JERG-0-052 宇宙転用可能部品の宇宙適用
Contents
1.2. THRONE E
3. RoHS RoHS lt
4. RNC CNES Q ST 60 100 5 3 2 1 3 5 3 2 1 3 1 3 EEE INST 002 G 1 2 3 Level 1 2 3 Commercial
5. ITAR COTS Commercial Off The Shelf COMMERCIAL COMPONENT CNES 2010 1 RNC CNES Q ST 60 100 General Requirements for the use o
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10. 4 2 4 PWB No IR H D PWB 4 2 5 No1 2 3 AT NDA NDA 4 2 5 PWB
11. 4 2 3 No A 6 QC Teo 7 y 8 due STE Z MIL Spec 9
12. RN A a 2 EEE INST 002 GSFC PPL 21Appendix B ECSS Q ST 30 11 36 4 5 4 5 1 E Dn 1 JAXA
13. RVT RVT RVT EFR HAST 4 3 1 1 3 IH 30 JERG 0 052 Xf PIND PIND 10
14. EI EH 4 2 1 E 4 2 4 A 4 2 2 4 2 5 4 2 3 K 4 2 6 TRE Zi WH 1 2 3 4
15. RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications 67 JERG 0 052 5 3 7 1 2 3 4 PEM PED a b
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17. JERG 1 XXX 9 10 m 11 JER6 0 034 NASA RP 1124
18. JAXA QML CNES 10 CNES ESA ECSS Q ST 60 13
19. JV E Yes Yes 2 Yes x Yes AL Yes No o m Yes RVT CA No oo Yes Yes NSPAR
20. 1 2 5 3 6 DPA DPA HH iss L Je Spa 238 DPA DPA E d MIL STD 1580A DPA DPA 65
21. O JMR 012 IT I JERG 0 052 1 JAXA MIL NASA ESCC JAXA
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23. ESCC 22900 MIL STD MIL STD 883 1019 JEDEC JESD57 5 3 5 150 1080 5 3 2 mHE 1 2 3 4 5
24. 5 3 6 1 HE DPA 42 4 5 2 2 1 1 uil EA DA ZZ aR 5 10 FECISTIS GYI 55 125C 500 GE T 1 MIL STD 883 1010 B 2 MIL STD 750 1051 B 100 72 2 RRE 25C
25. JAXA MIL NASA ESCO JAXA MIL NASA ESCO JAXA JAXA No v R pem Yes cm No E No Yes JERG 0 052 GQMS v No Yesl JS 1 bu le s i HDBKI No No NM s
26. E BIESETSIEUS S SORA RUN
27. d e g B 41 JERG 0 052 E LAT 4 5 2 2 1 3 j 1 3 JERG 0 052 amp 3T
28. http www semicon toshiba co jp docs datasheet ja Transistor 2SC5065 ja datasheet 071101 pdf w 4 2 2 2 15 J 4 2 1 ERG 0 052 APTYT No 4 2 2 Neo1 2 3 Q NDA
29. JMR 012 3 1 EEE 19 JMR 012 5 1 2 3 1 I Or Too dx OU AES oso aba oec Ln e e e e Ln CCD cL PUE 7Kdh ZK dE eds RFI EMI ZNA EGBRTZ47v25 y grex AJ Lu RF RF
30. JERG 0 052 NEC Co eu oll ali xa E 2 8 JAXA PAPDB H 1 AN JAXA URL https eeepitn1 tksc jaxa jp 2
31. 1 JERG 0 052 1 1 EEE VERE GB T 5 JAXA MIL NASA BSCC JAXA NSPAR 1H E 1 2
32. LET 25MeV cm2 mg SEU SEU CREME96 solar quiet condition worst week model 35 JERG 0 052 c SEB SEGR MOSFET SEE d SET SEFI 3
33. H4 O nH Qrf JW ZW d d Qrf A B C 18 JERG 0 052
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39. RoHS http www2 renesas com maps_download pdf TC 5590Apdf X 4 2 1 1 14 JERG 0 052
40. https nepp nasa gov DocUploads FFB52B88 36AE 4378 A05B2C084B5EE2CC EEE IN ST 002 addl pdf 52 JERG 0 052 5 3 2 1 1 AF y Jus e ec 8 5 a m E 1 X 100 MIL STD 883 2012 10 1 2 100 N A 3 100 55 85 10 T Jj MIL STD 883 1010 A 4 PIND 100
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42. 4 1 2 50 JERG 0 052 5 3 5 2 1 2 3 4 ba iE
43. C 6 QC 24 JERG 0 052 K 4 2 6 No R PWB 7
44. DPA 25 WCA 26 DPA 27 Be0 Cd Li Mg Hg Zn 28 iE 21 JERG 0 052 4 2 3
45. DPA E 5 3 6 1 RNC CNES Q ST 60 100 Be0 DPA 5 3 8 JERG 0 052 5 3 6 1 DPA US CU No GS X X X MIL STD 750 Method 2071 4 MIL PEM MIL STD 883 Method 2009 9 1 PIND X X X MIL STD 750 Method 2052 3 MIL STD 883 Method 2020 7 X X X MIL STD 75
46. 27 JERG 0 052 4 3 4 3 1 JMR 012 5 1 2 I II 3 3 i A
47. f 6 90nm H HH 7 8 9 fip n FU L1 H E HL Er JERG 0 050 T5318 23 10 ER ti NJ TA OSEE H mn H EJH 32 E E ox me H
48. PDA 4 5 5 3 4 5 3 NSPAR NSPAR NSPAR JERG 0 052 10 JAXA D EEE 2 3 PEM PED
49. 48 NSPAR Je 4 1 2 Im li FH RTRE Ze ipa OF Hrs HH EA 7 a Cx 5 Cmn NSPAR p T JAXA QML JAXA
50. 14 15 16 17 ESTEE E 25 JERG 0 052 K 4 2 6 PWB HD I D 1
51. 10 ovem nue 11 12 EM FM BERR 13 14 15 16
52. JERG 0 052 2 3 4
53. 1 ECSS Q ST 60 Space product assurance Electrical Electronic and Electromechanical EEE components 2 ECSS Q ST 60 14 Space product assurance Relifing procedure EFE components 3 RQA X0001 4 KHX 969010 H IIA 3 3 1 E Zi 1 m BC AL 2 JAXA JAXA 3J c Bi MIL NASA T 3 5 JAXA MIL NASA pr 5 NSPAR E E MIL NASA ESCC
54. SAW LPF HPF BPF 2 2 1 JERG 0 052 1 2 3 4 5 6 7 8 9 AFNOR A89 400 EN Soldering Measurement of solderability Wetting balance tests method ASTM E 595 STANDARD TEST METHOD FOR TOTAL MASS LOSS AND COLLECTED VOLATILE CONDENSABLE MATERIALS FROM OUTGASSING IN A VACUUM ENVIRONMENT CREME96 Cosmic Ray Effects on Micro Electronics 1996 Revision ECSS Q ST 30 11 Space Product Assurance Derating EEE components EEE INST 002 Instructions for EEE Parts Selection Screening Qualification and Derating ESCC 22900 TOTAL DOSE STEADY STATE IRRADIATION TEST METHOD ESCC 24800 Permanence of marking ESCC 25100 Single Event Effects test method and guidelines GSFC PPL 21 GSFC Preferred Parts List 10 IEC
55. 10 11 W a N 5 3 1 o TA 1 2 3 4 5 6 7 Qc Xi Nia gu zr Rd E BE X W p X J E u EE E ag 51 JERG 0 052 5 3 2
56. 20 85 10 10 75 3 4 5 2 HOR 5 3 a b c d e f Y f EOM XI 3 EXE Aqu B 3 L jii B
57. Commercial https nepp nasa gov DocUp1oads FFB52B88 36AE 4378 A05B2C084B5EE2CC EEE INST 0 02 addl pdf 45 2 2 01 93 8 2 7 3 Bd 5 3 3 1 3 gm unu Ed 4 5 2 2 1 3 K RNC CNES Q ST 60 100 4 5 2 2 5 3 2 1 3 5 3 3 5 3 3 1 5 2 4 4 4 2 J QMS IS0 JIS
58. NSPAR zi c ci No gt Yes yT NSPAR NG No GERIT ST J OK yM e EOI MESE Y LAT LAT LAT 5 e m ma A kh Y SE a TIN X 4 1 2 4 2 EH Ed 4 2 2 Js c hi ET Ah JERG 0 052 PL zi EJE HX Bl SE N
59. JERG 0 052 5 1 4 3 D A lt 1 1 2 3 3 RNC CNES Q ST 60 100 1 3 EEE INST 002 1 2 3 Level 1 2 3
60. NSPAR X 4 1 1 D Y 3 1
61. 5 l 4 4 3 MIL HDBK 217F nA i zQ 1 1 4 4 4 il FE SG DR 1 2 4 4 5 0 2 3 4 NPSL 1 JERG 0 052 E TE rQ 2 2 nQ 5 3 10
62. 25 4 10 0 55 125 wg etn 100 T 1 MIL STD 883 1010 B 2 xy MIL STD 750 1051 B amp 25 2 61 5 3 3 2 2 JERG 0 052 jd nor d C
63. NDA OQ K 4 2 2 QD Dis 4 2 3 4 2 3
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65. JERG 0 052 No ng bun A L 3E E ei EB ve zl E N qm ORERE DARUE LS
66. 5 tat M PKG aS due XX M 65 150 AuSn AuSi Al 1 Si 2bum Au
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68. DPA 3 5 3 6 1 DPA H 45 4 5 2 2 1 2 JERG 0 052 FP r inn 5 10 55 125C 500 E 1 T 2 MIL STD 883 1010 B MIL STD 750 1051 B 100 X amp 25C 3 6 1 RNC CNES
69. uy SS EHE t EST DI V n E JERG 0 052 F 5 i 1 5 1 t 2 1 2 1 100kg
70. JERG 0 052 5 3 3 5 3 2 RNC CNES Q ST 60 100 5 3 3 1 3 5 3 3 1 3 1 3 EEE INST 002 G 1 2 3 Level 1 2 3 Commercial https nepp nasa gov DocUp1oads FFB52B88 36AE 4378 A05B2C084B5EE2CC EEE IN ST 002 addl pdf 58 JERG 0 052 5 3
71. 5 EM FM 6 EM FM 7 8 MIL Spec IPC 9 23 JERG 0 052 K 4 2 6 No IH H PWB 1
72. R PC DPA ox EDEN S 26 JERG 0 052 nu 4 2 6 No IH H X PWB 22 WCA 23 DPA 24 Be0 Cd Li Mg Hg Zn 25
73. 3 1 2 3 3 1 3 4 E EE
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76. EZ JAXA JMR 012 2 ESCC E NSPAR Z7ZII 77IID JERG 0 052 JAXA ESCC ud 6 JAK NSPAR 7
77. PSR JAXA NSPAR ng z mn 4 5 2 JMR 012 5 3 1 2 3 1 B H B CDR
78. 10 JMR 012 5 5 6 5 5 10 5 10 5 3 9 FPGA PLD PROM OTP 68 5 4
79. NSPAR OUEST HR BI gt E gt nH 2e 2 NSPAR 3 49 1 H HH AR EA LC SUR NO NSPAR
80. 8 PDA NA 5 7 PDA 5 9 100 MIL STD 883 1014 A B C MIL STD 750 1071 HI H2 C K 10 100 750 MIL STD 883 2009 MIL STD 2071 MIL PEM RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space
81. APL NSPAR PAPDB HH N N Z HE EZS EH JERG 0 052 H TAR JAXA 2 J Bie MI E LAS URL https papdb tksc jaxa jp index php module Login amp action LoginMenu 1 APL NSPAR 1 2 3 A 5 6 7 8 9 CX 2 10 rm f Jena 0 3 ist
82. j 2 tE SDR JERG 0 052 c PAPDB 3 JAXA pn HH 4 JAXA
83. I II 8 9 0 11 HEOR
84. 2002 MDS 1 Mission Demonstration test Satel1ite 1 CSD Commercial Semiconductor Devices
85. 39 JERG 0 052 4 5 2 1 1 CA No 1 No 2 No 3 No 4 No 5 2 1 2 2 MIL STD 750 Method 2037 1 MIL STD 883 Method 2011 7 2 JEDEC 22 B116 X X P MIL STD 883 Method 2021 3 X X X X X X MIL STD 750 Method 2017 2 MIL STD 883 Method 2019 5 X Ex SEM X 1 MIL
86. JAXA PAPDB 71
87. b DD 2 SEE SEE SEL Single SEU Single SEB Single SEGR Single SEDR Single SET Single SEFI Single Even Event Event Event Event Event Event t ha Latchup Upset Burnout Gate Rupture Dielectric Rupture Transient Functional Interrupt a SEL LET Linear Energy Transfer LET 75MeV cm2 mg b SEU LET 25MeV cm2 mg
88. R T Ho R mI 8 MIL Spec 9 10 dein 11 PWB 4 SPUR 12 EM FM 13 I II PWB
89. 2 m uH 10 JERG 0 052 TT m I TI IL RES ema ae ELI JAXA MIUNASA ESCC JAXA JAXA QTS JMR 012 lt IESIRS T OE HERE OTRA HH F m o Msg BRERA DD CEU ETE EF FH ft 4 1 1 11 HDBK 4 441 41 442 42 Ga 20 800 8 E CHR 451 444 IRE BBES 445 446
90. EM PW 2 FM H PW A d 4 2 5 PWB No 1 4 3 1 2 PWB PWB 3 PWB 4 30 125CX1000
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93. 2 PWB S 3 DREE 4 m2 eeu XE p 2 SAEI 5 A PWB ir
94. 34 4 4 6 JERG 0 052 0 ID DD a Dose Depth Curve 1 25 AT 1 ELDRS Enhanced Low Dose Rate Sensitivity BICMOS TID
95. 25C HAST 96h or THB 1000h Eo 0 1000 95 C FTH IS 4 5 2 2 1 QUT 125C 1000 2000 1 44 JERG 0 052 55 125C 0 100 PELA 25C 55 125 C 100 500 25C 4 5 2 2 2 2 JERG 0 052 0 2 de 2 NUT CA 5 4 5 2 1 1 CA
96. H 3 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications rs 40 4 5 2 2 Q 2 6 7 CO xe uil Im a b c 0L f uu uu E uz X zx 4 5 2 2 1 3 ORF SETA 4 1
97. 3 6 RNC CNES Q ST 60 106 RNC CNES Q ST 60 106 TID 1 7 ASTME 595 JERG 0 034 ASTM E 595 JERG 0 034 1 2 C SAM PEM E TID RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications H ARE Y EAR AE EE Y NS n e o 43 Q3 T XU d 10 x
98. f JERG 0 052 HAST 96h HAST 96h 1 2 3 10C 10 TID SEE THB 1000h 1 THB 1000h 1 2000h 125C DPA 2000h 125C DPA 500 500 55C 125C 55C 125C TID SEE TID SEE
99. 1071 H1 H2 C K 9 100 MIL STD 883 2009 MIL PEM 1 MIL STD 750 2071 1 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications D AU URUIA uu EAR AE 56 F
100. 42 442 43 51 42 lt 443 PRE 444 RE BEES 42 452 4521 4522 52 453 53 531 532 533 534 535 53 CDPA 54 paad IHRES RES PRNSPAR E F 54 447 5 3 9 6 3T ROSE 71 537 538 72 73 Lo DB NPSL MIL QPL OML pg
101. JERG 0 052 5 3 2 3 3 A n Ps m puc NO MERCATUS azy I PIND 1 100 MIL STD 883 2020 A MIL STD 750 2052 A 1 100 MIL STD 883 1014 A B C MIL STD 750 1071 H1 H2 C K 1 3 jm RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications M RHY I CUR UTE AEBEEABR Ae uu 57 EE
102. n JAXA JERG 0 052 fn NSPAR Si E S T KUE EE 55 E HH H amp ERR ER Bin f EN IA ORB H J HH 3 EAD uie IOD CN HIC ul izi E 25 TE H PR Be inc E en l A m 4 NSPAR a b c d 5 1
103. 4 2 6 4 2 6 PWB PWB PWB PWB PWB PWB EM PW
104. 5 3 3 1 3 Bd 5 3 3 1 3 E LUN SR NM pu ri nul Lij JMR 012 5 1 2 3 1I I JMR 012 CAA 109011 5 28 A 4 3 1 B C
105. 10 i ESRB T a A REIRE T ERA J e QZSS 1 GOSAT SPRINT HTV 7 _ SP s MINDS GCOM C W SR zs DRTS MMO IKAROS X T ALOS 2 ASTRO H SDS 1 1 2 Be 3 Be E II 1 II III II 1 1L III SER ms nd Ex 1 i 1 1 1I i 1 IT 1II TI LTTITI es oi mM 1 amp Te AA
106. JAXA JERG 0 052 JAXA JMR 012
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108. 11 12 13 Ur iex 14 Ux 15 350C 16 17 MIL STD 883 Method2010 18 22 JERG 0 052
109. HH EEE JEDEC JESD22 112A JESD22 113A JESD26 A 4 5 6 JERG 0 039 BUE JERG 0 040 JERG 0 041 JERG 0 042 JERG 0 043 4 MBRON Im 1 ES
110. 125C 1000 2000 3T X 5 3 3 1 1 60 JERG 0 052 5 3 3 2 2 VoU ari Bx j 5 4 5 2 1 1 CA CA 2 10 0 130 85 RH PEM 96 1000 THB85 85 HAST or JESD22 A110 1000h THB JESD22 A101 for THB 85 85 25 0 JESD 22 A113 SMD JESD 22 B106 3 1 15 0 Ta 125 1000 MIL STD 883 Ta 125 1005 D
111. DPA 3 4 5 2 2 1 1 pa ZZ FUR GR 1 5 4 5 2 1 1 CA CA 2 10 i50 3T m 110 3 10 130 C PEM 8596RH 96 1000 A7 85 85 JESD22 A110 JESD22 A101 for THB HAST 25C 1000 QD bee veu I c ELE Pe JESD 22 A113 SMD JESD 22 B106 THB 85 85 4 10 Ta 125C 2000 Ta 125 1 MIL STD 883 1005 D 1000
112. PQR QMS 4 5 6 nu Lk e 23 R EE 37 JAXA 5 JERG 0 052 4 5 2 1 CD 5
113. 1 1 1 1 gt 2 2 1 3 2 3 3 3 3 x I 1 2 3 4 3 1 1 3 4 5 2 2 1 3 4 5 2 22173 5 3 2 1 93
114. 55C 125C PIND 2 MEN M m m na 025C y UM 240h 125 C 10 55C 125C 025C PDA 5 bes 240h 125 C 2 T ios PDA 5 1000h RVT HAST 96h HAST 96h THB 1000h 1 ER THB 1000h 1 2000h 125C DPA 1000h 125C DPA 100 100 HAST 96h 55C 125C 55C 125C
115. GE 2 4 5 2 1 1 3 CA 3 4 4 5 2 X 38 K 4 5 2 1 1 CA JERG 0 052 UU LATE No 1 No 2 No 3 No 4 No 5 SEIS e X X X X X MIL STD 750 Method 2071 4 MIL PEM MIL STD 883 Method 2009 9
116. HB 3T 2000 1000 C ZE 4 10 0 55 125 100 T 1 MIL STD 883 1010 B MIL STD 750 1051 B d QG32723 2 amp fEBE 25C 3 2 59 5 3 3 1 1 JERG 0 052 n di azy i a 5 RNC CNES See RNC CNES Q ST 60 106 RVT
117. 4 NSPAR PAP a NSPAR 4 1 2 DB DYE mi tert JIT ZER JERG 0 052 JAXA H NSPAR 4 5 1 NSPAR
118. JERG 0 052 12 13 14 EEE Electrical Electronic Electromechanical 15 NDA 3 2 JMR 012 2 C SAM Constant depth mode Scaning Acoustic Microscorpe CA Construction Analysis CDR Critical Design Review CNES
119. 100 MIL STD 883 1015 Tjmax 10 B Tg 10 1 125C 160 105 300 Tj 85 590 Tg 105 Ea 0 4eV e 6 100 3T 1 7 PDA 1 N A 4 6 PDA 5 55 E5 3 2 2 2 JERG 0 052 e 8 100 MIL STD 883 1014 A B C MIL STD 750
120. 15 20 c STD 033 5 3 8 5 3 2 5 3 3 K T 5 5 3 7 10 irs MAR D 7 2 d s N 2 5 3 a b c DPA 3 ik RNC CNES Q ST 60 100 Relifing 4 3 10 5 3 10 6 3 10 7
121. THB 1000h 1 RVT RVT 1000h 125 C 100 55C 125C 1 PM RNC CNES Q ST 60 100 General Requirements for the use of Co 4 5 2 2 X 4 5 2 2717 3 1 3 5 3 3 1 3 4 3 1 5 3 3 1 3 1 3 2 4 5 2 2 1 3 31 mmercial EEE Parts in Space Applications 5 3 2 5 3 2 1 3 5 3 3
122. X X X X X X MIL STD 750 Method 2076 3 X MIL STD 883 Method 2012 7 X X X X X ESCC 24800 PIND X X X X X MIL STD 750 Method 2052 3 MIL STD 883 Method 2020 7 X X X MIL STD 750 Method 1071 6 MIL STD 883 Method 1014 10 X X X RoHS EDX X DSC X X IEC60068 2 69 AFNOR A 89 400 X X X X X X X X MIL STD 750 Method 2074 4 2072 6 2069 MIL STD 883 Method 2010 10 MIL STD 883 Method 2013 SEM X X MIL STD 883 Method 2018
123. 1 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications ui HAST X 5 3 3 3 3 25C 25C 125C 1000 55 125C 100 64 Y 5 3 A IKIT JERG 0 052 4 4 6 3
124. 5 6 7 8 9 10 11 1 2 Je I i A HH N H LAT Jg Ped SB Ll 13 i
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127. 1 Q ST 60 1 06 1 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications E H uli AS iiid 25C m BODEN Q3T 25 C HAST 96h or THB 1000h 125 25C 0 1000 55 125C M Q 3T Ge ET e 25C
128. 3 1 1 FP Gar d 1 CA 5 4 5 2 1 1 CA 2 10 0 130C 85 RH PEM 96 1000 THB85 85 HAST or 1000h JESD22 A110 THB 85 85 JESD22 A101 for THB amp amp 25C JESD 22 A113 SMD JESD 22 B106 3 1 15 0 Ta 125C 2000 MIL STD 883 Ta 125 1005 D 1000 2
129. 62 home 3 64 iv JERG 0 052 NA QS a neo CPU 1990
130. Centre National d tudes Spatiales French National Space Agency COTS Commercial Off The Shelf CVCM Collected Volatile Condensable Materials DD Displacement Damage DPA Destructive Physical Analysis DSC Differential Scanning Calorimetry Ea Activation Energy ECSS European Coordination for Space Standardization EDX Energy Dispersive X ray spectroscopy EEE Electrical Electronic Electromechanical EFR Established Failure Rate ELDRS Enhanced Low Dose Rate Sensitivity ESCC European Space Components Coordination FPGA Field Programmable Gate Array GSFC Goddard Space Flight Center HAST Highly Accelerated Stress Test HSD Hot Solder Dip ITAR International Traffic in Arms Regulations JAXA Japan Aerospace eXploration Agency JEDEC Joint Electron Device Engineering Council 7 JESD LAT LET LETth MIL ASA DA PSL SPAR OTP PAPDB PDA PED PEM PIND PLD PQR PROM PSR PWB QML RH RoHS RVT SDR SEE SEU SEL SEB SEDR SEFI SEGR SET SEM SMD Tg THB TID TML JERG 0 052 JEDEC Standards Lot Acceptance Test Linear Energy Transfer ThresHold for Linear Energy Transfer MILitary National Aeronautics and Space Administration Non Disclosure Agreement NASA Parts Selection List Non Standard Parts Approval Request One Time Programmable devices Project Approved Parts Data Base Percent Defective Allowable Plastic Encapsulated Device Plastic Encapsulated Microcircuit Particle Impact Noise Detection Progr
131. E CS e E EE 70 Or E E E AA ANANS 70 NB UE RO eunana a A NEAN 71 iii JERG 0 052 ANC W NB AT AW AS AS AS EON OMNE RE OR AT AT X 2 1 llle 16 2 2 17 2 3 18 2 4 PWB 2 5 PWB 2 6 dil St ERO av ec HOP ORBI e rad er eta tr et te e E CDI 5 2 1 1 CA Less 39 Dp ne rci ds GE S ro TR TD EMINET ERE Qt 42 Bo II RC ELECE NAUES NR TI T REL TT 45 Bande qTHs c Ene ano vac a ette aac ios ated ea LAS atas 48 92 53 odo
132. MIL STD 883 2020 A MIL STD 750 2052 A 5 100 amp 25 C 6 100 MIL STD 883 1015 B T jmax 107C amp 125C 240 Tg 10 i 105 445 85 C 885 Tj Tg 105 1 Ea 0 4eV und cd 7 100 3T 53 K 5 3 2 1 1 JERG 0 052 RT UA ues EX sAE 3 Ap M a e
133. Q RNC CNES Q ST 60 106 TID EEEH ST 60 106 7 ASTM E 595 ASTM E 595 JERG 0 034 JERG 0 034 1 TTID 2 C SAM PEM RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications Sby 46 fi 3T 3 10 C 25C 3 NE H
134. 0 Method 1071 6 MIL STD 883 Method 1014 10 X X IEC60068 2 69 AFNOR A 89 400 X X X NA X X X MIL STD 750 Method 2074 4 2072 6 PEM 2069 MIL STD 883 Method 2010 10 1 2 2 MIL STD 750 Method 2037 1 MIL STD 883 Method 2011 7 2 JEDEC 22 B116 X X MIL STD 883 Method 2021 3 Ch X X X X X MIL STD 750 Method 2017 2 MIL STD 883 Method 2019 5 66 JERG 0 052 5 3 6 1 DPA 1 MIL
135. 2 2 62 JERG 0 052 d 5 3 3 3 3 SE ary i 1 5 4 5 2 1 1 CA CA 2 10 0 130C 85 RH PEM 96 1000 THB85 85 Z4 JESD22 A110 HAST or JESD22 A101 for THB 1000h THB 85 85 1 25C 9 JESD 22 A113 SMD d c JESD 22 B106 3 15 0 Ta 125 1000 MIL STD 883 Ta 125 1 1005 D
136. 60068 2 69 Part 2 69 Tests Test Te Solderability testing of electronic components for surface mounting devices SMD by the wetting balance method 11 J STD 033 Handling packing shipping and use of moisture reflow sensitive surface mount devices 12 JAXA QPL QML 13 JEDEC JESD57 Test Procedures for the Measurement of Single Event Effects in 14 JERG 0 034 Semiconductor Devices from Heavy Ion Irradiation 15 JERG 0 039 16 JERG 0 040 17 JERG 0 041 18 JERG 0 042 19 JERG 0 043 20 JERG 0 050 21 JERG 1 XXX 22 JESD22 A101 Steady sta
137. AST 96h 125C or THB 1000 1000h 125C 1000 2000 JERG 0 052 zu 25C E 55 125C 0 100 PEAR 25C 55 125C 100 500 4 5 2 2 2 2 47 JERG 0 052 JERG 0 034 4 5 2 2 3 3 SU RE xr en f 1 CA 5 4 5 2 1 1 CA 9 1 RNC CNES Q ST 6 RNC CNES Q ST 60 106 TID 0 106 3 ASTM E 595 ASTM E 595 JERG 0 034 1 TID
138. Applications ui E 54 JERG 0 052 5 3 2 2 2 AZ 2 DA ED CENE 1 1005 N A 2 100 55 85 10 1 T MIL STD 883 1010 A 3 PIND 100 MIL STD 883 2020 A MIL STD 750 2052 A 4 100 amp 1 25C 5
139. E t SAIS pH H 10 NPSL NPSL http nepp nasa gov nps1 Z Important Application Notes BIAS d x8 FE
140. Er c xi D 2 3 HAL EN1IG D 4 5 D 6 PH s mM 1k ps M pss M EEE HD I jJ CF ES xi T g CTE BA a SN TH c
141. JERG 0 052 24 5 11 JAXA JAXA Disclaimer The information contained herein is for general informational purposes only JAXA makes no warranty express or implied including as to the accuracy usefulness or timeliness of any information herein JAXA will not be liable for any losses relating to the use of the information 305 8505 2 1 1 JAXA Japan Aerospace Exploration Agency JERG 0 052 pquco aper ren RS 1 UE e E EEE mero E PU 3 IND jm X EE EE EE 3 qo S dA AE teu etae M am MN 3 4 3 1 8 9 m CP ETC T Puce 9 TM LEE MAL a c m 9 4 2
142. S 5 RNC CNES Q ST 60 106 RYD 1 106 1 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in Space Applications ML 4 REM FE 25C HAST 96h or THB 1000h 25C TR OD 25C 125C 1000 25C 55 125C 100 25C 5 3 3
143. ammable Logic Device Post Qualification test Review Programmable Read Only Memory PreShipment Review Printed Wiring Board Qualified Manufacturer Listing Relative Humidity Restriction of the use of certain Hazardous Substances Radiation Verification Testing System Definition Review Single Event Effect SEU SEL SEB SEDR SEFI SEGR SET Single Event Upset pi Single Event Latch up Single Event Burnout Single Event Dielectric Rapture Single Event Functional Interrupt Single Event Gate Rapture Single Event Transient Scanning Electron Microscope Surface Mount Device Glass transition Temperature Temperature Humidity Bias Total Ionizing Dose Total Mass Loss JERG 0 052 4 JMR 012 4 1 4 2 NE 4 1 H
144. f Commercial EEE Parts in Space Applications ECSS Q ST 60 13 2011 JAXA 2010 m
145. te temperature humidity bias life test 23 JESD22 A110 Highly accelerated temperature and humidity stress test 24 JESD22 A112 MOISTURE INDUCED STRESS SENSITIVITY FOR PLASTIC SURFACE MOUNT DEVICES 25 JESD22 A113 Preconditionning of plastic surface mount devices prior to reliability testing JERG 0 052 26 JESD22 A121 Test method for measuring whisker growth on tin and tin alloy surface finishes 27 JESD22 B106 Resistance to soldering temperature for through hole mounted devices 28 JESD22 B116 WIRE BOND SHEAR TEST 29 JESD26 A GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS RESCINDED 30 JUR 012 31 JMR 004 32 MIL HDBK 217 Reliability Prediction of Electronic Equipment 33 MIL STD 750 TEST METHOD STANDARD SEMICONDUCTOR DEVICES 34 MIL STD 883 Test Methods Standard Microcircuits 35 MIL STD 1580 DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL PARTS 36 NPSL NASA Parts Selection List 37 NASA RP 1124 Outgassing Data for Selecting Spacecraft Materials 38 RNC CNES Q ST 60 100 General Requirements for the use of Commercial EEE Parts in n I Space Applications 39 RNC CNES Q ST 60 106 Radiation Hardness Assurance requirements 2 2
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