Kingston Technology HyperX 256MB DDR2 533MHz
Contents
1. min 70 000ns max red Single Power Supply of 1 8V 4 1V Power 0 864 W operating ULRating 94 V 0 cd Operating Temperature 0 C to 55 C cd Storage Temperature 55 C to 125 C Document No 4804020 001 A00 08 11 04 Page 1 Kingston Technology MODULE DIMENSIONS Units Millimeters 133 35 131 35 128 95 63 00 Ee 55 00 E 2 7 1 270 0 10 7 p 3 00 5 00 e 4 00 4 00 moe Am J 3 80 i i I 0 20 Hi a gt ae 4 00 1 50 0 10 t 00 5 Detail A Detail B 0 80 0 05 gt 2 50 0 20 For more information go to www kingston com All Kingston products are tested to meet our published specifications Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings Kingston does not recommend that any user attempt to run their computers faster than the published speed Overclocking or modifying your system timing may result in damage to computer components Document No 4804020 001 A00 Page 22. Memory Module Specification KHX4300D2 256 256MB 32M x 64 Bit PC2 4300 CL3 240 Pin DIMM DESCRIPTION This document describes Kingston s 32M x 64 bit 256MB DDR2 533 CL3 SDRAM Synchronous DRAM memory module based on four 32M x 16 bit DDR2 FBGA components This module has been tested to run at DDR2 533MHz at low latency timing of 3 3 3 10 at 1 85V The SPD is programmed to JEDEC standard latency timing of 4 4 4 12 at 1 8V This 240 pin DIMM uses gold contact fingers and requires 1 8V The electrical and mechanical specifications are as follows FEATURES Power supply Vdd 1 8V 0 1V Vddq 1 8V 0 1V Y Double data rate architecture two data transfers per clock cycle W Bidirectional data strobe DQS Differential clock inputs CK and CK MM DLL aligns DQ and DQS transition with CK transition red Programmable Read latency 3 clock Burst Length 4 8 Interleave nibble sequential 4 Programmable Burst type sequential amp interleave Timing Reference 3 3 3 10 at 1 85V 4 Edge aligned data output center aligned data input Auto amp Self refresh 7 8us refresh interval 8K 64ms refresh MM Serial presence detect with EEPROM 4 High Performance Heat Spreader PCB Height 1 180 30 00mm single sided component PERFORMANCE Clock Cycle Time tCK CL 3 Sns min 8ns max Y Row Cycle Time tRC 60ns min Refresh to Active Refresh Command Time tRFC 105ns Row Active Time tRAS 45ns
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