Home

Intel D2550DC2

1. Supported processors http processormatch intel com Chipset information http www intel com products desktop chipsets index htm BIOS and driver updates http downloadcenter intel com Tested memory http www intel com support motherboards desktop sb CS 025414 htm Integration information http www intel com support go buildit Processor The board has a passively cooled soldered down Dual Core Intel Atom processor with integrated graphics and integrated memory controller 7 NOTE 16 The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the processor heatsink area for maximum heat dissipation effectiveness For information about Refer to Power supply connectors Section 2 2 2 3 page 46 Product Description 1 3 1 Intel D2550 Graphics Subsystem 1 3 1 3 1 1 Intel Graphics Media Accelerator 3650 Graphics Controller Intel GMA The Intel GMA 3650 graphics controller features the following e 640 MHZ core frequency e High quality texture engine DX9 3 and OpenGL 3 0 compliant Hardware Pixel Shader 4 1 Vertex Shader Model 4 1 Video Blu Ray 2 0 H 264 amp VC1 hardware decoder PAVP 1 1c HDCP 1 3 e Display Supports HDMI and DVI displays up to 1920 x 1200 at 60 Hz refresh WUXGA Dual independent display support For information about Refer to Obtaining graphics software and utilities
2. Inte Intel Desktop Board D2550DC2 Technical Product Specification July 2012 Part Number G73746 001 The Intel Desktop Board D2550DC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications Current characterized errata are documented in the Intel Desktop Board D2550DC2 Specification Update Revision History Revision Revision History Date 001 First release of the Intel Desktop Board D2550DC2 Technical Product July 2012 Specification This product specification applies to only the standard Intel Desktop Board D2550DC2 with BIOS identifier MUCDT10N 86A INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS OTHERWISE AGREED IN WRITING BY INTEL THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu POST completes The operating system loads While the operating system is loading USB keyboards and mice are recognized and may be used to configure the operating system Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program After the operating system loads the USB drivers all legacy and non legacy USB devices are recognized by the operating system and Legacy USB support from the BIOS is no longer used Additional USB legacy feature options can be accessed by using Intel Integrator Toolkit To install an operating system that supports USB verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system s installation instructions Overview of BIOS Features 3 6 BIOS Updates The BIOS can be updated using either of the following utilities which are available on the Intel World Wide Web site e Intel Express BIOS Update utility which enables automated updating while in the Windows environment Using this utility the BIOS can be updated from a file on a hard disk a USB drive a flash drive or a USB drive or an optical drive e Intel Flash Memory Update Utility which requires booting from DOS Using this utility the BIOS can be updated from a file on a hard
4. Table 16 Front Panel USB Header Pin Signal Name i Signal Name 1 5 VDC 3 D 5 D 7 Ground Ground 9 KEY no pin No Connect Table 17 Front Panel USB Header with Intel Z U130 USB Solid State Drive or Compatible Device Support Pin Signal Name Pin Signal Name 1 5 VDC 2 NC 3 D 4 NC 5 D 6 NC 7 Ground 8 NC 9 KEY no pin 10 LED 44 Technical Reference 2 2 2 2 Add in Card Connectors The board has the following add in card connectors e PCI Express Full Half Mini Card slot e Conventional PCI bus connector with riser card support for up to two PCI cards Note the following considerations for the Conventional PCI bus connector e The Conventional PCI bus connector is bus master capable e SMBus signals are routed to the Conventional PCI bus connector This enables Conventional PCI bus add in boards with SMBus support to access sensor data on the board The specific SMBus signals are as follows The SMBus clock line is connected to pin A40 The SMBus data line is connected to pin A41 The Conventional PCI bus connector also supports single slot and dual slot riser cards for use of up to two bus master PCI expansion cards In order to support two PCI bus master expansion cards the riser card must support the following PCI signal routing e Pin A11 additional 33 MHz PCI clock e Pin B10 additional PCI Request signal i e PREQ 2 e Pin B14 additional PCI Grant signal i e GNT 2 A
5. 2006 95 EC amp 2002 95 EC Espa ol Este producto cumple con las normas del Directivo Europeo 2004 108 EC 2006 95 EC amp 2002 95 EC Slovensky Tento produkt je v s lade s ustanoveniami eur pskych direkt v 2004 108 EC 2006 95 EC a 2002 95 EC Slovenscina Izdelek je skladen z dolocbami evropskih direktiv 2004 108 EC 2006 95 EC in 2002 95 EC Svenska Denna produkt har tillverkats i enlighet med EG direktiv 2004 108 EC 2006 95 EC amp 2002 95 EC T rk e Bu r n Avrupa Birli i nin 2004 108 EC 2006 95 EC ve 2002 95 EC y nergelerine uyar 5 1 3 Product Ecology Statements The following information is provided to address worldwide product ecology concerns and regulations 5 1 3 1 Disposal Considerations This product contains the following materials that may be regulated upon disposal lead solder on the printed wiring board assembly 5 1 3 2 Recycling Considerations As part of its commitment to environmental responsibility Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel s branded products to return used products to selected locations for proper recycling Please consult the http www intel com intel other ehs product ecology for the details of this program including the scope of covered products available locations shipping instructions terms and conditions etc hx TEZROSEARBRVUEZOKVEBUN RAR EXT Intel Product Recycling Program CBRE ARP lr ik DL gr s iu RFT dh E
6. China RoHS Environmentally Friendly Use Period Logo This is an example of the symbol used on Intel Desktop Boards and associated collateral The color of the mark may vary depending upon the application The Environmental Friendly Usage Period EFUP for Intel Desktop Boards has been determined to be 10 years K 85 Intel Desktop Board D2550DC2 Technical Product Specification 5 2 A A A 86 Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type Batteries should be recycled where possible Disposal of used batteries must be in accordance with local environmental regulations PRECAUTION Risque d explosion si la pile usag e est remplac e par une pile de type incorrect Les piles usag es doivent amp tre recycl es dans la mesure du possible La mise au rebut des piles usag es doit respecter les r glementations locales en vigueur en mati re de protection de l environnement FORHOLDSREGEL Eksplosionsfare hvis batteriet erstattes med et batteri af en forkert type Batterier bgr om muligt genbruges Bortskaffelse af brugte batterier bor foreg i overensstemmelse med g ldende milj lovgivning OBS Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type Brukte batterier b r kastes i henhold til gjeldende milj lovgivning VI KTI GT Risk f r explosion om batteriet ers tts med felaktig batterityp Batterier ska kasseras enligt de lokala mil
7. The back panel audio line out connector is designed to power headphones or amplified speakers only Poor audio quality occurs if passive non amplified speakers are connected to this output 39 Intel Desktop Board D2550DC2 Technical Product Specification 2 2 1 2 I O Shield The I O shield provided with the board allows access to all back panel connectors and is compatible with standard mini ITX and microATX chassis As an added benefit for system configurations with wireless PCI Express Mini Card solutions the I O shield also provides pre cut holes for user installation of up to three external wireless antennas Figure 10 shows an I O shield reference diagram 158 71 0 2 6 248 0 008 1 i 159 27 02 6 270 0 008 21 1 0 0831 0000 71 1 46 1 03 1007 27 77 2 799 1 815 0 118 0396 1 093 0 757 J NIF 0 000 0 298 HER 10457 5 92 12 47 0 233 16 92 0 491 0 666 N 18 23 0 718 is Ju 2792 1 163 ge 107 01 74 8 8 93 4 213 2 945 0 352 OM23331 Figure 10 1 O Shield Reference Diagram 40 Technical Reference 2 2 2 Component side Connectors and Headers Figure 11 shows the locations of the component side connectors and headers i OM23324 Figure 11 Component side Connectors and Headers 41 Intel Desktop Board D2550DC2 Technical Product Specification Table 10 lists the component side connectors and headers i
8. U WM Typographical Conventions This section contains information about the conventions used in this specification Not all of these symbols and abbreviations appear in all specifications of this type Notes Cautions and Warnings a Sal x NOTE Notes call attention to important information CAUTION Cautions are included to help you avoid damaging hardware or losing data Intel Desktop Board D2550DC2 Technical Product Specification Other Common Notation vi GB GB s Gb s KB Kb kb s MB MB s Mb Mb s TDP xxh x x V Used after a signal name to identify an active low signal such as USBP0 Gigabyte 1 073 741 824 bytes Gigabytes per second Gigabits per second Kilobyte 1024 bytes Kilobit 1024 bits 1000 bits per second Megabyte 1 048 576 bytes Megabytes per second Megabit 1 048 576 bits Megabits per second Thermal Design Power An address or data value ending with a lowercase h indicates a hexadecimal value Volts Voltages are DC unless otherwise specified This symbol is used to indicate third party brands and names that are the property of their respective owners Contents 1 Product Description dl SEYE en II DAN erg 11 ill Feature SU IN eege 11 1 122 E 13 1 13 Block Diagram i cic kad SR deta 15 1 2 Online Support nee ke 16 4 3 Processor do a 16 1 3 1 Intel D2550GraphicsSubsystem 17 1 4 System Memory series 18 1 5 In
9. 65 Intel Desktop Board D2550DC2 Technical Product Specification 3 6 2 Custom Splash Screen a Sal x During POST an Intel splash screen is displayed by default This splash screen can be augmented with a custom splash screen The Intel Integrator s Toolkit that is available from Intel can be used to create a custom splash screen NOTE If you add a custom splash screen it will share space with the Intel branded logo For information about Refer to Intel Integrator Toolkit http developer intel com design motherbd software itk 3 7 Boot Options In the BI OS Setup program the user can choose to boot from a hard drive optical drive removable drive or the network The default setting is for the optical drive to be the first boot device the hard drive second removable drive third and the network fourth 3 7 1 Optical Drive Boot Booting from the optical drive is supported in compliance to the El Torito bootable CD ROM format specification Under the Boot menu in the BIOS Setup program the optical drive is listed as a boot device Boot devices are defined in priority order Accordingly if there is not a bootable CD in the optical drive the system will attempt to boot from the next defined drive 3 7 2 Network Boot 66 The network can be selected as a boot device This selection allows booting from the onboard LAN or a network add in card with a remote boot ROM installed Pressing the lt F12 gt key during PO
10. Dimensions ns ay AS A kadm ik RAM 52 17 Localized High Temperature ZONES nen nnn nennen nennen nennen nenn 54 18 Fan Location Guide for Chassis Selection Chassis Orientation is Not Restricted arena euren Burma 57 Tables l1 Feature Sti Yaa iran EA ri HR Ba 11 2 Board Components Shown in Figure L A 14 3 SupporteedMemoryConfigurations 18 4 LAN Connector LED EE 24 5 Audio Jack Support saad cl RI ie Gd 25 6 Effects of Pressing the Power Switch 29 7 PowerStatesandlargetedSystemPower 30 8 Wake up Devices and Events AA 3l 9 System Memory Ma se E Ee Edge ENER 37 10 Component side Connectors and Headers Shown in Figure 11 42 Tle System Fan Header eis sun held AAA ro DE IIA 43 125 SATA Conner Eege aaa 43 13 Front Panel Wireless Activity LED Header 43 14 Front Panel Audio Header for Intel HD Audio 43 15 Front Panel Audio Header for AC 97 Audio 43 16 Front Panel USB leiert ai rs vat ERR 44 17 Front Panel USB Header with Intel Z U130 USB Solid State Drive or Compatible Device SuppoLE Belle a pesin eae sim 44 18 Power ee EE 46 19 Front Panel Heade ooo e o tie et Ho osea Ehe 47 20 States for a One Color Power LEID AAA 48 Intel Desktop Board D2550DC2 Technical Product Specification BIOS Configuration Jumper Settings 51 Fan Header Current Capability ea 53 Thermal Considerations for Compo
11. Intel Corporation may have patents or pending patent applications trademarks copyrights or other intellectual property rights that relate to the presented subject matter The furnishing of documents and other materials and information does not provide any license express or implied by estoppel or otherwise to any such patents trademarks copyrights or other intellectual property rights Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them Intel Desktop Boards may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order Intel the Intel logo and Intel Atom are trademarks of Intel Corporation in the U S and or other countries Other names and brands may be claimed as the property of others Copyright 2012 Intel Corporation All rights reserved Board Identification Information Basic Desktop Board D2550DC2 Identification Information AA Revision BIOS Revisio
12. Ox6E BDS Step14 Ox6F BDS return to DXE core should not get here continued 73 Intel Desktop Board D2550DC2 Technical Product Specification 74 Table 36 Port 80h POST Codes continued Port 80 Code Progress Code Enumeration Keyboard PS 2 or USB 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the keyboard 0x94 Clearing keyboard input buffer 0x95 Instructing keyboard controller to run Self Test PS 2 only Mouse PS 2 or USB 0x98 Resetting mouse 0x99 Detecting mouse Ox9A Detecting presence of mouse Ox9B Enabling mouse Fixed Media OxBO Resetting fixed media OxB1 Disabling fixed media 0xB2 Detecting presence of a fixed media IDE hard drive detection etc 0xB3 Enabling configuring a fixed media Removable Media 0xB8 Resetting removable media 0xB9 Disabling removable media OxBA Detecting presence of a removable media IDE CDROM detection etc 0xBC Enabling configuring a removable media DXE Core 0xE4 Entered DXE phase BDS OxE7 Waiting for user input OxE8 Checking password OxE9 Entering BIOS setup OxEB Calling Legacy Option ROMs Runtime Phase EFI OS Boot OxF8 EFI boot service ExitBootServices has been called OxF9 EFI runtime service SetVirtualAddressMap has been called Table 37 Typical Port 80h POST Sequence POST Code 24 27 28 33 E4 50 51 9
13. computer 32 Product Description 1 11 2 3 Instantly Available PC Technology Instantly Available PC technology enables the board to enter the ACPI S3 Suspend to RAM sleep state While in the S3 sleep state the computer will appear to be off the hard drive s and fan will power off the front panel LED will blink When signaled by a wake up device or event the system quickly returns to its last known state Table 8 on page 31 lists the devices and events that can wake the computer from the S3 state The board supports the PCI Bus Power Management Interface Specification Add in boards that also support this specification can participate in power management and can be used to wake the computer 1 11 2 4 Wake from USB USB bus activity wakes the computer from an ACPI S3 state A wi NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB and support in the operating system DR 1 11 2 5 PME Signal Wake up Support When the PME signal on the PCI bus is asserted the computer wakes from an ACPI S3 54 or 55 state with Wake on PME enabled in the BIOS 1 11 2 6 WAKE Signal Wake up Support When the WAKE signal on the PCI Express bus is asserted the computer wakes from an ACPI S3 S4 or S5 state 33 Intel Desktop Board D2550DC2 Technical Product Specification 1 11 2 7 5 V Standby Power Indicator LED 34 The 5 V standby power indicator LED shows that power is still present even
14. of Terms Term Description Ta The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink Tj Processor junction temperature Ya Junction to ambient thermal characterization parameter psi A measure of thermal solution performance using total package power Defined as T TA TDP Note Heat source must be specified for U measurements TIM Thermal Interface Material the thermally conductive compound between the heatsink and the processor die surface This material fills the air gaps and voids and enhances the transfer of the heat from the processor die surface to the heatsink TDP Thermal Design Power a power dissipation target based on worst case applications Thermal solutions should be designed to dissipate the thermal design power Ta external The measured external ambient temperature surrounding the chassis The external ambient temperature should be measured just upstream of the chassis inlet vent 55 Intel Desktop Board D2550DC2 Technical Product Specification 2 6 1 2 Thermal Specifications Guideline Terms Requirements TA lt 50 C T lt 100 C Ya lt 3 85 C W TIM Honeywell PCM45F TDP 10 W Ta external lt 35 C 2 6 1 3 Heatsink Design Guideline Maximum heatsink size Note 87 x52 x 29 mm Heatsink mass lt 63 6 grams Retention type Spring loaded fasteners 13 2 Ib Note Refers to the heatsink installed o
15. p NOTE BIOS IRQ programming for the second PCI slot on PCI riser card e D SEL AD20 Device 4 e Second PCI slot INT Mapping INT A A6 2 INT D of mother board PCI slot INT B B7 2 INT AX of mother board PCI slot INT C A7 gt INT B of mother board PCI slot INT D B8 2 INT C of mother board PCI slot m NOTE The Conventional PCI slot on this board does not support the PCI PHOLD function Due to this limitation errata certain PCI cards may experience performance or detection issues when DMA transfer is used as part of the PCI card operation 1 PHOLD is the signal required to hold the bus during DMA transfers 45 Intel Desktop Board D2550DC2 Technical Product Specification 2 2 2 3 Power Supply Connector 46 The board has a 2 x 12 power connector see Table 18 This board requires a TFX12V or SFX12V power supply Table 18 Power Connector Pin Signal Name Pin Signal Name 1 3 3 V 13 3 3 V 2 3 3 V 14 12 V 3 Ground 15 Ground 4 5 V 16 PS ON power supply remote on off 5 Ground 17 Ground 6 5 V 18 Ground 7 Ground 19 Ground 8 PWRGD Power Good 20 No connect 9 5 V Standby 21 45V 10 12 V 22 5 V 11 12 V 23 5 V 12 No connect 24 Ground Technical Reference 2 2 2 4 Front Panel Header This section describes the functions of the front panel header Table 19 lists the signal names of the front panel header Figure 12 is a connection diagram for the front panel h
16. when the computer appears to be off Figure 7 shows the location of the standby power indicator LED CAUTION If AC power has been switched off and the standby power indicator is still lit disconnect the power cord before installing or removing any devices connected to the board Failure to do so could damage the board and any attached devices OM23322 Figure 7 Location of the Standby Power Indicator LED 2 Technical Reference 2 1 Memory Map 2 1 1 Addressable Memory The board utilizes 4 GB of addressable system memory Typically the address space that is allocated for Conventional PCI bus add in cards PCI Express configuration space BIOS SPI Flash and chipset overhead resides above the top of DRAM total system memory On a system that has 4 GB of system memory installed it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions These functions include the following BIOS SPI Flash 2 MB Local APIC 19 MB Direct Media Interface 40 MB Internal graphics address registers Memory mapped I O that is dynamically allocated for Conventional PCI add in cards 35 Intel Desktop Board D2550DC2 Technical Product Specification The amount of installed memory that can be used will vary based on add in cards and BIOS settings Figure 8 shows a schematic of the system memory map All installed system memory can be used when there is no over
17. 1 Crisis Recovery has initiated 0x33 Loading recovery capsule 0x34 Start recovery capsule valid capsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEI SMM Phase 0x44 Begin CPU SMM Init smm relocate bases 0x45 Smm relocate bases for APs 0x46 End CPU SMM Init continued Board Status and Error Messages Table 36 Port 80h POST Codes continued Port 80 Code Progress Code Enumeration CPU DXE Phase 0x47 CPU DXE Phase begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed Ox4A Initialize strings to HII database 0x4B Initialize MP support 0x4C CPU DXE Phase End CPU DXE SMM Phase 0x4D CPU DXE SMM Phase begin 0x4E Relocate SM bases for all APs 0x4F CPU DXE SMM Phase end I O BUSES 0x50 Enumerating PCI buses 0x51 Allocating resources to PCI bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA ATAPI SATA Ox5A Resetting PATA SATA bus and all devices 0x5B Reserved for ATA BDS 0x60 BDS driver entry point initialize 0x61 BDS service routine entry point can be called multiple times 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 Ox6A BDS Step10 0x6B BDS Step11 0x6C BDS Step12 0x6D BDS Step13
18. 2 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 00 A3 Description Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Enumerating PCI buses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input Ready to boot Legacy USB driver disconnect Board Status and Error Messages 75 Intel Desktop Board D2550DC2 Technical Product Specification 76 5 Regulatory Compliance and Battery Disposal Information 5 1 Regulatory Compliance This section contains the following regulatory compliance information for Intel Desktop Board D2550DC2 e Safety standards e European Union Declaration of Conformity statement e Product Ecology statements e Electromagnetic Compatibility EMC standards e Product certification markings 5 1 1 Safety Standards Intel Desktop Board D2550DC2 complies with the safety standards stated in Table 38 when correctly installed in a compatible host system Table 38 Safety Standards Standard Title CSA UL 60950 1 Information Technology Equipment
19. BIOS Setup program This is the supervisor mode e The user password gives restricted access to view and change Setup options in the BIOS Setup program This is the user mode e If only the supervisor password is set pressing the lt Enter gt key at the password prompt of the BIOS Setup program allows the user restricted access to Setup e If both the supervisor and user passwords are set users can enter either the supervisor password or the user password to access Setup Users have access to Setup respective to which password is entered e Setting the user password restricts who can boot the computer The password prompt will be displayed before the computer is booted If only the supervisor password is set the computer boots without asking for a password If both passwords are set the user can enter either password to boot the computer e For enhanced security use different passwords for the supervisor and user passwords e Valid password characters are A Z a z and 0 9 Passwords may be up to 16 characters in length Table 31 shows the effects of setting the supervisor password and user password This table is for reference only and is not displayed on the screen Table 31 Supervisor and User Password Functions Password Password Password Supervisor to Enter During Set Mode User Mode Setup Options Setup Boot Neither Can change all Can change all None None None options Note options Note Supervisor Can change al
20. E RH VCEC ERSE HERE P hi aE e JEE Hh TER AER H FE BR W http www intel com intel other ehs product_ecology TARMA E HERD e E BALA jeet HIE Deutsch Als Teil von Intels Engagement f r den Umweltschutz hat das Unternehmen das Intel Produkt Recyclingprogramm implementiert das Einzelhandelskunden von Intel Markenprodukten ermoglicht gebrauchte Produkte an ausgewahlte Standorte f r ordnungsgem es Recycling zur ckzugeben Details zu diesem Programm einschlie lich der darin eingeschlossenen Produkte verf gbaren Standorte Versandanweisungen Bedingungen usw finden Sie auf der http www intel com intel other ehs product_ecology 79 Intel Desktop Board D2550DC2 Technical Product Specification 80 Espa ol Como parte de su compromiso de responsabilidad medioambiental Intel ha implantado el programa de reciclaje de productos Intel que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado Consulte la http www intel com intel other ehs product_ecology para ver los detalles del programa que incluye los productos que abarca los lugares disponibles instrucciones de env o t rminos y condiciones etc Fran ais Dans le cadre de son engagement pour la protection de l environnement Intel a mis en ceuvre le prog
21. ED states listed in Table 20 are default settings that can be modified through BIOS setup Systems built with a dual color front panel power LED can also use alternate color state options 2 2 2 4 4 Power Switch Header Pins 6 and 8 can be connected to a front panel momentary contact power switch The switch must pull the SW_ON pin to ground for at least 50 ms to signal the power supply circuitry to switch on or off The time requirement is due to internal debounce circuitry on the board At least two seconds must pass before the power supply circuitry will recognize another on off signal 48 Technical Reference 2 2 2 5 Front Panel USB Headers Figure 13 and Figure 14 are connection diagrams for the front panel USB headers A p NOTE e The 5 VDC power on the USB headers is fused e Use only a front panel USB connector that conforms to the USB 2 0 specification for high speed USB devices Power 5 V Power 5 V One D D One USB USB Port D D Port Ground No Connection Ground Key no pin OM20141 Figure 13 Connection Diagram for Front Panel USB Header Power 5 V No Connection One D No Connection USB Port D No Connection Ground No Connection Key no pin LED OM21794 Figure 14 Connection Diagram for Front Panel USB Header with Intel Z USB Solid State Drive or Compatible Device Support 49 Intel Desktop Board D2550DC2 Technical Product Specification 2 3 50 BIOS Configurat
22. ErP Refer to http www intel com go energystar http www epeat net http www kemco or kr new_eng pg02 pg02100300 asp http ec europa eu enterprise policies s ustainable business sustainable product policy ecodesign index en htm Regulatory Compliance and Battery Disposal Information 5 1 6 Regulatory Compliance Marks Board Level Intel Desktop Board D2550DC2 has the regulatory compliance marks shown in Table 41 Table 41 Regulatory Compliance Marks Description Mark UL joint US Canada Recognized Component mark Includes adjacent UL file number for Intel Desktop Boards E210882 CAA US FCC Declaration of Conformity logo mark for Class B equipment FG CE mark Declaring compliance to the European Union EU EMC directive Low Voltage directive and RoHS directive Australian Communications Authority ACA and New Zealand Radio Spectrum Management NZ RSM C tick mark Includes adjacent Intel supplier code number N 232 Japan VCCI Voluntary Control Council for Interference mark Korea Certification mark Includes an adjacent KCC Korean Communications Commission certification number KCC REM CPU D2550DC2 Taiwan BSMI Bureau of Standards Metrology and Inspections mark Includes adjacent Intel company number D33025 Printed wiring board manufacturer s recognition mark Consists of a unique UL recognized manufacturer s logo along with a flammability rating solder side
23. Plug and Play and SMBI OS Instantly Available Suspend to RAM support PC Technology e Wake on PCI PCI Express front panel USB ports and LAN Expansion e One Conventional PCI bus connector with riser card support for up to two PCI Capabilities cards e One PCI Express Full Half Mini Card slot Hardware Monitor e Hardware monitoring through the Windbond I O controller Subsystem e Voltage sense to detect out of range power supply voltages e Thermal sense to detect out of range thermal values e One fan header e One fan sense input used to monitor fan activity e Fan speed control 12 Product Description 1 1 2 Board Layout Figure 1 shows the location of the major components H Bj tI as TT is HJ 4 OM23316 Figure 1 Major Board Components Table 2 lists the components identified in Figure 1 13 Intel Desktop Board D2550DC2 Technical Product Specification 14 Table 2 Board Components Shown in Figure 1 Item callout from Figure 1 A TG mm S o m Qm m O S O Z Z r x Description Back panel connectors Standby power LED Processor core power connector 2 x 12 Intel Atom processor SO DIMM channel A socket DIMM 1 SO DIMM channel A socket DIMM 0 Intel NM10 Express Chipset SATA connectors System fan header Front panel header BIOS setup configuration jumper block Battery Front panel USB 2 0 header Front Panel Wireless Activity LED header Piezo monotonic speaker head
24. ST automatically forces booting from the LAN To use this key during POST the User Access Level in the BIOS Setup program s Security menu must be set to Full Overview of BIOS Features 3 7 3 Booting Without Attached Devices For use in embedded applications the BIOS has been designed so that after passing the POST the operating system loader is invoked even if the following devices are not present e Video adapter e Keyboard e Mouse 3 7 4 Changing the Default Boot Device During POST Pressing the lt F10 gt key during POST causes a boot device menu to be displayed This menu displays the list of available boot devices as set in the BIOS setup program s Boot Device Priority submenu Table 30 lists the boot device menu options Table 30 Boot Device Menu Options Boot Device Menu Function Keys Description 1 or lt i gt Selects a default boot device Enter Exits the menu saves changes and boots from the selected device lt Esc gt Exits the menu without saving changes 67 Intel Desktop Board D2550DC2 Technical Product Specification 3 8 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer with the following restrictions e The supervisor password gives unrestricted access to view and change all the Setup options in the
25. Safety Part 1 General Requirements USA and Canada EN 60950 1 Information Technology Equipment Safety Part 1 General Requirements European Union IEC 60950 1 Information Technology Equipment Safety Part 1 General Requirements International 77 Intel Desktop Board D2550DC2 Technical Product Specification 5 1 2 European Union Declaration of Conformity 78 Statement We Intel Corporation declare under our sole responsibility that the product Intel Desktop Board D2550DC2 is in conformity with all applicable essential requirements necessary for CE marking following the provisions of the European Council Directive 2004 108 EC EMC Directive 2006 95 EC Low Voltage Directive and 2002 95 EC ROHS Directive The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions L This product follows the provisions of the European Directives 2004 108 EC 2006 95 EC and 2002 95 EC e tina Tento v robek odpov d po adavk m evropsk ch sm rnic 2004 108 EC 2006 95 EC a 2002 95 EC Dansk Dette produkt er i overensstemmelse med det europ iske direktiv 2004 108 EC 2006 95 EC amp 2002 95 EC Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004 108 EC 2006 95 EC amp 2002 95 EC Eesti Antud toode vastab Euroopa direktiivides 2004 108 EC ja 2006 95 EC ja 2002 95 EC kehtestatud n uetele Suomi T
26. Section 1 2 page 16 1 2 High Definition Multimedia Interface HDMI The HDMI port supports standard enhanced or high definition video plus multi channel digital audio on a single cable The maximum supported resolution is 1920 x 1200 WUXGA The HDMI port is compliant with the HDMI 1 3a specification The HDMI port is enabled for POST whenever a monitor is attached 17 Intel Desktop Board D2550DC2 Technical Product Specification 1 4 The board has two 204 pin DDR3 SO DIMM sockets and supports the following memory features System Memory DDR3 SDRAM SO DIMMSs with gold plated contacts Unbuffered single sided or double sided DIMMs 4 GB maximum total system memory Minimum total system memory 256 MB Non ECC DIMMs Serial Presence Detect DDR3 1066 MHz DDR3 1333 MHz DDR3 1600 MHz SO DI MMs DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz NOTES Due to passively cooled thermal constraints system memory must have an operating temperature rating of 85 C The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the system memory area for maximum heat dissipation effectiveness If you are installing only one SO DIMM it must be installed in the bottom socket SO DIMM 1 To be fully compliant with all applicable DDR3 SDRAM memory specifications the board should be populated with SO DI MMs that support the Serial Presenc
27. an lm s piller yerel evre yasalar na uygun olarak at lmal d r OCTOPOTlA BnkopucTOBy TEe 6arapei mpaBunbHoro Tuny inakuie ICHYBaTUME pu3zuK BuUbyxy AKLJO MOXJIHBO BAKopucraHi 6arapei cr a yrunizyBaTu Yrunizayia BHKODHCTaHMX 6arapeli mae 6yru BUKOHaHa 3T ZHO MiCLIEBUX HODM LUO DeryJlIoIOTb OXOPOHY JOBKINNA Regulatory Compliance and Battery Disposal Information A UPOZORNENI V pripad vymeny baterie za nespr vny druh m ze dojit k vybuchu Je li to moZne baterie by mely byt recyklovany Baterie je treba zlikvidovat v souladu s mistnimi predpisy o ivotn m prost ed ETTEVAATUST Kui patarei asendatakse uue ebasobivat t pi patareiga v ib tekkida plahvatusoht T hjad patareid tuleb v imaluse korral viia vastavasse kogumispunkti T hjade patareide raviskamisel tuleb j rgida kohalikke keskkonnakaitse alaseid reegleid FIGYELMEZTET S Ha az elemet nem a megfelel tipusura cser li felrobbanhat Az elemeket lehet s g szerint jra kell hasznos tani A haszn lt elemeket a helyi k rnyezetv delmi el r soknak megfelel en kell kiselejtezni UZMAN BU Past v eksplozijas risks ja baterijas tiek nomain tas ar nepareiza veida baterij m Ja iesp jams baterijas vajadz tu nodot attiec gos pie em anas punktos Bateriju izme anai atkritumos j notiek saskand ar viet jiem vides aizsardz bas noteikumiem DEMESIO Naudojant netinkamo tipo baterijas irenginys gali sprogti Kai tik imanoma baterij
28. an be used not only in residential areas but also other areas 83 Intel Desktop Board D2550DC2 Technical Product Specification 5 1 5 84 Compliance Intel Desktop Board D2550DC2 meets the ENERGY STAR requirements listed in Table 40 when used in corresponding system configurations Table 40 ENERGY STAR Requirements ENERGY STAR Specification v4 0 v4 0 v5 0 v5 0 v5 0 Computer Type Desktop Computer Integrated Computer Desktop Computer Integrated Desktop Computer Thin Client Required States Idle State Cat A Sleep Mode Standby Level Off Mode Sleep Mode Idle State Active State Off Mode Sleep Mode Idle State Cat B ENERGY STAR 5 0 e Standby and ErP Capability Adjustments With and without Wake On LAN Sleep Standby With and without additional internal storage With and without Wake On LAN Sleep Standby Typical Electricity Consumption TEC Criteria N A Cat A under desktop conventional and desktop proxying operational mode weightings N A The Desktop Boards also meet the following international requirements e Republic of Korea e Standby program e European Union Energy related Products ErP directive For information about ENERGY STAR requirements and recommended configurations Electronic Product Environmental Assessment Tool EPEAT Korea e Standby Program European Union Energy related Products Directive 2009
29. ards aan re 5 1 2 European Union Declaration of Conformity Statement 5 1 3 Product Ecology Statements eyi Deka Seege d iye ns 514 EMC Regulations msxtr ia 5 1 5 ENERGY STAR 5 0 e Standby and ErP Compliance 5 1 6 Regulatory Compliance Marks Board Level 5 2 Battery Disposal Information degen d viii Contents Figures 1 Major Board Components u 2 22 RL RE 13 2 Block ELE EE E 15 3 Memory Channel and SO DIMM Configuration 19 4 LAN Connector LED Locations r aa 24 5 Back Panel Audio ele e ee 26 6 Thermal Sensors and Fan Header 28 7 Location of the Standby Power Indicator LED 34 8 DetailedSystemMemoryAddressMap 36 9 Back Panel Connectors ee 39 10 I O Shield Reference Diagram eene 40 11 Component sideConnectorsandHeaders 41 12 ConnectionDiagramforFrontPanelHeader 47 13 Connection Diagram for Front Panel USB Header 49 14 Connection Diagram for Front Panel USB Header with Intel Z USB Solid StateDriveorCompatibleDeviceSupport 49 15 LocationoftheBlIOSConfigurationJumperBlock 50 16 Board
30. as reikia naudoti pakartotinai Panaudotas baterijas i mesti b tina pagal vietinius aplinkos apsaugos nuostatus A ATTENZJONI Riskju ta splu joni jekk il batterija tinbidel b tip ta batterija mhux korrett Chatten g andhom ji u riciklati fein hu possibbli Ir rimi ta batteriji u ati g andu jsir skond ir regolamenti ambjentali lokali OSTRZE ENIE Ryzyko wybuchu w przypadku wymiany na baterie niew a ciwego typu W miar mo liwo ci baterie nale y podda recyklingowi Zu ytych baterii nale y pozbywa si zgodnie z lokalnie obowi zuj cymi przepisami w zakresie ochrony rodowiska 89 Intel Desktop Board D2550DC2 Technical Product Specification 90
31. at 1000 Mb s e DOS booted via network PXE system at idle e All on board peripherals enabled serial parallel audio Table 24 Minimum Load Configuration Current and Power Results 2 7 2 Maximum Load Configuration 58 Maximum load refers to the incremental power demands placed on the power supply augmenting the minimum load configuration into a fully featured system that stresses power consumption from all subsystems Maximum load configuration test results are shown in Table 25 The test configuration was defined as follows e 4GB DDR3 1066 MHz SO DIMM e SATA DVD R W Load DVD playback e 3 5 inch SATA hard disk drive running Microsoft Windows Vista Home Basic Load continuous read write benchmark e ntel Z U130 USB Solid State Drive or compatible device on the USB flash drive header Load continuous read write benchmark e Wireless card on PCI Express Full Half Mini Card slot connected via 802 11n protocol Load continuous read write benchmark on remote share e Riser card on conventional PCI slot populated with PCI LAN card running file transfer through local network to SATA hard drive e USB keyboard and mouse Technical Reference e Back and front panel host powered USB devices other than keyboard and mouse Load continuous read write activity on external drive peripheral e LAN linked at 1000 Mb s Load continuous read write benchmark on remote share e All on board peripherals enabled s
32. ction 0x2A Ox2F PEI phase post MRC execution 0x31 0x35 Recovery 0x36 Ox3F Platform DXE driver 0x41 Ox4F CPU Initialization PEI DXE SMM 0x50 Ox5F I O Buses PCI USB ATA etc Ox5F is an unrecoverable error Start with PCI 0x60 Ox6F BDS 0x70 Ox7F Output devices All output consoles 0x80 Ox8F For future use 0x90 Ox9F Input devices Keyboard Mouse OxAO OxAF For future use OxBO OxBF Boot Devices Includes fixed media and removable media Not that critical since consoles should be up at this point 0xC0 OxCF For future use OxDO OxDF For future use 71 Intel Desktop Board D2550DC2 Technical Product Specification 72 Table 36 Port 80h POST Codes Port 80 Code Progress Code Enumeration ACPI S States 0x00 0x01 0x02 0x03 0x04 0x05 Entering S0 S2 S3 S4 or S5 state 0x10 0x20 0x30 Resuming from S2 S3 S4 or S5 state PEI before MRC PEI Platform driver 0x11 Set boot mode GPIO init 0x12 Early chipset register programming 0x13 Basic chipset initialization 0x14 LAN init 0x15 Exit early platform init driver PEI SMBUS 0x16 SMBUS driver init 0x17 Entry to SMBUS execute read write 0x18 Exit SMBUS execute read write Memory 0x21 MRC entry point 0x24 Detecting presence of memory DIMMs 0x25 Override Detected DI MM settings 0x27 Configuring memory 0x28 Testing memory PEI Ms Recovery 0x3
33. dates for system components The MIF database defines the data and provides the method for accessing this information The BIOS enables applications such as third party management software to use SMBIOS The BIOS stores and reports the following SMBIOS information e BIOS data such as the BIOS revision level e Fixed system data such as peripherals serial numbers and asset tags e Resource data such as memory size cache size and processor speed e Dynamic data such as event detection and error logging Non Plug and Play operating systems require an additional interface for obtaining the SMBIOS information The BIOS supports an SMBIOS table interface for such operating systems Using this support an SMBIOS service level application running on a non Plug and Play operating system can obtain the SMBIOS information Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page 63 Intel Desktop Board D2550DC2 Technical Product Specification 3 5 64 Legacy USB Support Legacy USB support enables USB devices to be used even when the operating system s USB drivers are not yet available Legacy USB support is used to access the BIOS Setup program and to install an operating system that supports USB By default Legacy USB support is set to Enabled Legacy USB support operates as follows 1 2 3 When you apply power to the computer legacy support is disabled POST begins
34. dentified in Figure 11 Table 10 Component side Connectors and Headers Shown in Figure 11 Item callout from Figure 11 Description A Processor core power connector 2 x 12 SATA connector SATA connector System fan header Front panel header Front panel USB 2 0 header Front panel wireless activity LED header T O T M O O U Piezo monotonic speaker header l PCI Express Full Half Mini Card slot Conventional PCI bus add in card connector Front panel audio header ell dl be Front panel USB header supports Intel Z U130 USB Solid State Drive or compatible device brown colored 42 2 2 2 1 Technical Reference Signal Tables for the Connectors and Headers Table 11 System Fan Header Signal Name Ground 12 V PWM controlled pulses Tach Table 12 SATA Connectors Pin Signal Name 1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground Table 13 Pin Signal Name 1 Ground 2 MINICARD_WLAN Pin OTN Q O e Signal Name Port 1 Left channel Port 1 Right channel Port 2 Right channel SENSE_SEND Jack detection Port 2 Left channel Signal Name MIC_BIAS FP_OUT_R FP_OUT_L Front Panel Wireless Activity LED Header Signal Name Ground PRESENCE Dongle present Port 1 SENSE_RETURN Key no pin Port 2 SENSE_RETURN Signal Name AUD_GND AUD_GND FP_RETURN_R KEY no pin FP_RETURN_L 43 Intel Desktop Board D2550DC2 Technical Product Specification
35. dequada Consulte o site http www intel com intel other ehs product ecology em Ingl s para obter os detalhes sobre este programa inclusive o escopo dos produtos cobertos os locais dispon veis as instru es de envio os termos e condic es etc Regulatory Compliance and Battery Disposal Information Russian B KayecTBe yacTn CBONX o6s3aTe IbCTB K OKpyxaloulle cpene B Intel co3gaHa nporpaMMa yTunnaaunn mpoayKkumn Intel Product Recycling Program ana MPenoCcTaBneHNns KOHeUHBIM Monb30BaTenam Mapok npoAaykunn ntel BOBMOXHOCTM BO3BpaTa ucnonb3yemo MpPOAYKLUM B CNeynann3npOoBaHHbIe NYHKTbI ANA JOMKHO yrAnu3auM Moxany cTa o6paTWTecb Ha Be6 calr http www intel com intel other ehs product ecology 3a uHbopMaunen o6 ston nporpaMMe npuHumaembIx riponykrax Mecrax Mpuema MHCTpyKUMAX o6 ornpaske NONOXKEHUAX N YCNOBUAX M T A T rkce Intel evre sorumlulu una ba ml l n n bir par as olarak perakende t keticilerin Intel markal kullan lm r nlerini belirlenmi merkezlere iade edip uygun ekilde geri d n t rmesini ama layan Intel r nleri Geri D n m Program n uygulamaya koymu tur Bu program n r n kapsam r n iade merkezleri nakliye talimatlar kay tlar ve artlar v s dahil b t n ayr nt lar n grenmek i in l tfen http www intel com intel other ehs product ecology Web sayfas na gidin 5 1 4 EMC Regulations Intel Desktop Board D2550DC2 complie
36. der Current Capability m 53 2 5 2 Add in Board Considerations uror ee ne 53 2 6 Thermal onsideratloriss ie reete ER AS el cae 53 2 6 1 Passive Heatsink Design in a Passive System Environment 55 vii Intel Desktop Board D2550DC2 Technical Product Specification 2 7 Power Consumption u He Ida 2 7 1 Minimum Load Configuration rss ae ege 2 7 2 Maximum Load Conftouration r Pa Millia mS 2 9 Environmental sau uqa e ose eiut iacu tule era 3 Overview of BI OS Features 3 14 INEFOQUERION PR o klan s 3 2 BIOS Flash Memory Organization nter a ik Aus Resource CONTIGUA nass nee Euren 3 33 17 OPC AMO CONTI QUO areas 3 4 SystemManagementBIOS SMBI0S 32 Legacy USB Supp us amele rs 2 5 O A EE 381 BIOS Recovery use neigen eg 3 6 2 Custom Splash Screen a een ern 3 7 BOO OPHONS en en ee regen JAL Optical Drive BOL au er a ir ee 3 922 Network BOOK sx an ER IR EB 3 7 3 BootingWithoutAttachedDevices 3 7 4 Changing the Default Boot Device During POST 3 8 BIOS Security Features RE Helden 4 Board Status and Error Messages 4 1 BIOS Beep Codes 0 irn bre 4 2 Front panel Power LED Blink Codes r 4 3 Pla Error Messages uuu aeg 4 4 Port BOR POST CODOS sak mar a xia ER ma da aid 5 Regulatory Compliance and Battery Disposal Information 5 E Regulatory Compliance esse ee al 5 I L Safety Stand
37. disk a USB drive a flash drive or a USB drive or an optical drive e Intel F7 switch allows a user to select where the BIOS bio file is located and perform the update from that location device Similar to performing a BIOS Recovery without removing the BIOS configuration jumper Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS ell 2 NOTE Review the instructions distributed with the upgrade utility before attempting a BIOS update For information about Refer to BIOS update utilities http downloadcenter intel com 3 6 1 BIOS Recovery It is unlikely that anything will interrupt a BIOS update however if an interruption occurs the BIOS could be damaged Table 29 lists the drives and media types that can and cannot be used for BIOS recovery The BIOS recovery media does not need to be made bootable Table 29 Acceptable Drives Media Types for BIOS Recovery Media Type Note Can be used for BIOS recovery Optical drive connected to the SATA interface Yes USB removable drive a USB Flash Drive for example Yes USB diskette drive with a 1 44 MB diskette No USB hard disk drive Yes NOTE Supported file systems for BIOS recovery e NTFS sparse compressed or encrypted files are not supported FAT32 FAT16 FAT12 ISO 9660 For information about Refer to BIOS update instructions http www intel com support motherboards desktop sb CS 022312 htm
38. e Detect SPD data structure This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance If non SPD memory is installed performance and reliability may be impacted or the SO DIMMs may not function under the determined frequency Table 3 lists the supported SO DIMM configurations Table 3 Supported Memory Configurations Raw Card SO DIMM DRAM Device DRAM of DRAM Version Capacity Technology Organization Devices 1 GB 1 Gb 128 Mx8 8 2 GB 2 Gb 256Mx8 8 2 GB 1 Gb 128 Mx8 16 I 4 GB 2 Gb 256 Mx8 16 Notes 1 System memory configurations are based on availability and are subject to change 2 Support for one 4 GB SO DIMM installed in slot 1 Slot 0 must be left empty Product Description Figure 3 illustrates the memory channel and SO DIMM configuration OM23327 Figure 3 Memory Channel and SO DI MM Configuration 19 Intel Desktop Board D2550DC2 Technical Product Specification 1 5 Intel NM10 Express Chipset ex j x The Intel NM10 Express Chipset provides interfaces to the processor and the USB SATA LPC LAN PCI and PCI Express interfaces The Intel NM10 Express Chipset is a centralized controller for the board s I O paths NOTE The board is designed to be passively cooled in a properly ventilated chassis Chassis venting locations are recommended above the processor heatsink area for maximum heat dissi
39. e PC technology Wake from USB Power Management Event signal PME wake up support WAKE signal wake up support 1 11 1 ACPI ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer The use of ACPI with the board requires an operating system that provides full ACPI support ACPI features include e Plug and Play including bus and device enumeration e Power management control of individual devices add in boards some add in boards may require an ACPI aware driver video displays and hard disk drives e Methods for achieving less than 15 watt system operation in the power on standby sleeping state e A Soft off feature that enables the operating system to power off the computer e Support for multiple wake up events see Table 8 on page 31 e Support for a front panel power and sleep mode switch Table 6 lists the system states based on how long the power switch is pressed depending on how ACPI is configured with an ACPI aware operating system Table 6 Effects of Pressing the Power Switch If the system is in this and the power switch state is pressed for the system enters this state Off Less than four seconds Power on ACPI G2 G5 Soft off De ACPI GO working state On Less than four seconds Power off ACPI GO working state Be ACPI G2 G5 Soft off On Fail safe power off ACPI GO working state ACPI G2 G5 Soft off ACPI G1 sle
40. eader Table 19 Front Panel Header In In Pin Out Description Out Description Hard Drive Activity LED Power LED 1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out pull up to 5 V 3 HDA Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow LED LED Reset Switch On Off Switch 7 FP_RESET Jin Reset switch 8 Ground Ground Power Not Connected Front panel green LED UT Single Dual colored colored Power LED Power LED 7 R A hu Drive No ctivit ME y Po Y Reset Power Switch Switch 7 No 5 V DC m Connection OM20176 Figure 12 Connection Diagram for Front Panel Header 47 Intel Desktop Board D2550DC2 Technical Product Specification 2 2 2 4 1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive 2 2 2 4 2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole single throw SPST type switch that is normally open When the switch is closed the board resets and runs the POST 2 2 2 4 3 Power Sleep LED Header Pins 2 and 4 can be connected to a single or dual color LED Table 20 shows the default states for a single color LED Table 20 States for a One Color Power LED LED State Description Off Power off hibernate S5 S4 Blinking Sleeping S3 Steady Green Running Away S0 NOTE The L
41. eping state ACPI GO working state ACPI G1 sleeping state ACPI G2 G5 Soft off 29 Intel Desktop Board D2550DC2 Technical Product Specification 1 11 1 1 30 System States and Power States Under ACPI the operating system directs all system and device power state transitions The operating system puts devices in and out of low power states based on user preferences and knowledge of how devices are being used by applications Devices that are not being used can be turned off The operating system uses information from applications and user settings to put the system as a whole into a low power state Table 7 lists the power states supported by the board along with the associated system power targets See the ACPI specification for a complete description of the various system and power states Table 7 Power States and Targeted System Power Global States G0 working state G1 sleeping state G1 sleeping state G2 S5 G3 mechanical off AC power is disconnected from the computer Notes 1 Total system power is dependent on the system configuration including add in boards and peripherals Sleeping States S0 working S3 Suspend to RAM Context saved to RAM 54 Suspend to disk Context saved to disk S5 Soft off Context not saved Cold boot is required No power to the system Processor States C0 working No power No power No power powered by the sy
42. er PCI Express Full Half Mini Card slot Conventional PCI bus add in card connector Front panel audio header Front panel USB header supports Intel Z U130 USB Solid State Drive or compatible device brown colored 1 1 3 Block Diagram Product Description Figure 2 is a block diagram of the major functional areas Single Channel yal A Memory Bus O DIMM O Channel A SO DIMM 1 Da PCI Express Full Mini Half Mini Card Slot m u PCI Express x1 PCI Bus Serial ATA Interface Legacy 1 0 Controller Intel Atom processor Intel NM10 HD Audio Link r Back Panel Back Panel I on TA o DVI D Connector USB Te ra lt Front Panel USB A Back Panel USB sl USB i lt Back Panel USB i j PCI Express x1 Gigabit Ethernet Controller S PDIF Digital Audio Out optical 3 Line Out lt Mic In lt __ Line In OM23320 Figure 2 Block Diagram 15 Intel Desktop Board D2550DC2 Technical Product Specification 1 2 Online Support 1 3 A To find information about Visit this World Wide Web site Intel Desktop Board D2550DC2 http www intel com products motherboard index htm Desktop Board Support http www intel com p en_US support iid hdr support Available configurations for the Intel http ark intel com Desktop Board D2550DC2
43. erial parallel audio Table 25 Maximum Load Configuration Current and Power Results 2 8 Reliability The Mean Time Between Failures MTBF prediction is calculated using component and subassembly random failure rates The calculation is based on the Telcordia SR 332 Method Case 1 50 electrical stress 55 C ambient The MTBF prediction is used to estimate repair rates and spare parts requirements The MTBF data was calculated from predicted data at 55 C The Intel Desktop Board D2550DC2 has an MTBF of at least 394 528 hours 2 9 Environmental Table 26 lists the environmental specifications for the board Table 26 Intel Desktop Board D2550DC2 Environmental Specifications Parameter Specification Temperature Non Operating 20 C to 70 C Operating 0 C to 50 C Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches second2 Packaged Half sine 2 millisecond Free fall inches Velocity change inches s2 167 30 152 24 136 18 118 Vibration Unpackaged 5 Hz to 20 Hz 0 01 g2 Hz sloping up to 0 02 g2 Hz 20 Hz to 500 Hz 0 02 g Hz flat Packaged 10 Hz to 40 Hz 0 015 g Hz flat 40 Hz to 500 Hz 0 015 g Hz sloping down to 0 00015 g Hz 59 Intel Desktop Board D2550DC2 Technical Product Specification 60 3 Overview of BIOS Features 3 1 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory SPI Flash and can be updated using a di
44. inches 170 millimeters by 170 millimeters Location of the I O connectors and mounting holes are in compliance with the microATX specification 6 500 165 10 1 300 33 02 6 100 154 94 5 200 132 08 m 6425 163 20 6 200 157 48 OM23325 Figure 16 Board Dimensions 52 Technical Reference 2 5 Electrical Considerations 2 5 1 Fan Header Current Capability Table 22 lists the current capability of the fan header Table 22 Fan Header Current Capability Fan Header Maximum Available Current System fan LSA 2 5 2 Add in Board Considerations The board is designed to provide 2 A average of 5 V current for the Conventional PCI slot The total 5 V current draw for the Conventional PCI expansion slot total load must not exceed 2 A 2 6 Thermal Considerations E CAUTION A chassis with a maximum internal ambient temperature of 38 C at the processor fan inlet is a requirement Whenever possible use of a processor heat sink that provides omni directional airflow to maintain required airflow across the processor voltage regulator area is recommended E CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and or voltage regulator or in some instances damage to the board Fora list of chassis that have been tested with Intel Desktop Boards please refer to the following website http www3 intel com cd channel reseller asm
45. information about Refer to The location of the USB connectors on the back panel Figure 9 page 39 The location of the front panel USB headers Figure 11 page 41 1 5 3 SATA Support The board provides two SATA interface connectors that support one device per connector The board s SATA controller offers independent SATA ports with a theoretical maximum transfer rate of 3 0 Gb s on each port One device can be installed on each port for a maximum of two SATA devices A point to point interface is used for host to device connections unlike PATA which supports a master slave configuration and two devices on each channel For compatibility the underlying SATA functionality is transparent to the operating system The SATA controller supports IDE and AHCI configuration and can operate in both legacy and native modes In legacy mode standard ATA I O and IRQ resources are assigned IRQ 14 and 15 In native mode standard Conventional PCI bus resource steering is used Native mode is the preferred mode for configurations using the Windows Vista operating system For information about Refer to Obtaining AHCI driver Section 1 2 page 16 The location of the SATA connectors Figure 11 page 41 21 Intel Desktop Board D2550DC2 Technical Product Specification 1 6 Real Time Clock Subsystem K r A coin cell battery CR2032 powers the real time clock and CMOS memory When the computer is not plugged into a wall socket the battery has an esti
46. ion Jumper Block CAUTION Do not move the jumper with the power on Always turn off the power and unplug the power cord from the computer before changing a jumper setting Otherwise the board could be damaged Figure 15 shows the location of the jumper block The jumper determines the BIOS Setup program s mode Table 21 lists the jumper settings for the three modes normal configure and recovery ri RBRRRRRRRRRR RAARAARERRAARARARARARANARARAARARAARARRARAANRARAAA O Ett teta 222222 RRNNRRRRNNR RRNNRRRRRRRNNRRRNNNRRRNNNRRRNNHRHRNNHRRRNNRRRNNNN ee eee amm mmm mm OM23323 Figure 15 Location of the BIOS Configuration J umper Block Technical Reference Table 21 BIOS Configuration Jumper Settings Jumper Function Mode Setting Configuration Normal 1 2 The BIOS uses current configuration information and passwords for booting Configure 2 3 After the POST runs Setup runs automatically The maintenance menu is displayed Recovery None The BIOS attempts to recover the BIOS configuration See Section 3 7 for more information on BIOS recovery 51 Intel Desktop Board D2550DC2 Technical Product Specification 2 4 Mechanical Considerations 2 4 1 Form Factor The board is designed to fit into a mini ITX or microATX form factor chassis Figure 16 illustrates the mechanical form factor for the board Dimensions are given in inches millimeters The outer dimensions are 6 7 inches by 6 7
47. j v rdsbest mmelserna VARO R j hdysvaara jos pariston tyyppi on v r Paristot on kierr tett v jos se on mahdollista K ytetyt paristot on h vitett v paikallisten ymp rist m r ysten mukaisesti VORSI CHT Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr Die Batterie darf nur durch denselben oder einen entsprechenden vom Hersteller empfohlenen Batterietyp ersetzt werden Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend AVVERTI MENTO Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore Per disfarsi delle pile usate seguire le istruzioni del produttore Regulatory Compliance and Battery Disposal Information A PRECAUCI N Existe peligro de explosi n si la pila no se cambia de forma adecuada Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo Para deshacerse de las pilas usadas siga igualmente las instrucciones del fabricante A WAARSCHUWING Er bestaat ontploffingsgevaar als de batter wordt vervangen door een onjuist type batterij Batterijen moeten zoveel mogelijk worden gerecycled Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving A ATENC O Haver risco de explos o se a bateria for substitu da por um tipo de bateria incorreto As baterias devem se
48. l Can change a Supervisor Password Supervisor None only options limited number of options User only N A Can change all Enter Password User User options Clear User Password Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or and user set options limited Enter Password user user number of options Note If no password is set any user can change all Setup options 68 4 Board Status and Error Messages 4 1 BIOS Beep Codes The BIOS uses audible beep codes to signal status messages and error messages indicating recoverable errors that occur during the POST The beep codes are listed in Table 32 These beep codes can be heard through a speaker attached to the board s line out audio jack see Figure 5 B on page 26 Table 32 BIOS Beep Codes Type BIOS update in progress Video error Note Memory error Thermal trip warning None On off 1 0 second each two times then 2 5 second pause off entire pattern repeats beeps and pause once and the BIOS will continue to boot On off 1 0 second each three times then 2 5 second pause off entire pattern repeats beeps and pause until the system is powered off Alternate high and low beeps 1 0 second each for eight beeps followed by system shut down Note Disabled per default BIOS setup option Frequency 932 Hz When no VGA option ROM is found 932 Hz High beep 2000 Hz Low beep 1500 Hz 69 Intel Desk
49. lap of system addresses PCI Memory Range 4 approximately 750 MB DRAM Range 36 DOS Compatibility Memory 4 GB Top of system address space x FLASH APIC Reserved Upper S 4 GB of address space A gt 20 MB Top of usable DRAM memory visible to the operating system 1 MB 640 KB OFFFFFH OFOOOOH OEFFFFH 0 0000H ODFFFFH 0C0000H OBFFFFH 0A0000H O9FFFFH 00000H gt Upper BIOS area 64 KB Lower BIOS area 64 KB 16 KB x 4 Add in Card BIOS and Buffer area 128 KB 16 KB x 8 Standard PCI ISA Video Memory SMM Memory 128KB DOS area 640 KB Figure 8 Detailed System Memory Address Map 1 MB 960 KB 896 KB 768 KB 640 KB OKB OM21736 Technical Reference Table 9 lists the system memory map Table 9 System Memory Map Address Range Address Range decimal hex Description 1024 K 4194304 K 100000 FFFFFFFF 4095 MB Extended memory 960 K 1024 K F0000 FFFFF 64 KB Runtime BIOS 896 K 960 K E0000 EFFFF 64 KB Reserved 800 K 896 K C8000 DFFFF 96 KB Potential available high DOS memory open to the PCI bus Dependent on video adapter used 640 K 800 K A0000 C7FFF 160 KB Video memory and BIOS 639 K 640 K 9FC00 9FFFF 1 KB Extended BIOS data movable by memory manager software 512 K 639 K 80000 9FBFF 127 KB Extended conventional memory OK 512 K 00000 7FFFF 512 KB Co
50. m tuote noudattaa EU direktiivin 2004 108 EC 2006 95 EC amp 2002 95 EC maarayksia Fran ais Ce produit est conforme aux exigences de la Directive Europ enne 2004 108 EC 2006 95 EC amp 2002 95 EC Deutsch Dieses Produkt entspricht den Bestimmungen der Europ ischen Richtlinie 2004 108 EC 2006 95 EC amp 2002 95 EC EAAnvika To napov npoi v akoAoudel Tic Orar amp eic Tov Euponaikov O ny wv 2004 108 EC 2006 95 EC kal 2002 95 EC Magyar E term k megfelel a 2004 108 EC 2006 95 EC s 2002 95 EC Eur pai Iranyelv el r sainak Icelandic Pessi vara stenst regluger Evr pska Efnahags Bandalagsins numer 2004 108 EC 2006 95 EC amp 2002 95 EC Italiano Questo prodotto conforme alla Direttiva Europea 2004 108 EC 2006 95 EC amp 2002 95 EC Latvie u is produkts atbilst Eiropas Direktivu 2004 108 EC 2006 95 EC un 2002 95 EC noteikumiem Lietuviu is produktas atitinka Europos direktyvu 2004 108 EC 2006 95 EC ir 2002 95 EC nuostatas Malti Dan il prodott hu konformi mal provvedimenti tad Direttivi Ewropej 2004 108 EC 2006 95 EC u 2002 95 EC Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004 108 EC 2006 95 EC amp 2002 95 EC Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004 108 EC 206 95 EC i 2002 95 EC Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Europ ia 2004 108 EC
51. mated life of three years When the computer is plugged in the standby current from the power supply extends the life of the battery The clock is accurate to 13 minutes year at 25 C with 3 3 VSB applied NOTE If the battery and AC power fail custom defaults if previously saved will be loaded into CMOS RAM at power on When the voltage drops below a certain level the BIOS Setup program settings stored in CMOS RAM for example the date and time might not be accurate Replace the battery with an equivalent one Figure 1 on page 13 shows the location of the battery 1 7 Legacy I O Controller 22 The Legacy I O Controller provides the following features e Serial IRQ interface compatible with serialized IRQ support for Conventional PCI bus systems e Intelligent power management including a programmable wake up event interface e Conventional PCI bus power management support The BIOS Setup program provides configuration options for the Legacy I O controller For information about Refer to The location of the headers Figure 11 page 41 Product Description 1 8 LAN Subsystem The LAN subsystem consists of the following e Intel NM10 Express Chipset e Intel 825741 Gigabit Ethernet Controller for 10 100 1000 Mb s Ethernet LAN connectivity e RJ 45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include e CSMA CD protocol engine e LAN connect interface that supports the Ethernet c
52. n Notes G73894 600 MUCDT10N 86A 0069 1 2 Notes 1 The AA number is found on a small label on the component side of the board 2 The Intel NM10 Express Chipset and D2550 processor used on this AA revision consists of the following component Device Stepping S Spec Numbers CG82NM10 D2550 processor Errata Current characterized errata if any are documented in a separate Specification Update See http developer intel com products desktop motherboard index htm for the latest documentation Intel Desktop Board D2550DC2 Technical Product Specification Preface This Technical Product Specification TPS specifies the board layout components connectors power and environmental requirements and the BIOS for the Intel Desktop Board D2550DC2 It describes the standard product and available manufacturing options Intended Audience The TPS is intended to provide detailed technical information about the Intel Desktop Board D2550DC2 and its components to the vendors system integrators and other engineers and technicians who need this level of information It is specifically not intended for general audiences What This Document Contains Chapter Description 1 A description of the hardware used on the board A map of the resources of the board The features supported by the BIOS Setup program A description of the BIOS error messages beep codes and POST codes Regulatory compliance and battery disposal information
53. n bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan OSTRZEZENIE Istnieje niebezpieczenstwo wybuchu w przypadku zastosowania niew a ciwego typu baterii Zu yte baterie nale y w miar mo liwo ci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska PRECAUTIE Risc de explozie dac bateria este inlocuit cu un tip de baterie necorespunz tor Bateriile trebuie reciclate dac este posibil Depozitarea bateriilor uzate trebuie s respecte reglement rile locale privind protectia mediului BHMMAHME Mpun ncronb3oBaHun barapen HECOOTBETCTBYIOLUEFO TUla CYLJECTBYET PUCK ee B3pbiBa BaTapen JOJMKHbI ObITb YTUNU3UPOBAHBI MO BO3MOXHOCTH YTUSN3aUNA 6aTapen ZOJDKHa IDOBOZMTCA MO TTIDaBH IaM COOTBETCTBYHOLUNM MECTHbIM Tpe60BaHMsM UPOZORNENI E Ak bat riu vymen te za nespr vny typ hroz nebezpecenstvo jej vybuchu Bat rie by sa mali podla mo nosti v dy recyklova Likvid cia pou it ch bat ri sa musi vykon va v s lade s miestnymi predpismi na ochranu ivotn ho prostredia POZOR Zamenjava baterije z baterijo druga nega tipa lahko povzro i eksplozijo e je mogo e baterije reciklirajte Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi A dnt au A A 88 luna dg et ler ere ergeet ang ol s msiuumuatifienda ms TK E TE CH UYARI Yanl s t rde pil tak ld g nda patlama riski vard r Piller m mk n oldugunda geri d n st r lmelidir Kull
54. n the board Heatsink preload 2 6 1 4 Chassis Design Guideline 56 The pin fin heatsink design used on this board will be able to dissipate up to 10 W of processor power in most of the passively enabled system chassis This board is targeted for 3 7 liters volumetric or larger desktop tower orientation mini ITX and microATX chassis with a system fan The recommended fan type is an exhaust fan For best thermal performance it is recommended that the system fan provide reasonable airflow directly over all the major components on the board The pin fin heatsink is designed to have the best thermal performance when airflow direction is parallel to the heatsink fins The processor on the board will generate the highest amount of heat leading to high ambient temperature within the chassis The system fan should be located near the board region in order to effectively regulate airflow see Figure 18 A system fan located further away from the board region i e at the optical disk drive or hard disk drive region will be less effective in controlling the local ambient temperature Regardless of where the system fan is located the maximum local ambient temperature as defined by Tashould be capped at 50 C Chassis inlet vents should also provide adequate openings for airflow to pass through The recommended free area ratio of chassis vents should be equal to or greater than 0 53 By using the reference pin fin heatsink most chassis with a
55. nents rennen nennen 55 Minimum Load Configuration Current and Power Results 58 Maximum Load Configuration Current and Power Results 59 Intel Desktop Board D2550DC2 Environmental Specifications 59 BIOS Setup Program Menu Bar enne 62 BIOS Setup Program Function Keys 62 Acceptable Drives Media Types for BIOS Recovery 65 Boot Device Menu Options eren er re ehe det hehe RE EH 67 Supervisor and User Password Functions mn 68 BIOS Beep Codes rn ooo mr eM tu M We vM Ms 69 Front panel Power LED Blink Codes en ence ann nn nun nan nn 70 BIOS Error e EE ul dan ERREN a 70 Port BUN POST Code Ranges o es dE 71 P rt SOR POST ee EE 72 Typical Port 80h POST Sequence neng rasen 75 Safety Standards EE 77 EMC Reg l tioNS se seine aus Yegen 8l ENERGY STAR RequirementSs nan nen nun nennen nn nun nam nun nn 84 Regulatory Compliance Marks AA 85 1 Product Description 1 1 Overview 1 1 1 Feature Summary Table 1 summarizes the major features of Intel Desktop Board D2550DC2 Table 1 Feature Summary Form Factor Processor Memory Chipset Audio Graphics Legacy 1 O Control Peripheral Interfaces LAN Support Mini ITX 6 7 inches by 6 7 inches 170 millimeters by 170 millimeters compatible with microATX Passively cooled soldered down Dual Core Intel Atom processor wi
56. nventional memory 37 Intel Desktop Board D2550DC2 Technical Product Specification 2 2 vi 38 Connectors and Headers CAUTION Only the following connectors headers have overcurrent protection Back panel and front panel USB The other internal connectors headers are not overcurrent protected and should connect only to devices inside the computer s chassis such as fans and internal peripherals Do not use these connectors headers to power devices external to the computer s chassis A fault in the load presented by the external devices could cause damage to the computer the power cable and the external devices themselves NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements even if no device is attached to the cable Use shielded cable that meets the requirements for full speed devices This section describes the board s connectors and headers The connectors and headers can be divided into these groups e Back panel I O connectors see page 39 e Component side connectors and headers see page 41 Technical Reference 2 2 1 Back Panel 2 2 1 1 Back Panel Connectors Figure 9 shows the location of the back panel connectors OM23319 Item Description A S PDIF digital audio out optical B HDMI port C DVI D port D USB ports E LAN port F USB ports G Line in H Line out l Mic in Figure 9 Back Panel Connectors NOTE
57. o na eng tech_reference 53211 htm All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance E CAUTION Ensure that the ambient temperature does not exceed the board s maximum operating temperature Failure to do so could cause components to exceed their maximum case temperature and malfunction For information about the maximum operating temperature see the environmental specifications in Section 2 9 53 Intel Desktop Board D2550DC2 Technical Product Specification E CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit Failure to do so may result in damage to the voltage regulator circuit The processor voltage regulator area shown in Figure 17 can reach a temperature of up to 85 C in an open chassis Figure 17 shows the locations of the localized high temperature zones OUEBSUEEUS O EEBDUHEHDUE OM23326 Item Description A Processor voltage regulator area B Intel Atom processor C Intel NM10 Express Chipset Figure 17 Localized High Temperature Zones Table 23 provides maximum case temperatures for the board components that are sensitive to thermal changes The operating temperature current load or operating frequency c
58. on lt gt or lt gt gt Selects a different menu screen Moves the cursor left or right 1 or i Selects an item Moves the cursor up or down Enter Executes command or selects the submenu lt F9 gt Load the default configuration values for the current menu lt F10 gt Save the current values and exits the BIOS Setup program lt Esc gt Exits the menu 3 2 BIOS Flash Memory Organization The Serial Peripheral Interface Flash Memory SPI Flash includes an 8 Mb 1024 KB flash memory device 3 3 Resource Configuration 3 3 1 PCI Autoconfiguration The BIOS can automatically configure PCI devices PCI devices may be onboard or add in cards Autoconfiguration lets a user insert or remove PCI cards without having to configure the system When a user turns on the system after adding a PCI card the BIOS automatically configures interrupts the I O space and other system resources Any interrupts set to Available in Setup are considered to be available for use by the add in card 62 Overview of BIOS Features 3 4 System Management BIOS SMBIOS SMBIOS is a Desktop Management Interface DMI compliant method for managing computers in a managed network The main component of SMBIOS is the Management Information Format MIF database which contains information about the computing system and its components Using SMBIOS a system administrator can obtain the system types capabilities operational status and installation
59. ontroller e Conventional PCI bus power management Supports ACPI technology Supports LAN wake capabilities 1 8 1 LAN Subsystem Drivers LAN drivers are available from Intel s World Wide Web site For information about Refer to Obtaining LAN drivers Section 1 2 page 16 23 Intel Desktop Board D2550DC2 Technical Product Specification 1 8 2 RJ 45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ 45 LAN connector shown in Figure 4 OM23317 Figure 4 LAN Connector LED Locations Table 4 describes the LED states when the board is powered up and the Ethernet LAN subsystem is operating Table 4 LAN Connector LED States LED LED Color LED State Condition LAN link is not established Link Activity A Green LAN link is established Blinking LAN activity is occurring Off 10 Mb s data rate is selected or negotiated Link Speed B Green Yellow 100 Mb s data rate is selected or negotiated Yellow 1000 Mb s data rate is selected or negotiated 24 1 9 Product Description Audio Subsystem The board supports the Intel High Definition Audio Intel HD Audio subsystem The audio subsystem consists of the following Intel NM10 Express Chipset Realtek ALC662 audio codec The audio subsystem has the following features Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port The back panel a
60. orrect CMOS memory may have been corrupted Run Setup to reset values Memory Size Decreased Memory size has decreased since the last boot If no memory was removed then memory may be bad No Boot Device Available System did not find a device to boot 70 Board Status and Error Messages 4 4 Port 80h POST Codes K r K r During the POST the BIOS generates diagnostic progress codes POST codes to I O port 80h Ifthe POST fails execution stops and the last POST code generated is left at port 80h This code is useful for determining the point where an error occurred Displaying the POST codes requires a PCI bus add in card often called a POST card The POST card can decode the port and display the contents on a medium such as a seven segment display NOTE The POST card must be installed in the PCI bus connector The following tables provide information about the POST codes generated by the BIOS e Table 35 lists the Port 80h POST code ranges e Table 36 lists the Port 80h POST codes themselves e Table 37 lists the Port 80h POST sequence NOTE In the tables listed above all POST codes and range values are listed in hexadecimal Table 35 Port 80h POST Code Ranges Range Subsystem 0x00 0x05 Entering SX states S0 to S5 0x10 0x20 0x30 Resuming from SX states 0x10 0x20 S2 0x30 S3 etc 0x11 Ox1F PEI phase pre MRC execution 0x21 0x29 MRC memory dete
61. ould affect case temperatures Maximum case temperatures are important when considering proper airflow to cool the board 54 Technical Reference Table 23 Thermal Considerations for Components Component Maximum Case Temperature Intel Atom processor 100 C Processor voltage regulator area 85 C Intel NM10 Express Chipset 113 C Memory SO DIMM 85 C For information about Refer to Processor datasheets and specification updates Section 1 2 page 16 2 6 1 Passive Heatsink Design in a Passive System Environment This section highlights important guidelines and related thermal boundary conditions for passive heatsink design in a passive system environment Passive heatsink describes a thermal solution without a fan attached Passive system environment describes a chassis with either a power supply fan or a built in system fan This information should be used in conjunction with the Thermal and Mechanical Design Guide TMDG published for the Intel Atom processor D2000 series The TMDG contains detailed package information and thermal mechanical specifications for the processors The TMDG also contains information on how to enable a completely fanless design provided the right usage scenario and boundary conditions are observed for optimal thermal design While the TMSDG has a section on thermal design for passive system environments page 32 the information in this section can also be used to complement the TMDG 2 6 1 1 Definition
62. pation effectiveness For information about Refer to The Intel NM10 Express chipset http www intel com products desktop chipsets index htm Resources used by the chipset Chapter 2 1 5 1 1 Video Memory Allocation Video memory is allocated from the total available system memory for the efficient balancing of 2 D 3 D graphics performance and overall system performance Dynamic allocation of system memory to video memory is as follows e 256 MB total RAM results in 32 MB video RAM e 512 MB total RAM results in 64 MB video RAM e 1 GB total RAM results in 128 MB video RAM e 2 GB total RAM results in 224 MB video RAM 1 5 1 2 Digital Visual Interface DVI D 20 The DVI D port supports only digital DVI displays The maximum supported resolution is 1920 x 1200 at 60 Hz refresh WUXGA The DVI D port is compliant with the DVI 1 0 specification Product Description 1 5 2 USB The board provides up to seven USB 2 0 ports supports UHCI and EHCI and uses UHCI and EHCI compatible drivers four ports routed to the back panel and three ports routed to two front panel USB 2 0 headers One of the front panel USB headers brown colored supports an Intel Z U130 USB Solid State Drive or compatible device NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements even if no device is attached to the cable Use shielded cable that meets the requirements for full speed devices For
63. put For information about Refer to The locations of the front panel audio header and S PDIF audio header Figure 11 page 41 The signal names of the front panel audio header and S PDIF header Section 2 2 2 1 page 43 26 Product Description 1 10 Hardware Management Subsystem The hardware management features enable the board to be compatible with the Wired for Management WfM specification The board has several hardware management features including the following e Thermal monitoring e Voltage monitoring 1 10 1 Hardware Monitoring The hardware monitoring and fan control subsystem is based on the Winbond W83627DHG P device which supports the following e System ambient temperature monitoring e System fan speed monitoring e Power monitoring of 12 V 5 V 5 Vstdby 3 3 V and VCCP e SMBus interface 27 Intel Desktop Board D2550DC2 Technical Product Specification 1 10 2 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan header OM23321 Item Description A Remote thermal sensor B DTS located on the processor die C System fan header Figure 6 Thermal Sensors and Fan Header 28 Product Description 1 11 Power Management Power management is implemented at several levels including e Software support through Advanced Configuration and Power Interface ACPI e Hardware support Power connector Fan header LAN wake capabilities Instantly Availabl
64. r recicladas nos locais apropriados A eliminac o de baterias usadas deve ser feita de acordo com as regulamentac es ambientais da regi o A ASCIAROZZNASC IcHye pbi3bika Bbl6yxy Kani 3aMeHeHbl AKYMY IATAp HenpaBilnbHara TbIny AkymynaTapb rlaBiHHbI Ma MarubIMacui nepenpayoyBauyuya Maz6aynayya ag CTapbix akymynsaTapay narp36Ha 3rogHa 3 MACLIOBbIM 3akaHagaycTBaM na 3Kanorii A UPOZORNINI V pripad vym ny baterie za nespr vny druh m ze dojit k vybuchu Je li to mozn baterie by m ly byt recyklov ny Baterie je treba zlikvidovat v souladu s mistnimi p edpisy o ivotn m prost ed A rIpooox Yr apxe kiv uvoc yia Expn n GE nepintwon nou n unarap a avrikaraora si ano pia Aav aopevou TUnou Oi urarTapis 6a MpENEI va avaKUKAWVOVTGI OTAV KATI TETOIO Elva OuvaTo H an ppiyn rov XPNOILONOINUEVWV unarapiov MPENE va ylverai O U YUVA HE TOU KaTd TONO NEpIBAAAOVTIKOUG KAVOVIOLIOUG A VIGYAZAT Ha a telepet nem a megfelel tipusu telepre cser li az felrobbanhat A telepeket lehet s g szerint jra kell hasznositani A haszn lt telepeket a helyi k rnyezetv delmi el irasoknak megfelel en kell kiselejtezni As HARO ADE ai Gh 5 R Maki ii Be er ULL U ES ERBE BEES ARI Cit muneri RETE C CIEL 87 Intel Desktop Board D2550DC2 Technical Product Specification A A A AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul Bateri sepatutnya dikitar semula jika boleh Pelupusa
65. ramme Intel Product Recycling Program Programme de recyclage des produits Intel pour permettre aux consommateurs de produits Intel de recycler les produits us s en les retournant des adresses sp cifi es Visitez la page Web http www intel com intel other ehs product_ecology pour en savoir plus sur ce programme savoir les produits concern s les adresses disponibles les instructions d exp dition les conditions g n rales etc AAG ITITI Faia REE SEL fUME ATE UTIL IT FR eH EO MAGIK L TUES US DVETE 4v TV SLRSUS DJ N ZLER ESEK L HRA m Set BIKA CARNE TOJDI SLOR MARA http www intel com in tel other ehs product ecology HEE EIEKTRALN Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi lokasi terpilih untuk dikitarkan semula dengan betul Sila rujuk http www intel com intel other ehs product_ecology untuk mendapatkan butir butir program ini termasuklah skop produk yang dirangkumi lokasi lokasi tersedia arahan penghantaran terma amp syarat dsb Portuguese Como parte deste compromisso com o respeito ao ambiente a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados onde esses produtos s o reciclados de maneira a
66. s including e Power connector e Fan header e LAN wake capabilities e Instantly Available PC technology e Wake from USB e Power Management Event signal PME wake up support e WAKE signal wake up support e 5V Standby Power Indicator LED LAN wake capabilities and Instantly Available PC technology require power from the 5 V standby line K r NOTE The use of Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support 1 11 2 1 Fan Header The function operation of the fan header is as follows e The fan is on when the board is in the SO state e The fan is off when the board is off or in the 53 S4 or S5 state e The system fan header supports closed loop fan control that can adjust the fan speed and is wired to a fan tachometer input e The fan header supports 12 V 3 wire fans at 1A maximum For information about Refer to The locations of the fan header and thermal sensors Figure 6 page 28 The signal names of the system fan header Table 11 page 43 1 11 2 2 LAN Wake Capabilities LAN wake capabilities enable remote wake up of the computer through a network The LAN subsystem network adapter monitors network traffic at the Media Independent Interface The board supports LAN wake capabilities with ACPI in the following ways e By Ping e By Magic Packet Upon detecting the configured wake packet type the LAN subsystem asserts a wake up signal that powers up the
67. s with the EMC regulations stated in Table 39 when correctly installed in a compatible host system Table 39 EMC Regulations Regulation Title FCC 47 CFR Part 15 Title 47 of the Code of Federal Regulations Part 15 Subpart B Radio Subpart B Freguency Devices USA ICES 003 Interference Causing Equipment Standard Digital Apparatus Canada EN55022 Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment European Union EN55024 Information Technology Equipment Immunity Characteristics Limits and methods of measurement European Union EN55022 Australian Communications Authority Standard for Electromagnetic Compatibility Australia and New Zealand CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment International CISPR 24 Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement International VCCI V 3 V 4 Voluntary Control for Interference by Information Technology Equipment Japan KN 22 KN 24 Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act South Korea CNS 13438 Bureau of Standards Metrology and Inspection Taiwan 8l Intel Desktop Board D2550DC2 Technical Product Specification 82 FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules Operation is subject to the following two condi
68. sk based program The SPI Flash contains the BIOS Setup program POST the PCI auto configuration utility LAN EEPROM information and Plug and Play support The BIOS displays a message during POST identifying the type of BIOS and a revision code The initial production BI OSs are identified as MUCDT10N 86A The BIOS Setup program can be used to view and change the BIOS settings for the computer The BIOS Setup program is accessed by pressing the lt F2 gt key after the Power On Self Test POST memory test begins and before the operating system boot begins The menu bar is shown below Maintenance Main Advanced Security Power Boot Exit ir NOTE The maintenance menu is displayed only when the board is in configure mode Section 2 3 on page 50 shows how to put the board in configure mode 61 Intel Desktop Board D2550DC2 Technical Product Specification Table 27 lists the BIOS Setup program menu features Table 27 BIOS Setup Program Menu Bar Clears Displays Configures Sets Configures Selects boot Saves or passwords and processor advanced passwords power options discards displays and memory features and security management changes to processor configuration available features features and Setup information through the power states program chipset options options Table 28 lists the function keys available for menu screens Table 28 BIOS Setup Program Function Keys BIOS Setup Program Function Key Descripti
69. stem s power supply Device States D0 working state D3 no power except for wake up logic D3 no power except for wake up logic D3 no power except for wake up logic D3 no power for wake up logic except when provided by battery or external source Targeted System Power Note 1 Full power gt 30 W Power lt 5 W Note 2 Power lt 5 W Note 2 Power lt 5 W Note 2 No power to the system Service can be performed safely 2 Dependent on the standby power consumption of wake up devices used in the system Product Description 1 11 1 2 Wake up Devices and Events Wr t Table 8 lists the devices or specific events that can wake the computer from specific states Table 8 Wake up Devices and Events Devices events that wake up the system from this sleep state Power switch S3 S4 ss TT RTC alarm 3 84 ss ee LAN s3 s4 ss P USB S3 Note 2 WAKE S3 S4 ss e PME signal S3 S4 ss e Notes 1 S4 implies operating system support only 2 USB ports must be turned off during S4 S5 states NOTE The use of these wake up events from an ACPI state requires an operating system that provides full ACPI support In addition software drivers and peripherals must fully support ACPI wake events 31 Intel Desktop Board D2550DC2 Technical Product Specification 1 11 2 Hardware Support The board provides several power management hardware feature
70. system fan enabled should have local ambient temperature safely below the 50 C limit Technical Reference Recommended Fan and Vent Location Bad Fan Location Acceptable Fan and Vent Location Rear Panel Connectors Chassis ODD and HDD Region Front Panel Acceptable Fan and Vent Locations Recommended Fan and Bad Fan Locations Vent Locations OM23330 Figure 18 Fan Location Guide for Chassis Selection Chassis Orientation is Not Restricted For all chassis configurations the heatsink performance parameter W a should be less than 3 85 C W The detail thermal measurement metrology is described in the TMSDG For chassis that fail to meet the thermal specifications guideline highlighted above an actively cooled heatsink solution should be used 57 Intel Desktop Board D2550DC2 Technical Product Specification 2 7 Power Consumption Power measurements were performed to determine bare minimum and likely maximum power requirements from the board as well as attached devices in order to facilitate power supply rating estimates for specific system configurations 2 7 1 Minimum Load Configuration Minimum load refers to the power demand placed on the power supply when using a bare system configuration with minimal power requirement conditions Minimum load configuration test results are shown in Table 24 The test configuration was defined as follows e 2 GB DDR3 1066 MHz SO DIMM e USB keyboard and mouse e LAN linked
71. tel NMIO Express ChIDSet ro Fer Manila Pee P iE e EVER ias 20 1 5 2 JUS Bassett DIEI breue TER EE YE YAR SY EYE Se MEY EPEY alaala 21 15 3 BATA SUPPONE 255 ae lar Nee a i ipa adus 21 1 6 Real Time Clock SubDsystelm sioe nere Eo en tet Y ee eH a hn rex Ras 22 1 7 Legacy 1 0 Controller sise estas ee ei 22 1 8 LAN SUD Y Stemi rhe et eter bes Peau rennen 23 1 8 1 LAN Subsystem Drivers 23 1 8 2 RJ 45 LAN Connector with Integrated LEDS 24 1 9 Audio SUBSYSTEM ii cse relies reine 25 1 9 1 Audio Subsystem Software r 26 1 9 2 Audio Connectors and Headers nn an en ener nn 26 1 10 Hardware Management Subsystem nennen ernennen nenn 27 1 10 1 Hardware Monitoring e Zeg rear e ee 27 1 10 2 Thermal Monitoring unsre 28 1 11 Power Management xu eed deo EM tnr xr ree MPa EAS 29 E Ia U G MM CE nC rem e 29 1 11 2 Hardware Support GEET 32 2 Technical Reference 2 1 Memory Map un uxo qi HE ad ERROR ENEE 35 2 1 1 Addressable Memory ea rar EE 35 2 2 Connectors and Headeks ann lal ld Rei todo ud ee 38 21 Back Panel ly des E NH LR M es 39 2 2 2 Component sideConnectorsandHeaders 41 2 3 BIOS Configuration Jumper Block u rasen 50 2 4 Mechanical Considerations rr 52 2 41 FORM e o Ee IM MY ef 52 2 5 Electrical Considerations r r ee 1E FEE ORTA n RES 53 2 5 1 Fan Hea
72. th integrated graphics and integrated memory controller e Two 204 pin DDR3 SDRAM Small Outline Dual Inline Memory Module SO DIMM sockets e Support for DDR3 1066 MHz DDR3 1333 MHz and DDR3 1600 MHz SO DIMMs Note DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz e Support for up to 4 GB of system memory on a single SO DIMM Passively cooled Intel NM10 Express Chipset Multi streaming 5 1 6 channel audio subsystem support based on the Realtek ALC662 high definition audio codec Onboard Intel graphics subsystem with support for High Definition Multimedia Interface HDMI DVI D e External graphics support provided through the Conventional PCI bus connector Winbond W83627DHG P based Legacy I O controller for hardware management e Seven USB 2 0 ports Four back panel ports Two ports are implemented with a dual port internal header for front panel cabling One port is implemented with an internal header brown colored that supports an Intel Z U130 USB Solid State Drive or compatible device e Two Serial ATA SATA 3 0 Gb s connectors supporting IDE and AHCI mode 10 100 1000 Mb s Ethernet LAN subsystem using an Intel 82574L Gigabit Ethernet Controller continued 11 Intel Desktop Board D2550DC2 Technical Product Specification Table 1 Feature Summary continued BIOS e Intel BIOS resident in the SPI Flash device e Support for Advanced Configuration and Power Interface ACPI
73. tions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation For questions related to the EMC performance of this product contact Intel Corporation 5200 N E Elam Young Parkway Hillsboro OR 97124 1 800 628 8686 This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures e Reorient or relocate the receiving antenna e Increase the separation between the equipment and the receiver e Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected e Consult the dealer or an experienced radio TV technician for help Any changes or modifications to the equipment not e
74. top Board D2550DC2 Technical Product Specification 4 2 Front panel Power LED Blink Codes Whenever a recoverable error occurs during POST the BIOS causes the board s front panel power LED to blink an error message describing the problem see Table 33 Table 33 Front panel Power LED Blink Codes Type BIOS update in progress Off when the update begins then on for 0 5 seconds then off for 0 5 seconds The pattern repeats until the BIOS update is complete On off 1 0 second each two times then When no VGA option ROM is 2 5 second pause off entire pattern repeats found blink and pause until the system is powered off Memory error On off 1 0 second each three times then Note Video error Note 2 5 second pause off entire pattern repeats blinks and pause until the system is powered off Thermal trip warning Each beep will be accompanied by the following blink pattern 25 seconds on 25 seconds off 25 seconds on 25 seconds off This will result in a total of 16 blinks Note Disabled per default BIOS setup option 4 3 BIOS Error Messages Whenever a recoverable error occurs during POST the BIOS displays an error message describing the problem Table 34 lists the error messages and provides a brief description of each Table 34 BIOS Error Messages Error Message Explanation CMOS Battery Low The battery may be losing power Replace the battery soon CMOS Checksum Bad The CMOS checksum is inc
75. udio jacks are capable of retasking according to the user s definition or can be automatically switched depending on the recognized device type Front panel Intel HD Audio and AC 97 audio support 3 port analog audio out stack Windows Vista Basic certification A signal to noise S N ratio of 95 dB Table 5 lists the supported functions of the front panel and back panel audio jacks Table 5 Audio Jack Support rone i Audio Jack phone Headphones Front Spks Stereo 2 Mic In Back panel Green y U UU ctrl panel Defaut 25 Intel Desktop Board D2550DC2 Technical Product Specification 1 9 1 Audio Subsystem Software Audio software and drivers are available from Intel s World Wide Web site For information about Refer to Obtaining audio software and drivers Section 1 2 page 16 1 9 2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board The component side audio headers include front panel audio a 2 x 5 pin header that provides mic in and line out signals for front panel audio connectors A B r OM23318 Item Description A Line in B Line out C Mic in Figure 5 Back Panel Audio Connectors A wgl 2 NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only Poor audio quality occurs if passive non amplified speakers are connected to this out
76. xpressly approved by Intel Corporation could void the user s authority to operate the equipment Tested to comply with FCC standards for home or office use Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications Le pr sent appareil numerique n met pas de bruits radio lectriques d passant les limites applicables aux appareils num riques de la classe B prescrites dans le R glement sur le broullage radio lectrique dict par le minist re des Communications du Canada Regulatory Compliance and Battery Disposal Information Japan VCCI Statement Japan VCCI Statement translation This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment VCCI If this is used near a radio or television receiver in a domestic environment it may cause radio interference Install and use the equipment according to the instruction manual TORE HRUBLESERRSAEMHBMS VCCI DEE KES lt STFABHRBENRETT CORE RERRCHATSCE ZEMELTUIETH LDKENFTI AFPTLEISTRERKHELT ASNA E REMERASAECICEPINES DIRS IE TEL RMU IRUYZ U C F uv Korea Class B Statement Korea Class B Statement translation This equipment is for home use and has acquired electromagnetic conformity registration so it c

Intel D2550DC2

Contents

Download Pdf Manuals

Related Search

Related Contents