RKT102***MH User`s Manual
Contents
1. 382 7500 Far lt 1 gt 408 382 7501 Renesas Technology Europe Limited Dukes Meadow Millboard Road Bourne End Buckinghamshire SL8 5FH U K Tel lt 44 gt 1628 585 100 Fax lt 44 gt 1628 585 900 Renesas Technology Shanghai Co Ltd Unit 204 205 AZIAC enter No 1233 Lujiazui Ring Rd Pudong District Shanghai China 200120 Tel lt 86 gt 21 5877 1818 Fax lt 86 gt 21 6887 7898 Renesas Technology Hong Kong Ltd 7th Floor North Tower World Finance Centre Harbour City 1 Canton Road Tsimshatsui Kowloon Hong Kong Tel lt 852 gt 2265 6688 Fax lt 852 gt 2730 6071 Renesas Technology Taiwan Co Ltd 10th Floor No 99 Fushing North Road Taipei Taiwan Tel lt 886 gt 2 2715 2888 Fax lt 886 gt 2 2713 2999 Renesas Technology Singapore Pte Ltd 1 Harbour Front Avenue 06 10 Keppel Bay Tower Singapore 098632 Tel lt 65 gt 6213 0200 Fax lt 65 gt 6278 8001 Renesas Technology Korea Co Ltd Kukje Center Bldg 18th FI 191 2 ka Hangang ro Yongsan ku Seoul 140 702 Korea Tel lt 82 gt 2 796 3115 Fax lt 82 gt 2 796 2145 Renesas Technology Malaysia Sdn Bhd Unit 906 Block B Menara Amcorp Amcorp Trade Centre No 18 J alan Persiaran Barat 46050 Petaling J aya Selangor Darul Ehsan Malaysia Tel lt 603 gt 7955 9390 Fax lt 603 gt 7955 9510 Colophon 6 0 RKT102 MH User s Manual rCENESAS Renesas Electronics Corporation 1753 Shimonumabe Nakahara ku Kaw2. P0007 0100 Section3 Mounting 3 1 Reference Conditions of Mounting Major conditions of mounting are as follows Item Reference Condition Tape rupture strength 265 N mm Transportation method Roller Cutting method Cutting style Stress on inlet Antenna section Stress which does not deform Chip mounting section 8 Nor less Heat tolerance temp is Less than 118 C 5 Curvature tolerance 10 mm or more Notes 1 Rated rupture strength of PEN 2 Please consider selecting a cutting tool which does not cut the antenna section 3 Condition obtained by the stress test method of Figure 1 4 Condition is glass transition temp of the base film Actual tolerable temperature during mounting depends on duration and stress imposed in mounting Please set conditions after sufficient examination 5 Condition obtained by the curving test method of Figure 2 Energy load on chip mounting section with 20 mm m 611 mm steel ball Sample chip i Acrylic board Figure 1 Stress Test on Inlet Rev 1 00 Feb 23 2007 page 4of5 REJ11P0007 0100 RENESAS Sample Cylinder YA i 0 5 Jos N Load application period 100 s Figure 2 Curving Test 3 2 Measures Against Mechanical Stress 1 Deformation and disconnection of wires of the antenna Since the antenna module is thin wires may be disconnected due to curving breaking or distortion during mounting of the inlet or after the product is on the mark
3. To our customers Old Company Name in Catalogs and Other Documents On April 1 2010 NEC Electronics Corporation merged with Renesas Technology Corporation and Renesas Electronics Corporation took over all the business of both companies Therefore although the old company name remains in this document it is a valid Renesas Electronics document We appreciate your understanding Renesas Electronics website http www renesas com April 1 2010 Renesas Electronics Corporation Issued by Renesas Electronics Corporation http www renesas com Send any inquiries to http www renesas com inquiry 2CENESAS 10 11 12 Notice All information included in this document is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas Electronics products listed herein please confirm the latest product information with a Renesas Electronics sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website Renesas Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document No license express implied or otherwise is granted he
4. as Electronics does not warrant that such information is error free Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein Renesas Electronics products are classified according to the following three quality grades Standard High Quality and Specific The recommended applications for each Renesas Electronics product depends on the product s quality grade as indicated below You must check the quality grade of each Renesas Electronics product before using it in a particular application You may not use any Renesas Electronics product for any application categorized as Specific without the prior written consent of Renesas Electronics Further you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics The quality grade of each Renesas Electronics product is Standard unless otherwise expressly specified in a Renesas Electronics data sheets or data books etc Standard Computers office equip
5. asaki shi Kanagawa 211 8668 Japan REJ11P0007 0100
6. asures so that Renesas products may not be easily detached from your products Renesas shall have no liability for damages arising out of such detachment This document may not be reproduced or duplicated in any form in whole or in part without prior written approval from Renesas Please contact a Renesas sales office if you have any questions regarding the information contained in this document Renesas semiconductor products or if you have any other inquiries Rev 1 00 Feb 23 2007 pagei of 5 REJ11P0007 0100 RENESAS Contents Section 1 Structure of COA Type u Chip Inlet Section 2 Relhability Reference oerinoar a EE ade ence ees ee Section 3 Mounting 3 1 Reference Conditions of Mountings asic hee RU ee A ali i 3 2 Measures Against Mechanical Stress Note is a ROM code Note u Chip and the p Chip Logo are either registered Trademarks or Trademarks of Hitachi Ltd in Japan and in other countries Rev 1 00 Feb 23 2007 page ii of 5 REJ11P0007 0100 RENESAS Section 1 Structure of COA Type u Chip Inlet The u chips COA type inlet each of which consists of an antenna and chip are aligned and mounted on tape as shown in the figure below Note The chip mounting section is punched through if the chip is defective COA Chip on AL Note Please refer to the data sheet Document No REJO3P0007 0100 70 0 0 6 All dimensions mm 54 0 0 25 Antenna Recognition mark g square type Recognition mar
7. destruction or for the purpose of any other military use When exporting the products or technology described herein you should follow the applicable export control laws and regulations and procedures required by such laws and regulations All information included in this document such as product data diagrams charts programs algorithms and application circuit examples is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas products listed in this document please confirm the latest product information with a Renesas sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website http www renesas com Renesas has used reasonable care in compiling the information included in this document but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document When using or otherwise relying on the information in this document you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application Renesas makes no representations warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of
8. et When considering the method of mounting eliminate any method that does not provide sufficient reliability Cracks in the chip mounting section If the inlet is mounted on the product with the aid of a presser roller etc mechanical stress is concentrated on the chip mounting section and this may create cracks in the resin or the chip Therefore please design the method of mounting to avoid impact stress by for example creating a slight depression in the part of the press or roller that makes contact with the chip mounting section During the design process please verify that mechanical stress will not be applied to the chip mounting section after the product goes on the market and is sold Rev 1 00 Feb 23 2007 page 5of5 REJ11P0007 0100 RENESAS RKT102 MH User s Manual Publication Date Rev 1 00 February 23 2007 Published by Sales Strategic Planning Div Renesas Technology Corp Edited by Customer Support Department Global Strategic Communication Div Renesas Solutions Corp 2007 Renesas Technology Corp All rights reserved Printed in J apan Renesas Tech nology Corp Sales Strategic Planning Div Nippon Bldg 2 6 2 Ohte machi Chiyoda ku Tokyo 100 0004 J apan RENESAS SALES OFFICES EN ESAS http www renesas com Refer to http www renesas com en network for the latest and detailed information Renesas Technology America Inc 450 Holger Way San Jose CA 95134 1368 U S A Tel lt 1 gt 408
9. k dh cross type a u a ae 29 0 Section A 1 54 0 25 Note Dimensional tolerance is 0 2 mm unless otherwise specified Rev 1 00 Feb 23 2007 page 1 of 5 REJ11P0007 0100 RENESAS Details for Section A Chip mounting section Area of sealant coverage is less than 61 5 mm Punched hole for defective part 62 0 mm Typ deformations that require punching twice or more are passed over Cross section of B B 0 25 mm Max No Item Specification 1 Base film 25 um polyethylene naphthalate PEN 2 Adhesive Urethane resin 3 Antenna 20 um aluminum foil 4 Sealant Epoxy resin Note Typical thickness values Rev 1 00 Feb 23 2007 page 2 of 5 REJ11P0007 0100 RENESAS Section 2 Reliability Reference The major reliability data on the COA type u Chip inlet are given below For the official documentation please contact your nearest Renesas sales office Item Test Conditions Criterion Result High temp storage test 125 C 800 h 0 66 Temp cycle test 45 C to 125 C 10m 700 cycle 0 72 X ray tolerance test X ray tube voltage 120 kV ih 0 30 X ray tube current 250 mA 1 m equivalent to 150 Gy Ultraviolet ray tolerance test Wavelength 254 nm 10m 0 30 Power density of irradiation 0 378 Ws mm Salt water dip test 5 NaCl 24h 0 15 Salt water spray test 35 C 5 NaCl 24h 0 45 IPA dip test Isopropanorl 10m 0 15 Rev 1 00 Feb 23 2007 page 3 of 5 RENESAS REJ11
10. ment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots High Quality Transportation equipment automobiles trains ships etc traffic control systems anti disaster systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems medical equipment or systems for life support e g artificial life support devices or systems surgical implantations or healthcare intervention e g excision etc and any other applications or purposes that pose a direct threat to human life You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges Although Renesas Electronics endeavors to improve the quality and reliability of its products semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain
11. nd all damages arising out of such applications You should use the products described herein within the range specified by Renesas especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges Although Renesas endeavors to improve the quality and reliability of its products IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions Please be sure to implement safety measures to guard against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other applicable measures Among others since the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed the risk of accident such as swallowing by infants and small children is very high You should implement safety me
12. oducts or if you have any other inquiries Note 1 Renesas Electronics as used in this document means Renesas Electronics Corporation and also includes its majority owned subsidiaries Note 2 Renesas Electronics product s means any product developed or manufactured by or for Renesas Electronics ENESAS D CD o lt A S v RKT102 MH Precautions and Notes in Connection with Mounting COA Type u Chip Inlet R El i enesas Electronics Rev 1 00 2007 02 www renesas com 10 T 12 13 Notes regarding these materials This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document including but not limited to product data diagrams charts programs algorithms and application circuit examples You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
13. reby under any patents copyrights or other intellectual property rights of Renesas Electronics or others You should not alter modify copy or otherwise misappropriate any Renesas Electronics product whether in whole or in part Descriptions of circuits software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples You are fully responsible for the incorporation of these circuits software and information in the design of your equipment Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits software or information When exporting the products or technology described in this document you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military including but not limited to the development of weapons of mass destruction Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture use or sale is prohibited under any applicable domestic or foreign laws or regulations Renesas Electronics has used reasonable care in preparing the information included in this document but Renes
14. the application and use of the information in this document or Renesas products With the exception of products specified by Renesas as suitable for automobile applications Renesas products are not designed manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems or equipment or systems for transportation and traffic healthcare combustion control aerospace and aeronautics nuclear power or undersea communication transmission If you are considering the use of our products for such purposes please contact a Renesas sales office beforehand Renesas shall have no liability for damages arising out of the uses set forth above Notwithstanding the preceding paragraph you should not use Renesas products for the purposes listed below 1 artificial life support devices or systems 2 surgical implantations 3 healthcare intervention e g excision administration of medication etc 4 any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp its affiliated companies and their officers directors and employees against any a
15. use conditions Further Renesas Electronics products are not subject to radiation resistance design Please be sure to implement safety measures to guard them against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas Electronics product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other appropriate measures Because the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances including without limitation the EU RoHS Directive Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations This document may not be reproduced or duplicated in any form in whole or in part without prior written consent of Renesas Electronics Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics pr
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