shock and vibration testing condit
13. your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s Web Site Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries Copyright 2003 2005 Intel Corporation All rights reserved Other brands and names may be claimed as the property of others 2 mPGA604 Socket Mechanical Design Guide intel Contents 1 ere E 7 1 1 Gun cc 7 1 2 Purpose pt 7 1 3 SCOPO EN 7 Assembled Component and Package Description 9 Mechanical RequirementS J 11 3 1 Attachment saa ay 11 3 2 aa 11 9 2 1 DICKE HOUS uuu aaa nn aa ga apen aa nanah na 11 S22 CONOR Es 11 3 9 Cutouts for Package Removal sss enm enne 11 3 4 Socket Standoffs Height uuu u KAKA ANAKAN ANG GAR ANG GENEA ANAA BANA KAKA KAKA ANA AA ER BANA 11 3 9 WaS 12 35 Names i ne AEEA 12 3 5 2 Lock Closed and Unlock Open 12 3 5 3 Lot Traceability u uuu EP uter aaa be eoe ahaaa ga anas 12 3 6 Socket SIZe m 12 3 7 Socket Package Translation During Actuation
14. 13 A40 A39 30 12 C4 C16 58 57 A38 A37 31 14 C29 C16 A20 A19 A38 A37 32 12 D5 D16 56 55 A36 A35 33 12 D28 D16 A22 21 A36 A35 34 10 E6 E16 54 A53 A44 A43 35 10 E25 E16 A24 A23 A44 A43 36 14 F9 F23 A80 AT9 A28 27 37 14 W23 F23 A128 A127 A28 A27 38 14 F24 W24 A26 A25 A126 A125 39 14 F25 W24 A2 A1 A126 A125 40 16 E26 Y26 A4 A3 A124 A123 41 16 E27 Y26 A6 A5 A124 A123 mPGA604 Socket 21 Mechanical Design Guide Electrical Reguirements Table 4 3 Resistance Test Fixture Netlist Sheet 2 of 2 DC Endpoints Edgefingers Hi Edgefingers Low Daisy of Chain per chain 42 16 E28 Y28 A8 AT A122 A121 43 10 D29 N29 A10 A9 A34 A33 44 8 AA29 N29 A146 A145 A34 A33 45 10 C30 N30 A12 A11 A32 A31 46 10 AB30 N30 A144 A143 A32 A31 47 12 A31 N31 A16 A15 A30 A29 48 12 AD31 N31 A140 A139 A30 A29 4 2 Determination of Maximum Electrical Resistance This section provides a guideline for the instruments used to take the measurements Note The instrument selection should consider the guidelines in EIA 364 23A l 22 These measurements use a 4 wire technique where the instruments provide two separate circuits One is a precision current source to deliver the test current The other is a precision voltmeter circuit to measure the voltage drop between the desired points These separate circuits can be contained within one instrument such as a high quality micro ohmmeter a stand
15. L OL 7001 LON Y 101438 314v 3015 IN3NH2V11V M3lA 101108 99 SES 8 11130 33 323905 V V NO01123S NOLLISOd 031207 G31vn19V NI NMOHS 3015 NOILY3SNI M3IA 401 11V3S 39WDYd mPGA604 Socket Mechanical Design Guide 36 wings Mechanical Dra Figure 9 3 mPGA604 Socket Drawing Sheet 3 of 4 3125 3NOZ NI d33 131205 LNOAW 834 Q30N3NO23U MIN 19700 4609 t je i 3 Be Pak ame atl BN SUUM ee 90000000 929919 000000000 H 0000000000p000060 06000000000 i 0000000000 1 0000000000 0000000000 9900000000 0000000000 600000000 600000000 900000000 555050055 T77 333333359 000000000 000000000 1 000000000 900000000 1 000000000 000000000 pz F 000000000 T 6606 eso 000000000 000000000 000000000 900000000 000000000 900000000 000000000 000000000 4 900000000 000000000 000000000 5229 0000000000000009000000000000000 1 0000000000000000 000000000000000 2000000000000009000000000000000 000000000000000 000000000000000 000000000000000900000000000000 1 00000000000000000000000000000 1 1 1 L E 1 ess 121 X0 MMOHS SY 131VNIXO
16. NddV Q3NOI1ISOd ONY NaOHS SV 03183180 9NDIIVN 321 81 12 ol xz NIH 0 2 9 INOZ 19 9 3NOZ 66 9 NIN 072 9 INOZ ONIHLIM 301538 150 5313110301 1 NI 37 mPGA604 Socket Mechanical Design Guide intel Mechanical Drawings Figure 9 4 mPGA604 Socket Drawing Sheet 4 of 4 22 25 61 04 el 53 85 25 46 6 16 135 KEEP OUT ZONE WORKING ENVELOPE 38 mPGA604 Socket Mechanical Design Guide In tel 5 Mechanical Drawings Figure 9 5 603 Pin Interposer Assembly Drawing Sheet 1 of 6 PACKAGE mPGA604 Socket 39 Mechanical Design Guide Mechanical Drawings Figure 9 6 603 Pin Interposer Assembly Drawing Sheet 2 of 6 53 34 t 442 5 et tin 2 665 5 UD 21 8 1 i i js KOG 4 INTERPOSER 4 A 65 4 8 138 5 53 142 5 compon 30K 1 27 31 COLUMNS 00986009 Gosceoscooecoos S e p p gt 9 SOHO 66696606966069 6009008000008 P amp o 5 p p 5
17. UTO FANUDNODcPmANUGDNDDDP 4 4 2 4 4 4 4 4 4 4 4 4 4 0 9 8 7 6 5 4 3 2 1 0 e PJ US JS UTOY NI CD 20 mPGA604 Socket Mechanical Design Guide intel 5 Electrical Requirements Table 4 3 Resistance Test Fixture Netlist Sheet 1 of 2 DC Endpoints Edgefingers Hi Edgefingers Low Daisy of Chain per chain 1 14 AE2 AE16 94 9 118 117 2 14 29 16 A136 A135 A118 A117 3 16 AD1 AD16 A92 91 116 117 4 14 AD30 AD16 A138 A137 A116 A117 5 14 AC30 AC16 A96 A95 A114 A117 6 14 AC30 AC16 A142 A141 A114 A113 7 12 AB4 AB16 98 97 112 111 8 14 29 16 A134 A133 A112 A111 9 12 AA5 AA16 A100 A99 A110 A109 10 12 AA28 AA16 A132 A131 A110 A109 11 10 Y6 Y16 A102 A101 A108 A107 12 10 Y25 Y16 A130 A129 A108 A107 13 10 AC1 N1 A90 A89 A46 A45 14 12 B1 N1 A64 A63 A46 A45 15 10 AC2 N2 A88 A87 A48 A47 16 12 B2 N2 A66 A65 A48 A47 17 10 AB3 N3 A86 A85 A50 A49 18 10 C3 N3 A68 A67 A50 A49 19 8 AAA N4 A84 A83 A52 A51 20 10 D4 N4 A70 A69 A52 A51 21 16 E5 Y5 A72 71 120 119 22 14 F6 W7 A74 A73 A104 A103 23 14 F7 W7 A76 A75 A104 A103 24 14 F8 W9 A78 A77 A106 A105 25 12 G9 W9 A82 81 106 105 26 16 1 16 62 A61 A42 A41 27 14 A30 A16 A18 A17 A42 A41 28 14 B3 B16 A60 A59 A40 A39 29 14 B30 B16 A14 A
18. aa ala a an aha a aa a ID aaa a 25 4 5 Dielectric Withstand Voltage uu aasan s aaa nee 25 4 6 Insulation Resistance dd aaa aa 25 4 7 Contact Current Rating ci i iN iA 25 5 Environmental Requirements J 27 5 1 Mixed FlOWING Gas zu iuh a A Bag RE Cub aed gang ganjen 28 mPGA604 Socket 3 Mechanical Design Guide o N Figures Tables 5 2 Solvent ReSIStANGe e e ena eN ed RR Rd 28 5 3 Purabi en ne a a 28 Validation Testing RequirementS u J J nnmnnn 29 6 1 Applicable Documents pp 29 6 2 Testing ESD 29 6 3 29 6 4 Socket Design Verificallonm nm emnes 29 6 5 EEan ae ML 29 6 6 Process Changes srana kanea retiree ME EGE U eee GEN AGAR AGA uu aa 29 6 7 Quality Assurance Requirements pp 30 6 8 Socket Test Plan 0 30 6 8 1 Submission of an mPGA604 Socket for Validation Testing 30 6 9 Mechanical SampleS nn 30 6 10 Socket Validation Notification pp 30 6 11 Production Lot Definition nemen 30 6 12 Socket Validation sssssssssesssseeneeeeene enne nre 30 Safety Requirements 4255 54 45 rrr ise te rao tti naa nawan danane ngan aana naa sassa 31 Documentation Requirements 33 Mechanical uu u u uu adin un adin sabak ad unang aaa dauh ad aa aaa naak ge awa aa adana eaaa 35 4 1 Methodology for Measuring Total Electric
19. al Resistance 18 4 2 Methodology for Measuring Electrical Resistance of the 18 4 3 Electrical Resistance Fixtures Superimposed 19 4 4 Inductance Measurement Fixture 23 4 5 Inductance and Capacitance Fixture pp 23 5 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology 27 9 1 mPGA604 Socket Drawing Sheet 1 of 4 35 9 2 mPGA604 Socket Drawing Sheet 2 of 4 36 9 3 mPGA604 Socket Drawing Sheet of 4 37 9 4 mPGA604 Socket Drawing Sheet 4 of 4 38 9 5 603 Pin Interposer Assembly Drawing Sheet 1 of 6 39 9 6 603 Pin Interposer Assembly Drawing Sheet 2 of 6 40 9 7 603 Pin Interposer Assembly Drawing Sheet of 6 41 9 8 603 Pin Interposer Assembly Drawing OLGA Keepout Sheet 4 of 6 42 9 9 603 Pin Interposer Assembly Drawing FCBGA2 Keepout Sheet 5 of 6 43 9 10 603 Interposer Assembly Drawing Sheet 6 of 6
20. and superimposed The upper figure is the DUT TRACES package The next figure is the baseboard There are 48 daisy chain configurations on resistance test board The bottom figure is the two parts superimposed Table 4 3 shows these configurations with the number of pins per each chain and netlist Figure 4 3 Electrical Resistance Fixtures Superimposed oooNonfrmuncnoNonsmuunoc 1010 4444 4440 9 006990009606009006090060609606 LO 9 CO GO G 9 GOGO 09 G0 60 6060 606000606070 4 jan am sss ss s osos s arikat I 1 DI nin nadak ee gt 00606 6358980085 111111 1900909000 02844903 5606900000 2 890642 zt 199030 92844663 1118 28012 DLL sll li woe 14 9 090000009090000060 6 a 900900000009000009600009090 od 0220909025009092009000200996 i o 0 0 90 0 0 0 0 0 0 9 0 9 0 0 0 0 0 0 0 2 0 0 0 MM NUNN MUH 19 Mechanical Design Guide mPGA604 Socket Electrical Reguirements PCB TRACES am am am am am a Pe p PO PU EX UN 0 DUT TRACES PCB TRACES STARTS 48 MIDDLES 25 COR ENDS e PJ OUS UT OY NJ OD p ie e gt pa ka gt TO T
21. asurement and Model Data Inductance To correlate the measurement and model data for loop inductance one unit of measured socket assembly socket and shorted test fixture and one unit of measured sandwich shorted test fixture will be chosen for cross sectioning Both units will be modeled based on data from cross sectioning using Ansoft 3D The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data This procedure results in loop inductance for socket contact This final result can be compared with the loop inductance from the supplier model for the socket If there is any difference between them it will be called the de embedded correction factor Adding the test board to the socket and then eliminating the contribution of the fixture creates this correction factor because inductance is not linear Pin to Pin Capacitance Pin to pin capacitance shall be measured using configuration 4 with the motherboard not connected and only the measurements with the package mounted on the socket will be taken Capture data at frequency specified in item 5 of Table 4 1 Dielectric Withstand Voltage No disruptive discharge or leakage greater than 0 5 mA is allowed when subjected to 360 V RMS The sockets shall be tested according to EIA 364 Test Procedure 20A Method 1 The sockets shall be tested unmounted and unmated Barometric pressure shall be equivalent to Sea Level The sample size is 25 contact to c
22. cket Mechanical Design Guide 1 1 1 2 1 3 mPGA604 Socket Introduction Objective This document defines a surface mount Zero Insertion Force ZIF socket intended for workstation and server platforms based on Intel microprocessors The socket provides I O power and ground contacts The socket contains 604 contacts arrayed about a cavity in the center of the socket with solder balls surface mount features for surface mounting with the motherboard The mPGA604 Socket contacts have 1 27mm pitch with regular pin array to mate with a 604 pin processor package A 604 pin package will be mated with a 603 solder ball socket The dummy pin is a key that allows either the 603 pin processor package or the 604 pin processor package to be used in the same socket Purpose To define functional quality reliability and material that is visual dimensional and physical requirements and design guidelines of the mPGA604 Socket in order to provide low cost low risk robust high volume manufacturable HVM socket solution available from multiple sources Scope This design guideline applies to all 604 pin ZIF sockets purchased to the requirements of this design guideline Mechanical Design Guide intel Introduction 8 mPGA604 Socket Mechanical Design Guide 2 Assembled Component and Package Description The mPGA604 socket dimensions and characteristics must be compatible with that of the processor package and related assembly
23. e determined from the measurements done for the feasibility 6 Measurement frequency s for Linear region This is usually found at higher inductance frequency ranges This should be determined from the measurements done for the feasibility Electrical Resistance Figure 4 land Figure 4 2 show the proposed methodology for measuring the final electrical resistance The methodology requires measuring interposer flush mounted directly to the motherboard fixtures so that the pin shoulder is flush with the motherboard to get the averaged jumper resistance Rjumper The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture The same measurements are then made with a package fixture mounted on a supplier s socket and both are mounted on a motherboard fixture this provides the Rrotal The resistance requirement can be calculated for each chain as will be explained later Figure 4 1 Methodology for Measuring Total Electrical Resistance Interposer Socket Contact Shorting Bar Interposer Shoulder Interposer Pin V N SV 1 Motherboard Figure 4 2 Methodology for Measuring Electrical Resistance of the Jumper 18 Interposer Shorting Bar Interposer Shoulder WK M I Motherboard mPGA604 Socket Mechanical Design Guide Electrical Reguirements Figure 4 3 shows the resistance test fixtures separately
24. e probes using the appropriate torque wrench to ensure consistent data collection every time the measurement is performed 2 Set VNA a Bandwidth 300KHz 3GHz with 801 points b Averaging Factor 16 3 Perform Open Short Load Calibration a Calibration should be performed at the start of any measurement session b Create Calibration Kit if necessary for 1 time c Do not perform port extension after calibration 4 Check to ensure calibration successfully performed 5 Measure the inductance of the socket mounted to the motherboard fixture by probing the locations on the PGA Adapter and socket assembly a Call this L socket assembly b Export data into MDS ADS or capture data at frequency specified in item 6 of Table 4 1 6 Measure the inductance of the PGA Adapter by probing on the pads Call this L sandwich a Measure 30 units The test board for 30 units must be chosen from different lots Use 5 different lots 6 units from each lot c Export data into MDS ADS or capture data at frequency specified in item 6 of Table 4 1 d Calculate e For each socket unit calculate L L L sandwich socket socket assembly It means Lanes will be subtracted from each L and the result will be socket assembly compared with spec value for each individual socket unit 24 mPGA604 Socket Mechanical Design Guide 4 4 4 5 4 6 4 7 Electrical Requirements Correlation of Me
25. es including base material plating material or thickness and design modifications Quality Assurance Requirements The OEM s will work with the socket supplier s they choose to ensure socket quality Socket Test Plan Submission of an mPGA604 Socket for Validation Testing The socket supplier s mPGA604 socket will be sent to Intel s independent test facility for socket validation testing The sockets submitted must be per the drawing required in Section 6 4 Refer to Section 6 11 and 6 12 for production lot definition and number of samples required for validation testing Mechanical Samples A mechanical sample of mPGA604 Socket package and heat sink or suitable mockups that approximate size and mass of the planned heat sink will be used during the mated socket validation testing The maximum mass for mPGA604 Socket package heat sink is recommended as but not limited to 450g with the stipulation that the requirements of Section 3 1 be met See data sheet and related documentation for further information on heat sinks thermal solutions and mechanical support Socket Validation Notification Upon completion of the testing and receipt of test data Intel and or the Intel designated test facility will prepare a summary report for the socket supplier and Intel that will provide notification as to whether the socket has passed or failed socket validation testing Production Lot Definition A production lot is defined as a separate
26. f the socket mPGA604 Socket 13 Mechanical Design Guide intel Mechanical Requirements 3 11 3 12 3 13 3 14 3 15 3 16 14 CFCs and HFCs shall not be used in manufacturing the socket It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines Lever Actuation Requirements e Lever closed direction right e Actuation direction called out in Section 9 e 135 lever travel max e Pivot point in the center of the actuation area on the top of the socket Section 9 Socket Engagement Disengagement Force The force on the actuation lever arm must not exceed 44N to engage or disengage the package into the mPGA604 socket Movement of the cover is limited to the plane parallel to the motherboard The processor package must not be utilized in the actuation of the socket Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Table R2 7 Maximum Grip Forces Visual Aids The socket top will have markings identifying Pin 1 This marking will be represented by a clearly visible triangular symbol see Section 9 Socket BGA Co Planarity The co planarity profile requirement for all solder balls on the underside of the socket is located in Section 9 Solder Ball True Position The solder ball pattern has a true position requirement with respec
27. he mPGA604 Socket and actuation area must fit within the keep in zone defined in Section 9 mPGA604 Socket Mechanical Design Guide Mechanical Reguirements 3 7 Socket Package Translation During Actuation The socket shall be built so that the post actuated package pin field displacement will not exceed 1 27 mm Movement will be along the Y direction No Z axis travel lift out of the package is allowed during actuation 3 8 Orientation in Packaging Shipping and Handling Packaging media needs to support high volume manufacturing 3 9 Contact Characteristics 3 9 1 Number of contacts Total number of contacts 603 Total number of contact holes 604 3 9 2 Base Material High strength copper alloy 3 9 3 Contact Area Plating 0 762 hm min gold plating over 1 27 um min nickel underplate in critical contact areas area on socket contacts where processor pins will mate is required No contamination by solder in the contact area is allowed during solder reflow 3 9 4 Solder Ball Attachment Area Plating 3 81 hm min Tin Lead typically 85 5Sn Pb balance 3 9 5 Solder Ball Characteristics Tin Lead 63 37 0 5 Sn 3 9 6 Lubricants For the final assembled product no lubricant is permitted on the socket contacts If lubricants are used elsewhere within the socket assembly these lubricants must not be able to migrate to the socket contacts 3 10 Material and Recycling Requirements Cadmium shall not be used in the painting or plating o
28. ill also be at the expense of the supplier Socket Design Verification At the earliest possible date a detailed drawing of the socket supplier s mPGA604 Socket must be provided to Intel for review This drawing should include all of the features called out in this design guideline marking pinout cam location date code location and explanation etc as well as dimensional and board layout information This drawing will be used to confirm compliance to this design guideline Reporting Test reports of the socket validation testing will be provided directly from the independent test facility to Intel Intel will also be given access to contact the test facility directly to obtain socket validation status explanation of test results and recommendations based on the test results Process Changes Any significant change to the Socket will require submission of a detailed explanation of the change at least 60 days prior to the planned implementation Intel will review the modification and establish the necessary re validation procedure that the socket must pass Any testing that is required MUST be completed before the change is implemented mPGA604 Socket 29 Mechanical Design Guide intel Validation Testing Requirements 6 7 6 8 6 8 1 6 9 6 10 6 11 6 12 30 Typical examples of significant changes include but are not limited to the following Plastic material changes including base material or color contact chang
29. intel mPGA604 Socket Mechanical Design Guide March 2005 Document Number 254239 002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT Intel products are not intended for use in medical life saving life sustaining applications Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The mPGA604 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing
30. ions refer to the Thermal Mechanical Design Guidelines mPGA604 Socket 27 Mechanical Design Guide intel Environmental Requirements 5 1 Mixed Flowing Gas Test will be defined in a future revision of this document 5 2 Solvent Resistance Requirement No damage to ink markings if applicable EIA 364 11A 5 3 Durability Use per EIA 364 test procedure 09 Measure contact resistance when mated in 1st and 30th cycles The package should be removed at the end of each de actuation cycle and reinserted into the socket The socket s pick and place cover must be able to be inserted and removed from the socket at least 30 times 28 mPGA604 Socket Mechanical Design Guide 6 1 Note 6 2 6 3 6 4 6 5 6 6 Validation Testing Requirements This section of the document outlines the tests that must be successfully completed in order for the supplier s socket to pass the design guidelines validations It provides the test plan and procedure required for validation Applicable Documents e EIA 364 C e Applicable processor Datasheet e Applicable processor Thermal Design Guidelines Documents For details on ordering this document contact your Intel field sales representative Testing Facility Testing will be performed by Intel s designated test facility Funding Socket supplier will fund socket validation testing for their socket Any additional testing that is required due to design modifications w
31. lowing documentation e Multi Line Coupled SPICE models for socket e Product design guidelines incorporating the requirements of these design guidelines e Recommended board layout guidelines for the socket consistent with low cost high volume printed circuit board technology The test facility shall provide Intel and the supplier with the following document e Validation Testing and Test Report supporting successful compliance with these design guidelines mPGA604 Socket 33 Mechanical Design Guide Documentation Requirements 34 mPGA604 Socket Mechanical Design Guide 9 Mechanical Drawings These drawings refer to the mPGA604 socket Note Intel reserves the right to make changes and modifications to the design as necessary Note Figures may not be to scale Figure 9 1 mPGA604 Socket Drawing Sheet 1 of 4 NOTES 1 THE PURPOSE OF THIS DRAWING IS TO ESTABLISH THE WHICH MAY VARY FROM SUPPLIER TO SUPPLIER A MATERI AL BASE HIGH TEMPERATURE THERMOPLASTIC UL94V 0 COVER HIGH TEMPERATURE THERMOPLASTIC UL94V 0 CONTACT COPPER ALLOY LN rius cr DIMENSIONS PER INTEL SOCKET DESIGN GUIDE NO CONDUCTING MATERIAL TO BE EXPOSED ON PACKAGE SEATING PLANE SURFACE EXCEPT IN DESIGNATED CAM INCLUSION ZONE mPGA604 Socket Mechanical Design Guide 35 Figure 9 2 mPGA604 Socket Drawing Sheet 2 of 4 Mechanical Drawings 1 02 3w55 1 a ATNO M3IASH Y04 V 1IY1i0 9NIWYHQ SIH
32. o the component side of the socket PCB This is used to calibrate out the fixture contribution The materials for the fixture must match the materials used in the processor Note the probe pad features exist on the topside of the top fixture and the shorting plane exists only on the bottom side of the bottom fixture Figure 4 5 presents the inductance and capacitance fixture design Figure 4 4 Inductance Measurement Fixture Cross Section Probing Pads Surface 40 mils K Interposer P No Features or Plane on this Layer Socket Interposer Pin No Plane on this Layer Motherboard Short all L pins using a solid plane Full Plane on this Layer No Features or n d Plane on this Layer Interposer Shoulder Interposer Short all L pins using a solid plane Motherboard Figure 4 5 Inductance and Capacitance Fixture mPGA604 Socket 23 Mechanical Design Guide intel Electrical Requirements 4 3 1 Design Procedure for Inductance Measurements The measurement equipment required to perform the validation is e Equipment HP8753D Vector Network Analyzer or equivalent e Robust Probe Station GTL4040 or equivalent e Probes GS1250 amp GSG1250 Air Co Planar or equivalent e Calibration Cascade Calibration Substrates or equivalent e Measurement objects Sockets Motherboards Measurement Steps 1 Equipment Setup a Cables should be connected to the network analyzer and to th
33. oint This mark shall be molded or Laser Marked into the processor side of the socket housing Manufacturer s insignia font size at supplier s discretion This mark will be molded or laser marked into the socket housing Both marks must be visible when first seated in the motherboard Any request for variation from this marking requires a written description detailing size and location to be provided to Intel for approval Lock Closed and Unlock Open Markings The universal symbols for Lock and Unlock are to be marked on the socket in the appropriate positions Clear indicator marks must be located on the actuation mechanism that identifies the lock closed and unlock open positions of the cover as well as the actuation direction These marks should still be visible after a package is inserted into the socket Lock closed Unlock open Lot Traceability Each socket will be marked with a lot identification code that will allow traceability of all components date of manufacture year and week and assembly location The mark must be placed on a surface that is visible when mounted on a printed circuit board In addition this identification code must be marked on the exterior of the box in which the units ship Socket Size The socket size must meet the dimensions as shown in Section 9 allowing full insertion of the pins in the socket without interference between the socket and the pin field T
34. ontact pairs on each of 4 sockets The contacts shall be randomly chosen Insulation Resistance The Insulation Resistance shall be greater than 800 M Ohm when subjected to 500 V DC The sockets shall be tested according to EIA 364 Test Procedure 21 The sockets shall be tested unmated and unmounted The sample size is 25 contact to contact pairs on each of 4 sockets The contacts shall be randomly chosen Contact Current Rating Measure and record the temperature rise when the socket is subjected to rated current of 0 8A The sockets shall be tested according to EIA 364 Test Procedure 70A Test Method 1 The sockets shall be mounted on a test board and mated with a package so those 370 pins are connected in series The recommended Test board is the FSETV4 Rev 1 and the recommended package is FSETV5 Rev 1 The wiring list is shown below Mount the thermocouple as near to contact N3 or N 7 as possible Short the daisy chains by means of the edge fingers if possible Sample size is one socket mPGA604 Socket 25 Mechanical Design Guide Electrical Reguirements 26 Table 4 4 Net list for FSETV4 Rev 1 Edge Fingers Edge Fingers I 61 Jumpers A145 A85 A89 A45 A17 A135 A141 A59 A57 A129 A133 AT A5 A87 A95 A15 A13 A139 A143 49 47 131 137 1 101 99 A11 A9 mPGA604 Socket Mechanical Design Guide Environmental Requirements Design including materials shall be consistent
35. process run through the major operations including modeling contact stamping contact plating and assembly These lots should be produced on separate shifts or days of the week Lot identification marking needs to be provided to Intel as verification of this process Socket Validation Socket validation must meet or exceed all guidelines called out in this spec which include Visual Inspection CTF Dimensional Verification Electrical Resistance Loop Inductance Pin to Pin Capacitance Contact Current Rating Dielectric Withstand Voltage Insulation Durability Porosity Plating Thickness Solvent Resistance If Applicable Solderability Applicable for leaded sockets Post Reliability Visual and use conditions The use conditions target failure rates are lt 1 at 7 years and lt 3 at 10 years Statistical sample sizes taken randomly from multiple lots for each test is required mPGA604 Socket Mechanical Design Guide 7 Safety Reguirements Design including materials shall be consistent with the manufacture of units that meet the following safety standards e UL 1950 most current editions e CSA 950 most current edition e EN60 950 most current edition and amendments e IEC60 950 most current edition and amendments mPGA604 Socket Mechanical Design Guide 31 Safety Reguirements 32 mPGA604 Socket Mechanical Design Guide intel 8 Documentation Requirements The socket supplier shall provide Intel with the fol
36. t to Datum A B and C see Section 9 Critical to Function Dimensions The mPGA604 socket shall accept a 604 pin processor pin field All dimensions are metric Asymmetric features are designed to properly align the socket to the motherboard and prevent the socket from being assembled incorrectly to the motherboard Critical to function CTF dimensions are identified in Table 3 1 The CTF values are detailed on the mPGA604 socket drawing in Section 9 and take precedence over all values presented in this document Dimensional requirements identified in the drawing and in Table 3 1 must be met These dimensions will be verified as part of the validation process Also supplier will provide and mPGA604 Socket Mechanical Design Guide Mel Table 3 1 Mechanical Requirements maintain Critical Process Parameters controlling these CTFs or will provide direct measurements to meet ongoing quality requirements Package Critical To Function CTF Dimensions Dimension Socket Length Socket Width Socket Height Interposer surface from MB Assembled Seating Plane Flatness Ball Diameter True Position of Balls pattern relating Co planarity profile of Balls Actuation Distance Cover Travel Through Cavity X Through Cavity Y Cover Hole Diameter Must guarantee ZIF Cover Hole Countersink Depth Must guarantee ZIF Cover Hole Countersink Diameter Must guarantee ZIF
Download Pdf Manuals
Related Search