Dataram DRSX6275-13/8GB memory module
Contents
1. Hi i psn E 175 700 Hi Prag a Bh E aS fey a pes 7 4 l m M MaN Back view Side view 4 a o A E i E Pel Ser eas 127 a tO vy DO ai H DRSX6275 13 10 Sep 09 Copyright 2009 Dataram Corporation U S A Headquarters 1 609 799 0071 Offices in Europe and Asia www dataram com The information contained in this document has been carefully checked and is believed to be reliable and accurate However Dataram assumes no responsibility for errors2. eed A Optimizing Value and Performance Products in Family DRSX6275 13 2GB 1 x 2GB 1Rx4 DIMMs DRSX6275 813 2GB 1 x 2GB 2Rx8 DIMMs DRSX6275 13 4GB 1 x 4GB 2Rx4 DIMMs DRSX6275 13 8GB 1 x 8GB 2Rx4 DIMMs ue m 1 a ee St ee Oe E lp diritti DRSX6275 13 DDR3 1333 PC3 10600 Registered ECC 1 5V 240 pin DIMMs H amp oo oe gt id i ji Features Description 240 pin JEDEC compliant DIMMs 133 35 mm wide by 30 mm high 1 181 x 5 25 Data Transfer Rate 10 6 Gigabytes sec Operating Voltage 1 5 V 0 075 Fully ROHS Compliant Thermal Sensor Each DRSX6275 13 upgrade consists of a single DDR3 1333 Registered ECC DIMM that conforms to JEDEC s DDR3 PC3 10600 standard One 2K bit EEPROM is used for Serial Presence Detect and a combination register PLL with Address and Command Parity is also used A thermal sensor accurately monitors the DIMM module and can prevent exceeding the maximum operating temperature of 95C Dataram Product Sun Microsystems Product Supported in these Sun Microsystems systems DRSX6275 13 2GB X4673A DRSX6275 813 2GB Not Offered by Sun DRSX6275 13 4GB X4674A DRSX6275 13 8GB Not Offered by Sun Sun Blade X6275 Server Module Front view Notes i Tolerances on all dimensions except where otherwise indicated are 13 005 000 jitan af All dimensions are expressed f mean in millimeters inches b ee
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