BodyCom™ Development Kit User's Guide
Contents
1. E FI MOL NO oA HIMdHODATLNS ao 1S SEOTADN aN ea El zn ain 01 Il SSA SSA n ain nosi ak sou T IMdHODAIENS a 213 AJA 1 2 ON 128 XIIS 4 4 umm d AND apa qur NITAD 7143 Issa x ISSA an E M 2 El ji ADT ON ados T IMdt0OA IFL NS A i t zoi OIGS X199 VLVAAT VIVA 41 poo gt 6 9 9 mn EE 5 g z 7 TIMAHOATAS anyo VJ m Ww nro ali D Gow t JON T 0 22 idi ain A IMd ODA LNS wyo 89 2 a tal au L e vin At t DS41649B page 39 2012 Microchip Technology Inc BodyCom Development Kit User s Guide FIGURE A 5 BodyCom CAPACITIVE PAD WR OZ 886 3 5753170 7 86 21 34970699 HEJH HL EH 86 755 83298787 Http www 100y com tw 5 NI e E as E 4L 2 zo 2 3 A ee DS41649B page 40 2012 Microchip Technology Inc BodyCom Development Kit User s Guide NOTES OZ 886 3 5753170 86 21 34970699 HEJ E PRRI 86 755 83298787 Http www 100y com tw be l i M 2012 Microchip Technology Inc DS41649B page 412. PadstabilityConmector 7 8 RC7 USART_CTS Mixer Clock Select 17 J14 1 2 OSCO Select Demo Board Functionality 2 3 OSCI Select 1 2 RC2 Touch J15 OSCI to 8 192 MHz Crystal C 3 4 RC3 MOD OUT n6 J8 5 6 RA2 MOD OUT N 317 OSCI from 8 192 MHz Canned OSC D 9 10 RC7 ENABLE 1 Push Button Signal 119 1 2 Button Detect RA4 DS41649B page 16 2012 Microchip Technology Inc Introduction FIGURE 1 3 BodyCom BOARD JUMPER LAYOUT oog Hee 2012 Microchip Technology Inc DS41649B page 17 BodyCom Development Kit User s Guide 1 4 3 Mobile Unit Hardware A picture of the BodyCom Development Board is shown in Figure 1 4 The board includes the below components as indicated in the diagram 1 3V 2032 battery clip 2 LED Indicators ICSP programming pads Hex inverter MCP2035 Analog Front End AFE device PIC16LF1827 18 pin Flash MCU with XLP technology Mobile module a and coupling pad b Key fob casing ONO onm FIGURE 1 4 BodyCom MOBILE UNIT HARDWARE Eo 1 5 USING THE DEVELOPMENT KIT OUT OF THE BOX Although intended as a development platform the BodyCom Development Kit may also be used directly from the box as a demonstration platform for the pre programmed PIC16LF1829 microcontroller The 2 PIC16LF1827 devices on the Mobile units are also pre
3. Y T anyo t AS l SE0ZdOW ayo 1971 20940 1 ano Tizo E vsn 1 zo 2 E 2 ISa a 19 1 D AS AGE r lt M e e e E EET DS41649B page 38 Development Kit Schematics BodyCom MODULE FIGURE A 4 Dd ATA sou 41 1n0 GOW TIHVNH X158 zal IND aTavna O 2D 9H SH 92 ACE 10 TOEYTA TAL nyo g SSA aaa 5 c SSA HC FFP IVOdSOVINIDIW Gcd d114 OSOLL SdO SN VILA VEd ZdID I1A NINTO IISO LVA fee 272 AMASIIVISTIDO I A ISOLVIAILL SSdI SNV ETA SSII LZ8L49L91d 1OGS Hc4 T14ADE ID LOX T CSO VE gt ISSJ CHOS CIOSPIO X L 8Ld LSdO LNV S TA ISSwddA WIDINM S V lt 44 NTON 172 NIDIW DX S SSdO SNV FE ONMS Fd2O DIDOL LDOCO fSdO PNV PVW lt Ig gt dVOA VId IdDO LYOQIW 6SdO 6NV C Ri OUS EADI LAOTO ATAA NITO ENITO ESAD ENV EVA ISSA gt IOGS CIGS CVQS 1Q XW D X LNINGW OI SdO 0L NV CEl 1n00VG J8WA NICIO CNICIO CSdORNV CVW lt gt gt CSS INICL ISdO INV IVH 5 VIVA AT gt TOGS ONITI9 0Sd 0NV 0VA NO ho gt aaa za Y 1a AL AL va add
4. Depending on the configuration of J14 the enable jumpers which must be populated change J15 J16 Crystal Oscillator enable jumpers J14 must be in pin 1 2 configuration J17 must be in pin 2 3 configuration J17 Canned Oscillator enable jumper J14 must be in pin 2 3 configuration Default 3 2 3 Coupling Pad Prototyping Pins The J9 pins are meant to be used for prototyping custom user coupling pads Prototypes can be added to the J9 pins while a coupling pad populates J7 J11 allowing for dual functionality while testing FIGURE 3 2 PROTOTYPING PINS Touch Pins Signal Pins 3 2 4 Coupling Pad Connectors The BodyCom Development Kit includes 2 demonstration coupling pads for use with the Base board J7 connects the coupling pad top trace to the touch sensing pin on the device J11 connects the coupling pad bottom trace to the signal pin TX RX of the board Custom coupling pads can also be connected at these points J12 J13 DO NOT connect to anything on the coupling pad They are used for stability only they DO NOT connect to GND rail DS41649B page 32 2012 Microchip Technology Inc BodyCom Development Kit Hardware 3 2 5 Base Board Demo Functionality Jumpers The jumpers on J8 are used to enable disable demo board functionality or to be used to breakout connections to prototype designs All jumpers must be populated for use of the demo application 1 2
5. Base Unit Jumpers Figure 1 3 has an image of the BodyCom Development Board highlighting the jumper layout as indicated in the diagram 1 Mixer Clock Select J14 Crystal oscillator enable J15 OSCI J16 OSCO Prototype Touch Top and Signal Bottom expansion pins J9 Touch sensor pad connector J7 Signal coupler connector J11 Coupling pad enable J10 connect LC signal to pad Canned oscillator D enable connects canned to OSCI J17 Base Board Demo Functionality Jumpers 1 2 RC2 Touch Sensor coupling pad 3 4 RC3 MOD OUT used by LC driver circuit 5 6 RA2 MOD OUT used by LC driver circuit 7 8 RA1 SW DET push button enable 9 10 RC7 ENABLE RX enable receive circuit 8 Input Select 1 2 Input on RA4 push button enabled 2 3 Input on pin selects OSCO 9 Bootloader MCP2200 Functionality 1 2 RC5 USART TX 3 4 RC6 USART_RX 5 6 software MCLR USART_RTS 7 8 RC7 USART CTS 10 Power Supply Select 1 2 9V external power supply 3 4 5V USB 11 Touch indicator LED enable YO NA UD FIGURE 1 2 BodyCom BOARD JUMPER CONFIGURATION E WY Function Power Supply J2 1 2 9V J9 Top pins Touch Expansion 2 3 USB Bottom Pins Signal Out Expansion Bootloader 110 MA Signal Pad Enable Jumper 15 3 4 RC6 USART_RX J12 Pad Stability Connector 5 6 MCLR USART_RTS J13
6. Touch Enable RC2 is used for Touch detection on J9 Top J7 3 4 MOD OUT RC3 pin is used to control half LC circuit for LF Driver circuit via on chip DSM 5 6 MOD OUT RA2 pin is used to control other half of LC circuit for LF Driver via inverted DSM signal 7 8 SW DET is connected to SW DET signal and used for push buttons Refer to J9 lt 2 3 gt 9 10 Enable RX RC7 controls the receive circuit Required for receiving communication 3 2 6 Input Select By altering J19 configuration of the push button detection pin 1 2 Configures push button detection on Pin RA1 Default 2 3 Configures push button detection on Pin RA4 RA4 is used for OSCO thus cannot be used for push button detection when using the crystal oscillator configuration 3 2 7 Bootloader MCP2200 Functionality The jumpers on J5 are used to enable disable bootloader functionality support All jumpers must be populated for use of GUI or bootloader 1 2 USART TX Connects RC5 to MCP2200 TX pin RC5 is the alternative RX pin for on chip USART 3 4 USART RX Connects RC6 to MCP2200 RX pin RC6 is the alternative TX pin for on chip USART 5 6 USART RTS Connects RA3 MCLR to MCP2200 RTS Request to Send pin RA3 is used a software MCLR pin on demo 7 8 USART CTS Connects to MCP2200 CTS Clear to Send pin RC7 is a GPIO 3 2 8 Power Supply Select This jumper select
7. be considered valid during communication Mobile IDs can be added viewed or deleted from within the BodyCom Application GUI After completing the initialization process the LCD will display the BodyCom Development Kit welcome splash screen indicating the current firmware version in use After a short time the display will change and the user can begin menu navigation or BodyCom demonstrations 2 4 BodyCom MENU SYSTEM From the main menu location the user has four selections BodyCom Eval Touch BodyCom Eval Proximity Debug Menu and View Mobile ID This simple menu system can be navigated using the push buttons S2 UP S3 DOWN and S4 SELECT The menu does have a rollover feature implemented meaning that if the user presses DOWN while in the View Mobile ID menu state the navigation will move to BodyCom Eval Touch vice versa pressing UP while in BodyCom Eval Touch will rollover to View Mobile ID The SELECT button is multi purposed based on the current state SELECT has no actions while in BodyCom Eval Touch However when in BodyCom Eval Proximity the SELECT button will Start Stop the TX RX function of the coupling DS41649B page 24 2012 Microchip Technology Inc BodyCom Demonstration Application pad Pressing the SELECT button while in either the Debug Menu or View Mobile ID state will Enter Exit those options allowing the user to view the debug menu states or paired Mobile IDs by pressing SELEC
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9. The MCP1703 is a CMOS low dropout voltage regulator with 250 mA maximum output MCP1703 works with input voltage of up to 16V and in combination with its low current consumption of 2 uA is an ideal solution for applications using multi cell 9V alkaline or one cell two cell and three cell lithium ion batteries 3 1 13 Generous Prototyping Area To assist in the development and testing of application hardware the XLP board includes a 24 x 11 prototype area for the installation of the user s custom circuitry Sources for the board power VDD and ground are located above the area Supplied from 19 different I O signals the prototyping area supplies a wide range of possible fea tures which can be tested and experimented with from the prototyping area 2012 Microchip Technology Inc DS41649B page 31 BodyCom Development Kit User s Guide 3 2 JUMPER CONFIGURATION The jumper features of the BodyCom Development Kit are listed below They are rep resented in the order given in 1 4 Development Board Features and Figure 1 3 3 2 1 Mixer Clock Select By altering the configuration of this jumper the user is able to select between two exter nal oscillator sources for use with the BodyCom Development Kit 1 2 Selects 8 192 MHz crystal oscillator for use 2 3 Selects 8 192 MHz canned oscillator for use Default Note J15 J16 J17 J19 are effected by this jumper configuration 3 2 2 External Oscillator Enables
10. i 9 J 294 0 DLL NV PV 5555 348 3d8L ood VW H194S91 ood Iva SI E 0080 vt 283 Sio GOd NITO ONV O VE SOA ro UND EE and ovi 6l 7 1050 WS 1vadsol em ZHINC6US aod 0 4 SSA PPA 02 4 T Wt 0050 ILIT 1250 YE PPA en our TA ser AE T o dd 5 6 8149 214 44 WONT ATE anyo 1080 OH DAT wld 0080 569 vir 2012 Microchip Technology Inc DS41649B page 36 Development Kit Schematics BodyCom DEVELOPMENT BOARD 2 OF 3 FIGURE A 2 c I c I ver vor I 4 11 t v T I c I eer eur v t v t I T i ec eur i S0 0rS Vd Id SLA Lavsn G 3981 22 19 ole v 4 1980 D 7S0 TA ZHWZI ND UNO UND gt 1WS 8200 d HMd g m 1 o to lo uno 0 7 Any an 28 i q lt 19 99 lt i i A DAS HH noA gt T T E T E 1 Ate EU e en ANATOEE LEOL TAN AWACOOS LEOL ILON 50 0
11. line options Opa Opa Bit values 0 1 Constants OxFF A Italic Courier New A variable argument file o Where file be any valid filename Square brackets Optional arguments mcc18 options file options Curly brackets and pipe Choice of mutually exclusive errorlevel 011 character arguments an OR selection Ellipses Replaces repeated text var name var name Represents code supplied void main void user DS41649B page 8 2012 Microchip Technology Inc Preface WARRANTY REGISTRATION Please complete the enclosed Warranty Registration Card and mail it promptly Sending in the Warranty Registration Card entitles users to receive new product updates Interim software releases are available at the Microchip web site RECOMMENDED READING This user s guide describes how to use the BodyCom Development Kit Other useful documents are listed below The following Microchip documents are available and recommended as supplemental reference resources Release Notes for MPLAB ICD 3 In Circuit Debugger For the latest information on using the BodyCom Development Kit read the Readme for BodyCom Development Kit htm file an HTML file in the Readmes subdirectory of the MPLAB IDE installation directory The release notes Readme contains update information and known issues that may not be included in this user s guide 2012 Microchip Technology Inc DS41649B page 9 BodyCom De
12. programmed to work with the demonstration platform In addition the BodyCom Mobile Unit has been designed for easy prototyping Refer to Chapter 2 BodyCom Demonstration Application for details on the demonstration code operation Refer to Chapter 3 BodyCom Development Kit Hardware for details on prototyping and expansion using the Mobile unit design 1 6 DEMONSTRATION PROGRAM The pre programmed example code on the PIC16LF1829 base and PIC16LF1827 mobile devices is available for download from the Microchip web site http www microchip com Security All required project files are provided so that the code may be used as an example or a platform for further development These may be DS41649B page 18 2012 Microchip Technology Inc Introduction used with the included PIC16LF1829 base and PIC16LF 1827 mobile device by pro gramming the device using a PICkit starter kit or any other Microchip programming tool 1 7 REFERENCE DOCUMENTS In addition to the documents listed in the Recommended Reading section these documents are also available from Microchip to support the use of the BodyCom Development Kit PIC16 L F1826 1827 Data sheet DS41391 PIC16 L F1825 1829 Data sheet DS41440 MCP2035 Data sheet DS22304 AN1391 Introduction to the BodyCom Technology DS01391 AN1310 High Speed Serial Bootloader for PIC16 and PIC18 Devices DS01310 PICkit 2 Programmer Debugger User s Guide 05515
13. the SELECT S4 button the LCD will reflect that the user is viewing valid Mobile IDs related to the specific Base unit The top line of the LCD will display how many Valid IDs are stored into the unit and which ID value the user is looking at By using the UP S2 and DOWN S3 button the user can browse the paired Mobile IDs By pressing the SELECT S4 button again the user will exit back to the main menu Note Additional Mobile IDs can be added or existing Mobile IDs can be deleted using the BodyCom Application GUI 2012 Microchip Technology Inc DS41649B page 27 BodyCom Development Kit User s Guide NOTES DS41649B page 28 2012 Microchip Technology Inc BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Chapter 3 BodyCom Development Kit Hardware This chapter provides a more detailed description of the hardware features of the BodyCom Development Kit 3 1 BASE UNIT HARDWARE FEATURES The key features of the BodyCom Development Kit are listed below They are represented in the order given in Section 1 4 Development Board Features and Figure 1 1 3 1 1 28 Pin Receptacle Expansion Header The BodyCom Development Board implements a 28 pin modular expansion interface J6 This modular expansion is in place to allow future interface expansion for future Microchip demo expansion boards or for use with custom prototype applications The connector pin assignments for J6 are shown below in Figure 3 1
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15. 53 PICKit M Programmer Debugger User s Guide 0551795 Compiled Tips n Tricks Guide DS01146 A V r M Bl 2012 Microchip Technology Inc DS41649B page 19 BodyCom Development Kit User s Guide NOTES WE 2 886 3 5753170 7 HUE 86 21 34970699 ER E 3 86 755 83298787 Http www 100y com tw DS41649B page 20 2012 Microchip Technology Inc BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Chapter 2 BodyCom Demonstration Application This chapter describes the demonstration application that is pre programmed on the PIC16LF1829 Base and PIC16LF1827 Mobile microcontrollers which demonstrates the BodyCom technology in a working application In the process the application highlights various features of these two microcontroller families while utilizing peripherals to help reduce the complexity of the system 2 1 INITIAL SETUP Although intended as a development platform BodyCom Development Board is also designed to be used directly from the box as a demonstration platform The demonstration firmware pre programmed into both the PIC 16LF 1829 and PIC16LF1827 microcontroller is ready for immediate use The demonstration firmware on the Base unit uses the on board LCD to display Mobile ID information mode of operation navigate debug menu system or view valid paired Mobile IDs The demonstrati
16. HE ae 2 d 886 3 5753170 7 86 21 34970699 EET HL RI 86 755 83298787 Http www 100y com tw MICROCI BodyCom Development Kit User s Guide 2012 Microchip Technology Inc DS41649B Note the following details of the code protection feature on Microchip devices Microchip products meet the specification contained in their particular Microchip Data Sheet Microchip believes that its family of products is one of the most secure families of its kind on the market today when used in the intended manner and under normal conditions There are dishonest and possibly illegal methods used to breach the code protection feature All of these methods to our knowledge require using the Microchip products in a manner outside the operating specifications contained in Microchip s Data Sheets Most likely the person doing so is engaged in theft of intellectual property Microchip is willing to work with the customer who is concerned about the integrity of their code Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code Code protection does not mean that we are guaranteeing the product as unbreakable Code protection is constantly evolving We at Microchip are committed to continuously improving the code protection features of our products Attempts to break Microchip s code protection feature may be a violation of the Digital Millennium Copyright Act If su
17. Representative Local Sales Office Field Application Engineer FAE Technical Support Customers should contact their distributor representative or field application engineer FAE for support Local sales offices are also available to help customers A listing of sales offices and locations is included in the back of this document Technical support is available through the web site at http Awww microchip com support REVISION HISTORY Revision A August 2012 Initial release of this document Revision B November 2012 Revised Sections 2 1 1 2 3 2 4 2 4 EE 2012 Microchip Technology Inc DS41649B page 11 BodyCom Development Kit NOTES DS41649B page 12 2012 Microchip Technology Inc BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Chapter 1 Introduction 1 4 INTRODUCTION Thank you for purchasing Microchip Technology s BodyCom Development Kit This board provides a low cost and simple solution for integrating the BodyCom system into a wide range of applications The demonstration software programmed into the supplied PIC16LF1829 20 pin Flash MCU with XLP technology displays information using the on board LCD and contains firmware to demonstrate the methods of working with the BodyCom source code framework The application demonstrates basic communication between a base station and single or multiple Mobile units using the BodyCom communication method Contained in the firmware are options usef
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19. T and then exit back to the main menu by again pressing SELECT 2 4 1 BodyCom Touch Mode The BodyCom Evaluation Touch mode allows the user to demonstrate the BodyCom Technology communication system through use of a dual purpose coupling pad Figure 2 3 describes the dual purpose coupling pad the vertical and diagonal coupling pads are the same as described The LCD screen should display BodyCom Eval on the top line the bottom line should read Wait for Touch when the system is ready The symbol in the top right corner of the first line is used as a CVD state indicator Refer to Figure 2 4 for a description Touching the coupling pad the indicator green LED D4 will turn on and the bottom line of the LCD will change to Searching as the Base unit issues out a command indi cating it is searching for a valid Mobile ID If the user has a valid Mobile unit in posses sion the LCD will display the Mobile s ID on the bottom line of the LCD Also the indicator LED will begin to blink indicating valid communications The Mobile unit will also have a red LED D1 begin to blink as the Mobile unit transmits As long as the user stays in possession or within a range of the Mobile unit the Base and Mobile will continue to communicate each instance indicated by the blinking LEDs If the user breaks contact with the Base unit or is out of range of the Mobile the firmware will return to Wait for Touch state If the user continues to stay
20. able BodyCom Development Kit Quick Start Guide DS41649B page 14 2012 Microchip Technology Inc Introduction 1 4 DEVELOPMENT BOARD FEATURES 1 4 1 Base Unit Hardware A picture of the BodyCom Development Board is shown in Figure 1 1 The board includes the below components as indicated in the diagram Expansion header B LCD w backlight C 8 192 MHz crystal D 8 192 MHz canned oscillator E PIC16LF1829 20 pin Flash MCU with XLP technology F SA612AD signal mixer G MCP602 CMOS op amp H Three application push buttons MCP2035 Analog Front End AFE device J 12 MHz crystal K MCP2200 L Mini B USB connect M Software MCLR button N ICSP programmer header O 2 MCP 1703 LDO P 9V power supply connector Q Generous prototyping area A more detailed discussion of each feature and its configuration is provided in Chapter 3 BodyCom Development Kit Hardware FIGURE 1 1 BodyCom BOARD LAYOUT m E pt 2 555555555555555 EE _ a ils 5 de PL 2012 Technology Inc DS41649B page 15 BodyCom Development Kit User s Guide 1 4 2 The BodyCom Development Board has a versatile range of jumper configurations for future application expansions and prototyping Figure 1 2 shows the required default jumper configuration for use of the BodyCom Development Board application firmware
21. also refer to Appendix A Development Kit Schematics It is recommended that users refer ence the schematic before using the expansion on the board This additional modular expansion allows the user to incorporate other Microchip demo boards or all expansion of peripheral features through use of the expansion interface FIGURE 3 1 EXPANSION HEADER CALLOUT 1 33V 2 RAS 3 N C 4 RA4 5 6 7 8 9 2012 Microchip Technology Inc DS41649B page 29 BodyCom Development Kit User s Guide 3 1 2 16x2 Character LCD with Controller and Backlight The board includes the NHD C0216CiZ FSW FBW 3V3 from Newhaven Display International The screen features the ability to write two lines x 16 characters runs at 3 VDD with a 3V backlight display supported by two side White LEDs used for backlight 3 1 3 Selectable External Oscillator Source The BodyCom Development Board contains two external crystals which can be used in development of BodyCom Technology applications The external 8 192 MHz Y2 crystal oscillator is supplied on the board but is not used in the demonstration program However by altering the default jumper con figuration and applying a few firmware changes use of the crystal with the devel opment kit can easily be achieved The external 8 192 MHz Y3 canned oscillator is supplied on the board and is used by the demonstration program Th
22. as a software controlled MCLR the on chip weak pull up is enabled along with the IOC feature on the RA3 pin This allows the PIC device to jump to the ISR whenever this button is pressed regard less of the demo applications current state From the ISR the PIC device will be given the RESET command allowing a software MCLR The on board debug application LED connected to RAO is then configured as an output and 2012 Microchip Technology Inc DS41649B page 23 BodyCom Development Kit User s Guide ready for use Icd init The LCD display is then configured for use by calling the function Icd init which contains the function i2c init and configure the PIC device for 2 7 communication with the LCD s Chip On Glass COG controller Icd st7032 c and Icd h The source file st7032 c and header file 1 contain multiple functions useful for working with the LCD display However it is important to note that the BodyCom demonstration software uses custom func tions to load a LCD buffer which can be refreshed to update the LCD The following descriptions highlight initialization for BodyCom specific functions These are required for use with BodyCom Technology system TD Init This function configures the pin RC2 for use with the CVD mTouch method of scanning TD CvdHandle The touch detection feature is easily implemented by calling the function whenever a touch scan is required This mak
23. as low as 2 7V while drawing around 230 uA of quiescent current per amplifier 3 1 7 User Defined Switches Three push buttons switches SW1 MCLR SW2 SW3 are provided for user defined digital inputs They are connected to the I O pins MCLR RG5 RB1 and RBO When pressed they pull the respective port pin to ground Using these switches requires the corresponding pin s internal weak pull ups be enabled When the switches are not required the pull ups can be disabled This adds the ability to reduce power consump tion in software BE HE 7 M FL 886 3 5753170 JER EH 86 21 34970699 RER EL G3 86 755 83298787 Http www 100y com tw DS41649B page 30 2012 Microchip Technology Inc BodyCom Development Kit Hardware 3 1 8 MCP2035 Analog Front End AFE Device The MCP2035 is an Analog Front End AFE optimized for BodyCom applications It is a single channel stand alone device for low frequency LF signal detection and low power short range transponder applications such as BodyCom communications The device can detect an input signal with amplitude as low as 1 mVPP and can demodulate an amplitude modulated input signal with as low as 896 modulation depth The device communicates through a simple Serial Peripheral Interface SPI operating with currents typically around 10 pA and standby currents of 2 uA 3 1 9 MCP2200 USB 2 0 to UART Protocol Converter with External Crystal The MCP2200 is a USB to UART serial conver
24. ch acts allow unauthorized access to your software or other copyrighted work you may have a right to sue for relief under that Act Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates It is your responsibility to ensure that your application meets with your specifications MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORY OR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ITS CONDITION QUALITY PERFORMANCE MERCHANTABILITY OR FITNESS FOR PURPOSE Microchip disclaims all liability arising from this information and its use Use of Microchip devices in life support and or safety applications is entirely at the buyer s risk and the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims Suits or expenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectual property rights QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV ISO TS 16949 Trademarks The Microchip name and logo the Microchip logo dsPIC FlashFlex KEELOQ KEELOQ logo MPLAB PIC PICSTART PIC logo rfPIC SST SST Logo SuperFlash and UNI O are registered trademarks of Microchip Technology Incorporated in the U S A and other countries FilterLab Hampshire HI TECH C Lin
25. display a range of 0001 to 0003 when no signal is present when the user makes contact with the coupling pad and thus the signal pad value will increase representing noise put on the line by the user DS41649B page 26 2012 Microchip Technology Inc BodyCom Demonstration Application By putting a Mobile unit into Continuous Wave the user can use this debug state to signal strength based on body location proximity or for receive circuit design debug ging 2 4 2 2 RECEIVE PACKET The Receive Packet debug menu state is used for debugging with Mobile units or again for receives circuit design In this mode the Base unit is put in Continuous Receive mode allowing the mobile to transmit packets continuously to test circuit reception and design 24 2 3 TRANSMIT CONTINUOUS WAVE The Transmit Continuous Wave debug menu state is used to confirm good operation of the Base unit transmit circuit This mode allows the user to attach a probe to the sig nal TX RX pins to see what strength of the 125 kHz signal the Base station is output ting The BodyCom Technology system does not require fine LC tuning the LC circuit in this design is being used as a voltage multiplier but by using the Transmit CW debug mode the user can make modifications which can increase decrease Q values based on application and design requirements 2 4 2 4 TRANSMIT LOOPBACK The Transmit Loopback debug menu state allows the user to pass a string of data with a val
26. e crystal is used by the PIC16LF 1829 MCU as its clock source Also it is used by the Signal Mixer 3 2 5 to mix the mobile response signal of 8 MHz into a 192 kHz signal which can be received and processed by the MCP 2035 AFE 3 1 4 PIC16LF1829 20 Pin Flash MCU with XLP Technology The PIC16LF1829 20 pin SSOP MCU with XLP technology was selected for use with the BodyCom Development Base Board This device contains a 32 MHz Internal Oscil lator Block with three selectable power ranges or can run from an external crystal This device uses extremely low active currents of 48 LA MHz 0 1 8V and up to 20 nA 1 8V during Sleep while supporting a large list of internal peripheral features such as 10 bit ADC 5 bit DAC 2 comparators DSM EUSART and more 3 1 5 Double balanced Mixer and Oscillator The Phillips SA612A double balanced mixer is a low power VHF monolithic double bal anced mixer with on board oscillator and voltage regulator This device supplies a low cost low power solution for communication systems The mixer can operate up to 500 MHZ requires a low amount of external parts supplies excellent sensitivity gain and noise protection while maintaining a low radiated energy level 3 1 6 MCP602 CMOS Op Amp The MCP602 is a low power dual operation amplifier which utilizes Microchip s advanced CMOS technology to provide low bias current high speed operation high open loop gain and rail to rail output swing The CMOS can run on
27. ear Active Thermistor MTP SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U S A Silicon Storage Technology is a registered trademark of Microchip Technology Inc in other countries Analog for the Digital Age Application Maestro BodyCom chipKIT chipKIT logo CodeGuard dsPICDEM dsPICDEM net dsPICworks dsSPEAK ECAN ECONOMONITOR FanSense HI TIDE In Circuit Serial Programming ICSP Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK mTouch Omniscient Code Generation PICC PICC 18 PICDEM PICDEM net PICkit PICtail REAL ICE rfLAB Select Mode SQI Serial Quad I O Total Endurance TSHARC UniWinDriver WiperLock ZENA and Z Scale are trademarks of Microchip Technology Incorporated in the U S A and other countries SQTP is a service mark of Microchip Technology Incorporated in the U S A GestIC and ULPP are registered trademarks of Microchip Technology Germany GmbH amp Co amp KG a subsidiary of Microchip Technology Inc in other countries All other trademarks mentioned herein are property of their respective companies 2012 Microchip Technology Incorporated Printed in the U S A All Rights Reserved Printed on recycled paper ISBN 9781620767085 Microchip received ISO TS 16949 2009 certification for its worldwide headquarters design and wafer fabrication facilities in Chandler and Tempe Arizona Gresham O
28. equires multiple jumper alterations Default jumper configuration table is shown in Figure 2 1 FIGURE 2 1 JUMPER TABLE X amp WW Function 5 Power Supply Alternative Touch Sensor 1 2 9v J9 Top pins Touch Expansion 2 3 USB Bottom Pins Signal Out Expansion Bootloader J10 Signal Pad Enable Jumper 1 2 RCS USART TX J11 Signal Pad Connector 3 4 RC6 USART RX Pad Stability Connector MCLR USART RTS Pad Stability Connector RC7 USART CTS Mixer Clock Select Touch Pad Connector 1 2 OSCO Select Demo Board Functionality 2 3 OSCI Select 1 2 RC2 Touch J15 OSCI to 8 192 MHz Crystal C 3 4 RC3 MOD OUT J16 OSCO to 8 192 MHz Crystal C 5 6 RA2 MOD OUT N 117 OSCI from 8 192 MHz Canned OSC D 7 8 RA1 SW DET 118 Touch LED Indicator Enable 9 10 RC7 ENABLE RX Push Button Signal 1 2 Button Detect on RA4 2 3 Button Detect on RA3 2 2 DEMONSTRATION PROGRAM OPERATION The demonstration program uses the on board LCD for basic menu system navigation and to display all relevant information The demonstration firmware has been devel oped to present a real world application using the BodyCom protocol source code to make adaptation of the BodyCom system into existing applications quick and easy making it easy to move from concept to prototype or to show proof of concept T
29. ers assemblers linkers and other language tools These include all MPLAB C compilers all MPLAB assemblers including MPASM assembler all MPLAB linkers including MPLINK object linker and all MPLAB librarians including MPLIB object librarian Emulators The latest information on Microchip in circuit emulators This includes the MPLAB REAL ICE and MPLAB ICE 2000 in circuit emulators In Circuit Debuggers The latest information on the Microchip in circuit debuggers This includes MPLAB ICD 3 in circuit debuggers and PICkit 3 debug express MPLAB IDE The latest information on Microchip MPLAB IDE the Windows9 Integrated Development Environment for development systems tools This list is focused on the MPLAB IDE MPLAB IDE Project Manager MPLAB Editor and MPLAB SIM simulator as well as general editing and debugging features Programmers The latest information on Microchip programmers These include production programmers such as MPLAB REAL ICE in circuit emulator MPLAB ICD 3 in circuit debugger and MPLAB PM3 device programmers Also included are nonproduction development programmers such as PICSTART Plus and PICkit 2 and 3 We A 886 3 5753170 MEJ ETE 86 21 34970699 WE 91 86 755 83298787 Http www 100y com tw DS41649B page 10 2012 Microchip Technology Inc Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels Distributor or
30. es the use of the CVD mTouch scanning easy to use very versatile making it easy to integrate into any future application BC HardwarelnitSystem This function is called to fully initialize the PIC device being used for BodyCom Technology applications This function is stored within the source file bc hardware timer2 c which is accompanied by the header file bc hardware timer2 h bc hardware timer2 h The bc hardware timer2 h file contains a large number of defines allowing for a wider range of customizable configurations for example the ability to select the BodyCom Technology to use TMR1 TMR2 demo TMR4 or TMR6 depending on the available peripherals in an application source files for these variations can be found in the BodyCom Application folder BC TimerON After the BodyCom Technology system is configured the macro TimerON is called for use with the system This macro is modified based on the defined within bc config h board GuiEnable To enable use of the BodyCom Application GUI with the BodyCom Development Kit the function comlnit is called to configure the system for communication with a PC via USB 2 0 to UART Serial communication using the MCP2200 CheckPairedList The final step before finishing the initialization process is to call the function ProtocolCheckPairedList which will read from the on chip EEPROM to decide which Mobile IDs have been paired to the Base unit and will
31. he application program allows the user to demonstrate the BodyCom system in two oper ation modes supplies multiple helpful system debug states within an easy menu struc ture and a list of valid paired Mobile IDs The BodyCom Development Board permits the user to experiment with an existing working reference circuit along with functional firmware or can easily be adapted into new circuit designs using the prototyping space provided on the board The application firmware flowchart is show below in Figure 2 2 Fee DS41649B page 22 2012 Microchip Technology Inc BodyCom Demonstration Application FIGURE 2 2 BodyCom DEMONSTRATION FIRMWARE FLOWCHART BodyCom Menu Debug Menu A Receive Strength O Poveup BodyCom Eval RS 51 Mode Touch Mode Intial System Setu E BodyCom Eval Receive Packet Proximity Mode Display BodyCom Version Splash Screen Transmit Continuous Wave Enter BodyCom Demo Menu Valid Mobile IDs Nn Touch Operation 2 3 DEMONSTRATION PROGRAM INITIALIZATION PROCESS On power up the PIC device will first run through its initialization process The demo specific modifications include disabling the MCLR fuse setting by configuring it as an input The MCLR functionality will be done via firmware by enabling the Inter rupt On Change IOC feature on the pin inside the Interrupt Service Routine ISR a software Reset is
32. id Mobile ID The LCD will display Trans Loopback on the 1st line and S4 to Start Stop on the bottom To complete a loopback action the Base unit must first know which mobile to communicate with To do this the user must either touch the coupling pad while in possession of a mobile or have the mobile within proximity of the coupling pad before attempting to acquire a mobile to communicate with By pressing SELECT 54 the Base unit will ping out for a Mobile unit when the mobile responds the Base unit will Know which ID to address It will then transmit a string message to the Mobile unit For this demo that string is Loopback Pass this message will be displayed on the LCD 2nd line when successful communication is established 2 4 2 5 TOUCH OPERATION The Touch Operation debug menu state allows the user to test the functionality of the CVD mTouch scanning in a system The bottom line of the LCD displays a R aw and an A verage value from the CVD conversion The CVD mTouch method is based off the average value recorded when an increase in the raw value is detected depending on the shift level it is registered as a valid touch or as noise This debug menu should be very helpful in understanding how to integrate the touch feature into a BodyCom Technology application 2 4 3 View Mobile IDs Selectable from the main menu the top line of the LCD will read Valid Mobile IDs while the bottom reads S4 to Enter Exit Pressing
33. in contact with the coupling pad and no valid Mobile ID is found the display will continue to show Searching until the CVD indicator changes to upon time out If the system has a time out the CVD will re initialize and wait for another touch This will require the user to remove the touch and then return it before another scan can occur FIGURE 2 3 COUPLING PAD BLUE Touch Sensor 27 Pad Stability Connectors 212 213 TX RX Signal RED Coupling Pad Q11 2012 Microchip Technology Inc DS41649B page 25 BodyCom Development Kit User s Guide FIGURE 2 4 CVD TOUCH INDICATORS CVD State Indicator Released Pressed Initializing Default 2 4 1 1 BodyCom PROXIMITY MODE The BodyCom Evaluation Proximity mode allows the user to demonstrate the BodyCom Technology communication system through use of a single coupling pad This mode of communication allows the user to trigger the BodyCom Technology scanning process through non touch based methods Because this method does not use the CVD mTouch method no indicators are used The LCDs first line will display BodyCom Prox while the second line will show S4 to Start Stop By pressing the S4 SELECT button the user put the Base unit into Scan mode by pressing it again it will stop By pressing SELECT S4 the LCDs bottom line will display Searching If a valid Mobile ID comes with
34. in order to bet ter accommodate the battery clip and over all stability of the Coupling Pad inside the case BodyCom Technology can be made to accommodate a large number of case solutions depending on the application approach and design DS41649B page 34 2012 Microchip Technology Inc AN BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Appendix A Development Kit Schematics The following schematic diagrams are included in this appendix Figure A 1 Schematic for BodyCom Development Board Figure A 2 Schematic for BodyCom Module Figure A 3 Schematic for BodyCom Capacitive Pad 2012 Microchip Technology Inc DS41649B page 35 BodyCom Development Kit User s Guide BodyCom DEVELOPMENT BOARD 1 OF 3 FIGURE A 1 UND 7 4 att 1 att at 20 0 20 0 20 e 4 e TL TL TE 2 v1 RO O 30 0 3010 30 0 8 S m 8 D Sz y err ar SAT 4 cH ST Lt 27 LO 2 LAS ET
35. in range of the coupling pad the bottom line will display the valid ID If the Mobile ID is moved away from the coupling pad the display will return to Searching until the user presses the SELECT S4 button once more Menu navigation can only occur when the Base unit is NOT SCANNING Note This mode of communication is considered an Intentional Radiator 2 4 2 BodyCom Debug Menu The BodyCom Evaluation Debug menu is made to help in the development or debug ging of applications which are adapting the BodyCom Technology into their system These debugging methods are built into the BodyCom framework code and should be used as an example on how to implement them into a user s application From the main menu the user will see the LCD display Debug Menu on the top line and S4 to Enter Exit on the bottom line By pressing the SELECT S4 button the user enters the Debug menu Once inside the debug menu pressing the SELECT S4 but ton in any state will exit the user back to the Debug Menu state of the main menu 24 21 RECEIVE STRENGTH The Receive Strength debug menu state is used to see a functional value for the Receive Signal Strength Indicator RSSI pin on the MCP2035 AFE device which is key to the BodyCom Technology The LCD bottom line will display RSSI XXXX this value represents the 10 Bit ADC conversion value used as a RSSI to represent the strength of the signal This value will for the most part
36. meet customer needs so some actual dialogs and or tool descriptions may differ from those in this document Please refer to our web site www microchip com to obtain the latest documentation available Documents are identified with a DS number This number is located on the bottom of each page in front of the page number The numbering convention for the DS number is DSXXXXXA where XXXXX is the document number and A is the revision level of the document For the most up to date information on development tools see the MPLAB IDE online help Select the Help menu and then Topics to open a list of available online help files INTRODUCTION This chapter contains general information that will be useful to know before using the BodyCom Development Kit Items discussed in this chapter include Document Layout Conventions Used in this Guide Warranty Registration Recommended Reading The Microchip Web Site Development Systems Customer Change Notification Service Customer Support Revision History DOCUMENT LAYOUT This document describes how to use the BodyCom Development Kit as a development tool to emulate and debug firmware on a target board The manual layout is as follows Chapter 1 Introduction This chapter introduces the user to the BodyCom Demonstration Kit and provides an overview of its features Chapter 2 BodyCom Demonstration Application This chapter describes how to
37. on firmware on the Mobile unit runs through a short setup state then quickly enters Sleep waking only to respond to base station request thus entering the maximum power saving mode 2 1 1 Configuring and Connecting the Hardware To get started with the board verify that it is properly configured 1 Verify that a power source is selected Populate power supply select J2 Pins 2 3 Mid Bottom pins a Pins 1 2 External 9V power supply Not included b Pins 2 3 5V USB cable supplied in kit 2 Populate J11 to enable the touch LED indicator 3 Select an external oscillator source by populating J14 Pins 2 3 Mid Bottom pins a Pins 1 2 Crystal oscillator is selected for use b Pins 2 3 Canned oscillator is selected for use Populate the canned oscillator enable J17 Leave Crystal Oscillator Enable J15 J16 unpopulated Populate Coupling Pad Enable J10 Populate all base board demo functionality J8 Populate Push Button Enable J19 Pins 1 2 Left Mid pins a Pins 1 2 Enable OSCO b Pins 2 3 Enable push buttons 9 Populate Bootloader MCP2200 Functionality J5 a DO NOT reprogram via ICSP while J5 is populated gt ga O 2012 Microchip Technology Inc DS41649B page 21 BodyCom Development Kit User s Guide b For GUI functionality J5 must be populated Demo application will work regardless of J5 configuration Note Selecting crystal oscillator r
38. regon and design centers in California and India The Company s quality system processes and procedures are for its PIC MCUs and dsPIC DSCs KEELOQ code hopping devices Serial EEPROMs microperipherals nonvolatile memory and analog products In addition Microchip s quality system for the design and manufacture of development systems is ISO 9001 2000 certified DS41649B page 2 2012 Microchip Technology Inc Manufacturer Microchip Technology Inc 2355 W Chandler Blvd Chandler Arizona 85224 6199 USA This declaration of conformity is issued by the manufacturer The development evaluation tool is designed to be used for research and development in a laboratory environment This development evaluation tool is not intended to he a finished appliance nor is it intended for incorporation into finished appliances that are made commercially available as single functional units to end users This development evaluation tool complies with EU EMC Directive 2004 108 EC and as supported by the European Commission s Guide for the EMC Directive 2004 108 EC 8 February 2010 This development evaluation tool complies with EU RoHS2 Directive 2011 65 EU For information regarding the exclusive limited warranties applicable to Microchip products please see Microchip s standard terms and conditions of sale which are printed on our sales documentation and available at www microchip com Signed for and on behalf of Microchip Technolog
39. roller Multiple oscillator options 8 192 MHz canned oscillator 8 192 MHz crystal oscillator Multiple power source options USB Mini B to USB B 5V cable included 9V external power supply not included Two coupling pad boards designs vertical and diagonal Full bridge MOSFET LC driver circuit example design Touch Signal prototyping pins Configuration selection jumpers to disable board components Four push buttons One Power LED One Application LED On chip program Flash memory and EEPROM storage MCP2200 with Bootloader support for easy firmware upgrades Generous prototyping area with 9V 5V 3V and GND rails Support for all Microchip compatible programmers and emulators MCP2035 is a single channel stand alone Analog Front End AFE device for low frequency LF signal detection Mobile Unit PIC16LF1827 18 pin Flash MCU with XLP technology Low power hex inverter full bridge LC driver circuit example design Example key fob design Plastic case Two Application LEDs On chip program Flash memory and EEPROM storage ICSP programming pads MCP2035 is a single channel stand alone Analog Front End AFE device for low frequency LF signal detection 1 3 WHAT S IN THE KIT The BodyCom Development Kit includes the following BodyCom Development Board Base unit 2 Mobile units with unique identification values pre programmed to Base unit 2 Plastic key fob containers USB mini B c
40. s which power supply the BodyCom Development Board will use 1 2 Selects 9V external power supply as power source 2 3 Selects 5V USB cable as power source Default 3 2 9 Touch indicator LED enable Populating J18 enables the use of the green LED D4 through pin RAO This LED is meant to assist in system debugging or as a functional LED 2012 Microchip Technology Inc DS41649B page 33 BodyCom Development Kit User s Guide 3 3 MOBILE UNIT HARDWARE FEATURES The key features of the BodyCom Mobile Unit are listed below They are represented in the order given in Section 1 4 Development Board Features and Figure 1 4 3 3 1 Battery Clip The BK 912 is a low height surface mount 2032 coin cell battery holder The battery clip supplies a reliable connection while fitting to most key fob size standards 3 3 2 LED Indicators There are 2 LED indicators populated on the Mobile unit The green LED D2 is con nected to pin RB7 The red LED D1 is connected to pin RB6 These LEDs are used in the demo application and are extremely useful when debugging the Mobile unit com munication system 3 3 3 ICSP Programming Pads Programming Pads on the Mobile unit make updating the firmware or prototyping with custom firmware relatively easy Head pins can easily be soldered to the pads for quick programming during prototyping Header pins can also be pressed against these pads to create a connection allowing for non in
41. ter which enables USB connectivity in application that have an UART interface The device reduces external components by integrating the USB termination resistors The MCP2200 also has 256 bytes of inte grated user EEPROM The MCP2200 has eight general purpose input output pins Four of the pins have alternate functions to indicate USB and communication status An external 12 MHz canned oscillator is used as a frequency source 3 1 10 Selectable Power Sources The BodyCom Development Board uses two selectable power sources listed below 9V external power supply connected to J3 with J2 configured on pins lt 1 2 gt An LDO 3 1 12 is used to create a 5V power rail Another LDO is used to create a 3 3V power rail for use with the PIC device and other on board components while using the 5V for the transmit receive circuit 5V USB cable connected to J1 with J2 configured on pins lt 2 3 gt An LDO 3 1 12 is used to create a 3 3V power rail for use with the PIC device while using the 5V for the transmit receive circuit The red LED D3 will turn on when the board is powered from either source 3 1 11 ICSP Programmer Header The 6 pin programmer header J4 can be used by the PICkit PICkit 3 and ICD3 programming devices Through use of the PICkit 3 the user is capable of debugging the included demonstration software or creating and debugging custom software in use with the BodyCom Development Kit 3 1 12 MCP1703 LDO
42. trusive re programming 3 3 4 Hex Inverter The Texas Instruments SN74LVCO4APWR Hex inverter is used for the LC Driver circuit on the Mobile device Capable of operating from 1 65 to 3 6V the circuit is controlled using a single GPIO This minimizes component counts and circuit complexity 3 3 5 MCP2035 Analog Front End AFE Device Refer to 3 1 8 3 3 6 PIC16LF1827 18 Pin Flash MCU with XLP Technology The PIC16LF1827 18 pin SSOP MCU with XLP technology was selected for use with the BodyCom Mobile Unit This device contains a 32 MHz Internal Oscillator Block with three selectable power ranges or can run from an external crystal This device uses extremely low active currents of 75 2 1 8V and up to 30 nA 1 8V during Sleep while supporting a large list of internal peripheral features such as 10 bit ADC 5 bit DAC 2 comparators DSM EUSART and more 3 3 7 Mobile Module and Coupling Pad The BodyCom Mobile Unit has been designed so that a Mobile module which contains all circuitry can be sandwiched with any form of a coupling pad In the BodyCom Kit design the coupling pad has the battery clip attached to a supply power TP2 3 3V TP3 GND along with a single signal connector TP1 This allows for expanding Mobile unit designs 3 3 8 Key Fob Casing The Mobile unit is contained inside the key fob FB 20 series from PolyCase with a sin gle button option The case has had very small modifications made to it
43. ul for debugging or evaluating a BodyCom application design as well as a menu system which allows the user to view mobile devices actively paired to the base station These applications have been optimized for quick efficient and simple adaptation thus have been designed in a portable code method to reduce implementation time of the BodyCom framework The BodyCom Development Kit also includes 2 Mobile units which are enclosed within a generic key fob These Mobile units have been pre programmed with firmware which allows them to communicate with the base station each unit possessing its own unique ID number paired with the Base unit The Mobile units once powered will enter a Sleep state until a request is received from the Base unit After receiving a request the Mobile units will wake up generate a response and then return to Sleep until any other information is requested The mobile circuit and firmware can easily be adapted for quick and easy custom Mobile unit designs Please visit the following web site to download the latest quick start guide user s guide application firmware bootloader source code and BodyCom GUI executable http www microchip com Security 2012 Microchip Technology Inc DS41649B page 13 BodyCom Development Kit User s Guide 1 2 HIGHLIGHTS The BodyCom Development Kit includes these features Base Unit PIC16LF1829 20 pin Flash MCU with XLP technology 16x2 character LCD w backlight and cont
44. used The FOSC bits are configured to External Clock High power mode ECH and run from the on board 8 192 kHz canned oscillator No other Configuration Words fuse settings are required by the demonstration program The following descriptions highlight initialization for demo specific functions These are not required for use with the BodyCom Technology system 0 This module is configured to generate interrupt on overflow and a small TICK counter system is created using the ISR used for state refresh rates This allows different states to update the LCD display at a rate which is applicable to them The LCD display is controlled by the software created TICK flag while the flags set rate refresh speed is controlled by the variable TickTmr This function configures the push buttons S2 UP S3 DOWN S4 SELECT for basic operation with the BodyCom demonstration firmware BTN_Update Once configured the buttons can be managed by calling the function BTN_Update Within this function the current states of each button will be stored and a de bouncing process will be handled automatically BTN Get After BTN Update has been called the function BTN Get will return any press states for use with navigation This code is very portable allow ing it to be easily adapted to any type of application and has also been written in a very expandable method RESET Because the S1 is to be used
45. velopment Kit THE MICROCHIP WEB SITE Microchip provides online support via our web site at www microchip com This web site is used as a means to make files and information easily available to customers Accessible by using your favorite Internet browser the web site contains the following information Product Support Data sheets and errata application notes and sample programs design resources user s guides and hardware support documents latest software releases and archived software General Technical Support Frequently Asked Questions FAQs technical support requests online discussion groups Microchip consultant program member listing Business of Microchip Product selector and ordering guides latest Microchip press releases listing of seminars and events listings of Microchip sales offices distributors and factory representatives DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE Microchip s customer notification service helps keep customers current on Microchip products Subscribers will receive e mail notification whenever there are changes updates revisions or errata related to a specified product family or development tool of interest To register access the Microchip web site at www microchip com click on Customer Change Notification and follow the registration instructions The Development Systems product group categories are Compilers The latest information on Microchip C compil
46. work with the supplied BodyCom Demonstration firmware Chapter 3 BodyCom Development Kit Hardware This chapter provides a more detailed description of the BodyCom Development Kit Hardware and configuration settings Appendix A Development Kit Schematics This chapter provides the Development Kit Schematics 2012 Microchip Technology Inc DS41649B page 7 BodyCom Development Kit CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions DOCUMENTATION CONVENTIONS Description Represents Examples Arial font Italic characters Referenced books MPLAB IDE User s Guide Emphasized text is the only compiler Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window Save project before build dialog Underlined italic text with A menu path File Save right angle bracket Bold characters A dialog button Click OK A tab Click the Power tab N Rnnnn A number in verilog format 4 b0010 2 hF1 where N is the total number of digits R is the radix and n is a digit Text in angle brackets lt gt A key on the keyboard Press Enter F1 Courier New font Plain Courier New Sample source code define START Filenames autoexec bat File paths c mcci8 n Keywords _asm endasm static Command
47. y Inc at Chandler Arizona USA Derek Carlson Date VP Development Tools 2012 Microchip Technology Inc DS41649B page 3 BodyCom Development Kit User s Guide NOTES DS41649B page 4 2012 Microchip Technology Inc AN BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Table of Contents Preface 2 RNase eqno te Nate 7 Introduction o iii AN set 7 Doc ment 1 Nus 7 Conventions Used in this Guide 8 RecommendedReading 9 The Microchip Web Site 9 Customer Support 7 th tte AN 11 Document Revision 11 Chapter 1 Introduction X Car 13 Chapter 2 BodyCom Demonstration Application 21 Chapter 3 BodyCom Development Kit Hardware 29 Appendix A Development Kit Schematics nennen nnn 35 2012 Microchip Technology Inc DS41649B page 5 BodyCom Development Kit User s Guide NOTES DS41649B page 6 2012 Microchip Technology Inc BodyCom DEVELOPMENT KIT MICROCHIP USER S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated and this manual is no exception Microchip tools and documentation are constantly evolving to
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