IE-703114-MC-EM1 UM - Renesas Electronics
Contents
1. NQPACK100RB Target system 52 User s Manual U16533EJ1VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION C 1 Usage 1 When mounting NQPACK100SD or NQPACK100RB on target system lt 1 gt lt 2 gt lt 3 gt lt 4 gt Coat the tip of the four projections points at the bottom of the NQPACK100SD or NQPACK100RB with two component type epoxy adhesive cure time longer than 30 min and bond the NQPACK100SD or NQPACK100RB to the target system If not bonded properly the pad of the printed circuit board may peel off when the emulator is removed from the target system If the leads of the NQPACK100SD is not can be easily aligned with the pads of the target system perform step lt 2 gt to adjust the position To adjust the position insert the guide pins for position adjustment NQGUIDE provided with the NQPACK100SD or NQPACK100RB into the pin holes on the upper side of NQPACK100SD or NQPACK100RB refer to Figure C 1 The diameter of a hole is 1 0 mm There are three non through holes refer to APPENDIX A DIMENSIONS After setting the HQPACK100SD or HQPACK100RB solder the NQPACK100SD or HQPACK100RB to the target system By following this sequence adherence of fl2. H Target am Target TITI system system lt 14 gt g system system Target system Remark 1 lt 1 gt Personal computer PC 9800 series PC AT or compatible lt 2 gt Debugger sold separately device He lt 3 gt PC interface board IE 70000 PCI IF A IE 70000 CD IF A Sold separately lt 4 gt PC interface cable included with IE V850E MC lt 5 gt _In circuit emulator IE V850E MC Sold separately lt 6 gt _In circuit emulator option board IE 703114 MC EM1 lt 7 gt External logic probe included lt 8 gt Extension probe SC 100SDN Sold separately lt 9 gt Connector for GC package emulator connection YQPACK100SD Included lt 10 gt Connector for GC package target connection NQPACK100SD Included lt 11 gt GC package device mount cover HQPACK100SD Included lt 12 gt GF package conversion adapter NEXB 2R100SD RB Sold separately 14 User s Manual U16533EJ1VOUM CHAPTER 1 OVERVIEW lt 13 gt lt 14 gt lt 15 gt lt 16 gt lt 17 gt lt 18 gt Connector for GF package emulator connection YQPACK100RB Included with NEXB 2R100SD RB Connector for GC package target connection NQPACK100RB Included with NEXB 2R100SD RB GF package device mount cover HQPACK100RB Included with NEXB 2R100SD RB Power adapter IE 70000 MC PS B So
3. c Connecting part IE 703114 MC EM1 e d z kel Fe D kel Di gt 2 x bel o st a 2 O O Users Manual U16533EJ1VOUM 18 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS This chapter describes the names functions and switch settings of components comprising the IE 703114 MC EMA For the details of the pod jumper and switch positions etc refer to the IE V850E MC IE V850E MC A User s Manual U14487E 2 1 Component Names and Functions of IE 703114 MC EM1 Figure 2 1 IE 703114 MC EM1 a Top view b Bottom view Direction of pin 1 of the connector for target connection Connector for target connection Serial No Connector for IE V850E MC connection Version LWA OW VELEOL Al XX LION XXXXXXXXX TON Emulation memory User s Manual U16533EJ1VOUM 19 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 1 Test pins TP1 to TP6 To leave the DMA cycle in the tracer or to set a break connect these pins to the external logic probe e TP1 GND e TP2 Test pin for product shipment test e TP3 DMAAKO e TP4 DMAAK1 e TP5 DMAAK2 e TP6 DMAAK3 2 SW1 This is a switch for clock mode switching for details refer to 2 2 Clock Settings 3 JP1 This is a jumper for switching the clock supply source for detai
4. GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GC 14 x 14 GC 14 x 14 GF 14 x 20 GC 14 x 14 GC 14 x 14 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 ASTB GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 WAIT GC 14 x 14 GF 14 x 20 34 GC 14 x 14 GF 14 x 20 Users Manual U16533EJ1VOUM CLKOUT GC 14 x 14 GC 14 x 14 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Figure 5 3 Pin Equivalent Circuit 3 Vops 33 KQ Emulation CPU RESET uPD703191 Table 5 3 Corresponding Pins Pin Equivalent Circuit 3 GC 14 x 14 GF 14 x 20 Figure 5 4 Pin Equivalent Circuit 4 AVsso AVss1 Vss Vsss CVss GND Table 5 4 Corresponding Pins Pin Equivalent Circuit 4 Pin Name 1 Pin Name 2 Package GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20
5. GF 14 x 20 CH ANI15 GC 14 x 14 Ko GF 14 x 20 ANI16 GC 14 x 14 GF 14 x 20 ANI17 GC 14 x 14 GF 14 x 20 RVoo GC 14 x 14 GF 14 x 20 REGOUT GC 14 x 14 GF 14 x 20 SIO GC 14 x 14 GF 14 x 20 SO0 GC 14 x 14 GF 14 x 20 SCKO GC 14 x 14 GF 14 x 20 RXDO GC 14 x 14 GF 14 x 20 Users Manual U16533EJ1VOUM 37 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Table 5 6 Corresponding Pins Pin Equivalent Circuit 6 2 3 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Package P31 GC 14 x 14 GF 14 x 20 si RXD1 GC 14 x 14 GF 14 x 20 SO1 TXD1 GC 14 x 14 GF 14 x 20 SCK1 ASCK1 GC 14 x 14 GF 14 x 20 TI2 INTP20 GC 14 x 14 GF 14 x 20 TO21 INTP21 GC 14 x 14 GF 14 x 20 TO22 INTP22 GC 14 x 14 GF 14 x 20 TO23 INTP23 GC 14 x 14 GF 14 x 20 TO24 INTP24 GC 14 x 14 GF 14 x 20 TCLR2 INTP25 GC 14 x 14 GF 14 x 20 TI3 INTP30 GC 14 x 14 GF 14 x 20 TO3 INTP31 GC 14 x 14 GF 14 x 20 TIUD10 TO10 GC 14 x 14 GF 14 x 20 TCUD10 INTP100 GC 14 x 14 GF 14 x 20 TCLR10 INTP101 GC 14 x 14 GF 14 x 20 NMI POO GC 14 x 14 GF 14 x 20 ESOO INTPO GC 14 x 14 GF 14 x 20 ESO1 INTP1 GC 14 x 14 GF 14 x 20 ADTRGO INTP2 GC 14 x 14 GF 14 x 20 ADTRG1 INTP3 GC 14 x 14 GF 14 x 20 INTP4 TO3OFF GC
6. Eh Te EH A lorena 4 Ee 10 9 13 3 15 7 18 1 Side view 0 25 X 0 3 en Bottom view 44 Users Manual U16533EJ1VOUM APPENDIX A DIMENSIONS 5 HQPACK100SD Unit mm Top view 16 6 0 5 X 24 12 0 5 8 Side view Bottom view Users Manual U16533EJ1VOUM 45 APPENDIX A DIMENSIONS 6 NEXB 2R100SD RB Unit mm Top view Side view Bottom view CH 46 Users Manual U16533EJ1VOUM APPENDIX A DIMENSIONS 7 NQPACK100RB Unit mm Top view 21 75 0 65 x 19 12 35 18 85 0 65 x 29 Side view Bottom view To To l D HDDDRRODDDERDDDDERDDDDHDODDDEE To G GR AAAAAAAAAAAAAARAAAAA Opn 4 2 0 A projection height 1 8 mm Users Manual U16533EJ1VOUM 47 APPENDIX A DIMENSIONS 8 YQPACK100RB Unit mm Top view 23 75 17 4 8 0 65 x 19 12 35 0 65 x 29 18 85 Fo Side vi
7. esse 8 ec OO OO OO Eee Ooo0o00000000 00 000 0 OO 0 0 0 00O 0 0 0 0 0 0 0 0 0 OO OO 0 0 0 OO 0 0 0 0 0 0 OO O 0 0 0 OO O 0 0 0 O 0 0 0 OO O 0 0 0 OO O OOOO MONS 0 0 0 OO 0 0 OO 0 0 0 0 OO 0 0 OO 0 0 0 OO 0 0 0 OO 0 0 OO 0 0 OO 0 0 0 010 Ge Ge Ge Ge Ge Ge Ge Ge Ge Ge x Ge Ge Ge E O oO 0O00000000000000000 A1 pin position Insertion guide IE V850E MC insertion area
8. 14 x 14 GF 14 x 20 TO000 GC 14 x 14 GF 14 x 20 Users Manual U16533EJ1VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Table 5 6 Corresponding Pins Pin Equivalent Circuit 6 3 3 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Package GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 Users Manual U16533EJ1VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Figure 5 7 Pin Equivalent Circuit 7 a When using an external clock 74HC157 x1 gt uPD70F3114 33 kQ b When using an internal clock X1 OPEN 33 kQ Table 5 7 Corresponding Pins Pin Equivalent Circuit 7 GC 14 x 14 GF 14 x 20 Figure 5 8 Pin Equivalent Circuit 8 a When selecting PLL via SW1 CKSEL uPD70F3114 33 gd b When selecting DIRECT via SW1 5V 33 kQ CKSEL uPD70F3114 Table 5 8 Corresponding Pins Pin Equivalent Circuit 8 GC 14 x 14 GF 14 x 20 40 Users Manua
9. appear in this document e NEC Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products No license express implied or otherwise is granted under any patents copyrights or other intellectual property rights of NEC Electronics or others e Descriptions of circuits software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples The incorporation of these circuits software and information in the design of a customer s equipment shall be done under the full responsibility of the customer NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits software and information e While NEC Electronics endeavors to enhance the quality reliability and safety of NEC Electronics products customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely To minimize risks of damage to property or injury including death to persons arising from defects in NEC Electronics products customers must incorporate sufficient safety measures in their design such as redundancy fire containment and anti failure features e NEC Electronics products are c
10. GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 Users Manual U16533EJ1VOUM 35 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Figure 5 5 Pin Equivalent Circuit 5 MODEO MODE1 REGIN X2 OPEN Table 5 5 Corresponding Pins Pin Equivalent Circuit 5 Pin Name 1 Pin Name 2 Package GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GC 14 x 20 Figure 5 6 Pin Equivalent Circuit 6 uPD70F3114 Remark For the corresponding pin names refer to Table 5 6 Users Manual U16533EJ1VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Pin Name 1 AVopo Table 5 6 Corresponding Pins Pin Equivalent Circuit 6 1 3 Pin Name 2 Pin Name 3 Pin Name 4 Package GC 14 x 14 GF 14 x 20 ANIOO GC 14 x 14 GF 14 x 20 ANIO1 GC 14 x 14 GF 14 x 20 ANIO2 GC 14 x 14 GF 14 x 20 ANIO3 GC 14 x 14 GF 14 x 20 ANIO4 GC 14 x 14 GF 14 x 20 ANIO5 GC 14 x 14 GF 14 x 20 AVop GC 14 x 14 GF 14 x 20 ANI10 GC 14 x 14 GF 14 x 20 ANI11 GC 14 x 14 GF 14 x 20 ANI12 GC 14 x 14 GF 14 x 20 ANI13 GC 14 x 14 GF 14 x 20 ANI14 GC 14 x 14 O OINIOIDINI oO om RI AINI w r
11. Specifications of IE 703114 MC EM1 When Connected to IE V850E MC Parameter Specification Emulation memory capacity Internal ROM 128 KB External memory 4MB Execution pass detection coverage Targeting internal ROM 128 KB Program execution function Real time execution Go Execution from cursor position Automatic Go Execution function up to cursor position Restart Return out Non real time execution Step in Next over Slow motion function Break function Event detection break software break forcible break break by Come function break when condition is satisfied during step execution fail safe break Trace function Trace conditions All trace section trace qualify trace Memory capacity 168 bit x 32 K frames Other functions Mapping function event function snapshot function stub function register manipulation function memory manipulation function time measurement function real time RAM sampling function Caution Some of the functions may not be supported depending on the debugger used Users Manual U16533EJ1VOUM 13 CHAPTER 1 OVERVIEW 1 4 System Configuration The system configuration when connecting the IE 703114 MC EM1 to the IE V850E MC which is then connected to a personal computer PC 9800 series PC AT or compatibles is shown below Figure 1 1 System Configuration
12. manuals Product Name Document Number IE V850E MC IE V850E MC A In Circuit Emulator U14487E IE 703114 MC EM1 In Circuit Emulator Option Board This manual V850E IA2 Hardware U15195E V850 Series Development Tools Tutorial Guide U14218E CA850 Ver 2 50 or Later C Compiler Package Operation U16053E C Language U16054E PM plus U16055E Assembly Language U16042E ID850 Ver 2 50 Integrated Debugger Operation To be prepared SM850 Ver 2 50 System Simulator Operation To be prepared SM850 Ver 2 00 or Later System Simulator External Part User Open Interface U14873E Specifications RX850 Ver 3 13 or Later Real Time OS Basics U13430E Installation U13410E Technical U13431E RX850 Pro Ver 3 13 Real Time OS Basics U13773E Installation U13774E Technical U13772E RD850 Ver 3 01 Task Debugger U13737E RD850 Pro Ver 3 01 Task Debugger U13916E AZ850 Ver 3 10 System Performance Analyzer U14410E V850 Series Development Tools Tutorial Guide U16544E Supporting 32 Bit OS Windows Based Application Note 6 User s Manual U16533EJ1VOUM CONTENTS CHAPTER 1 OVERVIEW ne EES 10 1 1 Hardware Configuration seen 11 1 2 Hardware Specifications When Connected to IE V850E MG annae ae enen enenanen enne eennen 12 1 3 System Specifications of IE 703114 MC EM1 When Connected to IE V850E MC 13 1 4 Syste
13. memory refer to 2 5 1 Wait setting for emulation memory Users Manual U16533EJ1VOUM 29 CHAPTER 3 FACTORY SETTINGS Setting Remark Settings other than those shown here are prohibited Setting that detects the power supply on the target board and switches automatically whether the emulator operates on Voo from the target system or on the emulator s internal power supply DIRECT Set to PLL mode Crystal oscillator OSC1 30 4 000 MHz crystal oscillator is mounted The frequency can be changed by changing the crystal resonator Users Manual U16533EJ1VOUM CHAPTER 4 CAUTIONS 4 1 Cautions Related to Pin Termination The following shows the pins that need special processing in the emulator For the detailed circuit configuration refer to CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT 1 Pins that cannot be emulated The following pins are left open in the emulator so they cannot be emulated Evaluate them by using the target device Table 4 1 Pins That Cannot Be Emulated Pin Name 1 Pin Name 2 Package GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GC 14 x 14 2 RESET pin The RESET pin is connected pulled up to Voo via a 33 KQ resistor 3 X1 pin When using an external clock the X1 pin is p
14. or NQPACK100RB to the target system cover it with the HQPACK100SD or HQPACK100RB for protection against splashing flux Recommended soldering conditions Reflow 240 C 20 seconds max Partial heating 240 C 10 seconds max per pin row Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK100SD or NQPACK100RB Moreover when covering with the HQPACK100SD or HQPACK100RB check that the hold pins of the HQPACK100SD or HQPACK100RB are not broken or bent before mounting the HQPACK100SD or HQPACK100RB If there are broken or bent pins fix them with a thin flat plate such as a blade When securing the YQPACK100SD or YQPACK100RB connector for emulator connection or HQPACK100SD or HQPACK100RB to the NQPACK100SD or NQPACK100RB with screws tighten the four screws temporarily with the screwdriver provided or a driver with a torque gauge then tighten the screws in a crisscross pattern with 0 054 N m max torque Excessive tightening of only one screw may diminish conductivity If the conductivity is diminished after screw tightening stop tightening remove the screws and make sure the NQPACK100SD or NQPACK100RB is clean and the device pins are parallel flat Device pins are not strong Repeatedly connecting to the NQPACK100SD or NQPACK100RB may cause pins to bend When mounting a device on NQPACK100SD or NQPACK100RB check and adjust bent pins Users Manual U16533EJ1VOUM 55 APPENDIX D MOUN
15. 0 1 register setting However 1 wait when set to 0 waits Depends on DWC 0 1 register setting and WAIT signal status Address wait Fixed to 0 waits Depends on AWC register setting Idle state Depends on BCC register setting Users Manual U16533EJ1VOUM Depends on BCC register setting CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 5 2 Cautions related to emulation memory 1 Number of data waits required for emulation memory access The number of data waits that must be inserted for emulation memory access varies depending on the operating frequency of the emulator 4 MHz lt Operating frequency lt 25 MHz 0 waits 25 MHz lt Operating frequency lt 40 MHz 1 wait 40 MHz Operating frequency 2 waits 2 Bus sizing Make the bus sizing 16 bits set BSn0 in the BSC register to 1 An 8 bit bus cannot be used 3 WAIT pin The number of data waits for the emulation memory is not affected by the WAIT pin 4 Address wait Address waits cannot be inserted in the emulation memory When address waits need to be inserted set as follows Number of data waits for CS Number of address waits for Number of data waits for space of emulation memory external memory or external I O external memory or external I O This setting is effective to make the access speed to the emulation memory equal to that of the external memory or external I O to measure the performance etc For how to insert waits in the emulation
16. 7 8 open Target system IE V850E MC Crystal oscillator SW1 PLL Direct mode Emulation switching CPU CKSEL CLKOUT uPD70F3114 Users Manual U16533EJ1VOUM 25 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 3 Operation Mode Setting The IE 703114 MC EM1 supports single chip mode and ROMless mode similar to the V850E IA2 Set these as follows Set as follows in the configuration dialog box mask setting area in accordance with the operation mode used when the integrated debugger ID850 is activated Operation in ROMless mode Select Mode00 Operation in single chip mode Select Mode02 Caution In ROMless mode be sure to start mapping emulation memory from address OH if the emulator is not connected to the target system Emulation of the MODE pin cannot be performed since the input level to the MODE pin is implemented using the debugger pin mask function in the IE 703114 MC EM1 For the settings of the pins on the target system refer to the V850E IA2 Hardware User s Manual U15195E 26 Users Manual U16533EJ1VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 4 Power Supply Settings 2 4 1 JP2 setting When JP2 is set as shown in Figure 2 6 the IE 703114 MC EM1 detects the power supply on the target board and automatically switches whether the emulator operates on VDD from the target system or the emulator s internal power supply Factory setting Caution If the JP2 setting is incorre
17. Depends on AWC register setting Idle state Fixed to 0 cycles Depends on BCC register setting 1 WAIT ACCESS Data wait Fixed to 1 wait Depends on DWC 0 1 register setting and WAIT signal status Address wait Fixed to 0 waits Depends on AWC register setting Idle state Fixed to 0 cycles Depends on BCC register setting TARGET WAIT 2 MULTI Data wait Depends on DWC 0 1 register setting However 1 wait when set to 0 waits Depends on DWC 0 1 register setting and WAIT signal status Address wait Fixed to 0 waits Depends on ASC register setting Idle state Depends on BCC register setting Depends on BCC register setting Select mask or unmask for WAIT and EMWAIT using the Pinmask command Selection WAIT Mask EMWAIT Mask Wait Type Data wait Emulation Memory Access Fixed to 0 waits External Memory Access Depends on DWC 0 1 register setting WAIT signal masked Address wait Fixed to 0 waits Depends on AWC register setting Idle state Fixed to 0 cycles Depends on BCC register setting WAIT Unmask EMWAIT Mask Data wait Fixed to 1 wait Depends on DWC 0 1 register setting and WAIT signal status Address wait Fixed to 0 waits Depends on AWC register setting Idle state Fixed to 0 cycles Depends on BCC register setting WAIT Unmask EMWAIT Unmask 28 Data wait Depends on DWC
18. GET CONNECTION 52 APPENDIX C CONNECTORS FOR TARGET CONNECTION is neren ee enanenanenenanenenseennnen 53 ET Usage na Mn E en een seadevvecddecnud tienne age end nd 53 C 2 Cautions on Handling Connectors nana nent 55 APPENDIX D MOUNTING PLASTIC SPACER nnn ann snansnonanenenanensnneensnansnanenensenesnanenanneenaneeensenennnn 56 Users Manual U16533EJ1VOUM 7 LIST OF FIGURES Figure No Title Page EN en elle e EE 14 1 2 Contents in Carton insu ecient bren deter ets NE se nee aba riante Ait stats 16 1 3 Connection Between IE V850E MC and IE 703114 MC EM1 ene eennenennenennerenneerenseernerenseeenenn 17 2 1 1E 703114 MC EM D 19 2 2 Glock Setting Outline EE 21 2 3 Outline When Using Mounted Internal Clock sien 23 2 4 Outline When Changing Mounted Crystal Oscillator and Using New Oscillator as Internal Clock 24 2 5 Outline When Using Crystal Oscillator on Target System as External Clock A 25 2 6 JP2 Setting Automatic Switching Setting sis 27 2 7 JP2 setting When Power from Target System Is Used annen nennenennenennerennnereneerenvenenverenenenvenen 27 4 1 Schematic Diagram of Power Supply Flow ennenenneerenneeeneeeenverennerenenenereenevennenenneeenerenenenenen 32 5 1 Pin Equivalent Girouit lr ege EE ee Aare hetere eenn dates 33 52 Pin Equivalent Circuit TTT 34 5 3 Pin Ge Ee iw ks ead alien te ik a elle 35 5 4 ip Equivalent Citcuit 4 a ae dcr senate Gah aii ian ave aie ae det Ge natin da
19. S MC EM1 with the default settings lt 2 gt lt 3 gt lt 4 gt Change JP1 as indicated in Table 2 2 with the default settings Set the SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 2 To start up the integrated debugger ID850 select Internal in the clock source selection area in the configuration dialog box selection of clock in emulator Type of Clock Used Use crystal oscillator OSC1 mounted on IE 703114 MC EM1 as internal clock Note Clock Source Selection Internal JP1 Setting OSC1 Crystal Oscillator Factory setting 4 000 MHz Table 2 2 Settings When Using Mounted Internal Clock Direct CKSEL Pin Low level input when operating the emulator on a standalone basis IE V850E MC Emulation CPU Direct Figure 2 3 Outline When Using Mounted Internal Clock 1 2 shorted 3 4 shorted 5 6 open 7 8 open IE 703114 MC EM1 Mounted Select Internal on ID850 OSC1 swi PLL Direct mode switching uPD70F3114 Users Manual U16533EJ1VOUM crystal oscillator CKSEL CLKOUT High level input The input setting for the CKSEL pin is made only when a target system is connected Leave this pin open Target system Crystal oscillator 23 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 Changing the crystal oscillat
20. SW1 PLL Direct mode switching Users Manual U16533EJ1VOUM CLKOUT Target system CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 3 Using the target system crystal oscillator as an external clock lt 1 gt Set JP1 as shown in Table 2 4 factory setting lt 2 gt Setthe SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 4 lt 3 gt Select External in the clock source selection area in the configuration dialog box on the integrated debugger ID850 Table 2 4 Settings When Using External Clock Type of Clock Used Clock Source OSC1 Crystal JP1 CKSEL Pin Selection Oscillator Setting Use crystal oscillator External Crystal Low level input on target system as oscillator can external clock be either Direct mounted or not mounted Direct High level input Note The input setting for the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a standalone basis Caution Be sure to input a clock generated by a crystal oscillator to the X1 pin When a clock generated by a crystal ceramic resonator is used the emulator does not operate normally Figure 2 5 Outline When Using Crystal Oscillator on Target System as External Clock IE 703114 MC EM1 Se Sei Select Can be either 4 snorte External mounted or 5 6 open on ID850 not mounted
21. TING PLASTIC SPACER This chapter describes the mounting method for the plastic spacer supplied with the IE V850E MC When using the emulator connected to the target system mount the plastic spacer as shown in Figure D 1 to fix the pod horizontally Mounting plastic spacer on IE V850E MC lt 1 gt Remove the nylon rivet from the rear part of the pod lt 2 gt Tighten the plastic spacer with the plastic screw supplied lt 3 gt To adjust the height use a spacer other than the included spacer or a stand Figure D 1 Mounting Method of Plastic Spacer Plastic spacer Target system 56 User s Manual U16533EJ1VOUM
22. To our customers Old Company Name in Catalogs and Other Documents On April 1 2010 NEC Electronics Corporation merged with Renesas Technology Corporation and Renesas Electronics Corporation took over all the business of both companies Therefore although the old company name remains in this document it is a valid Renesas Electronics document We appreciate your understanding Renesas Electronics website http www renesas com April 1 2010 Renesas Electronics Corporation Issued by Renesas Electronics Corporation http www renesas com Send any inquiries to http www renesas com inquiry QENESAS 10 11 12 Notice All information included in this document is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas Electronics products listed herein please confirm the latest product information with a Renesas Electronics sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website Renesas Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document No license express implied or otherwise is granted
23. al U16533EJ1VOUM CHAPTER 1 OVERVIEW 1 6 Connection Between IE V850E MC and IE 703114 MC EM1 The procedure for connecting the IE V850E MC and IE 703114 MC EM1 is described below Caution Do not break or bend connector pins lt 1 gt lt 2 gt lt 3 gt lt 4 gt lt 5 gt Remove the pod cover lower of the IE V850E MC Set the PGA socket lever of the IE 703114 MC EM1 to the OPEN position as shown in Figure 1 3 b Connect the IE 703114 MC EM1 to the PGA socket at the rear of the pod refer to Figure 1 3 c When connecting position the IE V850E MC and IE 703114 MC EM1 so that they are horizontal Spacers can be connected to fix the pod refer to APPENDIX D MOUNTING PLASTIC SPACER Set the PGA socket lever of the IE 703114 MC EM1 to the CLOSE position as shown in Figure 1 3 b Fix the IE 703114 MC EM1 between the pod cover lower with the nylon rivets supplied with the IE V850E MC Figure 1 3 Connection Between IE V850E MC and IE 703114 MC EM1 1 2 a Overview Nylon rivets Nylon rivets IE 703114 MC EM1 IE V850E MC User s Manual U16533EJ1VOUM 17 CHAPTER 1 OVERVIEW Figure 1 3 Connection Between IE V850E MC and IE 703114 MC EM1 2 2 O O O O O O 00000000000000000 O0 0 0 0 0 00 0 0 00 0 0 0 0 O 0 OO OO 0 0
24. cillator as the internal clock High level input Direct Use the crystal oscillator on External Crystal Low level the target system as an oscillator can input external clock be either Direct mounted or not mounted Direct High level input Notes 1 Select the clock source in the clock source selection area in the configuration dialog box on the debugger 2 The input setting for the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a standalone basis The emulator operates according to the SW1 setting 3 When changing the crystal oscillator on the emulator choose an oscillator that satisfies the conditions described below Power supply voltage Output level CMOS Type 8 pin type Pin positions Pin 1 NC Pin 4 GND Pin 5 OUT Pin 8 Voo 4 For cautions related to using an external clock refer to the V850E IA2 Hardware Users Manual U15195E Caution Settings other than those described above are prohibited 22 User s Manual U16533EJ1VOUM 1 Using the crystal oscillator OSC1 mounted on the IE 703114 MC EM1 as the internal clock Mount the 4 000 MHz crystal oscillator mounted at factory shipment in the OSC1 socket of the IE 703114 lt 1 gt CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENT
25. ct the emulator may be damaged Figure 2 6 JP2 Setting Automatic Switching Setting Set 1 and 2 as shorted and 3 and 4 as open Note A relay is used for switching the power supply Depending on the combinations with the target system the relay may repeatedly turn on off making a continuous switching sound when the target system is turned off In such a case set JP2 as shown in Figure 2 7 When JP2 is set as shown in Figure 2 7 Voo is always supplied from the target system Note that with this setting the emulator does not operate when the target system is not connected Figure 2 7 JP2 setting When Power from Target System Is Used Set 1 and 2 as open and 3 and 4 as shorted Users Manual U16533EJ1VOUM 27 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 5 Emulation Memory This is a substitute memory used to emulate the memory or memory mapped I O on the target system capacity 4 MB The emulation memory is mounted on the IE 703114 MC EM1 2 5 1 Wait setting for emulation memory The data wait address wait and idle state for the emulation memory are set as follows 1 ID850 Select from the following three types on the configuration screen Selection WAIT MASK Wait Type Data wait Emulation Memory Access Fixed to 0 waits External Memory Access Depends on DWC 0 1 register setting WAIT signal masked Address wait Fixed to 0 waits
26. e measures must be taken such as setting access breaks beforehand because if the higher 6 KB space is accessed the emulator cannot issue a fail safe break 32 User s Manual U16533EJ1VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT This chapter describes the equivalent circuits in the emulator for signals of the emulator connected to the target system Note that depending on the processing within the emulator some pins cannot be emulated refer to CHAPTER 4 CAUTIONS Figures 5 1 to 5 8 show the equivalent circuits Tables 5 1 to 5 8 list the pins corresponding to each equivalent circuit Figure 5 1 Pin Equivalent Circuit 1 5V 5V 4 45 V 220 uPC358 74VHCT541 IE V850E MC Yo LED Target 1kQ 5V TIT Emulation CPU uPD703191 uPD70F3114 Table 5 1 Corresponding Pins Pin Equivalent Circuit 1 Von GC 14 x 14 39 64 86 GF 14 x 20 41 66 88 Users Manual U16533EJ1VOUM 33 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT Figure 5 2 Pin Equivalent Circuit 2 PDLO to PDL15 PDHO to PDH5 PCTO to PCT6 PCMO to PCM1 Emulation CPU uPD703191 Pin Name 1 Pin Name 2 Table 5 2 Corresponding Pins Pin Equivalent Circuit 2 Package GC 14 x 14 Pin Name 1 GF 14 x 20 Pin Name 2 Package GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14 GF 14 x 20 GC 14 x 14
27. e 35 5 5 Pin Equivalent le EE 36 5 6 Pin Equivalent Circuit Occean Adee nl nee nn Adis ten terne inet remet tu tune 36 5 7 Pin Equivalent Citeuit 7 e e 288 tekenaar ate ae eege RAR deco 40 5 8 PinEquival nt irgendee eege deg A0 A 1 100 Pin Plastic LQFP Fine Pitch 14 x1 l nier 50 MD 100 Pin Plastic QFP 14 X OT Rd nn da ae do it eu 51 C 1 Mounting NQPACK100SD or NQPACK100RB AA 53 G2 Mounting Device inertie Eed nie meet dis eed dEENE Eed 54 C 3 NQPACK100SD or NQPACK100RB and Device Pin sise 54 D 1 Mounting Method of Plastic Spacer sise 56 Users Manual U16533EJ1VOUM LIST OF TABLES Table No Title Page 1 1 Hlardwate SpeecificatiOns se Etgen eeEeeE eege dees 12 1 2 System Specifications of IE 703114 MC EM1 When Connected to IE V850E MC eee 13 2 1 List of Hardware Settings When Setting Clock 22 2 2 Settings When Using Mounted Internal Clock ss 23 2 3 Settings When Changing Mounted Internal Clock 24 2 4 Settings When Using External Clock sise 25 4 1 Pins That GannotiBe EmUulated EEE ne nn e 31 5 1 Corresponding Pins Pin Equivalent Circuit 1 sisi 33 5 2 Corresponding Pins Pin Equivalent Circuit 2 iii 34 5 3 Corresponding Pins Pin Equivalent Circuit 3 sisi 35 5 4 Corresponding Pins Pin Equivalent Circuit AN 35 5 5 Corresponding Pins Pin Equivalent Circuit Bi 36 5 6 Corresponding Pins Pin Equivalent Circuit 6 37 5 7 Corresponding Pins Pin Equivalent Circuit 7 iii 40 5 8 Corre
28. eoul Korea Tel 02 558 3737 e Succursale Fran aise V lizy Villacoublay France Tel 01 30 67 58 00 e Filiale Italiana Milano Italy Tel 02 66 75 41 e Branch The Netherlands Eindhoven The Netherlands Tel 040 2445845 e Tyskland Filial Taeby Sweden Tel 08 63 80 820 e United Kingdom Branch Milton Keynes UK Tel 01908 691 133 Users Manual U16533EJ1VOUM NEC Electronics Shanghai Ltd Shanghai P R China Tel 021 6841 1138 NEC Electronics Taiwan Ltd Taipei Taiwan Tel 02 2719 2377 NEC Electronics Singapore Pte Ltd Novena Square Singapore Tel 6253 8311 J03 4 Target Readers Purpose Organization How to Read This Manual Conventions INTRODUCTION This manual is intended for users who wish to design and develop application systems using the V850E IA2 This manual is intended to give users an understanding of the basic specifications and the proper operation of the IE 703114 MC EM1 This manual is broadly divided into the following parts Overview e Names and functions of components e Factory settings e Cautions e Differences between target device and target interface circuit It is assumed that the readers of this manual have general knowledge of electrical engineering logic circuits and microcontrollers The IE 703114 MC EM1 is used connected to the IE V850E MC in circuit emulator This manual explains the basic setup procedure and switch settings of the IE 703114 MC EM1 F
29. esas Electronics does not warrant that such information is error free Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein Renesas Electronics products are classified according to the following three quality grades Standard High Quality and Specific The recommended applications for each Renesas Electronics product depends on the product s quality grade as indicated below You must check the quality grade of each Renesas Electronics product before using it in a particular application You may not use any Renesas Electronics product for any application categorized as Specific without the prior written consent of Renesas Electronics Further you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics The quality grade of each Renesas Electronics product is Standard unless otherwise expressly specified in a Renesas Electronics data sheets or data books etc Standard Computers office equ
30. ew Bottom view T bald 48 Users Manual U16533EJ1VOUM APPENDIX A DIMENSIONS 9 HQPACK100RB Unit mm Top view 23 75 0 65 x 19 12 35 os wl 18 85 0 65 x 29 Side view Bottom view Users Manual U16533EJ1VOUM 49 APPENDIX A DIMENSIONS The following shows a diagram of the conditions when connecting the in circuit emulator option board to the conversion connector Follow the configuration below and consider the shape of parts to be mounted on the target system when designing a system Figure A 1 100 Pin Plastic LQFP Fine Pitch 14 x 14 In circuit emulator IE V850E MC In circuit emulator option board IE 703114 MC EM1 Conversion connector 231 3 mm gt YQGUIDE Note YQPACK100SD NQPACK100SD TMT HET Target system Note YQSOCKET100SDN sold separately can be inserted here to adjust the height height 3 2 mm Target system IE 703114 MC EM1 YQPACK100SD NQPACK100SD YQGUIDE Connection condition diagram Connect to IE V850E MC IE 703114 MC EM1 Target system 28 7445 mm 50 Users Manual U16533EJ1VOUM APPENDIX A DIMENSIONS Figure A 2 100 Pin Plastic QFP 14 x 20 Side view In circuit emulator IE V850E MC In circuit emulator optio
31. hereby under any patents copyrights or other intellectual property rights of Renesas Electronics or others You should not alter modify copy or otherwise misappropriate any Renesas Electronics product whether in whole or in part Descriptions of circuits software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples You are fully responsible for the incorporation of these circuits software and information in the design of your equipment Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits software or information When exporting the products or technology described in this document you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military including but not limited to the development of weapons of mass destruction Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture use or sale is prohibited under any applicable domestic or foreign laws or regulations Renesas Electronics has used reasonable care in preparing the information included in this document but Ren
32. ipment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots High Quality Transportation equipment automobiles trains ships etc traffic control systems anti disaster systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems medical equipment or systems for life support e g artificial life support devices or systems surgical implantations or healthcare intervention e g excision etc and any other applications or purposes that pose a direct threat to human life You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges Although Renesas Electronics endeavors to improve the quality and reliability of its products semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certai
33. is used Note adapter NEXB 2R100SD RB Power adapter AC adapter dedicated to NEC Electronics in circuit emulators IE 70000 MC PS B Note For further information contact Daimaru Kogyo Co Ltd Tokyo Electronics Department TEL 81 3 3820 71 12 Osaka Electronics Department TEL 81 6 6244 6672 Users Manual U16533EJ1VOUM CHAPTER 1 OVERVIEW 1 2 Hardware Specifications When Connected to IE V850E MC Table 1 1 Hardware Specifications Parameter Value Target device uPD703114GC xxx 8EU mask ROM version 0 5 mm pitch uPD70F3114GC 8EU flash memory version 0 5 mm pitch uPD703114GF xxx 3BA mask ROM version 0 65 mm pitch uPD70F3114GF 3BA flash memory version 0 65 mm pitch Target interface voltage Von RVoo AVppo AVpp1 5 0 V 10 REGIN 3 0 to 3 6 V Maximum operating frequency 40 MHz External dimensions 28 mm Refer to APPENDIX A DIMENSIONS 229 mm 96 mm Power consumption 9 1 W Max Weight 190g Extremely lightweight and compact Higher equivalence with target device can be achieved by omitting buffer between signal cables 8 bit external trace can be performed by connecting external logic probe included O O O O O The following pins can be masked RESET NMI WAIT 12 User s Manual U16533EJ1VOUM CHAPTER 1 OVERVIEW 1 3 System Specifications of IE 703114 MC EM1 When Connected to IE V850E MC Table 1 2 System
34. l U16533EJ1VOUM APPENDIX A DIMENSIONS 1 IE V850E MC IE 703114 MC EM1 Unit mm Top View Pin 1 direction IE V850E MC 2 Side View IE 703114 MC EM1 Bottom View Users Manual U16533EJ1VOUM 41 APPENDIX A DIMENSIONS 2 SC 100SDN Unit mm 90000000 00000000 Heereccce Bo0000006 42 Users Manual U16533EJ1VOUM APPENDIX A DIMENSIONS 3 NQPACK100SD Unit mm Top view 21 0 0 5 X 24 12 0 58 03 Slit width gt 1 2 5 Side view EN Bottom view j es Gel IDDIE NDDDDDDODHDODDDDDR E SC co co co ch ah SSA 8 gegsgganengngoeansnsnanen A7 ARBBBBABEEBENAANEERBEAERE Slit width 4 62 0 Projection height 1 8 Users Manual U16533EJ1VOUM 43 APPENDIX A DIMENSIONS 4 YQPACK100SD Unit mm Top view 16 6 0 5 X 24 12 0 im pand D S a Eck mm ck
35. lassified into the following three quality grades Standard Special and Specific The Specific quality grade applies only to NEC Electronics products developed based on a customer designated quality assurance program for a specific application The recommended applications of an NEC Electronics product depend on its quality grade as indicated below Customers must check the quality grade of each NEC Electronics product before using it in a particular application Standard Computers office equipment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots Special Transportation equipment automobiles trains ships etc traffic control systems anti disaster systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems life support systems and medical equipment for life support etc The quality grade of NEC Electronics products is Standard unless otherwise expressly specified in NEC Electronics data sheets or data books etc If customers wish to use NEC Electronics products in applications not intended by NEC Electronics they must contact an NEC Electronics sales representative in advance to determine NEC Electronics willingness to support a given ap
36. ld separately 100 V AC power cable sold separately Included with IE 70000 MC PS B 220 V AC power cable sold separately Included with IE 70000 MC PS B Remark 2 The circled areas in the above figure are the enlargements of the connectors for target connection Note Obtain the device file from the website of NEC Electronics http www necel com micro Users Manual U16533EJ1VOUM 15 CHAPTER 1 OVERVIEW 1 5 Contents in Carton The carton of the IE 703114 MC EM1 contains the main unit guarantee card packing list and accessory bag Make sure that the accessory bag contains this manual and connector accessories In case of missing or damaged items contact an NEC Electronics sales representative or distributor Figure 1 2 Contents in Carton ee lt 2 gt Accessory bag lt 1 gt IE 703114 MC EM1 lt 5 gt IC Socket NQPACK100SD lt 4 gt Packing list lt 6 gt IC Socket YQPACK100SD lt 3 gt Guarantee card lt 7 gt IC Socket HQPACK100SD lt 8 gt Guide pin YQGUIDE lt 1 gt IE 703114 MC EM1 x 1 IC socket NQPACK100SD x 1 lt 2 gt Accessory bag x 1 IC socket YQPACK100SD x 1 lt 3 gt Guarantee card x 1 IC socket HQPACK100SD x 1 lt 4 gt Packing list x 1 Guide pin YQGUIDE x 4 Check that the accessory bag contains this manual a packing list an external logic probe and a restriction document 16 Users Manu
37. ls refer to 2 2 Clock Settings 4 JP2 This is a jumper for switching the power supply for details refer to 2 4 Power Supply Settings 5 CN1 EXTD Connects the external logic probe included 6 LD1 CKSEL Green This is an LED for indicating the level input to the CKSEL pin When the target system is not connected this is lit or extinguished according to the SW1 setting LED Status When Used as Standalone Unit When Used in Target System Connection Lit SW1 DIRECT The CKSEL signal from the target system is high Extinguished SW1 PLL The CKSEL signal from the target system is low 7 LD2 RUN Yellow This is an LED for indicating if a user program is being executed or not Lit User program is being executed Extinguished User program is halted 8 Connector for IE V850E MC connection This is a connector for connecting the IE V850E MC 9 Connector for target connection This is a connector for connecting the target system or the extension probe 10 Emulation memory This is a memory that replaces the memory memory mapped I O on the target system for details refer to 2 5 Emulation Memory 20 User s Manual U16533EJ1VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 2 Clock Settings 2 2 1 Clock settings outline The following 3 clock setting methods are available For details refer to 2 2 2 Clock setting methods 1 Use the crystal oscillator mounted on OSC1 of the IE 703114 MC EM1 as
38. m Configuration ges ees SEENEN edd 14 1 5 Contents in Carton eessen EEN 16 1 6 Connection Between IE V850E MC and IE 703114 MC EM1 ins 17 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS is innmnennennnenmnne 19 2 1 Component Names and Functions of IE 703114 MC EM1 is 19 22 CIOCK TE ele EE 21 2 2 1 Clock lee 21 2 22 ClOCK Setting KE EE 22 2 3 Operation Mode Setting mnnnennenenennnnneennnnennnnenenenennnnes 26 2 4 Power Supply Settings nnnnnnennnnnnenennnnennneennnnnennenennnes 27 2 4 1 JP2 Setling ss ein ei RE ne ee ee en dt ten Aaen ven 27 2 5 Emulation Memory EE 28 2 5 1 Wait setting for emulation memory sise 28 2 5 2 Cautions related to emulation memory n nanne nenneveneeeenenennnerenvenenerenverenverenverenvenenneeennn 29 CHAPTER 3 FACTORY SETTINGS nan aaananannenenanenenanenensennanenenneenenansesnaennannnenannnennnsnananenannvennnnennnenn 30 CHAPTER 4 CAUTION D a deser ee a paraa eaaa a as paa Aa ai ec 31 4 1 Cautions Related to Pin TerminatiOn eennennnnennns 31 4 2 Cautions Related to Internal RAM ennen enanenenseerenneensnanenanenennnensnnanenanenennnneensennnnann 32 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICE AND TARGET INTERFACE CIRCUIT 33 APPENDIX A DIMENSIONS snit an cesecccenteceseanecesecseatecedacerescecrunseteaneesousenstueveseiseadecssetevedterssaieeccucterti 41 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TAR
39. n board IE 703114 MC EM1 231 3 mm Conversion connector yNote Jam TT 00SD RB Ee st NQPACK100RB Target system LJ Note YQSOCKET100SDN sold separately can be inserted here to adjust the height height 3 2 mm NEXB 2R100SD RB Target system Pin 1 position IE 703114 MC EM1 8 mm YQPACK100RB NQPACK100RB YQGUIDE Connection condition diagram IE 703114 MC EM1 Connect to IE V850E MC Pin 1 position NEXB 2R100SD RB YQPACK100RB NQPACK100RB Target system Users Manual U16533EJ1VOUM 51 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION 1 When directly connecting device to target system connector for target connection is not used Device Target system 2 When using device using connector for target connection GC package Fastening screws included with HQPACK100SD HQPACK100SD Device NQPACK100SD Target system 3 When using device using connector for target connection GF package Fastening screws included with HQPACK100RB HQPACK100RB Device
40. n use conditions Further Renesas Electronics products are not subject to radiation resistance design Please be sure to implement safety measures to guard them against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas Electronics product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other appropriate measures Because the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances including without limitation the EU RoHS Directive Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations This document may not be reproduced or duplicated in any form in whole or in part without prior written consent of Renesas Electronics Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics
41. or OSC1 mounted on the IE 703114 MC EM1 and using the new oscillator as the internal clock lt 1 gt Remove the crystal oscillator OSC1 that is mounted on the IE 703114 MC EM1 and mount the oscillator to be used lt 2 gt Set JP1 as shown in Table 2 3 factory settings lt 3 gt Set the SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 3 lt 4 gt Select Internal in the clock source selection area in the configuration dialog box on the integrated debugger ID850 Table 2 3 Settings When Changing Mounted Internal Clock Type of Clock Used CKSEL pin Clock Source Selection OSC1 Crystal JP1 Oscillator Setting Change the crystal Internal oscillator mounted on IE 703114 MC EM1 and use the new oscillator as the internal clock Change to other than 4 000 MHz Low level input Direct High level input Direct Note The input setting for the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a standalone basis Figure 2 4 Outline When Changing Mounted Crystal Oscillator and Using New Oscillator as Internal Clock IE 703114 MC EM1 IE V850E MC Emulation CPU 1 2 shorted 3 4 shorted 5 6 open 7 8 open Select Internal on ID850 B uPD70F3114 Change crystal oscillator OSCH Other than 4 MHz
42. or the names and functions of the IE V850E MC and the connection of parts refer to the IE V850E MC IE V850E MC A User s Manual U14487E which is a separate volume To broadly understand the basic specifications and operation methods Read this manual in the order of the CONTENTS To know the operation methods and command functions of the IE V850E MC and IE 703114 MC EM1 Read the user s manual of the debugger sold separately that is used Note Footnote for item marked with Note in the text Caution Information requiring particular attention Remark Supplementary information Numerical representation Binary xxxx or xxxxB Decimal xxxx Hexadecimal xxxxH Prefix indicating the power of 2 address space memory capacity K kilo 2 1 024 M mega 2 1 024 Users Manual U16533EJ1VOUM 5 Terminology The meanings of terms used in this manual are listed below Target device This is the device to be emulated Target system The system user built system to be debugged This includes the target program and hardware configured by the user Emulation CPU This is the device that performs emulation of the target device in the IE V850E MC Related Documents When using this manual refer to the following manuals The related documents indicated in this publication may include preliminary versions However preliminary versions are not marked as such O Documents related to development tools user s
43. plication Note 1 NEC Electronics as used in this statement means NEC Electronics Corporation and also includes its majority owned subsidiaries 2 NEC Electronics products means any product developed or manufactured by or for NEC Electronics as defined above M8E 02 11 1 Users Manual U16533EJ1VOUM Regional Information Some information contained in this document may vary from country to country Before using any NEC Electronics product in your application please contact the NEC Electronics office in your country to obtain a list of authorized representatives and distributors They will verify e Device availability e Ordering information e Product release schedule e Availability of related technical literature e Development environment specifications for example specifications for third party tools and components host computers power plugs AC supply voltages and so forth e Network requirements In addition trademarks registered trademarks export restrictions and other legal issues may also vary from country to country GLOBAL SUPPORT http www necel com en support support html NEC Electronics America Inc U S NEC Electronics Europe GmbH NEC Electronics Hong Kong Ltd Santa Clara California Duesseldorf Germany Hong Kong Tel 408 588 6000 Tel 0211 65 03 01 Tel 2886 9318 800 366 9782 e Sucursal en Espa a NEC Electronics Hong Kong Ltd Madrid Spain Seoul Branch Tel 091 504 27 87 S
44. products or if you have any other inquiries Note 1 Renesas Electronics as used in this document means Renesas Electronics Corporation and also includes its majority owned subsidiaries Note 2 Renesas Electronics product s means any product developed or manufactured by or for Renesas Electronics 1RENESAS User s Manual IE 703114 MC EM1 In Circuit Emulator Option Board Target Device V850E I1A2 Document No U16533EJ1VOUMOO 1st edition Date Published September 2003 N CP K NEC Electronics Corporation 2003 Printed in Japan MEMO 2 Users Manual U16533EJ1VOUM Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and or other countries PC AT is a trademark of International Business Machines Corporation e The information in this document is current as of December 2002 The information is subject to change without notice For actual design in refer to the latest publications of NEC Electronics data sheets or data books etc for the most up to date specifications of NEC Electronics products Not all products and or types are available in every country Please check with an NEC Electronics sales representative for availability and additional information e No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics NEC Electronics assumes no responsibility for any errors that may
45. sponding Pins Pin Equivalent Circuit 8 sir 40 Users Manual U16533EJ1VOUM 9 CHAPTER 1 OVERVIEW The IE 703114 MC EM1 is an option board for the in circuit emulator IE V850E MC By connecting the IE 703114 MC EM1 to the IE V850E MC hardware and software can be debugged efficiently in system development using the V850E IA2 In this manual the basic setup procedures and switch settings of the IE 703114 MC EM1 when connecting it to the IE V850E MC are described For the names and functions of the parts of the IE V850E MC and for the connection of parts refer to the IE V850E MC IE V850E MC A User s Manual U14487E which is a separate volume 10 Users Manual U16533EJ1VOUM CHAPTER 1 OVERVIEW 1 1 Hardware Configuration Separately sold hardware In circuit emulator IE V850E MC Option board IE V850E MC can be used as in circuit emulator for V850E IA2 by IE 703114 MC EM1 adding this board Separately sold hardware Extension probe General purpose extension probe made by TOKYO ELETECH SC 100SDN CORPORATION PC interface board These boards are used to connect the IE V850E MC A to a personal IE 70000 PCI IF A computer These boards are inserted in the expansion slot of the IE 70000 CD IF A personal computer IE 70000 PCI IF A For PCI bus IE 70000 CD IF A For PCMCIA socket 100 pin GC GF conversion Socket to convert to GF foot pattern when 100 pin GF package
46. the HQPACK100SD or HQPACK100RB refer to Figure C 2 Using the screws provided with the HQPACK100SD or HQPACK100RB four locations M2 x 6 mm secure the HQPACK100SD or HQPACK100RB device and NQPACK100SD or NQPACK100RB Tighten the screws in a crisscross pattern with the screwdriver provided or a driver with a torque gauge avoid tightening only one screw strongly Tighten the screws with 0 55 kg f cm 0 054 N m max torque Excessive tightening may diminish conductivity At this time each pin is fixed inside the plastic dividers by the contact pin of the NQPACK100SD or NQPACK100RB and the hold pin of the HQPACK100SD or HQPACK100RB refer to Figure C 3 Thus pins cannot cause shorting with the pins of neighboring devices Figure C 2 Mounting Device Fastening screws HQPACK100SD or HQPACK100RB Device NQPACK100SD or NQPACK100RB Target system Figure C 3 NQPACK100SD or NQPACK100RB and Device Pin Hold pin of HQPACK100SD or HQPACK100RB Divider Device Contact pin of NQPACK100SD or NQPACK100RB Users Manual U16533EJ1VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION C 2 Cautions on Handling Connectors 1 2 When taking connectors out of the case remove the sponge while holding the main unit When soldering the NQPACK100SD
47. the internal clock 2 Change the crystal oscillator mounted on OSC1 of the IE 703114 MC EM1 the replacement oscillator as the internal clock 3 Use the crystal oscillator on the target system as an external clock clock input from target system Caution When using an external clock input the clock generated by the crystal oscillator to the X1 pin When a clock generated by a crystal ceramic resonator is used the emulator does not operate normally Figure 2 2 Clock Setting Outline IE 703114 MC EM1 Crystal oscillator can be changed Internal external clock switch OSCH Target system IC4 O Crystal O oscillator IE V850E MC SW1 PLL Direct mode Emulation switching CPU uPD70F3114 CLKOUT Users Manual U16533EJ1VOUM 21 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 2 2 Clock setting methods A list of the hardware settings when setting the clock is shown below Table 2 1 List of Hardware Settings When Setting Clock Type of Clock Used Clock OSC1 Crystal JP1 Setting Source Oscillator Selection 1 Use crystal oscillator Internal Factory Low level OSC1 mounted on settings input IE 703114 MC EM1 as 4 000 MHz Direct internal clock Direct High level input Change crystal oscillator Internal Change Low level OSC1 mounted on to other than input IE 703114 MC EM1 and 4 000 MHz use new os
48. ulled down via a 33 kQ resistor The input to the clock generator is delayed by up to 13 2 ns because it passes through 74HC157 first When using an internal clock this pin is pulled down via a 33 kQ resister and left open 4 CKSEL pin Pull up pull down can be switched by SW1 When PLL is selected by SW1 this pin is pulled down via a 33 kQ resistor When DIRECT is selected it is pulled up via a 33 kQ resistor Users Manual U16533EJ1VOUM 31 CHAPTER 4 CAUTIONS 5 Voo pin 1 Voo in the target system is used to operate the circuit in the emulator 2 When JP2 is set as 1 and 2 open and 3 and 4 shorted the evaluation chip in the emulator operates on Von from the target system 3 When JP2 is set as 1 and 2 open and 3 and 4 open the emulator recognizes the target system power is off and operates with the 3 3 V power supply Figure 4 1 Schematic Diagram of Power Supply Flow Target system IE 703114 MC EM1 IE V850E MC Emulation uPD70F3114 CPU Power supply circuit Switched automatically 4 2 Cautions Related to Internal RAM In the emulator the internal RAM is mapped at the 12 KB space OxFFFCO000 to OxFFFEFFF Since the V850E IA2 is mapped at the 6 KB space OxFFFCOOO to OxFFFD7FF the target system is not mapped at the higher 6 KB space in the internal RAM OxFFFD800 to OxFFFEFFF Therefor
49. ux or solder sputtering on the contact pins of the NQPACK100SD or HQPACK100RB can be avoided Recommended soldering conditions Reflow 240 C 20 seconds max Partial heating 240 C 10 seconds max per pin row Remove the guide pins Figure C 1 Mounting NQPACK100SD or NQPACK100RB HQPACK100SD or HQPACK100RB III Guide pins NQGUIDE NQPACK100SD or NQPACK100RB Target system Remark NQPACK100SD or NQPACK100RB Connector for target connection HQPACK100SD or NQPACK100RB Cover for device installation Users Manual U16533EJ1VOUM 53 APPENDIX C CONNECTORS FOR TARGET CONNECTION 2 When mounting device 54 Caution Check for abnormal conditions such as resin burr or bent pins before mounting a device on the lt 1 gt lt 2 gt NQPACK100SD or NQPACK100RB Moreover check that the hold pins of the HQPACK100SD or HQPACK100RB are not broken or bent before mounting the HQPACK100SD or HQPACK100RB If there are broken or bent pins fix them with a thin flat plate such as a blade Make sure that the NQPACK100SD or NQPACK100RB is clean and the device pins are parallel flat before mounting a device on the NQPACK100SD or NQPACK100RB Then after mounting the NQPACK100SD or NQPACK100RB on the target board fix the device and
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